CN110617771B - Device for automatically detecting thickness of sapphire wafer - Google Patents
Device for automatically detecting thickness of sapphire wafer Download PDFInfo
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- CN110617771B CN110617771B CN201910994470.7A CN201910994470A CN110617771B CN 110617771 B CN110617771 B CN 110617771B CN 201910994470 A CN201910994470 A CN 201910994470A CN 110617771 B CN110617771 B CN 110617771B
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- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 52
- 239000010980 sapphire Substances 0.000 title claims abstract description 52
- 238000001514 detection method Methods 0.000 claims abstract description 64
- 239000004579 marble Substances 0.000 claims abstract description 30
- 230000000903 blocking effect Effects 0.000 claims description 52
- 238000009434 installation Methods 0.000 claims description 52
- 230000005540 biological transmission Effects 0.000 claims description 21
- 230000007704 transition Effects 0.000 claims description 20
- 230000001360 synchronised effect Effects 0.000 claims description 19
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 210000004907 gland Anatomy 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 25
- 238000012423 maintenance Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 37
- 238000003466 welding Methods 0.000 description 8
- 241000446313 Lamella Species 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000005457 optimization Methods 0.000 description 6
- 230000000007 visual effect Effects 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007777 multifunctional material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a device for automatically detecting the thickness of a sapphire wafer, which comprises a supporting frame, an upper vision device, a detection device, a guide mounting plate, a lifting conveying device, a lower vision device and a marble detection platform. The upper vision device and the lower vision device are used for finding the initial detection position of the sapphire wafer and reading the data index for detecting the thickness of the sapphire wafer printed on the ceramic disc, the detection device is used for measuring the thickness of the sapphire wafer, the lifting conveying device can realize automatic horizontal conveying and vertical lifting conveying of the ceramic disc, the ceramic disc is automatically conveyed to the detection position, and the marble detection platform is used for placing the ceramic disc, so that the stability and accuracy of detection are ensured. The invention has the advantages of high detection efficiency, high detection precision, high automation degree, simple and clear device structure, convenient assembly and maintenance and strong compatibility.
Description
Technical Field
The invention relates to an automatic assembly line machine vision measurement range, in particular to an automatic detection device for detecting the thickness of a sapphire wafer.
Background
Sapphire (also known as Sapphire) single crystal is an excellent multifunctional material. It has high temperature resistance, high heat conductivity, high hardness, infrared transmission and high chemical stability. Is widely used in a plurality of fields of industry, national defense and scientific research, and the fields have strict requirements on the thickness of the sapphire wafer used.
The prior art mainly uses the traditional method to measure the thickness of the sapphire wafer manually, generally uses a digital display dial indicator as a measuring tool, has low efficiency, multiple single-point measurement times and large error, and simultaneously brings about continuous increase of labor cost, poor quality stability and less profit of enterprises. In order to adapt to the development of modernization and intelligence, enterprises need to further improve the production efficiency and quality and reduce the product cost, so that the improvement and design of the existing assembly line are necessary.
Disclosure of Invention
The invention aims to solve the technical problems of low efficiency and unstable quality caused by the fact that a large amount of manpower is required to be consumed for detecting the thickness of a sapphire wafer, and provides a device for automatically detecting the thickness of the sapphire wafer.
The invention realizes the above purpose through the following technical scheme: an apparatus for automatically detecting a thickness of a sapphire wafer, wherein: comprises a supporting frame, an upper vision device, a detection device, a guide mounting plate, a lifting conveying device, a lower vision device and a marble detection platform; the upper vision device, the detection device, the guide mounting plate, the lifting conveying device and the lower vision device are all positioned in the support frame;
The support frame comprises a first installation surface, a second installation surface and a third installation surface from top to bottom, the first installation surface, the second installation surface and the third installation surface are communicated, the first installation surface is positioned on the top surface of the support frame, the second installation surface is positioned in the middle of the support frame, and the third installation surface is positioned between the second installation surface and the bottom surface of the support frame; the upper vision device is arranged at the first mounting surface of the support frame, the detection device is arranged on the second mounting surface, the guide plate is arranged on the third mounting surface, the lifting conveying device penetrates through the guide plate, the lower vision device is arranged below the guide plate, and the marble detection platform device is arranged inside the support frame, below the guide plate and independent of the support frame.
As a further optimized scheme of the invention, the upper vision device comprises a camera fixing cross beam, an upper camera mounting plate, a camera and a lens, wherein the camera fixing cross beam is mounted on the central line of the first mounting surface, the camera mounting plate is mounted at the center of the camera fixing cross beam, the camera is mounted on the camera mounting plate, the lens is mounted on the head of the camera, and the lens faces downwards.
