CN110629037A - Method for leaching copper in waste printed circuit board by using glycine solution - Google Patents
Method for leaching copper in waste printed circuit board by using glycine solution Download PDFInfo
- Publication number
- CN110629037A CN110629037A CN201910999379.4A CN201910999379A CN110629037A CN 110629037 A CN110629037 A CN 110629037A CN 201910999379 A CN201910999379 A CN 201910999379A CN 110629037 A CN110629037 A CN 110629037A
- Authority
- CN
- China
- Prior art keywords
- leaching
- glycine
- circuit board
- printed circuit
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0065—Leaching or slurrying
- C22B15/0067—Leaching or slurrying with acids or salts thereof
- C22B15/0073—Leaching or slurrying with acids or salts thereof containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/007—Wet processes by acid leaching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Processing Of Solid Wastes (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses a method for leaching copper in a waste printed circuit board by using glycine. The method comprises the following steps: obtaining a waste printed circuit board sample with smaller particle size through disassembly and mechanical crushing treatment; and (2) under the condition of stirring, placing the pretreated sample in a mixed leaching agent of glycine and hydrogen peroxide, leaching for a period of time at constant temperature, filtering the leaching solution, and leaching out copper. The method adopts a hydrometallurgy method, selects the glycine as a leaching agent to leach the metal copper in the waste printed circuit board, has environmental protection and high efficiency compared with the traditional leaching agent, has the highest leaching rate of the copper up to 94 percent, and is an environmental-friendly treatment method.
Description
Technical Field
The invention relates to a method for recycling waste printed circuit board resources, in particular to a method for leaching copper in a waste printed circuit board by using glycine.
Background
In recent years, with the rapid development of electronic technology and electronic information industry, various electronic goods are coming up endlessly, various electronic devices such as mobile phones, computers, household appliances and the like are becoming more and more popular, the service life of electronic products is becoming shorter and shorter, and the replacement speed of electronic products is increasing, resulting in the rapid increase of the quantity of electronic waste. Printed wiring boards are one of the most important components in electronic equipment, and the number thereof is also increasing as the number of electronic waste increases. The waste printed wiring boards contain a large amount of metal resources including basic metals (Al, Cu, Fe, Ni, Pb, Sn, Zn, etc.), precious metals and rare metals (Au, Ag, Pd, Rh, Se, etc.), toxic heavy metals (As, Pb, Cd, etc.), among which the copper content is the highest. If the waste printed circuit board can be effectively recycled, the method not only can be used for the ecological environment, but also can be used for obtaining a large amount of copper resources through recovery.
The recovery processing of the waste printed circuit boards is started from the U.S. mining administration in 1969 for over a hundred years, and after exploration and research, the resource processing technology of the WPCBs has a solid theoretical foundation at home and abroad, and a plurality of mature processing technologies are searched. Currently, the most used treatment techniques are physical mechanical treatment, pyrometallurgical, hydrometallurgical, microbiological and supercritical fluid processes. Among them, the pyrometallurgical and physico-mechanical treatment methods have high equipment cost, high energy consumption, serious pollution, immature microbiological method and supercritical fluid method, low treatment capacity and not widely used. The hydrometallurgical technology is the most widely applied technology in a plurality of waste printed circuit board processing technologies, and is emphasized by various researchers due to simple operation and low energy consumption. Patent CN107574310A discloses a method for efficiently leaching copper in a waste circuit board, which is characterized in that multi-metal powder of the waste circuit board is mixed with sulfuric acid solution to be slurry, manganese oxide ore is added to be used as an oxidant to leach, the leaching rate of copper is more than 96%, however, the sulfuric acid solution is used as a leaching agent in the method, so that the method has certain danger, the human body is easily damaged due to improper operation, and acid waste liquid generated by leaching needs additional treatment.
Disclosure of Invention
In order to solve the problems, the invention provides a method for leaching copper in a waste printed circuit board by using glycine. The method is based on a hydrometallurgy technology, and the selected leaching agent is environment-friendly and safe, and has the characteristics of safe operation, simple process and no generation of acid-base waste liquid in the leaching process.
In order to achieve the purpose, the invention adopts the technical scheme that:
a method for leaching copper in a waste printed circuit board by using glycine comprises the following steps of using glycine to replace traditional inorganic acid as a leaching agent, using hydrogen peroxide as an oxidant, and leaching the copper in the waste printed circuit board under the condition of constant-temperature stirring:
step 1: disassembling, shearing and crushing the waste printed circuit board to obtain a pretreated sample;
step 2: and (2) under the condition of stirring, placing the pretreated sample in a mixed leaching agent of glycine and hydrogen peroxide, leaching for a period of time at constant temperature, filtering the leaching solution, and leaching out copper.
