CN110602867B - PCB design method and system for improving power supply connection stability of server and PCB - Google Patents
PCB design method and system for improving power supply connection stability of server and PCB Download PDFInfo
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- CN110602867B CN110602867B CN201910736069.3A CN201910736069A CN110602867B CN 110602867 B CN110602867 B CN 110602867B CN 201910736069 A CN201910736069 A CN 201910736069A CN 110602867 B CN110602867 B CN 110602867B
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- 238000013461 design Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 238000003475 lamination Methods 0.000 claims abstract description 9
- 238000006748 scratching Methods 0.000 abstract description 2
- 230000002393 scratching effect Effects 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 40
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013135 deep learning Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a PCB design method and a system for improving the power supply connection stability of a server and a PCB. In the same lamination, the distance between the power supply surface at the high-current connection position of the PCB and the adjacent power supply surface and the distance between the power supply surface and the part are both 100 mils; the diameter of the screw gasket is smaller than that of the bare copper of the power supply surface. Based on the design method provided by the invention, the invention further provides a design system and a PCB. The invention can effectively avoid short circuit caused by scratching the PCB by the screw, and even if the PCB is scratched and damaged, the attributes of different laminated layers are the same, so that the problems of short circuit current and burning and the like can not be generated, and the product stability and quality of the high-performance server can be effectively improved.
Description
Technical Field
The invention belongs to the technical field of server power supply, and particularly relates to a PCB design method and system for improving the power supply connection stability of a server and a PCB.
Background
In recent years, with the development of cloud computing, big data, artificial intelligence and deep learning technology and the development of high-performance computing in the non-scientific field, the high-performance computing server has gained explosive growth. With the continuous expansion of the scale of the internet and the interest of the era of the internet +, the research and development of key technologies of the internet of things and the application demonstration in key fields are promoted, the construction of a cloud computing big data service platform is enhanced, and the demand of a high-end server is greatly increased. Meanwhile, the data volume of the big data technology is increased explosively under the promotion of advanced data acquisition technology and higher analysis requirements, and the high-performance server is a necessary choice for big data access and processing and is in vigorous demand along with the development of the big data technology. As the role of the high-performance server in the server field becomes more and more important, the product stability of the high-performance server becomes an important index for the design of the high-performance server. As the application scenes of the high-performance server are more and more, the data processing amount is larger and larger, and the system power consumption system current of the high-performance server is also larger and larger. The high current can produce higher heat in the power supply junction, can burn out the integrated circuit board of high performance server in the twinkling of an eye when the short circuit, solves the design of good high performance server heavy current power supply junction just can very big improvement high performance server's product stability.
In the prior art, lock screw power supply is a common power supply connection mode. However, the PCB is easily damaged by the screws, the power attributes of different laminated PCBs are different, and short circuit between different power attributes can occur after the PCBs are damaged, so that the product stability and the product quality of the high-performance server are seriously affected by the problems of PCB burnout and the like.
Disclosure of Invention
The invention provides a PCB design method and system for improving the power supply connection stability of a server and a PCB. The product stability and the product quality of the high-performance server are effectively improved by modifying the attribute of the power plane at the large-current connection position of the PCB.
In order to achieve the above object, the present invention provides a PCB design method for improving the power supply connection stability of a server, the method comprising the steps of:
the power supply attributes of adjacent laminated power supply surfaces of the PCB are changed from repulsion to the same at the large-current connection position of the PCB, and a plurality of VIA through holes are arranged around the large-current connection position of the PCB and used for balancing the current density of the PCB and dissipating heat.
Furthermore, in the same lamination, the distance between the power supply surface at the high-current connection position of the PCB and the adjacent power supply surface is 100 mil; meanwhile, the distance between the power supply surface at the large-current connection position of the PCB and the same laminated part is 100 mil.
Furthermore, the high-current connection position of the PCB is a power supply connection position for the PCB through a lock screw.
Furthermore, the diameter of the screw gasket at the high-current connection position of the PCB is smaller than that of bare copper on the power supply surface at the high-current connection position of the PCB; the diameter of the screw gasket is smaller than the length of the diameter of the bare copper of the power supply surface; and the difference in length is greater than 20 mils.
Furthermore, the number of the VIA through holes is set according to the current amount passing through the large-current connection part of the PCB; the current passed through each VIA hole was 1A.
