CN110600418B - Stripping method and stripping device for flexible display device - Google Patents
Stripping method and stripping device for flexible display device Download PDFInfo
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- CN110600418B CN110600418B CN201910786284.4A CN201910786284A CN110600418B CN 110600418 B CN110600418 B CN 110600418B CN 201910786284 A CN201910786284 A CN 201910786284A CN 110600418 B CN110600418 B CN 110600418B
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- display panel
- film
- chip
- height
- suction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Abstract
The present disclosure provides a peeling method of a flexible display device and a peeling device thereof. The peeling method comprises the steps of providing a flexible display device, wherein the flexible display device comprises a display panel, glue and a chip on film, the display panel is provided with a chip on film binding area, the glue is arranged on the chip on film binding area, the chip on film is bound to the display panel through the glue, the peeling device is provided and comprises an arm, at least one first adsorption member and at least one second adsorption member, the at least one first adsorption member is connected with the arm, the chip on film is grabbed by the at least one first adsorption member, the chip on film is grabbed by the at least one second adsorption member, the height of the at least one second adsorption member used for grabbing the chip on film and the height of the at least one first adsorption member used for grabbing the display panel have a height difference, and the display panel is peeled. The yield of peeling the display panel can be improved through the display panel peeling method.
Description
[ technical field ] A method for producing a semiconductor device
The present disclosure relates to the field of display technologies, and in particular, to a method and an apparatus for peeling a flexible display device.
[ background of the invention ]
In the prior art, the yield of the stripping method of the flexible display device is poor, and no corresponding scheme exists for the glue overflow on the binding region of the flip chip film, so that the glue adheres to the display panel, the display panel is difficult to strip, and the product is scrapped.
Therefore, there is a need to provide a method and an apparatus for peeling off a flexible display device to solve the problems of the prior art.
[ summary of the invention ]
In order to solve the above-mentioned problems, an object of the present disclosure is to provide a peeling method and a peeling apparatus for a flexible display device, which can improve the yield of peeling a display panel.
To achieve the above objects, the present disclosure provides a method for peeling a flexible display device. The peeling method comprises the steps of providing a flexible display device, wherein the flexible display device comprises a display panel, glue and a chip on film, the display panel is provided with a chip on film binding area, the glue is arranged on the chip on film binding area, the chip on film is bound to the display panel through the glue, the peeling device is provided and comprises an arm, at least one first adsorption member and at least one second adsorption member, the at least one first adsorption member is connected with the arm, the chip on film is grabbed by the at least one first adsorption member, the chip on film is grabbed by the at least one second adsorption member, the height of the at least one second adsorption member used for grabbing the chip on film and the height of the at least one first adsorption member used for grabbing the display panel have a height difference, and the display panel is peeled.
In one embodiment of the present disclosure, the height of the at least one second suction member is adjusted to grasp the flip chip film by the at least one second suction member.
In one embodiment of the present disclosure, the at least one first suction member includes at least one first suction nozzle, and the at least one second suction member includes at least one second suction nozzle.
In an embodiment of the disclosure, the adhesive and the display panel lose adhesion by applying a force to the flip chip film through the at least one second suction nozzle.
In one embodiment of the present disclosure, the colloid is an anisotropic conductive film.
In one embodiment of the disclosure, the flexible display device further includes a flexible circuit board connected to the flip-chip film, the peeling device is further connected to at least one third suction member of the arm, and the flexible circuit board is grasped by the at least one third suction member.
In one embodiment of the disclosure, a height of the at least one second suction member for grasping the chip on film and a height of the at least one third suction member for grasping the flexible circuit board have a height difference.
In one embodiment of the present disclosure, a height of the at least one first suction member grasping the display panel is the same as a height of the at least one third suction member grasping the flexible circuit board.
In one embodiment of the present disclosure, the at least one third suction member includes at least one third suction nozzle.
The present disclosure provides a peeling apparatus of a flexible display device. The stripping device comprises an arm, at least one first adsorption component connected with the arm and at least one second adsorption component connected with the arm. The display panel is grabbed through the at least one first adsorption member, and the chip on film is grabbed through the at least one second adsorption member. The height of the at least one second adsorption member for grabbing the chip on film and the height of the at least one first adsorption member for grabbing the display panel have a height difference.
