CN110621114B

CN110621114B - Circuit board and preparation method thereof

Info

Publication number: CN110621114B
Application number: CN201910898173.2A
Authority: CN
Inventors: 张娟
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2019-09-23
Filing date: 2019-09-23
Publication date: 2020-12-01
Anticipated expiration: 2039-09-23
Also published as: CN110621114A

Abstract

The application provides a circuit board and a preparation method of the circuit board, and relates to the technical field of display. The circuit board includes a substrate; a photosensitive component disposed on the substrate; and a waterproof layer covering the photosensitive component; the waterproof layer has a light transmission characteristic and comprises a plurality of added materials for improving light transmittance. The embodiment of this application increases the luminousness of waterproof layer through introducing the additional material in the waterproof layer to effectively reduced the barrier effect of waterproof layer to sensitization components and parts response light, and then reduced the emergence probability that sensitization components and parts became invalid because the response can not reach light and the sensitization function that leads to.

Description

Circuit board and preparation method thereof

Technical Field

The application relates to the technical field of display, in particular to a circuit board and a preparation method of the circuit board.

Background

Currently, display devices, such as smartwatches, smartphones, and the like, have a problem of water ingress during use. Therefore, a waterproof member needs to be added to the display device to prevent water from affecting the display function of the display device. However, the addition of the waterproof member may affect the functions of other components in the display device. For example, when the water-repellent member is disposed on the optical path of the photosensitive component, the photosensitive characteristics of the photosensitive component are affected.

Therefore, when the waterproof member is added, how to avoid the influence of the waterproof member on the functions of other members is a problem to be solved.

Disclosure of Invention

In view of the above, embodiments of the present application are directed to providing a circuit board, a method for manufacturing the circuit board, and a display device, so as to solve the problem in the prior art that the addition of a waterproof component affects the functions of other components.

One aspect of the present application provides a circuit board, including: a substrate; a photosensitive component disposed on the substrate; and a waterproof layer covering the photosensitive component; the waterproof layer has a light transmission characteristic and comprises a plurality of added materials for improving light transmittance.

In one embodiment of the present application, the additive material comprises at least one reflective surface for reflecting light; the included angle between the extending direction of the reflecting surface of the additive material and the direction perpendicular to the surface of the substrate, on which the photosensitive component is arranged, is an acute angle.

In one embodiment of the present application, the center of gravity of the additive material is offset from the geometric center of the additive material.

In one embodiment of the present application, the circuit board further comprises a fixing layer; the fixing layer is arranged on the substrate and covers the root of the photosensitive component, and the waterproof layer is arranged on one side, far away from the photosensitive component, of the fixing layer.

In one embodiment of the present application, the fixing layer completely covers an electrical connection portion between the photosensitive component and the substrate.

In an embodiment of the present application, an orthographic projection of the waterproof layer on the substrate completely covers an orthographic projection of the photosensitive component on the substrate.

In one embodiment of the present application, the additive material includes at least one of silver and aluminum.

Another aspect of the present application provides a method for manufacturing a circuit board, including: coating a coating liquid of a waterproof layer with light-transmitting property on a substrate so that the coating liquid of the waterproof layer coats a photosensitive component on the substrate; adding a plurality of additive materials for improving light transmittance to the coating liquid on the substrate; and coating the coating liquid of the water-repellent layer again on the plurality of additive materials.

In one embodiment of the present application, the additive material comprises at least one reflective surface for reflecting light rays, the center of gravity of the additive material being offset from the geometric center of the additive material; wherein the adding of a plurality of additive materials that improve light transmittance to the coating liquid on the substrate includes: simultaneously placing the plurality of additive materials on the coating liquid on the substrate, wherein one of the reflective surfaces of each of the plurality of additive materials is in a horizontal form, and the reflective surface in the horizontal form is an upper surface of the corresponding additive material; wherein, before the re-coating of the coating liquid of the water-repellent layer on the plurality of additional materials, after the adding of a plurality of additional materials that increase light transmittance to the coating liquid on the substrate, the preparation method further comprises: and standing the substrate for a preset time so that an included angle between the extension direction of the reflecting surface of the additive material and the direction perpendicular to the surface of the substrate, on which the photosensitive component is arranged, is an acute angle.

