CN110628380A - Heat-conducting glue and synthesis method thereof - Google Patents
Heat-conducting glue and synthesis method thereof Download PDFInfo
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- CN110628380A CN110628380A CN201910948421.XA CN201910948421A CN110628380A CN 110628380 A CN110628380 A CN 110628380A CN 201910948421 A CN201910948421 A CN 201910948421A CN 110628380 A CN110628380 A CN 110628380A
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- component
- heat
- conducting
- thermally conductive
- conductive paste
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
Abstract
The application discloses a heat-conducting glue and a synthetic method thereof, and the heat-conducting glue comprises: the component A, the component B and the component C are as follows: the component A is a colloid which comprises hydroxyl-terminated polydimethylsiloxane, fumed silica and activated calcium carbonate; the component B is a curing agent; the component C is a heat-conducting additive. The problem of current photovoltaic curtain heat dissipation poor, influence photovoltaic module's conversion efficiency, also can not reduce the hidden danger of high temperature on fire is solved to this application.
Description
Technical Field
The application relates to the technical field of buildings, in particular to a heat-conducting glue and a synthesis method thereof.
Background
Solar energy is an inexhaustible energy source. In order to convert solar energy into usable energy without pollution, the photovoltaic curtain wall technology is produced. The photovoltaic curtain wall converts light energy into electric energy through the photovoltaic module. In the process of converting solar energy into electric energy by the photovoltaic curtain wall, most of the solar energy is converted into heat energy, so that the temperature of the photovoltaic curtain wall is increased. The rising of curtain temperature can reduce photovoltaic module's conversion efficiency on the one hand, and on the other hand also can produce high temperature hidden danger of starting a fire.
The metal structure support of the curtain wall has large heat capacity and is a better heat conductor. However, heat is mainly generated in the photovoltaic module and accumulated in a portion (such as a junction box) with poor heat dissipation, and the structural adhesive (silicone adhesive) and the sealant for connecting the photovoltaic module and the metal structure are poor heat conductors, which cannot conduct the absorbed heat of the photovoltaic module better. Thereby influencing the conversion efficiency of the photovoltaic module and also being incapable of reducing the hidden danger of high-temperature fire.
Disclosure of Invention
The application mainly aims to provide a heat-conducting adhesive and a synthesis method thereof, so as to solve the problems that the existing photovoltaic curtain wall is poor in heat dissipation, the conversion efficiency of a photovoltaic assembly is influenced, and the hidden danger of high-temperature fire can not be reduced.
In order to achieve the above object, according to a first aspect of the present application, there is provided a thermally conductive paste.
The heat conductive paste according to the present application includes:
the component A, the component B and the component C are as follows:
the component A is a colloid which comprises hydroxyl-terminated polydimethylsiloxane, fumed silica and activated calcium carbonate;
the component B is a curing agent;
the component C is a heat-conducting additive.
Further, the curing agent comprises methyl alkoxy silane, ethyl polysilicate, organic metal chelate, polyfunctional group substituted alkoxy silane and methyl dimethoxy polydimethylsiloxane.
Further, the heat-conducting additive comprises one or more of zinc oxide particles, aluminum nitride particles, silicon carbide particles and inorganic materials with high heat-conducting and wide energy gap.
Further, the mixture ratio of the component A, the component B and the component C is as follows:
the weight ratio of the component A to the component B to the component C is 100-150: 10: 0.1-10.
Further, the particle size range of the particles of the components in the heat-conducting additive is 0.02-10 microns.
Further, the methylalkoxysilane is a mixture of methyltrimethoxysilane and methyltriethoxysilane.
Furthermore, the organic metal chelate is a di-n-butoxy di (2-ethyl crotonate 3-oxy) chelate tin compound and a 1, 3-propylenedioxy di (2-ethyl crotonate 3-oxy) chelate titanium compound.
Further, the multifunctional substituted alkoxy silane is 4-oximido 4, 6-dimethyl heptyl triethoxy silane or N-beta-aminoethyl gamma-aminopropyl trimethoxy silane or gamma-aminopropyl triethoxy silane.
In order to achieve the above object, according to a second aspect of the present application, a method for synthesizing a thermally conductive paste is provided.