Further, the waste printed circuit board is disassembled, sheared and crushed to obtain a pretreatment sample with the grain size less than or equal to 1 mm.
Furthermore, in the mixed leaching agent of glycine and hydrogen peroxide, the concentration of glycine is 0.25-1.25 mol/L, and the volume fraction of hydrogen peroxide is 2.5-10%.
Further, the ratio of the pretreated sample to the mixed leaching agent is 5-25 g/L.
Further, the constant temperature is between room temperature and 60 ℃, and the leaching time is more than 480 min.
Compared with the prior art, the invention has the following beneficial effects:
(1) the method uses the glycine to replace the traditional inorganic acid to leach the copper in the waste printed circuit board, selects the hydrogen peroxide as the oxidant, does not add strong acid and strong base reagents, has safe operation process, low energy consumption and high leaching efficiency of the copper, and can reach more than 94 percent.
(2) The method has the advantages that the method is environment-friendly, no toxic and harmful byproducts are generated in the leaching process, no acid/alkali waste liquid is generated after leaching, the obtained product copper glycinate is harmless to the environment, and the subsequent treatment is convenient; compared with other organic acids, the glycine is cheap and easy to obtain.
Drawings
FIG. 1 is a process flow diagram of the method for leaching copper in waste printed circuit boards by using a glycine solution.
Detailed Description
The invention will now be described in more detail by way of the following examples, which are given for the purpose of better illustrating the invention, the scope of protection of the invention being not limited to the examples given.
With reference to fig. 1, the method for leaching copper in the waste printed circuit board by using glycine of the invention comprises the following steps:
step 1: the waste printed circuit board is disassembled, sheared, crushed and the like to obtain a pretreated sample;
step 2: preparing a glycine solution with a certain concentration;
and step 3: adding a certain amount of hydrogen peroxide into a glycine solution, uniformly mixing to obtain a mixed solution of glycine and hydrogen peroxide, and taking the mixed solution as a leaching agent;
and 4, step 4: under the magnetic stirring, adding a certain amount of the waste printed circuit board sample pretreated in the step 1 at a constant temperature, leaching for a period of time, immersing copper in the circuit board into the solution, and filtering the mixed solution.
Example 1
The waste printed circuit board is firstly disassembled manually and then is crushed to the grain diameter of less than or equal to 1mm by a double-shaft shearing machine and a crusher. Then preparing a glycine solution in a 500mL beaker, stirring with a glass rod, adding hydrogen peroxide, adding ultrapure water to a constant volume of 200mL, uniformly stirring with a magnetic stirrer to finally obtain a mixed solution of glycine with the concentration of 1mol/L and hydrogen peroxide with the volume fraction of 2.5%, and taking the mixed solution as a leaching agent. Adding crushed waste printed circuit board powder, wherein the ratio of the powder to a leaching agent is 5g/L, controlling the temperature to be 30 ℃, continuously stirring and leaching for 480min by using a magnetic stirrer, centrifugally filtering and diluting the obtained mixed solution to measure the copper content, and calculating to obtain the leaching rate of the copper, wherein the leaching rate of the copper is 78.65%.
Example 2
The experiment was carried out at different temperatures, in accordance with the other conditions of example 1, with the following specific results:
TABLE 1 experiment at different temperatures
As is clear from Table 1, the leaching effect of copper is good at room temperature to 40 ℃ and the leaching effect of copper is best at 30 ℃ and the temperature is preferably 30 ℃.
Example 3
Other conditions were otherwise identical to those of example 1, and experiments were carried out with different volume fractions of hydrogen peroxide mixed in the leachant, with the following specific results:
TABLE 2 experiment of different hydrogen peroxide concentrations
As can be seen from table 2, when the volume fraction of hydrogen peroxide in the leaching agent is 5.0 to 10%, the leaching effect of copper is good, and when the volume fraction of hydrogen peroxide in the leaching agent is 10%, the leaching effect of copper is best, and preferably, the volume fraction of hydrogen peroxide is 10%.
Example 4
Other conditions were identical to those of example 1, and the experiments were carried out at different ratios of powder to leaching agent, with the following specific results:
table 3 experiments with different powder and lixiviant ratios
As is clear from Table 4, when the ratio of the powder to the leaching agent is 5 to 15g/L, the leaching effect of copper is good, and when the ratio of the powder to the leaching agent is 10g/L, the leaching effect of copper is best, and preferably, the ratio of the powder to the leaching agent is 10 g/L.