In one embodiment of the present application, the additive material includes at least one reflective surface for reflecting light, and the adding of the plurality of additive materials for improving light transmittance to the coating liquid on the substrate includes: curing the coating liquid on the substrate; inclining the upper surface of the solidified coating liquid so that an included angle between the extending direction of the upper surface of the solidified coating liquid and the direction vertical to the surface of the substrate, on which the photosensitive component is arranged, is an acute angle; and placing the additive material on the upper surface of the coating liquid after curing.

The embodiment of this application increases the luminousness of waterproof layer through introducing the additional material in the waterproof layer to effectively reduced the barrier effect of waterproof layer to sensitization components and parts response light, and then reduced the emergence probability that sensitization components and parts became invalid because the response can not reach light and the sensitization function that leads to.

Drawings

FIG. 1 is a schematic block diagram of a circuit board according to one embodiment of the present application.

Fig. 2 is a schematic block diagram of a circuit board according to another embodiment of the present application.

Fig. 3a and 3b are partial schematic views of a water barrier according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a circuit board according to still another embodiment of the present application.

Fig. 5 is a schematic flow chart of a method of manufacturing a circuit board according to one embodiment of the present application.

Fig. 6a and 6b are schematic cross-sectional views of an additive material according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

In order to prevent the occurrence of a short circuit caused by water entering the display device, a waterproof member is added to the display device to prevent the occurrence of the short circuit. For example, the circuit board may be coated with a waterproof layer so that water and electrical circuits can be isolated. However, for the photosensitive component on the circuit board, for example, the light sensor, the waterproof layer can cover the photosensitive component, so that the waterproof layer can obstruct the photosensitive component from sensing light, that is, the light is obstructed by the waterproof layer, and then the photosensitive function of the photosensitive component is obstructed. Therefore, how to avoid the influence of the waterproof layer on the functions of the photosensitive component while arranging the waterproof layer becomes an urgent problem to be solved.

In such a case, if the light blocking effect of the waterproof layer is reduced, the above problem will be effectively improved.

FIG. 1 is a schematic block diagram of a circuit board according to one embodiment of the present application. Fig. 2 is a schematic block diagram of a circuit board according to another embodiment of the present application.

Based on this, embodiments of the present application provide a circuit board. As shown in fig. 1, the circuit board may include a substrate 1, a photosensitive component 2 disposed on the substrate 1, and a waterproof layer 3 covering the photosensitive component 2. Here, the waterproof layer 3 may have a light transmitting property, and the waterproof layer 3 includes a plurality of additive materials 4 that improve light transmittance.

Specifically, the circuit board may be a flexible circuit board or a non-flexible circuit board. The flexibility of the circuit board may be determined by design requirements. In addition, the circuit may be a control main board in the display device, or may be a flexible circuit board electrically connected to the control main board. The type of circuit board may also be determined by design requirements.

The waterproof layer 3 may completely cover the photosensitive component 2, or may partially cover the photosensitive component 2. For example, in an embodiment of the present application, as shown in fig. 1, an orthographic projection of the waterproof layer 3 on the substrate 1 may completely cover an orthographic projection of the photosensitive component 2 on the substrate 1, so that the waterproof layer 3 may completely cover the photosensitive component 2. It should be understood that when the waterproofing layer 3 completely covers the light sensing component 2, the water and the light sensing component 2 will not contact at all, thereby achieving the best waterproofing degree.

As shown in fig. 2, when the upper surface 21 of the photosensitive component 2 is dense, the waterproof layer 3 may cover only the electrical connection portion 5 of the photosensitive component 2 and the substrate 1 and the junction position of the upper surface 21 and the side surface 22 of the photosensitive component 2, thereby preventing water from entering the inside of the photosensitive component 2 or contacting the electrical connection portion 5. Here, the electrical connection portion 5 of the photosensitive component 2 and the substrate 1 may be disposed between the photosensitive component 2 and the substrate 1.

The additive material 4 may increase the light transmittance of the waterproof layer 3 by increasing the light transmittance of the waterproof layer 3, or may increase the light transmittance by reflecting the light path of the changed light. When the additive material 4 is to increase the light transmittance of the waterproof layer 3 by increasing the light transmittance of the waterproof layer 3, the additive material 4 may be a nucleating agent. In the process of solidifying the waterproof layer 3, the nucleating agent can increase the number of crystal nuclei and also can reduce the volume of crystals formed by the crystal nuclei, thereby increasing the light transmittance of the solidified waterproof layer 3. The case of increasing the light transmittance by reflection will be described in detail in the following examples.