As a further optimization scheme of the invention, the detection device consists of a four-axis robot and a detection clamp, wherein the detection clamp comprises a connecting end and a detection end, and the connecting end comprises a clamp connecting block, a sliding block, a clamp middle plate, a buffer fixing block, a guide pin shaft, a buffer spring, a high frame plate and a rod end joint bearing; the detection end comprises a cable fixing plate, a cable fixing piece, a precision sensor, a sensor mounting plate, a pin shaft and special screws; the four-axis robot arm end connection anchor clamps connecting block, the anchor clamps connecting block passes through slider sliding connection anchor clamps intermediate lamella, buffering fixed block one end is fixed in the middle part of anchor clamps intermediate lamella, the other end of buffering fixed block is connected with the anchor clamps connecting block through the guide pin axle, buffer spring installs in the guide pin epaxial, the top of anchor clamps intermediate lamella is fixed in to the altitude board, the cable fixed plate is fixed in the other end of Gao Jiaban, the cable mounting is fixed in on the cable fixed plate, rod end joint bearing one end is connected on the anchor clamps intermediate lamella, the inductor mounting panel is fixed in rod end joint bearing's the other end through the round pin axle, accurate inductor probe is installed on the inductor mounting panel, accurate inductor's line is fixed in on the cable mounting, special screw installs in the lower surface of inductor mounting panel.
As a further optimization scheme of the invention, a plurality of waist-shaped holes are respectively formed in two opposite sides of the guide mounting plate, a U-shaped opening is formed in the other side of the guide mounting plate, a through hole is formed in the middle of the guide mounting plate, and the guide mounting plate is fixed on the support frame through the waist-shaped holes.
As a further optimization scheme of the invention, one end of the guide mounting plate is provided with a transition wheel assembly, the transition wheel assembly comprises a welding plate, a transition shaft and a bearing roller, a waist-shaped hole is formed in the welding plate, one end of the transition shaft is arranged on the waist-shaped hole, and the bearing roller is arranged at the other end of the transition shaft.
As a further optimization scheme of the invention, the lifting conveying device comprises two jacking cylinders, a distance beam, four guide posts, a first wire body installation side plate, a second wire body installation side plate, a blocking piece, a transmission shaft, a plurality of bearing assembly components, a short synchronous belt, a long synchronous belt, a motor and a motor adjusting block, wherein the jacking cylinders are fixedly arranged on the lower surface of a guide installation plate, the distance beam is transversely fixed above the jacking cylinders, the first wire body installation side plate and the second wire body installation side plate are connected, one ends of the four guide posts are vertically fixed below the distance beam, and the blocking piece is arranged on one side of the first wire body installation side plate and one side of the second wire body installation side plate; bearing assembly components are arranged on the first wire body installation side plate and the second wire body installation side plate side by side, and the bearing assembly components are in transmission connection through a long synchronous belt to form a transmission group; two ends of the transmission shaft are arranged on two bearing assembly assemblies at the outermost side of the transmission group; the motor is arranged on the second wire body mounting side plate and is positioned below the transmission group, a bearing assembly is also arranged at the output end of the motor, and the bearing assembly at the motor end is connected with the bearing assembly at one end of the transmission shaft through the short synchronous belt.
Further, the blocking piece includes two fixed curb plates of blocking the cylinder, two blocking the cylinder, blocking the cylinder mounting panel, two blocking the cylinder connecting plate, stroke sensing piece, two blocking the gyro wheel, block the both ends of cylinder mounting panel and install one respectively and block the fixed curb plate of cylinder, stroke sensing piece installs in the middle part that blocks the cylinder mounting panel to stroke sensing piece is the center of symmetry, has seted up two breach on blocking the cylinder mounting panel, block the cylinder connecting plate is installed to the breach top, blocks the lower surface mounting of cylinder connecting plate and blocks the cylinder, blocks the lower surface mounting of cylinder connecting plate and blocks the gyro wheel, blocks the pivot connection of cylinder and blocks the gyro wheel.
Further, the bearing assembly component comprises a rotary short shaft, a tug, a catch wheel, a bearing seat, two synchronous wheels and a gland, wherein the tug, the catch wheel, the bearing seat and the two synchronous wheels are sequentially fixed on the rotary short shaft, and the two synchronous wheels are fixed on the rotary short shaft through the gland.
As a further optimization scheme of the invention, the lower vision device is arranged on the lower surface of the through hole of the guide mounting plate, the lower vision device comprises a camera connecting support, a lower camera mounting plate, a camera and a lens, one side of the camera connecting support is fixed at the edge position of the mounting plate, the lower camera mounting plate is fixed at the other side of the camera connecting support, the camera is fixed on the lower camera mounting plate, the lens is arranged on the camera, and the lens faces upwards.