Example 5
The other conditions were identical to those of example 1, and the experiments were carried out at different glycine concentrations, with the following specific results:
TABLE 4 experiments with different glycine concentrations
As can be seen from Table 5, the leaching rate of copper is not greatly affected by the excessive glycine, and the leaching rate of copper can basically reach more than 88% when the glycine concentration is 0.25-1.25 mol/L. However, when the glycine concentration is 1mol/L, the leaching effect of copper is the best, and the glycine concentration is preferably 1 mol/L.
The above description is a preferred embodiment of the present invention, but does not represent a limitation to the scope of the present invention, and those skilled in the art will be able to make modifications of the present invention without departing from the spirit and scope of the present invention.
Claims (5)
1. A method for leaching copper in a waste printed circuit board by using glycine is characterized by comprising the following steps:
step 1: disassembling, shearing and crushing the waste printed circuit board to obtain a pretreated sample;
step 2: and (3) under the stirring condition, putting the pretreated sample into a mixed leaching agent of glycine and hydrogen peroxide, and leaching for a period of time at constant temperature.
2. The method of claim 1, wherein the waste printed wiring boards are disassembled, sheared and crushed to obtain a pretreated sample with a particle size of 1mm or less.
3. The method as claimed in claim 1, wherein the glycine concentration in the mixed leaching agent of glycine and hydrogen peroxide is 0.25 ~ 1.25.25 mol/L and the volume fraction of hydrogen peroxide is 2.5% ~ 10%.
4. A method as claimed in claim 1 or claim 3, wherein the ratio of pre-treated sample to combined leachant is 5 ~ 25 g/L.
5. The method of claim 1, wherein the constant temperature is from room temperature to 60 ℃ and the leaching time is greater than 480 min.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910999379.4A CN110629037A (en) | 2019-10-21 | 2019-10-21 | Method for leaching copper in waste printed circuit board by using glycine solution |
| PCT/CN2020/113868 WO2021077922A1 (en) | 2019-10-21 | 2020-09-08 | Method for extracting copper from waste printed circuit board using glycine solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910999379.4A CN110629037A (en) | 2019-10-21 | 2019-10-21 | Method for leaching copper in waste printed circuit board by using glycine solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110629037A true CN110629037A (en) | 2019-12-31 |
Family
ID=68976917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910999379.4A Pending CN110629037A (en) | 2019-10-21 | 2019-10-21 | Method for leaching copper in waste printed circuit board by using glycine solution |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110629037A (en) |
| WO (1) | WO2021077922A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111394587A (en) * | 2020-04-26 | 2020-07-10 | 郑州大学 | Method for leaching copper from acid-washed copper slag of zinc hydrometallurgy |
| WO2021077922A1 (en) * | 2019-10-21 | 2021-04-29 | 西南科技大学 | Method for extracting copper from waste printed circuit board using glycine solution |
| CN112961991A (en) * | 2021-02-05 | 2021-06-15 | 江西理工大学 | Copper-catalyzed glycine-thiosulfate composite gold leaching process |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04344864A (en) * | 1991-05-22 | 1992-12-01 | Hitachi Powdered Metals Co Ltd | Method for removing burr in copper-made parts and treatment of its waste solution |
| CN102643995A (en) * | 2012-05-15 | 2012-08-22 | 四川大学 | Method for separating and recovering copper from waste electronic appliances |
| CN103540748A (en) * | 2012-07-16 | 2014-01-29 | 中国科学院化学研究所 | Separating method for metals and nonmetals of waste printed circuit board substrate |
| CN104264184A (en) * | 2014-09-12 | 2015-01-07 | 上海电力学院 | Method for extracting metallic copper from waste circuit board |
| CN105154680A (en) * | 2015-10-30 | 2015-12-16 | 上海第二工业大学 | Method for selectively peeling away metal gold from the surface of waste printed circuit board |
| CN105755289A (en) * | 2016-04-28 | 2016-07-13 | 中南大学 | Method for comprehensively recycling valuable metals of waste circuit board |
| CN107400777A (en) * | 2017-05-23 | 2017-11-28 | 西北矿冶研究院 | Method for leaching copper by using alkaline glycine salt solution |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5618913B2 (en) * | 2010-11-25 | 2014-11-05 | 株式会社日立製作所 | Exudate and metal recovery method |
| ES2940464T3 (en) * | 2013-09-04 | 2023-05-08 | Mining and Process Solutions Pty Ltd | Process to recover copper and/or precious metals |