Here, the material used for the waterproof layer 3 may be any transparent waterproof material, and the material used for the waterproof layer 3 is not particularly limited in the embodiments of the present application.

The embodiment of this application increases waterproof layer 3's luminousness through introducing additional material 4 in waterproof layer 3 to effectively reduced waterproof layer 3 and responded to the hindrance effect of light to photosensitive component 2, and then reduced photosensitive component 2 because the response can not reach the emergence probability of the photosensitive function inefficacy that light leads to.

The case where the additive material 4 increases the light transmittance by reflection will be described in detail below.

In one embodiment of the present application, the additive material 4 may include at least one of silver and aluminum, or the like.

Specifically, in the embodiment of the present application, in order to enable the additive material 4 to reflect light, the additive material 4 may be made of a reflective material, or the surface of the additive material 4 may be coated with a reflective material. Here, the reflective material may be aluminum, silver, or the like.

Fig. 3a and 3b are each a partial schematic view of a water barrier 3 according to an embodiment of the present application.

In one embodiment of the present application, the additive material 4 may include at least one reflective surface 43 for reflecting light. Here, the reflecting surface 43 is a flat surface. For example, the additive material 4 may be in the form of a sheet, and a large-area surface of the additive material 4 may be used to reflect light. Accordingly, both opposite large-area surfaces of the sheet-like additive material 4 may be the reflection surfaces 43. As shown in fig. 3a, an angle θ between the extending direction a of the reflective surface 43 of the additive material 4 and the direction B perpendicular to the surface of the substrate 1 on which the photosensitive component 2 is disposed is an acute angle.

Specifically, there is granular structure 6 in the inside of non-light tight waterproof layer 3, and granular structure 6 can play the scattering effect to light, and partial light can lose to make the light that photosensitive component part 2 sensed reduce. Set up a plurality of additional material 4 in waterproof layer 3, and contained angle theta between the extending direction A of the reflection surface 43 of every additional material 4 and the direction B perpendicular to the base plate 1 that is provided with the surface of sensitization components and parts 2 is the acute angle, and the reflection surface 43 of an additional material 4 can reflect the light that grain structure 6 reflects, as shown in fig. 3a to change the light path of light, make light can propagate towards sensitization components and parts 2, and then effectively reduced the loss of light. Here, the grain structure 6 may refer to foreign substances, bubbles, larger crystals formed when the waterproof layer 3 is solidified, and the like mixed in the waterproof layer 3.

In addition, the light reflected by the reflecting surface 43 of one additive material 4 can also be emitted by the reflecting surface 43 of another additive material 4, or the reflecting surfaces 43 of another plurality of additive materials 4 are reflected, as shown in fig. 3a, so that the light with changed light path can also be transmitted towards the photosensitive component 2, and the loss of the light is effectively reduced.

In one embodiment of the present application, an angle θ between the extending direction a of the reflective surface 43 of the additive material 4 and the direction B perpendicular to the surface of the substrate 1 on which the photosensitive component 2 is disposed may be 45 ° or more and less than 90 °.

For example, as shown in FIG. 3b, the included angle θ 1 is greater than the included angle θ 2. When the angle θ is set to θ 1, the reflecting surface 43 of the additive material 4 on the left side can reflect three light rays. However, when the angle θ is set to θ 2, the reflecting surface 43 of the left-hand additive material 4 can reflect only one light ray. It follows that the smaller the angle of the included angle θ, the less favorable the reflective surface 43 of the additive material 4 can be to be used. Therefore, the angle θ between the extending direction a of the reflecting surface 43 of the additive material 4 and the direction B perpendicular to the surface of the substrate 1 on which the photosensitive component 2 is disposed may be 45 ° or more and less than 90 °. For example, the included angle θ may be 45 °, 50 °, 60 °, 75 °, or the like.

