CN110631401A - Heat conduction invisible method, device and application - Google Patents
Heat conduction invisible method, device and application Download PDFInfo
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- CN110631401A CN110631401A CN201910817929.6A CN201910817929A CN110631401A CN 110631401 A CN110631401 A CN 110631401A CN 201910817929 A CN201910817929 A CN 201910817929A CN 110631401 A CN110631401 A CN 110631401A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
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Abstract
The invention discloses a heat conduction stealth method, a heat conduction stealth device and application. The directional heat conduction structure is characterized in that a directional heat conduction structure composed of high-heat-conductivity materials and low-heat-conductivity materials which are arranged in a staggered mode is introduced to a background heat conduction medium plane, one or more temperature field invisible areas are arranged in the directional heat conduction structure and used for placing an object to be subjected to heat conduction invisibility, the directional heat conduction structure enables heat flow to smoothly bypass the temperature field invisible areas through directional guiding of an external temperature field, the temperature field distribution gradient in the temperature field invisible areas is zero, and therefore heat conduction invisibility is achieved. The method can be used for protecting electronic elements on the surface of a printed circuit board, guiding heat flow on the surface of a thermal solar cell and thermally shielding the artificial skin surface element. The invention is easy to realize, the geometric shape can be designed at will, and the invention is not limited to a circular structure.
Description
Technical Field
The invention belongs to a novel heat conduction stealth technology, and particularly relates to a heat conduction stealth method, a heat conduction stealth device and application.
Background
The invisible heat conduction is a novel thermal device provided along with the development of a thermal metamaterial. When heat is conducted on a uniform heat conducting plane, the distribution of the temperature field is also uniform. However, if some other object of different thermal conductivity is present in the plane of heat conduction, the distribution of the temperature field will no longer be uniform, at which point an external observer will "perceive" the presence of other objects in the plane of heat conduction through the distribution of the temperature field. The function of the heat conduction invisible structure is to add a structure with special heat conductivity distribution around the objects with the heat conductivity different from that of the background heat conduction plane, so that the temperature field distribution is restored to be uniform, and an external observer cannot sense that other objects exist on the heat conduction plane through the temperature field distribution. The heat conduction invisibility can simultaneously realize the following two functions: first, the temperature gradient inside the concealed area is zero; second, in the concealed area, the external temperature field does not change regardless of the placement of any thermal conductive material.
The invisible heat conduction structure realized in the current experiment is a cylindrical shell structure mainly obtained by wrapping two or more layers of materials with different heat conductivities [ Han T, Bai X, Gao D, et al, Physical Review Letters112(5), 054302 (2014) ]. These structures have the following limitations: first, these heat conduction invisible geometries are all circular in the heat conduction plane. However, in practical applications, the heat conduction hidden structures with different geometric shapes are designed according to specific applications. Second, for thermal conduction invisibility (based on a design that directly solves the thermal conduction equations and boundary conditions) of the thermal conductivity material composition of the bilayer, the material required for the thermally conductive invisibility structure is related to the geometry of the structure. That is, as the geometry of the covert structure changes, the required material to achieve thermal stealth will change accordingly, and the parameters of the overall covert structure will change. Third, the stealth of thermal conduction (based on alternating thermal) corresponding to the composition of multiple layers of thermal conductivity materials requires the use of multiple different thermal conductivity materials, and complex grading [ Schittny R, Kadic M, guenneau, et al, Physical Review Letters 110(19) ]. The invention provides a novel heat conduction invisible structure which can be realized by only needing two materials to be staggered regardless of the geometric dimension of the structure, has a non-cylindrical shape and can be designed.
Disclosure of Invention
The invention aims to solve the problems that the materials required by the existing heat conduction invisible structure are complex or the heat conductivity of the materials is related to the geometric dimension of a device, and the existing heat conduction invisible structure is only limited to a circular ring shape.
A heat conduction invisible method is characterized in that a directional heat conduction structure composed of high-heat-conductivity materials and low-heat-conductivity materials which are arranged in a staggered mode is introduced to a background heat conduction medium plane, one or more temperature field invisible areas are arranged in the directional heat conduction structure and used for placing an object to be subjected to heat conduction invisible, the directional heat conduction structure enables heat flow to smoothly bypass the temperature field invisible areas through directional guiding of an external temperature field, and the temperature field distribution gradient in the temperature field invisible areas is zero, so that heat conduction invisible is achieved.
The geometric shape of the invisible temperature field area can be changed, and the heat flow can be smoothly bypassed.