Since the peeling method of the flexible display device and the peeling device thereof in the embodiments of the present disclosure include providing the flexible display device, the flexible display device includes a display panel, a sealant, and a flip chip, the display panel has a flip chip bonding area, the sealant is disposed on the flip chip bonding area, the flip chip is bonded to the display panel through the sealant, providing the peeling device, the peeling device includes an arm, and at least one first absorption member and at least one second absorption member connected to the arm, the display panel is grabbed by the at least one first absorption member and the flip chip is grabbed by the at least one second absorption member, a height of the at least one second absorption member grabbing the flip chip and a height of the at least one first absorption member grabbing the display panel have a height difference, and peeling the display panel. The yield of peeling the display panel can be improved through the display panel peeling method.
In order to make the aforementioned and other aspects of the present disclosure more comprehensible, preferred embodiments accompanied with figures are described in detail below:
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of a peeling apparatus of a flexible display device according to an embodiment of the disclosure.
Fig. 2 is a flow chart illustrating a peeling method of a flexible display device according to an embodiment of the disclosure.
[ detailed description ] embodiments
In order to make the aforementioned and other objects, features and advantages of the present disclosure comprehensible, preferred embodiments accompanied with figures are described in detail below. Furthermore, directional phrases used in this disclosure, such as, for example, upper, lower, top, bottom, front, rear, left, right, inner, outer, lateral, peripheral, central, horizontal, lateral, vertical, longitudinal, axial, radial, uppermost or lowermost, etc., refer only to the orientation of the attached drawings. Accordingly, the directional terms used are used for the purpose of illustration and understanding of the present disclosure, and are not used to limit the present disclosure.
In the drawings, elements having similar structures are denoted by the same reference numerals.
Referring to fig. 1 and 2, embodiments of the present disclosure provide a peeling method of a flexible display device and a peeling apparatus thereof. The peeling method 200 includes a step 210 of providing a flexible display device 10, the flexible display device 10 including a display panel 12, a sealant 14 and a flip-chip film 16, the display panel 12 having a flip-chip film bonding region 122, the sealant 14 being disposed on the flip-chip film bonding region 122, the flip-chip film 16 being bonded to the display panel 12 through the sealant 14, a step 220 of providing a peeling device 20, the peeling device 20 including an arm 22 and at least one first suction member 24 and at least one second suction member 26 connected to the arm 22, a step 230 of grasping the display panel 12 through the at least one first suction member 24 and grasping the flip-chip film 16 through the at least one second suction member 26, a step 240 of grasping the flip-chip film 16, and a step 24 of grasping the at least one second suction member 26 of the display panel 12, the height of the at least one first suction member 24 of the display panel 12 having a height difference, and a step 250 of peeling off the display panel 12. Arm 22 is, for example, a Robot arm.
Specifically, in one embodiment of the present disclosure, the height of the at least one second suction member 26 is adjusted to grasp the flip chip 16 by the at least one second suction member 26. Specifically, in one embodiment of the present disclosure, the at least one first suction member 24 includes at least one first suction nozzle 242, and the at least one second suction member 26 includes at least one second suction nozzle 262. Specifically, in one embodiment of the present disclosure, the display panel 12 is grasped by the at least one first suction nozzle 242, so that the display panel 12 is stably adsorbed by the at least one first suction nozzle 242. Specifically, in one embodiment of the present disclosure, the at least one second suction nozzle 262 applies a downward force to the flip-chip film 16, so that the adhesive 14 and the display panel 12 lose adhesion. Specifically, in one embodiment of the present disclosure, the colloid 14 is an anisotropic conductive film.
Specifically, in one embodiment of the present disclosure, the flexible display device 10 further includes a flexible circuit board 18 connected to the flip-chip film 16, the peeling device 20 is further connected to at least one third suction member 28 of the arm 22, and the flexible circuit board 18 is grabbed by the at least one third suction member 28. Specifically, in one embodiment of the present disclosure, the at least one third suction member 28 includes at least one third suction nozzle 282. Specifically, in one embodiment of the present disclosure, the flexible circuit board 18 is grasped by the at least one third suction nozzle 282, such that the flexible circuit board 18 is stably adsorbed by the at least one third suction nozzle 282.
