CN110589445A

CN110589445A - High-speed conveying device

Info

Publication number: CN110589445A
Application number: CN201910828667.3A
Authority: CN
Inventors: 董晓清; 邱其伟
Original assignee: Wuxi Jiangsong Science And Technology Co Ltd
Current assignee: Wuxi Jiangsong Science And Technology Co Ltd
Priority date: 2019-09-03
Filing date: 2019-09-03
Publication date: 2019-12-20

Abstract

The invention discloses a high-speed conveying device, and relates to the technical field of silicon wafer conveying. High-speed conveyor, including first transfer chain and second transfer chain, first transfer chain and second transfer chain mutually perpendicular, first transfer chain both ends are equipped with lift power device, and the second transfer chain is equipped with middle transfer chain in the clearance department in the middle of the first transfer chain, and first transfer chain side is equipped with the vacancy that supplies the silicon chip to pass through for the high position of second transfer chain. The silicon wafers on the second conveying line can be distributed to other stations through the arrangement of the first conveying line, through the arrangement of the vacancy, the silicon wafers on the second conveying line can be conveyed to the middle conveying line through the vacancy when the silicon wafers on the first conveying line are conveyed, and then the silicon wafers are conveyed to the second conveying line on the other side of the first conveying line from the middle conveying line, so that the second conveying line does not need to be stopped for waiting when the silicon wafers are conveyed by the first conveying line, and further the production beat is accelerated to improve the conveying efficiency of the silicon wafers.

Description

High-speed conveying device

Technical Field

The invention relates to the technical field of silicon wafer conveying, in particular to a high-speed conveying device.

Background

The conventional silicon wafer conveying device divides silicon wafers on a main rail to other stations by lifting a dividing rail, the silicon wafers on the main rail need to be stopped to wait when the dividing rail rises or falls, the silicon wafers can be conveyed continuously when the dividing rail returns to the original position after the materials are distributed, and the beat of the silicon wafer conveying device cannot meet the demand of capacity under the condition of increasing market demand.

Disclosure of Invention

In order to improve the tact time of silicon wafer transportation. The technical scheme of the invention provides a high-speed conveying device.

The technical scheme is as follows: high-speed conveyor, including first transfer chain and second transfer chain, first transfer chain and second transfer chain mutually perpendicular, first transfer chain both ends are equipped with lift power device, are equipped with the breach that leaves first transfer chain lift on the second transfer chain, and the clearance department of second transfer chain in the middle of first transfer chain is equipped with middle transfer chain, and first transfer chain side is equipped with the vacancy that supplies the silicon chip to pass through for the high position of second transfer chain.

The silicon wafers on the second conveying line can be distributed to other stations through the arrangement of the first conveying line, through the arrangement of the vacancy, the silicon wafers on the second conveying line can be conveyed to the middle conveying line through the vacancy when the silicon wafers on the first conveying line are conveyed, and then the silicon wafers are conveyed to the second conveying line on the other side of the first conveying line from the middle conveying line, so that the second conveying line does not need to be stopped for waiting when the silicon wafers are conveyed by the first conveying line, and further the production beat is accelerated to improve the conveying efficiency of the silicon wafers.

In particular, the high-speed conveyor comprises at least two first conveyor lines, each of which is equipped with at least five second conveyor lines.

Through the arrangement of at least two first conveying lines, silicon wafers can be conveyed to the second conveying line for conveying and sorting when the first conveying line is conveyed in a vacancy mode.

Particularly, the lifting power device is a lifting cylinder.

In particular, each second conveyor line has a corresponding vacancy on the first conveyor line.

In particular, the length of the gap covers the conveying area of all the second conveying lines.