The invention also provides a PCB design system for improving the power supply connection stability of the server, which comprises a first design module;
the first design module is used for changing the power supply attribute of the adjacent laminated power supply surfaces of the PCB from repulsion to the same at the large-current connection position of the PCB, and a plurality of VIA through holes are arranged around the large-current connection position of the PCB.
Further, the system further comprises a second design module and a third design module;
the second design module is used for setting the distance between a power supply surface at the heavy current connection position of the PCB and an adjacent power supply surface to be 100mil in the same lamination for the PCB with the modified power supply attribute; setting the distance between a power supply surface at the large-current connection position of the PCB and the same laminated part to be 100 mil;
the third design module is used for enabling the diameter of a screw gasket at the high-current connection position of the PCB to be smaller than the diameter of bare copper on a power supply surface at the high-current connection position of the PCB; the diameter of the screw gasket is smaller than the length of the diameter of the bare copper of the power supply surface; and the difference in length is greater than 20 mils.
The invention further provides a PCB which is manufactured based on the PCB design method for improving the power supply connection stability of the server.
The effect provided in the summary of the invention is only the effect of the embodiment, not all the effects of the invention, and one of the above technical solutions has the following advantages or beneficial effects:
the embodiment of the invention provides a PCB design method and system for improving the power supply connection stability of a server and a PCB, wherein in the high-current connection position of the PCB, the power supply attribute of the adjacent laminated power supply surfaces of the PCB is changed from repulsion to identity, a plurality of VIA through holes are arranged around the high-current connection of the PCB and used for balancing the current density of the PCB and dissipating heat, the current passing through each VIA through hole is 1A, and the number of the VIA through holes required to be arranged can be determined according to the requirement of the passing current. In the same lamination, the distance between the power supply surface at the high-current connection position of the PCB and the adjacent power supply surface is 100 mil; meanwhile, the distance between the power supply surface at the large-current connection position of the PCB and the same laminated part is 100 mil. The diameter of the screw gasket at the high-current connection position of the PCB is smaller than that of bare copper on the power supply surface at the high-current connection position of the PCB; the diameter of the screw gasket is smaller than the length of the diameter of the bare copper of the power supply surface; and the difference in length is greater than 20 mils. Based on the PCB design method for improving the power supply connection stability of the server, the invention also provides a PCB design system for improving the power supply connection stability of the server and a PCB. The invention is suitable for server systems powered by high current, such as other AI servers, blade servers, storage servers, edge computing servers, complete cabinet servers and the like, and is also suitable for the design of power supply connection PCBs at other high current connections. The PCB layout method provided by the invention can effectively avoid the short circuit burning phenomenon caused by scratching the PCB by the screw, and even if the PCB is scratched and damaged, the attributes of different laminated layers of the PCB are the same, so that the problems of short circuit current and burning and the like can not be caused. The product stability and the product quality of the high-performance server can be effectively improved, serious quality problems such as burning of power supply connection parts are avoided, and the customer satisfaction is improved.
Drawings
Fig. 1 is a schematic design diagram of a PCB of 6 layers in a PCB design method for improving power supply connection stability of a server according to embodiment 1 of the present invention;
fig. 2 is a flowchart of a PCB design method for improving the power supply connection stability of a server according to embodiment 1 of the present invention;
fig. 3 is a schematic diagram of a PCB design system for improving the power connection stability of a server according to embodiment 1 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Example 1
The embodiment 1 of the invention provides a PCB design method and system for improving the power supply connection stability of a server and a PCB. According to the method, the power supply attributes of adjacent laminated power supply surfaces of the PCB are changed from repulsion to the same at the large-current connection position of the PCB, a plurality of VIA through holes are formed around the large-current connection position of the PCB and used for balancing and radiating the current density of the PCB, the current passing through each VIA through hole is 1A, and the number of the VIA through holes required to be formed can be determined according to the current passing requirement.
The PCB board heavy current junction is the PCB board power supply junction through the lock screw.
In the same lamination, the distance between the power supply surface at the high-current connection position of the PCB and the adjacent power supply surface is 100 mil; meanwhile, the distance between the power supply surface at the large-current connection position of the PCB and the same laminated part is 100 mil. The distance between the adjacent power supply surfaces is large enough to ensure that the adjacent power supply surfaces cannot generate interference; the distance between the power supply surface at the large-current connection position of the PCB and the same laminated part is large enough, so that the power supply surface and the same laminated part cannot be interfered.