Specifically, in one embodiment of the present disclosure, the number of the at least one first suction member 24 is greater than the number of the at least one second suction member 26 and the number of the at least one third suction member 28, so that the display panel 12 is stably held by the at least one first suction member 24. Specifically, in one embodiment of the present disclosure, the number of the at least one first suction nozzle 242 is greater than the number of the at least one second suction nozzle 262 and the number of the at least one third suction nozzle 282, such that the display panel 12 is stably adsorbed by the at least one first suction nozzle 242.
Specifically, in one embodiment of the present disclosure, the number of the at least one second adsorption element 26 is equal to the number of the at least one third adsorption element 28. Specifically, in one embodiment of the present disclosure, the number of the at least one second suction nozzle 262 is equal to the number of the at least one third suction nozzle 282.
Specifically, in one embodiment of the present disclosure, the height of the at least one second suction member 26 gripping the flip chip 16 and the height of the at least one third suction member 28 gripping the flexible circuit board 18 have a height difference.
Specifically, in one embodiment of the present disclosure, the height of the at least one first suction member 24 grasping the display panel 12 is the same as the height of the at least one third suction member 28 grasping the flexible circuit board 18.
Specifically, in one embodiment of the present disclosure, the colloid 14 and the display panel 12 are de-adhered by a force applied by the at least one second suction member 26 and adjusting the height of the at least one second suction nozzle 262. When the display panel 12 is peeled off, the colloid 14 is prevented from adhering to the display panel 12, and the product is prevented from being scrapped.
Specifically, in one embodiment of the present disclosure, the steps are as follows. 1. The arm 22 adds the at least one second suction member 26 and adjusts the height of the at least one second suction nozzle 262. 2. After the peeling device 20 picks the display panel 12, the adhesive 14 and the display panel 12 are separated from each other due to the force, so that the adhesive 14 is prevented from adhering to the display panel 12, and when the display panel 12 is peeled and removed, the display panel 12 is not damaged, and the abnormality such as product scrap or poor functionality is avoided.
In summary, in the peeling method of the flexible display device and the peeling apparatus thereof in the embodiments of the present disclosure, the peeling method includes providing the flexible display device, the flexible display device includes a display panel, a sealant and a flip chip, the display panel has a flip chip bonding area, the sealant is disposed on the flip chip bonding area, the flip chip is bonded to the display panel through the sealant, providing the peeling apparatus, the peeling apparatus includes an arm, and at least one first absorption member and at least one second absorption member connected to the arm, the at least one first absorption member captures the display panel and the at least one second absorption member captures the flip chip, a height of the at least one second absorption member capturing the flip chip and a height of the at least one first absorption member capturing the display panel have a height difference, and peeling the display panel. The yield of peeling the display panel can be improved through the display panel peeling method.
Although the disclosure has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based upon a reading and understanding of this specification and the annexed drawings. The present disclosure includes all such modifications and alterations, and is limited only by the scope of the appended claims. In particular regard to the various functions performed by the above described components, the terms used to describe such components are intended to correspond, unless otherwise indicated, to any component which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the specification. In addition, while a particular feature of the specification may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for a given or particular application. Furthermore, to the extent that the terms "includes," has, "" contains, "or variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term" comprising.
The foregoing is merely a preferred embodiment of the present disclosure, and it should be noted that modifications and refinements may be made by those skilled in the art without departing from the principle of the present disclosure, and these modifications and refinements should also be construed as the protection scope of the present disclosure.
Claims (7)
1. A peeling method of a flexible display device, the peeling method comprising:
providing a flexible display device, wherein the flexible display device comprises a display panel, colloid and a chip on film, the display panel is provided with a chip on film binding area, the colloid is arranged on the chip on film binding area, and the chip on film is bound to the display panel through the colloid;
providing a stripping device, wherein the stripping device comprises an arm and at least one first adsorption member and at least one second adsorption member which are connected with the arm;
grabbing the display panel through the at least one first adsorption member and grabbing the chip on film through the at least one second adsorption member;
the height of the at least one second adsorption component for grabbing the chip on film and the height of the at least one first adsorption component for grabbing the display panel have a height difference; and
peeling off the display panel;
the height of the at least one second suction member is adjusted to grab the chip on film through the at least one second suction member, the at least one first suction member comprises at least one first suction nozzle, the at least one second suction member comprises at least one second suction nozzle, the chip on film is downwards forced through the at least one second suction nozzle, the glue body and the display panel lose viscosity, and the number of the at least one first suction nozzle is larger than that of the at least one second suction nozzle, so that the display panel is stably sucked by the at least one first suction nozzle.