Compared with the prior art, the invention has the beneficial effects that: the silicon wafers on the second conveying line can be distributed to other stations through the arrangement of the first conveying line, through the arrangement of the vacancy, the silicon wafers on the second conveying line can be conveyed to the middle conveying line through the vacancy when the silicon wafers on the first conveying line are conveyed, and then the silicon wafers are conveyed to the second conveying line on the other side of the first conveying line from the middle conveying line, so that the second conveying line does not need to be stopped for waiting when the silicon wafers are conveyed by the first conveying line, and further the production beat is accelerated to improve the conveying efficiency of the silicon wafers.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention, in which:

FIG. 1 is a perspective view of a high-speed conveyor according to an embodiment of the present invention;

FIG. 2 is a perspective view of FIG. 1 from another perspective;

FIG. 3 is a top view of FIG. 1;

FIG. 4 is a front view of FIG. 1;

FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;

fig. 6 is a partial view of the position B in fig. 1.

Reference numerals: 1 first conveying line, 2 second conveying lines, 3 lifting power devices, 4 gaps, 5 middle conveying lines and 6 gaps

Detailed Description

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

In order to improve the tact time of silicon wafer transportation. The technical scheme of the invention provides a high-speed conveying device. The technical scheme is as follows:

the invention is explained in further detail below with reference to fig. 1 to 6.

As shown in fig. 1 to 6, the present invention provides a high-speed conveying apparatus. The technical scheme is as follows: high-speed conveyor, including first transfer chain 1 and second transfer chain 2, first transfer chain 1 and 2 mutually perpendicular of second transfer chain, 1 both ends of first transfer chain are equipped with lift power device 3, are equipped with the breach 4 that leaves the lift of first transfer chain 1 on the second transfer chain 2, and second transfer chain 2 is equipped with middle transfer chain 5 in the clearance department in the middle of first transfer chain 1, and 1 side of first transfer chain is equipped with vacancy 6 that supplies the silicon chip to pass through for the high position of second transfer chain 2.

The silicon wafer on the second conveying line 2 can be distributed to other stations through the arrangement of the first conveying line 1, through the arrangement of the vacancy 6, the silicon wafer on the second conveying line 2 can be conveyed to the intermediate conveying line 5 through the vacancy 6 when the silicon wafer on the first conveying line 1 is conveyed, and then the silicon wafer is conveyed to the second conveying line 2 on the other side of the first conveying line 1 from the intermediate conveying line 5, so that the second conveying line 2 does not need to be stopped for waiting when the silicon wafer is conveyed by the first conveying line 1, and further the production beat is accelerated to improve the silicon wafer conveying efficiency.

In actual production, the high-speed conveyor comprises at least two first conveyor lines 1, each first conveyor line 1 being equipped with at least five second conveyor lines 2.

Through the arrangement of at least two first conveying lines 1, silicon wafers can be conveyed to the second conveying line 2 for conveying and sorting when the first conveying line 1 is conveyed from the vacancy 6.

Specifically, the lifting power device 3 is a lifting cylinder.

In order to allow each wafer to be transferred from the vacancy 6 on the first transfer line 1, each second transfer line 2 corresponds to the vacancy 6 on the first transfer line 1.

In particular, the length of the gap 6 covers the transport range of all the second transport lines 2, i.e. the length of the gap 6 allows all the silicon wafers of the second transport line 2 corresponding to the first transport line 1 to be transported through the gap 6.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. High-speed conveyor, its characterized in that, including first transfer chain and second transfer chain, first transfer chain with second transfer chain mutually perpendicular, first transfer chain both ends are equipped with lift power device, be equipped with on the second transfer chain and leave the breach that first transfer chain goes up and down, the second transfer chain is in clearance department in the middle of the first transfer chain is equipped with middle transfer chain, first transfer chain side for the high position of second transfer chain is equipped with the vacancy that supplies the silicon chip to pass through.

2. The high-speed conveyor device according to claim 1, characterized in that it comprises at least two first conveyor lines, each equipped with at least five second conveyor lines.

3. The high-speed conveying device according to claim 1, wherein the lifting power device is a lifting cylinder.

4. The high-speed conveyor apparatus according to claim 1, wherein each of the second conveyor lines has the corresponding gap on the first conveyor line.

5. The high-speed conveyor apparatus according to claim 1, wherein the length of the gap covers the conveying range of all the second conveying lines.