As a further optimization scheme of the invention, the marble detection platform device comprises a welding frame, an adjusting bracket, a marble platform and a cylinder, wherein the adjusting bracket is arranged at the top of the adjusting bracket, the marble platform is arranged on the adjusting bracket, one end of the cylinder is fixed on the marble platform, and the other end of the cylinder passes through the guide mounting plate.
The beneficial effects of the invention are as follows:
Through setting up buffer spring, guarantee to detect anchor clamps downward position and have the buffer volume, can adapt to certain difference in height and detect.
By arranging the blocking piece, the ceramic disc provided with the sapphire wafer is prevented from being excessively conveyed in the conveying process, and the problem of position deviation of the ceramic disc is avoided.
Through setting up vision device and lower vision device, realized effectively locating sapphire wafer's position, realized accurate measurement.
Through setting up marble testing platform, guaranteed the stability of ceramic dish in the measurement process, reduced vibration and rock the influence that brings.
By arranging a plurality of precise inductors, multiple detection on the same product is avoided, and time is effectively saved.
The invention can realize the butt joint conveying with other devices with different heights by arranging the lifting conveying device and the transition wheel assembly, and automatically realize the transportation in the horizontal direction and the lifting in the vertical direction.
Drawings
FIG. 1 is a schematic view of an apparatus for automatically detecting thickness of a sapphire wafer according to the present invention;
FIG. 2 is a schematic diagram of a second embodiment of an apparatus for automatically detecting thickness of a sapphire wafer according to the present invention;
FIG. 3 is a schematic diagram of a third embodiment of an apparatus for automatically detecting thickness of a sapphire wafer according to the present invention;
FIG. 4 is a schematic view of the structure of a support frame of the apparatus for automatically detecting the thickness of a sapphire wafer according to the present invention;
FIG. 5 is a schematic view of the structure of the upper vision device of the device for automatically detecting the thickness of the sapphire wafer according to the present invention;
FIG. 6 is a schematic view of the structure of a detecting unit of the apparatus for automatically detecting the thickness of a sapphire wafer according to the present invention;
FIG. 7 is a schematic view of the structure of a detecting jig of the apparatus for automatically detecting the thickness of a sapphire wafer according to the present invention;
FIG. 8 is a schematic view of a transition wheel assembly of the apparatus for automatically detecting the thickness of a sapphire wafer of the present invention;
FIG. 9 is a schematic view of a lift conveyer of the apparatus for automatically detecting the thickness of a sapphire wafer according to the present invention;
FIG. 10 is a schematic view showing a structure of a bearing assembly of the apparatus for automatically detecting thickness of sapphire wafers according to the present invention
FIG. 11 is a schematic view of a barrier structure of an apparatus for automatically detecting the thickness of a sapphire wafer according to the present invention;
FIG. 12 is a schematic view of the lower vision apparatus of the apparatus for automatically detecting the thickness of a sapphire wafer according to the present invention;
Fig. 13 is a schematic view showing a structure of a marble inspection stage of the apparatus for automatically inspecting the thickness of a sapphire wafer of the present invention;
1-support frame, 2-upper vision device, 3-detection device, 4-guide mounting plate, 5-lifting and conveying device, 6-lower vision device, 7-marble Dan Jiance platform, 8-ceramic plate, 11-first mounting surface, 12 second mounting surface, 13-third mounting surface, 201-camera fixed beam, 202-upper camera mounting plate, 203-camera, 204-lens, 301-four-axis robot, 302-detection fixture, 303-fixture connecting block, 304-slider, 305-fixture middle plate, 306-buffer fixed block, 307-guide pin, 308-buffer spring, 309-high frame plate, 310-cable fixed plate, 311-cable fixed member, 312-precision inductor 313-inductor mounting plate, 314-pin, 315-rod end joint bearing, 316-special screw, 402-transition wheel assembly, 403-welding plate, 404-transition shaft, 405-bearing roller, 500-drive train, 501-jack cylinder, 502-distance beam, 503-guide post, 504-wire body mounting side plate one, 505-wire body mounting side plate two, 506-blocking piece, 507-drive shaft, 508-bearing assembly, 509-short timing belt, 510-long timing belt, 511-motor, 512-motor adjustment block, 513-rotation short shaft, 514-tug, 515-blocking wheel, 516-bearing seat, 517-timing wheel, 518-gland, 519-blocking cylinder fixing side plate, 520-blocking cylinder, 519-blocking cylinder, 521-blocking cylinder mounting plate, 522-blocking cylinder connecting plate, 523-stroke sensor, 524-blocking roller, 601-camera connecting bracket, 602-lower camera mounting plate, 701-welding frame, 702-adjusting bracket, 703-marble Dan Pingtai, 704-cylinder.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings, wherein it is to be understood that the following detailed description is for the purpose of further illustrating the application only and is not to be construed as limiting the scope of the application, as various insubstantial modifications and adaptations of the application to those skilled in the art can be made in light of the foregoing disclosure.