The synthesis method of the heat-conducting glue comprises the following steps:
obtaining three components of a component A, a component B and a component C of the heat-conducting adhesive, wherein the component A is a colloid which comprises hydroxyl-terminated polydimethylsiloxane, fumed silica and active calcium carbonate, the component B is a curing agent, and the component C is a heat-conducting additive;
pouring the three components into a container according to a preset proportion;
and (3) stirring the three components in the container to synthesize the heat-conducting glue.
Further, the method further comprises:
monitoring the color and viscosity of the colloid during stirring;
and when the color and the viscosity of the colloid meet the preset requirements, the stirring is finished.
In the embodiment of the application, the heat-conducting glue comprises three components of a component A, a component B and a component C: the component A is a colloid which comprises hydroxyl-terminated polydimethylsiloxane, fumed silica and activated calcium carbonate; the component B is a curing agent; the component C is a heat-conducting additive. It can be seen that the heat-conducting adhesive of the application, compared with the existing structural adhesive (bi-component silicone adhesive) and sealant for connecting the photovoltaic module and the metal structure, contains the heat-conducting additive, and the heat-conducting additive is a good thermal conductor, so that the heat-conducting adhesive has good heat conductivity. The heat-conducting glue is applied between the photovoltaic module and the structural support, so that heat on the photovoltaic module can be quickly conducted to the structural support, and the purpose of reducing the temperature of the photovoltaic module is achieved by radiating through the structural support. Thereby reducing the influence of high temperature on the conversion efficiency of the photovoltaic module and effectively reducing the hidden danger of high-temperature fire.
Detailed Description
It should be noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of this application, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention is further illustrated by the following specific examples.
The first embodiment is as follows:
the embodiment provides a heat-conducting glue, which comprises three components of a component A, a component B and a component C:
the component A is a colloid which is a basic colloid for forming the heat-conducting adhesive, and specifically comprises hydroxyl-terminated polydimethylsiloxane, fumed silica and activated calcium carbonate; the weight ratio of the hydroxyl-terminated polydimethylsiloxane, the fumed silica and the active calcium carbonate is as follows: 80-120: 5-15: 100-200; the component A can be a finished raw material product, and can also be obtained by mixing the components in the weight ratio of A and stirring the components by a high-speed mixer.
The component B is a curing agent;
the component C is a heat-conducting additive.
The heat-conducting adhesive in the embodiment is added with a heat-conducting additive on the basis of the components of the existing structural adhesive (two-component silicone adhesive) for connecting the photovoltaic module and the metal structure, and the heat-conducting additive is a good heat conductor, so that the heat-conducting adhesive has good heat conductivity. The heat-conducting glue is applied between the photovoltaic module and the structural support, so that heat on the photovoltaic module can be quickly conducted to the structural support, and the purpose of reducing the temperature of the photovoltaic module is achieved by radiating through the structural support. Thereby reducing the influence of high temperature on the conversion efficiency of the photovoltaic module and effectively reducing the hidden danger of high-temperature fire.
Further, the weight ratio of the component A, the component B and the component C is 100-150: 10: 0.1-10.
The component A is hydroxyl-terminated polydimethylsiloxane synthesized by one-step method of dimethyl cyclosiloxane and tetramethylhydroxylamine, the reaction condition is that the reaction is carried out for 2 hours at the temperature of 95-100 ℃ under normal pressure, and a polymerization degree regulator is added for end capping to obtain the product.
The component A uses active calcium carbonate as a filler, the active calcium carbonate has good compatibility with organic materials, and the processing fluidity of high-viscosity materials can be enhanced, so that the high filling content can be achieved, the product cost is reduced, the fluidity of colloid can be maintained, the good extrusion performance is ensured, and the rapid requirement of building construction is met. It is further noted that since the activated calcium carbonate used does not require a drying process, the residual moisture on the surface greatly accelerates the curing rate of the A, B, C components when mixed.
Further, the component B curing agent in the heat-conducting glue comprises methyl alkoxy silane, polyethyl silicate, organic metal chelate, polyfunctional group substituted alkoxy silane and methyl dimethoxy polydimethylsiloxane.