The higher the thermal conductivity of the high thermal conductivity material is relative to the thermal conductivity of the background heat-conducting medium plane, the lower the thermal conductivity of the low thermal conductivity material is relative to the thermal conductivity of the background heat-conducting medium plane, and the better the heat conduction invisible effect is.
The thermal conductivity of the high thermal conductivity material is 10 times or more of that of the background heat-conducting plate, and the thermal conductivity of the low thermal conductivity material is 10% or less of that of the background heat-conducting plate.
The heat conduction invisible device prepared according to the heat conduction invisible method comprises a background heat conduction medium plane and a directional heat conduction structure consisting of high-heat-conductivity materials and low-heat-conductivity materials which are arranged in a staggered mode, wherein one or more temperature field invisible areas are arranged in the directional heat conduction structure.
The heat conduction invisible device is applied to the protection of electronic components on the surface of a printed circuit board, the guiding of heat flow on the surface of a thermal solar cell and the heat shielding of an artificial skin surface component.
The invention has the beneficial effects that:
1) the method is easy to realize and can be realized only by staggering two materials with higher thermal conductivity than a background material and lower thermal conductivity than the background material;
2) the geometric shape can be designed arbitrarily and is not limited to a circular structure;
3) when the geometric shape and the dimensional parameters of the heat conduction invisible structure are changed, the two heat conduction materials are not required to be changed.
Drawings
FIG. 1 is a schematic view of a heat transfer stealth device designed according to the method of the present invention;
FIG. 2 is a comparison of temperature fields when the temperature field in the temperature field invisible region reaches a thermal equilibrium state;
FIG. 3 is a comparison graph of temperature field distribution when the temperature field outside the temperature field structure reaches thermal equilibrium;
FIG. 4 is a schematic view of a heat conduction concealed device designed according to the method of the present invention (having a different location of the concealed area of the temperature field than that of FIG. 1);
FIG. 5 is a schematic view of a heat conduction concealed device designed according to the method of the present invention (rectangular configuration);
in the figure, a high-thermal-conductivity material 1-1, a low-thermal-conductivity material 1-2, a temperature field invisible area 1-3 and a background heat-conducting medium plane 1-4 are arranged.
Detailed Description
The invention is further illustrated below with reference to the figures and examples.
A heat conduction invisible method is characterized in that a directional heat conduction structure composed of high-heat-conductivity materials and low-heat-conductivity materials which are arranged in a staggered mode is introduced to a background heat conduction medium plane, one or more temperature field invisible areas are arranged in the directional heat conduction structure and used for placing an object to be subjected to heat conduction invisible, the directional heat conduction structure enables heat flow to smoothly bypass the temperature field invisible areas through directional guiding of an external temperature field, and the temperature field distribution gradient in the temperature field invisible areas is zero, so that heat conduction invisible is achieved. The geometric shape of the invisible temperature field area can be changed, and the heat flow can be smoothly bypassed. The higher the thermal conductivity of the high thermal conductivity material is relative to the thermal conductivity of the background heat-conducting medium plane, the lower the thermal conductivity of the low thermal conductivity material is relative to the thermal conductivity of the background heat-conducting medium plane, and the better the heat conduction invisible effect is.
As shown in FIG. 1, the whole heat conduction invisible device is composed of a high heat conductivity material (1-1) and a low heat conductivity material (1-2) in a background heat conduction medium plane (1-4). The structure composed of the high thermal conductivity material and the low thermal conductivity material can generate directional guiding effect on the temperature field. In the middle of the two materials with high and low thermal conductivity, the holes are smoothly dug to obtain temperature field invisible areas (1-3), namely heat invisible areas.