In one embodiment of the present application, the circuit board may further include a fixing layer 7, as shown in fig. 4. The fixed layer 7 can be arranged on the substrate 1 and covers the root of the photosensitive component 2, and the waterproof layer 3 can be arranged on one side of the fixed layer 7, which is far away from the photosensitive component 2.

Specifically, the fixing layer 7 may be used to reinforce the fixed connection relationship between the substrate 1 and the photosensitive component 2, so as to prevent the photosensitive component 2 from falling off from the substrate 1. Here, the fixing layer 7 may be made of a material having poor denseness so that water can penetrate through the fixing layer 7 to come into contact with the photosensitive element 2. Therefore, in order to avoid this, the waterproof layer 3 may be provided on the fixing layer 7, that is, the waterproof layer 3 may be formed on the fixing layer 7. In such a case, water cannot penetrate the waterproof layer 3, and thus the fixing layer 7.

In one embodiment of the present application, the fixing layer 7 completely covers the electrical connection portion 5 between the photosensitive component 2 and the substrate 1.

For example, when the circuit board is a printed circuit board, metal traces for conducting electricity are printed on the substrate 1 of the circuit board, and conductive pins for achieving electrical connection are further provided. Here, the conductive pins of the photosensitive component 2 and the conductive pins of the circuit board may be electrically connected by conductive paste or solder paste, and the conductive paste or solder paste may constitute the electrical connection portion 5 between the photosensitive component 2 and the substrate 1.

Specifically, when the additive material 4 is a conductive material, in order to prevent the additive material 4 from contacting the electrical connection portion 5 between the photosensitive component 2 and the substrate 1 to cause a short circuit, the fixing layer 7 may completely cover the electrical connection portion 5 between the photosensitive component 2 and the substrate 1, so that the fixing layer 7 may isolate the electrical connection portion 5 between the photosensitive component 2 and the substrate 1 from the waterproof layer 3, thereby avoiding occurrence of a corresponding short circuit.

The circuit board according to the embodiment of the present application is described above, and the method of manufacturing the circuit board according to the embodiment of the present application is described below with reference to fig. 5.

As shown in fig. 5, the method for manufacturing the circuit board may include the following steps.

Step 510, coating the coating liquid of the waterproof layer 3 with light-transmitting property on the substrate 1, so that the coating liquid of the waterproof layer 3 coats the photosensitive component 2 on the substrate 1.

Specifically, the coating liquid of the waterproof layer 3 and the photosensitive component 2 may be in direct contact, and another film layer, such as the fixing layer 7 described above, may be provided between the coating liquid of the waterproof layer 3 and the photosensitive component 2.

In addition, the coating liquid of the waterproof layer 3 may completely cover the photosensitive component 2, or may partially cover the photosensitive component 2, that is, the coating liquid of the waterproof layer 3 is only disposed on the optical path of part of the light.

In step 520, a plurality of additive materials 4 for increasing light transmittance are added to the coating liquid on the substrate 1.

In step 530, the coating liquid of the water-repellent layer 3 is applied again on the plurality of additive materials 4.

Specifically, the coating liquid of the waterproof layer 3 applied again may cover the additive material 4 and the coating liquid of the waterproof layer 3 applied previously. Since the materials of the coating liquids of the two waterproof layers 3 are the same, the coating liquids of the two waterproof layers 3 may be fused with each other, and after curing, the interface between the coating liquids of the two waterproof layers 3 may also disappear.

Fig. 6a and 6b are schematic cross-sectional views of an additive material 4 according to an embodiment of the present application.

In one embodiment of the application, the additional material 4 comprises at least one reflecting surface 43 for reflecting light rays, the centre of gravity 42 of the additional material 4 being offset from the geometric centre 41 of the additional material 4. Step 520 may include simultaneously placing a plurality of additive materials 4 on the coating liquid on the substrate 1. Here, one reflecting surface 43 of the additive material 4 is in a horizontal form, and the reflecting surface 43 in the horizontal form is an upper surface 44 of the corresponding additive material. It should be understood that the additive material may also include other reflective surfaces 43, except that the reflective surface 43 is not the upper surface 44 of the additive material 4. For example, when the additive material 4 is in a sheet shape, the two parallel reflecting surfaces 43 of the additive material 4 disposed opposite to each other may each be in a horizontal form. When the two oppositely disposed reflecting surfaces 43 of the additive material 4 in a sheet shape are not parallel, one reflecting surface 43 of the additive material 4 may be in a horizontal form. Before step 530, after step 520, the preparation method may further include: the substrate 1 is left standing for a predetermined time so that an angle θ between the extending direction a of the reflecting surface 43 of the additive material 4 and the direction B perpendicular to the surface of the substrate 1 on which the photosensitive component 2 is provided is acute as shown in fig. 3 a.