Example 1
The device for automatically detecting the thickness of the sapphire wafer as shown in fig. 1, 2 and 3 comprises a supporting frame 1, an upper vision device 2, a detection device 3, a guide mounting plate 4, a lifting conveying device 5, a lower vision device 6 and a marble detection platform 7. The upper vision device 2, the detection device 3, the guide mounting plate 4, the lifting conveying device 5 and the lower vision device 6 are all positioned in the support frame 1.
As shown in fig. 3, the support frame 1 includes, from top to bottom, a first mounting surface 11, a second mounting surface 12, and a third mounting surface 13, where the first mounting surface 11, the second mounting surface 12, and the third mounting surface 13 are communicated, the first mounting surface 11 is located on the top surface of the support frame 1, the second mounting surface 12 is located in the middle of the support frame 1, and the third mounting surface 13 is located between the second mounting surface 12 and the bottom surface of the support frame 1. The upper vision device 2 is arranged at the first mounting surface 11 of the support frame 1, the detection device 3 is arranged on the second mounting surface 12, the guide mounting plate 4 is arranged on the third mounting surface 13, the jacking cylinder 501 of the lifting conveying device 5 penetrates through the guide mounting plate 4 and is fixedly arranged on the lower surface of the guide mounting plate 4, the lower vision device 6 is arranged below the guide mounting plate 4, and the lifting conveying device 5 is arranged below the detection device 3. The marble inspection platform device 7 is arranged in the support frame 1, below the guide mounting plate 4, and independent from the support frame 1.
As shown in fig. 4, the upper vision device 2 includes a camera fixing beam 201, an upper camera mounting plate 202, a camera 203, and a lens 204, the camera fixing beam 201 is mounted on a center line of the first mounting surface 11, the camera mounting plate 202 is mounted at a center of the camera fixing beam 201, the camera 203 is mounted on the camera mounting plate 202, the lens 204 is mounted on a head of the camera 203, and the lens 204 faces downward.
In order to automatically find the position of the sapphire wafer, the detection device 3 is ensured to accurately detect the thickness of the sapphire wafer and automatically read the two-dimensional code data information carried by the sapphire wafer, and as shown in fig. 5 and 6, the detection device 3 consists of a four-axis robot 301 and a detection clamp 302. The four-axis robot 301 is a prior art, and can be purchased directly, and the four-axis robot 301 can drive the detection clamp 302 to move and rotate on a certain X axis and a certain Y axis and to lift on a certain Z axis. The detection clamp 302 includes a connection end and a detection end, where the connection end includes a clamp connection block 303, a slider 304, a clamp middle plate 305, a buffer fixing block 306, a guide pin 307, a buffer spring 308, a high frame plate 309, and a rod end joint bearing 315. The detection end comprises a cable fixing plate 310, a cable fixing piece 311, a precision sensor 312, a sensor mounting plate 313, a pin shaft 314 and a special screw 316.
The four-axis robot 301 arm end connection anchor clamps connecting block 303, anchor clamps connecting block 303 pass through slider 304 sliding connection anchor clamps intermediate lamella 305, and buffering fixed block 306 one end is fixed in the middle part of anchor clamps intermediate lamella 305, and the other end of buffering fixed block 306 is connected with anchor clamps connecting block 303 through guide pin shaft 307, and buffer spring 308 installs on guide pin shaft 307, and during operation, four-axis robot 301 arm descends and can make the detection anchor clamps 302 down the position through buffer spring 308 and have the buffer capacity, guarantees that detection anchor clamps can adapt to the detection of certain difference in height.
The upper frame plate 309 is fixed to the top end of the clamp middle plate 305, the cable fixing plate 310 is fixed to the other end of Gao Jiaban, five pairs of cable fixing members 311 are fixed to the cable fixing plate 310, and the cable fixing members 311 can be used to fasten and fix the wires at the end of the precision sensor 312. One end of a rod end joint bearing 315 is connected to the fixture intermediate plate 305, and the sensor mounting plate 313 is fixed to the other end of the rod end joint bearing 315 by a pin 314, so that the rod end joint bearing 315 can finely adjust the position of the sensor mounting plate 313 in a certain range, thereby enabling the probe of the precision sensor 312 and the special screw 316 to better contact the corresponding surfaces. The precision sensor 312 is mounted on the sensor mounting plate 313, the special screw 316 is mounted on the lower surface of the sensor mounting plate 313, the precision sensor 312 on the detecting clamp 302 is used for contacting the sapphire wafer, the special screw 316 contacts the reference standard surface, in the present invention, the surface of the ceramic disc 8, and the height difference formed by the two is the thickness of the sapphire wafer. When the special screw 316 contacts the reference standard surface during measurement, the five precision sensors 312 are stretched downwards until the sapphire sheet is propped up, and the thickness of the sapphire sheet is obtained by the height difference between the special screw 316 and the precision sensors 312.