The diameter of the screw gasket at the high-current connection position of the PCB is smaller than that of bare copper on the power supply surface at the high-current connection position of the PCB; the diameter of the screw gasket is smaller than the length of the diameter of the bare copper of the power supply surface; and the difference in length is greater than 20 mils. The power supply surface width of the large-current connection position of the PCB is ensured to be larger than the diameter of the screw gasket, and the phenomenon of short circuit burning cannot occur.
Fig. 1 is a schematic design diagram of a PCB of 6 layers in a PCB design method for improving power supply connection stability of a server according to embodiment 1 of the present invention;
the TOP layer is a power supply layer in which the property of the first power supply plane at the first large-current connection is P12V and the property of the second power supply plane at the second large-current connection is GND. The first power plane and the second power plane are spaced at 100 mils, and the first power plane is spaced at 100 mils from the TOP stack features.
The second layer is a GND layer, and in the present invention, the property of the third power plane at the first large-current connection is modified to P12V which is the same as the property of the first power plane of the TOP layer, and the property of the fourth power plane at the second large-current connection is kept GND.
The third layer is a power supply layer, and in the present invention, the property of the fifth power supply plane at the first large-current connection is held at P12V, and the property of the sixth power supply plane at the second large-current connection is modified to GND which is the same as the property of the fourth power supply plane at the second layer.
The fourth layer is a GND layer, and in the present invention, the property of the seventh power supply plane at the first large-current connection is modified to P12V which is the same as the property of the fifth power supply plane of the third layer, and the property of the eighth power supply plane at the second large-current connection is kept GND.
The fifth layer is a signal layer, and in the present invention, the property of the ninth power plane at the connection with the first large current is modified to P12V which is the same as the property of the seventh power plane of the fourth layer, and the property of the tenth power plane at the connection with the second large current is modified to GND which is the same as the property of the eighth power plane of the fourth layer.
The sixth layer is a GND layer, and in the present invention, the property of the eleventh power plane at the first large-current connection is modified to P12V which is the same as the property of the ninth power plane at the fifth layer, and the property of the twelfth power plane at the second large-current connection is kept GND.
FR4 insulating material is placed in between each stack. All set up sufficient quantity of VIA through-hole around first heavy current junction and second heavy current junction, make current density more balanced, the copper sheet heat dissipation is faster, and the electric current that every VIA through-hole passes through is 1A, if the electric current that needs to pass through at first heavy current junction is 10A, then need set up 10 VIA through-holes around first heavy current junction.
The diameter of the screw pad at the first large current connection must be smaller than the bare copper of the first power plane PCB in the PCB by more than 20 mil. The bare copper widths of the first power plane, the third power plane, the fifth power plane, the seventh power plane, the ninth power plane and the eleventh power plane are the same. Similarly, the diameter of the screw pad at the second high current connection must be less than 20mil or more of the bare copper of the PCB on the second power plane of the PCB. The second power plane, the fourth power plane, the sixth power plane, the eighth power plane, the tenth power plane and the twelfth power plane have the same bare copper width.
The structure protected by the invention is not limited to the design of the 6-layer plate listed in the embodiment 1, and is also suitable for server systems powered by high current, such as other AI servers, blade servers, storage servers, edge calculation servers, complete cabinet servers and the like, and is also suitable for the design of power supply connection PCBs at other high current connection positions.
Fig. 2 is a flowchart of a PCB design method for improving the power supply connection stability of a server according to embodiment 1 of the present invention;
in step S201, at the high-current connection point of the PCB, the power attributes of the adjacent stacked power planes of the PCB are modified from repulsion to identity, and a plurality of VIA through holes are disposed around the high-current connection point of the PCB.
In step S202, in the same lamination, the distance between the power plane at the large current connection of the PCB and the adjacent power plane is set to be 100 mil; meanwhile, the distance between the power supply surface at the large-current connection position of the PCB and the same laminated part is 100 mil.
In step S203, the diameter of the screw gasket at the high-current connection position of the PCB is set to be smaller than the diameter of the bare copper of the power plane at the high-current connection position of the PCB; and the diameter of the screw gasket is smaller than the length of the diameter of the bare copper of the power supply surface, and the difference value of the lengths is smaller than 20 mil.