Specifically, in the embodiment of the present application, the additive material 4 may be a regular pattern. That is, the shape of the reflecting surface 43 of the additive material 4 is a regular pattern. Here, the reflecting surface 43 of the additive material 4 may refer to a surface perpendicular to the thickness direction of the additive material 4, that is, the reflecting surface 43 of the additive material 4 may be a surface in which the area of the additive material 4 is the largest. The regular pattern may be a triangle, a rectangle, a regular polygon, a circle, or the like. As shown in fig. 6a, when the reflecting surface 43 of the additive material 4 is in a horizontal form, and the reflecting surface 43 in the horizontal form is the upper surface 44 of the additive material, the geometric center 41 and the gravity center 42 of the additive material 4 do not coincide on the horizontal plane C where the gravity center 42 of the additive material 4 is located, that is, the gravity center 42 of the additive material 4 is offset from the geometric center 41 of the additive material 4, so that after the upper surface 44 of the additive material 4 is placed on the coating liquid on the substrate 1 in a horizontal form, the side where the gravity center 42 of the additive material 4 is located preferentially droops, and the additive material 4 is in a tilted state in the coating liquid, that is, the angle θ between the extending direction a of each reflecting surface of the additive material 4 and the direction B perpendicular to the surface of the substrate 1 on which the photosensitive element 2 is provided is an acute angle. Here, when the shape of the reflecting surface 43 of the additive material 4 is a regular pattern, different regions of the reflecting surface 43 of the additive material 4 may employ materials of different densities, so that the center of gravity 42 of the additive material 4 may be offset from the geometric center 41 of the additive material 4.

It should be understood that the shape of the reflective surface 43 of the additive material 4 may also be an irregular pattern. In this case, as shown in fig. 6b, when the upper surface of the additive material 4 is in a horizontal form, the additive material 4 may include a straight line D having the longest distance on a horizontal plane where the center of gravity 42 of the additive material 4 is located, and the midpoint of the straight line D may be defined as the geometric center 41. In such a case, the geometric center 41 and the center of gravity 42 of the additive material 4 are also set so as not to coincide, so that when the upper surface of the additive material 4 is placed on the coating liquid on the substrate 1 in a horizontal state, the side where the center of gravity 42 of the additive material 4 is located preferentially droops, so that the additive material 4 is in a state of being inclined in the coating liquid, that is, the angle θ between the extending direction a of each reflecting surface 43 of the additive material 4 and the direction B perpendicular to the surface of the substrate 1 where the photosensitive component 2 is provided is acute.

In one embodiment of the present application, where the additive material 4 includes at least one reflective surface 43 for reflecting light, step 520 may include: each of the plurality of additive materials 4 is obliquely inserted into the coating liquid on the substrate 1 such that an angle θ between an extending direction a of each of the reflective surfaces 43 of the additive materials 4 and a direction B perpendicular to the surface of the substrate 1 on which the photosensitive component 2 is provided is acute.

In one embodiment of the present application, the additive material 4 includes at least one reflection surface 43 for reflecting light, and adding a plurality of additive materials 4 for improving light transmittance to the coating liquid on the substrate 1 includes: curing the coating liquid on the substrate 1; inclining the upper surface of the cured coating liquid so that an included angle between the extending direction of the upper surface of the cured coating liquid and a direction B perpendicular to the surface of the substrate 1, on which the photosensitive component 2 is arranged, is an acute angle; and placing the additive material 4 on the upper surface of the coating liquid after curing.

Specifically, the additive material 4 may be in a sheet shape, and two surfaces having a large area disposed opposite to each other may be the reflective surfaces 43. When the additive material 4 is placed on the upper surface of the coating liquid after curing, the extending direction of the reflecting surface 43 of the additive material 4 may be parallel to the upper surface of the coating liquid after curing. Accordingly, the angle between the extending direction of the upper surface of the coating liquid after curing and the direction B perpendicular to the surface of the substrate 1 on which the photosensitive component 2 is provided is an acute angle, that is, the angle θ between the extending direction a of each reflecting surface 43 of the additive material 4 and the direction B perpendicular to the surface of the substrate 1 on which the photosensitive component 2 is provided is an acute angle.