The guide mounting plate 4 is a plastic spraying Q235 plate with the length of 921mm, the width of 500mm and the height of 10mm, six waist-shaped holes are formed in two ends of the guide mounting plate 4 in the length direction, the waist-shaped holes are used for fixedly mounting the guide mounting plate 4 on the support frame 1, threaded holes are formed in the side of one waist-shaped hole, and the screw holes are used for fixedly mounting the transition wheel assembly 402 on the guide mounting plate 4. The long side of the guide mounting plate 4 is provided with a U-shaped opening with the length of 125mm multiplied by 150mm, the motor 511 avoids interfering with the guide mounting plate 4 when lifting up and down, and the rectangular opening with the length of 220mm multiplied by 145mm is arranged in the middle of the guide mounting plate 4, so that the purpose is to ensure that the lower vision device 6 can irradiate an object above the guide mounting plate 4. As shown in fig. 7, the ferry wheel assembly 402 includes a welding plate 403, a transition shaft 404, and a bearing roller 405, where the welding plate 403 is provided with a waist-shaped hole, one end of the transition shaft 404 is installed on the waist-shaped hole, and the bearing roller 405 is installed at the other end of the transition shaft 404. The transition wheel assembly 402 may enable transition interfacing with other devices.
As shown in fig. 8, the lifting and conveying device 5 includes two lifting cylinders 501, a distance beam 502, four guide posts 503, a first wire body installation side plate 504, a second wire body installation side plate 505, a blocking member 506, a transmission shaft 507, a plurality of bearing assembly components 508, a short synchronous belt 509, a long synchronous belt 510, a motor 511 and a motor adjusting block 512, wherein the lifting cylinders 501 are fixedly installed on the lower surface of the mounting plate 4, the distance beam 502 is transversely fixed above the lifting cylinders 501, one ends of the four guide posts 503 are vertically fixed below the distance beam 502, and the blocking member 506 is installed on one side of the first wire body installation side plate 504 and one side of the second wire body installation side plate 505. Bearing assembly assemblies 508 are arranged on the first wire body installation side plate 504 and the second wire body installation side plate 505 side by side, and the bearing assembly assemblies 508 are in transmission connection through a long synchronous belt 510 to form a transmission group 500. The drive shaft 507 is mounted at both ends to two bearing mount assemblies 508 on the outermost sides of the drive train 500. The motor 511 is mounted on the second wire body mounting side plate 505 and is located below the transmission set 500, and a bearing assembly 508 is also mounted at the output end of the motor 511, and the bearing assembly 508 at the end of the motor 511 is linked with the bearing assembly 508 at the end of the transmission shaft 507 through a short synchronous belt 509.
As shown in fig. 10, the blocking member 506 includes two blocking cylinder fixing side plates 519, two blocking cylinders 520, a blocking cylinder mounting plate 521, two blocking cylinder connecting plates 522, a stroke sensing member 523, and two blocking rollers 524, wherein one blocking cylinder fixing side plate 519 is respectively mounted at two ends of the blocking cylinder mounting plate 521, the stroke sensing member 523 is mounted at the middle part of the blocking cylinder mounting plate 521, two notches are formed in the blocking cylinder mounting plate 521 with the stroke sensing member 523 as a symmetry center, the blocking cylinder connecting plate 522 is mounted above the notches, blocking cylinders 520 are mounted on the lower surface of the blocking cylinder connecting plate 522, blocking rollers 524 are mounted on the lower surface of the blocking cylinder connecting plate 522, and rotating shafts of the blocking cylinders 520 are connected with the blocking rollers 524.
As shown in fig. 9, the bearing assembly 508 includes a rotary stub shaft 513, a tug 514, a catch wheel 515, a bearing housing 516, two synchronizing wheels 517, and a gland 518, the tug 514, the catch wheel 515, the bearing housing 516, and the two synchronizing wheels 517 are sequentially fixed on the rotary stub shaft 513, and the two synchronizing wheels 517 are fixed on the rotary stub shaft 513 through the gland 518.
As shown in fig. 11, the lower vision device 6 is mounted on the lower surface of the through hole of the guide mounting plate 4, the lower vision device 6 includes a camera connecting bracket 601, a lower camera mounting plate 602, a camera 203, and a lens 204, one side of the camera connecting bracket 601 is fixed on the edge position of the guide mounting plate 4, the lower camera mounting plate 602 is fixed on the other side of the camera connecting bracket 601, the camera 203 is fixed on the lower camera mounting plate 602, the lens 204 is mounted on the camera 203, and the lens 204 faces upward. Information sharing between the lower visual device 6 and the upper visual device 2 is achieved, and after the lower visual device 6 scans the two-dimensional code on the ceramic disc 8, the upper visual device 2 can position the sapphire wafer on the ceramic disc 8 according to the positioning direction of the lower visual device 6 on the two-dimensional code.