The material of the background heat-conducting medium can be selected from epoxy resin (with a thermal conductivity of 3.4W/(mK)), and in this case, the high-thermal-conductivity material (1-1) can be selected from copper (with a thermal conductivity of 401W/(mK)), and the low-thermal-conductivity material (1-2) can be selected from foam (with a thermal conductivity of 0.03W/(mK)). In the structure of fig. 1, four temperature field concealing areas (1-3) to be concealed are set to air (thermal conductivity 0.01W/(mK)), and one constant high temperature boundary 400K is applied to the left boundary, one constant low temperature boundary 200K is applied to the right boundary, and the upper and lower boundaries are set to be thermally insulated. At this time, the distribution of the temperature field in the temperature field hidden areas (1-3) at the time of reaching the thermal equilibrium state is given to the left part of fig. 2. If the copper and the foam plastics which are arranged in a staggered mode are removed, only the background heat conducting medium plane (1-4) and the temperature field invisible area (1-3) are reserved, and the boundary conditions of the left side, the right side, the upper side and the lower side are the same. The distribution of the temperature field when it reaches thermal equilibrium is now given in the right part of fig. 2. It can be seen that under the same other conditions, the temperature field invisible regions (1-3) are kept as a constant temperature region (the temperature field gradient is zero) after reaching the thermal equilibrium after the designed directional heat conduction structure is added. If the directionally-conductive structure is removed, the temperature in the obscured region will be related to the thermal conductivity of the material placed in that region, and will generally not be constant (there is a significant temperature field gradient). Fig. 3 shows the temperature field distribution in a straight line along the vertical direction on the right of the outer part of the stealth structure in the above two cases. The solid line is the distribution of the temperature field on the same straight line after the thermal equilibrium is reached under the condition that the directional heat conduction structure is added and the thermal equilibrium state is reached (no disturbance is generated to the external temperature field), while the dotted line is the distribution of the temperature field on the same straight line after the directional heat conduction structure is removed and the thermal equilibrium state is reached under the premise that other conditions are not changed. At this time, it is apparent that the temperature field distribution is not uniform. This is due to the disturbance of the incident temperature field by the air in the temperature field invisible areas (1-3).
There are many other possible designs besides the one shown in fig. 1. For example, fig. 4 and 5 show two other examples of structures that can achieve invisible heat conduction and are also composed of staggered high and low thermal conductivities. The temperature field invisible area for placing the hidden object can be obtained by only utilizing the high and low thermal conductivity materials to form a directional heat conduction structure which does not disturb the external temperature field in a staggered arrangement mode and then smoothly digging holes in the middle of the high and low thermal conductivity materials. Fig. 4 is also a square configuration, except that the location of the smooth cut in the high and low thermal conductivity material is different from that of fig. 1. Fig. 5 is a rectangular structure and holes are dug only at upper and lower two positions.
The heat conduction invisible device can be used for protecting important electronic components on the surface of a printed circuit board, guiding heat flow on the surface of a thermal solar cell, thermally shielding an artificial skin surface component and the like.
Claims (6)
1. A heat conduction invisible method is characterized in that a directional heat conduction structure composed of high-heat-conductivity materials and low-heat-conductivity materials which are arranged in a staggered mode is introduced into a background heat conduction medium plane, one or more temperature field invisible areas are arranged in the directional heat conduction structure and used for placing an object to be subjected to heat conduction invisible, the directional heat conduction structure enables heat flow to smoothly bypass the temperature field invisible areas through directional guiding of an external temperature field, and the temperature field distribution gradient in the temperature field invisible areas is zero, so that heat conduction invisible is achieved.
2. The heat conduction concealing method according to claim 1, wherein the temperature field concealing area has a variable geometry, so that the heat flow is smoothly bypassed.
3. The heat conduction invisibility method according to claim 1, wherein the higher the thermal conductivity of the high thermal conductivity material relative to the thermal conductivity of the background heat conducting medium plane, the lower the thermal conductivity of the low thermal conductivity material relative to the thermal conductivity of the background heat conducting medium plane, the better the heat conduction invisibility effect.
4. The heat conduction invisibility method according to claim 3, wherein the thermal conductivity of said high thermal conductivity material is 10 times or more of that of the background heat-conducting plate, and the thermal conductivity of said low thermal conductivity material is 10% or less of that of the background heat-conducting plate.
5. A heat conduction invisibility device according to any one of claims 1 to 4, comprising a directional heat conduction structure consisting of a background heat conduction medium plane (1-4) and staggered high heat conductivity materials (1-1) and low heat conductivity materials (1-2), wherein one or more temperature field invisibility zones (1-3) are arranged in the directional heat conduction structure.
6. Use of a heat conducting contact device according to claim 5 for protection of printed circuit board surface electronics, guidance of thermal flow to a thermal solar cell surface, thermal shielding of artificial skin surface elements.
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Cited By (2)
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| CN113158457A (en) * | 2021-04-16 | 2021-07-23 | 太原理工大学 | Hot spoofing method and hot spoofing structure |
| CN113656933A (en) * | 2021-07-03 | 2021-11-16 | 复旦大学 | Zero-energy-consumption hotspot mobile device based on gradient thermal conductivity and design method thereof |
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| CN113656933B (en) * | 2021-07-03 | 2024-04-19 | 复旦大学 | Zero-energy-consumption heat point moving device based on gradient heat conductivity and design method thereof |
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