| CN110629037A (en) * | 2019-10-21 | 2019-12-31 | 西南科技大学 | Method for leaching copper in waste printed circuit board by using glycine solution |
-
2019
- 2019-10-21 CN CN201910999379.4A patent/CN110629037A/en active Pending
-
2020
- 2020-09-08 WO PCT/CN2020/113868 patent/WO2021077922A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04344864A (en) * | 1991-05-22 | 1992-12-01 | Hitachi Powdered Metals Co Ltd | Method for removing burr in copper-made parts and treatment of its waste solution |
| CN102643995A (en) * | 2012-05-15 | 2012-08-22 | 四川大学 | Method for separating and recovering copper from waste electronic appliances |
| CN103540748A (en) * | 2012-07-16 | 2014-01-29 | 中国科学院化学研究所 | Separating method for metals and nonmetals of waste printed circuit board substrate |
| CN104264184A (en) * | 2014-09-12 | 2015-01-07 | 上海电力学院 | Method for extracting metallic copper from waste circuit board |
| CN105154680A (en) * | 2015-10-30 | 2015-12-16 | 上海第二工业大学 | Method for selectively peeling away metal gold from the surface of waste printed circuit board |
| CN105755289A (en) * | 2016-04-28 | 2016-07-13 | 中南大学 | Method for comprehensively recycling valuable metals of waste circuit board |
| CN107400777A (en) * | 2017-05-23 | 2017-11-28 | 西北矿冶研究院 | Method for leaching copper by using alkaline glycine salt solution |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021077922A1 (en) * | 2019-10-21 | 2021-04-29 | 西南科技大学 | Method for extracting copper from waste printed circuit board using glycine solution |
| CN111394587A (en) * | 2020-04-26 | 2020-07-10 | 郑州大学 | Method for leaching copper from acid-washed copper slag of zinc hydrometallurgy |
| CN112961991A (en) * | 2021-02-05 | 2021-06-15 | 江西理工大学 | Copper-catalyzed glycine-thiosulfate composite gold leaching process |
| CN112961991B (en) * | 2021-02-05 | 2023-01-03 | 江西理工大学 | Copper-catalyzed glycine-thiosulfate composite gold leaching process |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021077922A1 (en) | 2021-04-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Kumar et al. | LEACHING OF METALS FROM WASTE PRINTED CIRCUIT BOARDS (WPCBs) USING SULFURIC AND NITRIC ACIDS. | |
| CN100580109C (en) | Method for extracting gold from waste circuit boards | |
| CN110629037A (en) | Method for leaching copper in waste printed circuit board by using glycine solution | |
| Xiu et al. | A novel recovery method of copper from waste printed circuit boards by supercritical methanol process: Preparation of ultrafine copper materials | |
| CN101392325B (en) | Method for extracting gold from waste printed circuit board | |
| CN107400780A (en) | A kind of method that gold, silver and bronze are extracted in the plate from cell phone lines | |
| CN105112674A (en) | All-wet recovery process for waste circuit boards | |
| CN101100706A (en) | Method for immersing gold from printing wiring board | |
| CN104745824A (en) | Method for recovering copper from waste circuit board | |
| CN104630479B (en) | A kind of method reclaiming various metals from electron wastes | |
| Li et al. | Extraction of indium from indium-zinc concentrates | |
| Hossain et al. | Selective recovery of copper from waste mobile phone printed circuit boards using sulphuric acid leaching | |
| Duan et al. | Recent advances in recovering technology for recycling gold from waste printed circuit boards: a review | |
| CN102747229A (en) | Method for separating and recycling valuable metals in powder rich in multiple metals of waste circuit board | |
| CN114134337B (en) | Low-cost and high-efficiency method for recovering noble metal in circuit board components | |
| Chen et al. | Behaviour of zinc during the process of leaching copper from WPCBs by typical acidic ionic liquids | |
| Li et al. | Review on the gentle hydrometallurgical treatment of WPCBs: Sustainable and selective gradient process for multiple valuable metals recovery | |
| CN105385860A (en) | Method for extracting copper from waste circuit boards | |
| CN106011480A (en) | Method for recycling silver (Ag) from waste mobile phone electronic components | |
| Yin et al. | Comparison of leaching processes of gold and copper from printed circuit boards of waste mobile phone | |
| Ozairy et al. | Optimization of metal bio-acid leaching from mobile phone printed circuit boards using natural organic acids and H 2 O 2 | |
| WO2021169780A1 (en) | Gold leaching agent for selectively leaching gold from gold-containing material, and preparation method therefor and application thereof | |
| CN105087944B (en) | A kind of method that valuable metal is reclaimed from electron wastes | |
| Shoshay et al. | Hydrometallurgical methods for extracting non-ferrous metals from electronic gadgets | |
| CN112342384B (en) | Method for recycling waste circuit board and waste oxidizing solution in synergy manner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191231 |