The marble inspection platform device 7 is independent of the supporting frame 1 and other devices, as shown in fig. 12, the marble Dan Jiance platform device 7 comprises a welding frame 701, an adjusting bracket 702, a marble platform 703 and cylinders 704, the adjusting bracket 702 is mounted on the top of the adjusting bracket 702, the marble platform 703 is placed on the adjusting bracket 702, one ends of the cylinders 704 are fixed on the marble platform 703, the number of the four cylinders 704 is 4, and the other ends of the four cylinders 704 penetrate through four corresponding holes on the guide mounting plate 4. The lifting and conveying device 5 descends the ceramic disc 8 on the four cylinders 704, and the adjusting bracket 702 can finely adjust the marble platform 703 so that the four cylinders 704 are on the same horizontal plane.
In measurement, the ceramic disc 8 attached with the sapphire wafer firstly passes through the transition wheel assembly 402, and then the ceramic disc 8 moves on the bearing assembly assemblies 508 which are arranged on the first wire body installation side plate 504 and the second wire body installation side plate 505 side by side until the ceramic disc abuts against the two blocking rollers 524 on the blocking member 506. Then, the two lifting cylinders 501 start to descend, and the ceramic disc 8 falls on the four cylinders 704 of the marble inspection platform device 7 during the descent. The two-dimensional code on the back of the ceramic disc 8 is positioned in the direction through the lower vision device 6 arranged on the lower surface of the guide mounting plate 4, the two-dimensional code data information is read, the upper vision device 2 receives the information of the lower vision device 6, and the position of the first wafer is automatically detected on the ceramic disc 8 according to the direction orientation of the lower vision device 6 to the two-dimensional code. After the positioning is finished, the detection device 3 starts to run, under the adjustment of the four-axis robot 301, the detection clamp 302 starts to descend until the special screw 316 contacts the surface of the ceramic disc 8 and contacts the surface of the ceramic disc 8, the five precision sensors 312 start to extend downwards until the sapphire wafer is propped against the sapphire wafer, and the thickness of the sapphire wafer is obtained by the height difference between the special screw 316 and the precision sensors 312. After the first sapphire wafer on the ceramic disc 8 is detected, the mechanical arm of the four-axis robot 301 on the detection device 3 drives the detection clamp 302 to rise to a certain position, then the four-axis robot 301 rotates along the X axis and the Y axis to automatically position the position right above the next sapphire wafer needing to be detected on the ceramic disc 8, then the mechanical arm of the four-axis robot 301 drives the detection clamp 302 to start descending, the detection steps are repeated again until the sapphire wafer needing to be detected on the ceramic disc 8 is detected to be half, the two jacking cylinders 501 on the lifting conveying device 5 work to rise, the two blocking cylinders 520 on the blocking piece 506 descend until the two jacking cylinders 501 rise to the highest point, the motor 511 installed on the wire body installation side plate II 505 starts to rotate, the bearing assembly 508 at one end of the wire body installation side plate 504 and the wire body installation side plate II 505 are driven by the short synchronous belt 509 to rotate through the bearing assembly 508 at one end of the wire transmission shaft 507, and the ceramic assembly 508 installed on the wire body installation side plate II and the wire body installation side plate II is driven to automatically rotate again to the station to convey the ceramic disc 8.
The lifting conveying device and the transition wheel assembly can realize the butt joint conveying with other devices and equipment, and automatically realize the transportation in the horizontal direction and the lifting in the vertical direction. The upper vision device and the lower vision device are adopted to automatically find and position the position direction of the product, so that the detection device can detect data at an accurate position and can read information data carried by the product. The detection device uses a precise sensor, can detect data of five points at one time, avoids repeated detection of the same product, and has detection repetition precision as high as less than or equal to 2 mu m. The marble detection platform device is independent of other device structures, vibration brought by other device structures can be prevented, marble has the effects of absorbing vibration and reducing vibration, products are placed on four cylinders of the marble detection platform device, and then the detection device is used for data detection, so that the influence caused by vibration and shaking is reduced. The invention has simple structure, easy production and manufacture, high detection efficiency and precision, simple maintenance and wide popularization and application.
The above examples are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Various modifications and improvements of the technical scheme of the present invention will fall within the protection scope of the present invention without departing from the design concept of the present invention, and the technical content of the present invention is fully described in the claims.