The invention further provides a PCB design system for improving the power supply connection stability of the server, and fig. 3 is a schematic diagram of the PCB design system for improving the power supply connection stability of the server provided by embodiment 1 of the invention. The design method comprises the steps of including a first design module, a second design module and a third design module;
the first design module is used for modifying the power supply attribute of the adjacent laminated power supply surfaces of the PCB to be the same from repulsion at the large-current connection position of the PCB, and a plurality of VIA through holes are arranged around the large-current connection position of the PCB.
The second design module is used for setting the distance between the power supply surface at the heavy current connection position of the PCB and the adjacent power supply surface to be 100mil in the same lamination for the PCB with the modified power supply attribute; setting the distance between a power supply surface at the large-current connection position of the PCB and the same laminated part to be 100 mil;
the third design module is used for setting the diameter of a screw gasket at the high-current connection position of the PCB to be smaller than the diameter of bare copper on the power surface at the high-current connection position of the PCB; and the diameter of the screw gasket is smaller than the length of the diameter of the bare copper of the power supply surface, and the difference value of the lengths is larger than 20 mil.
The invention further provides a PCB which is manufactured based on the PCB design method for improving the power supply connection stability of the server.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the present invention as defined in the accompanying claims.
Claims (5)
1. The PCB design method for improving the power supply connection stability of the server is characterized by comprising the following steps of: the power supply attributes of adjacent laminated power supply surfaces of the PCB are changed from repulsion to the same at the large-current connection position of the PCB, and a plurality of VIA through holes are arranged around the large-current connection position of the PCB and used for balancing the current density of the PCB and dissipating heat;
the high-current connecting part of the PCB is a connecting part for supplying power to the PCB through a locking screw; the diameter of the screw gasket at the high-current connection position of the PCB is smaller than that of bare copper on the power supply surface at the high-current connection position of the PCB; the diameter of the screw gasket is smaller than the length of the diameter of the bare copper of the power supply surface; and the difference in length is greater than 20 mils.
2. The PCB design method for improving the power supply connection stability of the server as claimed in claim 1, wherein in the same lamination layer, the distance between the power plane at the high current connection position of the PCB and the adjacent power plane is 100 mil; meanwhile, the distance between the power supply surface at the large-current connection position of the PCB and the same laminated part is 100 mil.
3. The PCB design method for improving the power supply connection stability of the server according to claim 1, wherein the number of VIA through holes is set according to the amount of current passing through the high-current connection part of the PCB; the current passed through each VIA hole was 1A.
4. The PCB design system for improving the power supply connection stability of the server is characterized by comprising a first design module;
the first design module is used for changing the power supply attribute of the adjacent laminated power supply surfaces of the PCB from repulsion to identity at the high-current connection position of the PCB, and a plurality of VIA through holes are arranged around the high-current connection position of the PCB;
the system further includes a second design module and a third design module;
the second design module is used for setting the distance between a power supply surface at the heavy current connection position of the PCB and an adjacent power supply surface to be 100mil in the same lamination for the PCB with the modified power supply attribute; setting the distance between a power supply surface at the large-current connection position of the PCB and the same laminated part to be 100 mil;
the third design module is used for setting the diameter of the screw gasket at the high-current connection position of the PCB to be smaller than the diameter of bare copper on the power surface at the high-current connection position of the PCB; the diameter of the screw gasket is smaller than the length of the diameter of the bare copper of the power supply surface; and the difference in length is greater than 20 mils.
5. A PCB board manufactured by the PCB design method for improving the power supply connection stability of the server according to any one of claims 1 to 3.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910736069.3A CN110602867B (en) | 2019-08-09 | 2019-08-09 | PCB design method and system for improving power supply connection stability of server and PCB |
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| CN201910736069.3A CN110602867B (en) | 2019-08-09 | 2019-08-09 | PCB design method and system for improving power supply connection stability of server and PCB |
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| CN110602867A CN110602867A (en) | 2019-12-20 |
| CN110602867B true CN110602867B (en) | 2020-11-10 |
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| JP3884580B2 (en) * | 1998-09-29 | 2007-02-21 | 株式会社ルネサステクノロジ | Hybrid integrated circuit device and electronic device incorporating the hybrid integrated circuit device |
| US7256354B2 (en) * | 2000-06-19 | 2007-08-14 | Wyrzykowska Aneta O | Technique for reducing the number of layers in a multilayer circuit board |
| CN206402527U (en) * | 2017-01-22 | 2017-08-11 | 东莞市华拓电子有限公司 | A kind of radiating explosion-proof type PCB multilayer board |
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