Specifically, the methylalkoxysilane is a mixture of methyltrimethoxysilane and methyltriethoxysilane;
the organic metal chelate is di-n-butoxy di (2-ethyl crotonate 3-oxy) chelate tin compounds and 1, 3-propylene dioxy di (2-ethyl crotonate 3-oxy) chelate titanium compounds;
the multifunctional group substituted alkoxy silane is 4-oximido 4, 6-dimethyl heptyl triethoxy silane or N-beta-aminoethyl gamma-aminopropyl trimethoxy silane or gamma-aminopropyl triethoxy silane.
The weight ratio of the components contained in the component B is as follows:
methyl alkoxy silane 20-40
10-30 parts of poly (ethyl silicate)
Organic metal chelate 0.5-2.0
Polyfunctional group-substituted alkoxysilane 5-20
Methyl dimethoxy polydimethylsiloxane 5-10
The component B may be a finished product of raw materials, or may be obtained by charging the components in a planetary mixer or other mixers and mixing them in a weight ratio of the components contained in component B.
Furthermore, the component B adopts ethyl polysilicate as a curing agent, methylalkoxysilane as a curing accelerator, an organic metal chelate as a curing reaction catalyst and polyfunctional group alkoxy silane as a tackifier.
Further, the C component heat conduction additive in the heat conduction glue comprises one or more of zinc oxide particles, aluminum nitride particles, silicon carbide particles and inorganic materials with high heat conduction and wide forbidden band.
Wherein, the particle size ranges of the zinc oxide particles, the aluminum nitride particles and the silicon carbide particles are 0.02-10 microns.
The heat conductivity coefficient of the heat-conducting adhesive in the embodiment can reach 1-5W/mK, and compared with a structural adhesive (two-component silicone adhesive) in the prior art, the heat-conducting property is greatly improved. It should be noted that in practical applications, the heat conductive adhesive in the embodiment does not completely replace the structural adhesive in the prior art to fix and adhere the photovoltaic modules, but the heat conductive adhesive is added on the photovoltaic modules to help the photovoltaic modules dissipate heat.
Example two:
in view of the heat-conducting adhesive provided in the first embodiment, another embodiment of the present application provides a method for synthesizing a heat-conducting adhesive, which specifically includes the following steps:
firstly, three components of a component A, a component B and a component C of a heat-conducting adhesive are obtained, wherein the component A is a colloid which comprises hydroxyl-terminated polydimethylsiloxane, fumed silica and active calcium carbonate, the component B is a curing agent, and the component C is a heat-conducting additive;
the specific components contained in the component a, the component B and the component C and the ratio of the components are described in the above embodiment, and are not described herein again.
Secondly, pouring the three components into a container according to a preset proportion;
the preset proportion is that the weight ratio of the component A to the component B to the component C is 100-150: 10: 0.1-10. The following specific proportioning schemes are provided:
example A component-100, B component-10, C component-0.1;
example two-component a-150, component B-10, component C-10;
three A-component-120, B-component-10, C-component-4 are exemplified.
And finally, stirring the three components in the container to synthesize the heat-conducting glue.
It should be noted that in the stirring process, the color and viscosity of the colloid in the stirring process need to be monitored in real time; and when the color and the viscosity of the colloid meet the preset requirements, the stirring is finished. The specific preset requirements are uniform colloid color and viscosity. In the embodiment, the stirring can be performed by mechanical stirring through stirring, and the stirring can be performed by manpower when the amount is small.
In this embodiment, the synthesized thermal conductive adhesive includes a thermal conductive additive, and the thermal conductive additive is a good thermal conductor, so that the thermal conductive adhesive has good thermal conductivity. The colloid is used for connecting the photovoltaic module and the structural support, so that heat on the photovoltaic module can be quickly conducted to the structural support, and the purpose of reducing the temperature of the module can be achieved by radiating through the support.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A heat conductive paste, comprising: the component A, the component B and the component C are as follows:
the component A is a colloid which comprises hydroxyl-terminated polydimethylsiloxane, fumed silica and activated calcium carbonate;
the component B is a curing agent;
the component C is a heat-conducting additive.
2. A thermally conductive paste as claimed in claim 1, wherein the curing agent comprises methylalkoxysilane, polyethyl silicate, organic metal chelate, polyfunctionally-substituted alkoxysilane, and methyldimethoxy polydimethylsiloxane.