Claims (7)
1. A device for automatically detecting the thickness of a sapphire wafer, characterized in that: comprises a supporting frame (1), an upper vision device (2), a detection device (3), a guide mounting plate (4), a lifting conveying device (5), a lower vision device (6) and a marble detection platform (7); the upper vision device (2), the detection device (3), the guide mounting plate (4), the lifting conveying device (5) and the lower vision device (6) are all positioned in the support frame (1);
The support frame (1) comprises a first installation surface (11), a second installation surface (12) and a third installation surface (13) from top to bottom, the first installation surface (11), the second installation surface (12) and the third installation surface (13) are communicated, the first installation surface (11) is positioned on the top surface of the support frame (1), the second installation surface (12) is positioned in the middle of the support frame (1), and the third installation surface (13) is positioned between the second installation surface (12) and the bottom surface of the support frame (1); the upper vision device (2) is arranged at a first mounting surface (11) of the support frame (1), the detection device (3) is arranged on a second mounting surface (12), the guide mounting plate (4) is arranged on a third mounting surface (13), the lifting conveying device (5) penetrates through the guide mounting plate (4), the lower vision device (6) is arranged below the guide mounting plate (4), the marble detection platform (7) is arranged in the support frame (1), below the guide mounting plate (4) and independent of the support frame (1);
The upper vision device (2) comprises a camera fixing cross beam (201), an upper camera mounting plate (202), a camera (203) and a lens (204), wherein the camera fixing cross beam (201) is mounted on the central line of the first mounting surface (11), the camera mounting plate (202) is mounted at the center of the camera fixing cross beam (201), the camera (203) is mounted on the camera mounting plate (202), the lens (204) is mounted on the head of the camera (203), and the lens (204) faces downwards;
The detection device (3) consists of a four-axis robot (301) and a detection clamp (302), wherein the detection clamp (302) comprises a connecting end and a detection end, and the connecting end comprises a clamp connecting block (303), a sliding block (304), a clamp middle plate (305), a buffer fixing block (306), a guide pin shaft (307), a buffer spring (308), a high frame plate (309) and a rod end joint bearing (315); the detection end comprises a cable fixing plate (310), a cable fixing piece (311), a precision sensor (312), a sensor mounting plate (313), a pin shaft (314) and special screws (316); the four-axis robot (301) mechanical arm end is connected with a clamp connecting block (303), the clamp connecting block (303) is connected with a clamp middle plate (305) in a sliding manner through a sliding block (304), one end of a buffer fixing block (306) is fixed to the middle part of the clamp middle plate (305), the other end of the buffer fixing block (306) is connected with the clamp connecting block (303) through a guide pin shaft (307), a buffer spring (308) is arranged on the guide pin shaft (307), a high frame plate (309) is fixed to the top end of the clamp middle plate (305), a cable fixing plate (310) is fixed to the other end of Gao Jiaban (309), a cable fixing piece (311) is fixed to a cable fixing plate (310), one end of a rod end joint bearing (315) is connected to the clamp middle plate (305), an inductor mounting plate (313) is fixed to the other end of the rod end joint bearing (315) through a pin shaft (314), a precision inductor (312) probe is arranged on the inductor mounting plate (313), a wire of the precision inductor (312) is fixed to the cable fixing piece (311), and a special screw (316) is arranged on the lower surface of the inductor mounting plate (313);
The lower vision device (6) install in the lower surface of direction mounting panel (4) through-hole, lower vision device (6) include camera linking bridge (601), lower camera mounting panel (602), camera (203), camera (204), one side of camera linking bridge (601) is fixed in direction mounting panel (4) border position, lower camera mounting panel (602) is fixed in the opposite side of camera linking bridge (601), camera (203) are fixed in on lower camera mounting panel (602), camera (204) are installed on camera (203), and camera (204) orientation is upwards.
2. The apparatus for automatically detecting the thickness of a sapphire wafer according to claim 1, wherein: a plurality of waist-shaped holes are respectively formed in two opposite sides of the guide mounting plate (4), a U-shaped opening is formed in the other side of the guide mounting plate (4), a through hole is formed in the middle of the guide mounting plate (4), and the guide mounting plate (4) is fixed to the support frame (1) through the waist-shaped holes.
3. The apparatus for automatically detecting the thickness of a sapphire wafer according to claim 1, wherein: transition wheel subassembly (402) are installed to one end of direction mounting panel (4), and transition wheel subassembly (402) are including welded plate (403), transition axle (404), bearing roller (405), have seted up waist type hole on welded plate (403), one end of transition axle (404) install in on the waist type hole, the other end in transition axle (404) is installed to bearing roller (405).