After the additional material 4 is placed on the upper surface of the coating liquid after curing, the coating liquid of the water-repellent layer 3 may be applied to the upper surface of the coating liquid after curing for a second time and cured, and the upper surface of the coating liquid after second coating may be subjected to an inclination treatment so that the additional material is placed again on the upper surface of the coating liquid after second coating after the inclination treatment. Such a cycle may be cycled multiple times. The method of manufacturing the circuit board according to the embodiment of the present application is described above, and the display device according to the embodiment of the present application is described below.

The display device may comprise a circuit board as described in any of the above embodiments.

Specifically, the circuit board may be a control motherboard in the display device, or may be a circuit board electrically connected to the control motherboard. The type of circuit board may be determined by design requirements. Here, the control main board may refer to a main circuit board that functions as a control function.

In an embodiment of the present application, when the circuit board provided with the photosensitive component 2 is not a control motherboard, the display device may further include a control motherboard, the circuit board may be a flexible circuit board, and the circuit board and the control motherboard may be electrically connected through an electrical connector, so that the control circuit integrated on the control motherboard may receive the light sensing signal transmitted by the photosensitive component 2.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modifications, equivalents and the like that are within the spirit and principle of the present application should be included in the scope of the present application.

Claims

1. A circuit board, comprising:

a substrate;

a photosensitive component disposed on the substrate; and

a waterproof layer covering the photosensitive component;

wherein the waterproof layer has a light transmission characteristic and comprises a plurality of additive materials for improving light transmittance,

the additive material comprises at least one reflecting surface for reflecting light;

the included angle between the extending direction of the reflecting surface of the additive material and the direction perpendicular to the surface of the substrate, on which the photosensitive component is arranged, is an acute angle.

2. The circuit board of claim 1, wherein a center of gravity of the additive material is offset from a geometric center of the additive material.

3. The circuit board of claim 1, further comprising a securing layer;

the fixing layer is arranged on the substrate and covers the root of the photosensitive component, and the waterproof layer is arranged on one side, far away from the photosensitive component, of the fixing layer.

4. The circuit board of claim 3, wherein the fixing layer completely covers the electrical connection portion between the photosensitive component and the substrate.

5. The circuit board of claim 1, wherein an orthographic projection of the water-repellent layer on the substrate completely covers an orthographic projection of the photosensitive component on the substrate.

6. The circuit board of any one of claims 1 to 5, wherein the additive material comprises at least one of silver and aluminum.

7. A method for manufacturing a circuit board, comprising:

coating a coating liquid of a waterproof layer with light-transmitting property on a substrate so that the coating liquid of the waterproof layer coats a photosensitive component on the substrate;

adding a plurality of additive materials for improving light transmittance to the coating liquid on the substrate,

the substrate is placed for a preset time, so that an included angle between the extending direction of the reflecting surface of the additive material and the direction perpendicular to the surface of the substrate, on which the photosensitive component is arranged, is an acute angle; and

coating the coating liquid of the water-repellent layer on the plurality of additive materials again.

8. The production method according to claim 7, wherein a center of gravity of the additive material is offset from a geometric center of the additive material;

wherein the adding of a plurality of additive materials that improve light transmittance to the coating liquid on the substrate includes:

simultaneously placing the plurality of additive materials on the coating liquid on the substrate, wherein one of the reflective surfaces of each of the plurality of additive materials is in a horizontal form, and the reflective surface in the horizontal form is an upper surface of the corresponding additive material.

9. The production method according to claim 7, wherein the adding of a plurality of additive materials that increase light transmittance to the coating liquid on the substrate includes:

curing the coating liquid on the substrate;

inclining the upper surface of the solidified coating liquid so that an included angle between the extending direction of the upper surface of the solidified coating liquid and the direction vertical to the surface of the substrate, on which the photosensitive component is arranged, is an acute angle; and

placing the additive material on the upper surface of the coating liquid after curing.