3. The thermally conductive paste of claim 1, wherein the thermally conductive additive comprises one or more of zinc oxide particles, aluminum nitride particles, silicon carbide particles, and inorganic materials with high thermal conductivity and wide energy gap.
4. A heat-conducting glue according to claim 1, wherein the proportion of the component A, the component B and the component C is as follows:
the weight ratio of the component A to the component B to the component C is 100-150: 10: 0.1-10.
5. A thermally conductive paste as claimed in claim 3, wherein the constituent particles of the thermally conductive additive have a particle size in the range of 0.02 μm to 10 μm.
6. The heat conductive paste as claimed in claim 2, wherein the methylalkoxysilane is a mixture of methyltrimethoxysilane and methyltriethoxysilane.
7. A thermally conductive paste as claimed in claim 2, wherein said organic metal chelate is di-n-butoxy di (2-ethyl crotonate 3-oxy) chelated tin compound and 1, 3-propylenedioxy di (2-ethyl crotonate 3-oxy) chelated titanium compound.
8. The thermally conductive paste as claimed in claim 2, wherein the multi-functionally substituted alkoxysilane is 4-hydroxyimino-4, 6-dimethylheptyltriethoxysilane or N- β -aminoethyl γ -aminopropyltrimethoxysilane or γ -aminopropyltriethoxysilane.
9. A method for synthesizing a heat-conducting adhesive is characterized by comprising the following steps:
obtaining three components of a component A, a component B and a component C of the heat-conducting adhesive, wherein the component A is a colloid which comprises hydroxyl-terminated polydimethylsiloxane, fumed silica and active calcium carbonate, the component B is a curing agent, and the component C is a heat-conducting additive;
pouring the three components into a container according to a preset proportion;
and (3) stirring the three components in the container to synthesize the heat-conducting glue.
10. A method for synthesizing a thermally conductive adhesive as claimed in claim 9, further comprising:
monitoring the color and viscosity of the colloid during stirring;
and when the color and the viscosity of the colloid meet the preset requirements, the stirring is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910948421.XA CN110628380A (en) | 2019-09-30 | 2019-09-30 | Heat-conducting glue and synthesis method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910948421.XA CN110628380A (en) | 2019-09-30 | 2019-09-30 | Heat-conducting glue and synthesis method thereof |
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| Publication Number | Publication Date |
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| CN110628380A true CN110628380A (en) | 2019-12-31 |
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| CN201910948421.XA Pending CN110628380A (en) | 2019-09-30 | 2019-09-30 | Heat-conducting glue and synthesis method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105646A1 (en) * | 2020-11-18 | 2022-05-27 | 隆基乐叶光伏科技有限公司 | Potting adhesive and preparation method therefor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1282772A (en) * | 2000-06-23 | 2001-02-07 | 杭州之江有机硅化工有限公司 | Dual-component structural adhesive of silicone for biuldings |
| WO2006049921A1 (en) * | 2004-11-02 | 2006-05-11 | General Electric Company | Electrically and thermally conductive silicone adhesive compositions |
| CN102618209A (en) * | 2011-01-28 | 2012-08-01 | 深圳市百丽春粘胶实业有限公司 | One-component alcohol sealant for photovoltaic assembly and preparation technology thereof |
| CN109971415A (en) * | 2019-04-10 | 2019-07-05 | 陈立 | A kind of high heat conduction organosilicon adhesive and preparation method thereof |
-
2019
- 2019-09-30 CN CN201910948421.XA patent/CN110628380A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1282772A (en) * | 2000-06-23 | 2001-02-07 | 杭州之江有机硅化工有限公司 | Dual-component structural adhesive of silicone for biuldings |
| WO2006049921A1 (en) * | 2004-11-02 | 2006-05-11 | General Electric Company | Electrically and thermally conductive silicone adhesive compositions |
| CN102618209A (en) * | 2011-01-28 | 2012-08-01 | 深圳市百丽春粘胶实业有限公司 | One-component alcohol sealant for photovoltaic assembly and preparation technology thereof |
| CN109971415A (en) * | 2019-04-10 | 2019-07-05 | 陈立 | A kind of high heat conduction organosilicon adhesive and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105646A1 (en) * | 2020-11-18 | 2022-05-27 | 隆基乐叶光伏科技有限公司 | Potting adhesive and preparation method therefor |
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