4. The apparatus for automatically detecting the thickness of a sapphire wafer according to claim 1, wherein: the lifting conveying device (5) comprises two lifting cylinders (501), a distance beam (502), four guide posts (503), a first wire body installation side plate (504), a second wire body installation side plate (505), a blocking piece (506), a transmission shaft (507), a plurality of bearing assembly components (508), a short synchronous belt (509), a long synchronous belt (510), a motor (511) and a motor adjusting block (512), wherein the lifting cylinders (501) are fixedly arranged on the lower surface of the guide installation plate (4), the distance beam (502) is transversely fixed above the lifting cylinders (501), one ends of the first wire body installation side plate (504) and the second wire body installation side plate (505) are vertically fixed below the distance beam (502), and the blocking piece (506) is arranged on one side of the first wire body installation side plate (504) and one side of the second wire body installation side plate (505); bearing assembly assemblies (508) are arranged on the first wire body installation side plate (504) and the second wire body installation side plate (505) side by side, and the bearing assembly assemblies (508) are in transmission connection through a long synchronous belt (510) to form a transmission group (500); two ends of the transmission shaft (507) are arranged on two bearing assembly assemblies (508) at the outermost side of the transmission group (500); the motor (511) is arranged on the wire body installation side plate II (505) and is positioned below the transmission group (500), the output end of the motor (511) is also provided with a bearing assembly component (508), and the bearing assembly component (508) at the end of the motor (511) is connected with the bearing assembly component (508) at one end of the transmission shaft (507) through a short synchronous belt (509).
5. The apparatus for automatically detecting the thickness of a sapphire wafer according to claim 4, wherein: the blocking piece (506) comprises two blocking cylinder fixing side plates (519), two blocking cylinders (520) and blocking cylinder mounting plates (521), two blocking cylinder connecting plates (522), a stroke sensing piece (523) and two blocking rollers (524), wherein one blocking cylinder fixing side plate (519) is respectively mounted at two ends of each blocking cylinder mounting plate (521), each stroke sensing piece (523) is mounted in the middle of each blocking cylinder mounting plate (521), each stroke sensing piece (523) is used as a symmetrical center, two notches are formed in each blocking cylinder mounting plate (521), blocking cylinder connecting plates (522) are mounted above each notch, blocking cylinders (520) are mounted on the lower surface of each blocking cylinder connecting plate (522), blocking rollers (524) are mounted on the lower surface of each blocking cylinder connecting plate (522), and the rotating shafts of the blocking cylinders (520) are connected with the corresponding blocking rollers (524).
6. The apparatus for automatically detecting the thickness of a sapphire wafer according to claim 4, wherein: the bearing assembly (508) comprises a rotary short shaft (513), a tug wheel (514), a catch wheel (515), a bearing seat (516), two synchronous wheels (517) and a gland (518), wherein the tug wheel (514), the catch wheel (515), the bearing seat (516) and the two synchronous wheels (517) are sequentially fixed on the rotary short shaft (513), and the two synchronous wheels (517) are fixed on the rotary short shaft (513) through the gland (518).
7. The apparatus for automatically detecting the thickness of a sapphire wafer according to claim 1, wherein: marble testing platform (7) include weld holder (701), adjust support (702), marble platform (703), cylinder (704), adjust support (702) and install in adjusting support (702) top, marble platform (703) are placed on adjusting support (702), and cylinder (704) one end is fixed in on marble platform (703), and the other end of cylinder (704) passes direction mounting panel (4).
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| CN110927064B (en) * | 2020-01-21 | 2020-06-19 | 北京中鼎高科自动化技术有限公司 | Intelligent efficient sagger detection device based on visual system |
| CN113008145A (en) * | 2021-02-08 | 2021-06-22 | 厦门特仪科技有限公司 | Multi-probe automatic online thickness measuring device and thickness measuring method thereof |
| CN113048911B (en) * | 2021-03-11 | 2022-08-26 | 浙江环宇轴承有限公司 | Radian detection device for bearing machining and detection method thereof |
| CN114427818A (en) * | 2021-12-28 | 2022-05-03 | 甘肃旭晶新材料有限公司 | Measuring device for sapphire wafer |
| CN116448027B (en) * | 2023-06-16 | 2023-10-13 | 浙江晶盛机电股份有限公司 | Wafer measurement system and wafer measurement method |
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| EP0897887B1 (en) * | 1997-08-15 | 2002-04-17 | Ferag AG | Method and device for checking the thickness of sheetlike objects conveyed continuously |
| FR2959864B1 (en) * | 2010-05-06 | 2013-01-18 | Altatech Semiconductor | DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR MOVING PLATELETS. |
| CN204854640U (en) * | 2015-08-25 | 2015-12-09 | 上海盾杰电子科技有限公司 | Long wide and wall thickness check out test set in product |
| CN109724522A (en) * | 2017-10-27 | 2019-05-07 | 群光电子(苏州)有限公司 | A kind of product thickness verifying attachment |
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