2. The peeling method of a flexible display device according to claim 1, wherein the adhesive is an anisotropic conductive adhesive film.
3. The peeling method of a flexible display device according to claim 1, wherein the flexible display device further comprises a flexible circuit board connected to the flip-chip film, the peeling device is further connected to at least one third suction member of the arm, and the flexible circuit board is grasped by the at least one third suction member.
4. The peeling method of the flexible display device according to claim 3, wherein a height of the at least one second suction member grasping the flip-chip film and a height of the at least one third suction member grasping the flexible circuit board have a height difference.
5. The peeling method of a flexible display device according to claim 4, wherein a height of the at least one first suction member grasping the display panel is the same as a height of the at least one third suction member grasping the flexible circuit board.
6. The method of claim 1, wherein the at least one third suction member comprises at least one third suction nozzle.
7. The utility model provides a flexible display device's stripping off device, flexible display device includes display panel, colloid and cover brilliant film, display panel has cover brilliant film and binds the district, the colloid sets up cover brilliant film binds on the district, cover brilliant film passes through the colloid binds to display panel, its characterized in that, flexible display device's stripping off device includes:
an arm;
at least one first absorbent member connected to said arm; and
at least one second adsorption component connected with the arm;
wherein the display panel is grasped by the at least one first suction member and the chip on film is grasped by the at least one second suction member; and
the height of the at least one second suction member for grabbing the chip on film and the height of the at least one first suction member for grabbing the display panel have a height difference, the height of the at least one second suction member is adjusted to grab the chip on film through the at least one second suction member, the at least one first suction member comprises at least one first suction nozzle, the at least one second suction member comprises at least one second suction nozzle, the chip on film is downwards applied with force through the at least one second suction nozzle, so that the glue and the display panel lose viscosity, and the number of the at least one first suction nozzle is larger than that of the at least one second suction nozzle, so that the display panel is stably adsorbed by the at least one first suction nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910786284.4A CN110600418B (en) | 2019-08-23 | 2019-08-23 | Stripping method and stripping device for flexible display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910786284.4A CN110600418B (en) | 2019-08-23 | 2019-08-23 | Stripping method and stripping device for flexible display device |
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| Publication Number | Publication Date |
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| CN110600418A CN110600418A (en) | 2019-12-20 |
| CN110600418B true CN110600418B (en) | 2022-03-29 |
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| CN201910786284.4A Active CN110600418B (en) | 2019-08-23 | 2019-08-23 | Stripping method and stripping device for flexible display device |
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| CN112188830B (en) * | 2020-10-16 | 2021-09-03 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108022941A (en) * | 2016-11-01 | 2018-05-11 | 群创光电股份有限公司 | Display device and forming method thereof |
| CN109377890A (en) * | 2018-12-21 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Flexible display apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007206580A (en) * | 2006-02-04 | 2007-08-16 | Nagano Automation Kk | Film carrying-out device and method |
| KR102159738B1 (en) * | 2013-11-01 | 2020-09-24 | 삼성디스플레이 주식회사 | Flexible device peeling apparatus and peeling method using the same |
| CN104698689B (en) * | 2015-04-07 | 2017-07-14 | 京东方科技集团股份有限公司 | A kind of anisotropic conductive film, display device and its repair method |
| CN106783910A (en) * | 2015-11-23 | 2017-05-31 | 上海和辉光电有限公司 | Flexible OLED display panel anode preparation method and display panel preparation method |
| CN107068728A (en) * | 2017-05-05 | 2017-08-18 | 武汉华星光电技术有限公司 | The method for dismounting of electronic device in OLED display panel |
| CN109132558B (en) * | 2018-10-24 | 2024-04-16 | 苏州精濑光电有限公司 | Mechanical arm |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108022941A (en) * | 2016-11-01 | 2018-05-11 | 群创光电股份有限公司 | Display device and forming method thereof |
| CN109377890A (en) * | 2018-12-21 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Flexible display apparatus |
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