CN110587472B - Polishing debugging system - Google Patents
Polishing debugging system Download PDFInfo
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- CN110587472B CN110587472B CN201910818286.7A CN201910818286A CN110587472B CN 110587472 B CN110587472 B CN 110587472B CN 201910818286 A CN201910818286 A CN 201910818286A CN 110587472 B CN110587472 B CN 110587472B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
- B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Abstract
The invention relates to a polishing debugging system, which comprises a robot, a film pressure sensor, a sensor mounting mechanism assembly, a data acquisition system, a data analysis and control system and a visualization system, wherein the film pressure sensor is arranged on the robot; the sensor mounting mechanism assembly is used for fixing the polishing head and the sensor to the tail end of the robot and the tail end of the polishing head respectively; the data acquisition system is used for acquiring a plurality of actual pressure values of the current point location acquired by the sensor and acquiring a pressure cloud picture; the data analysis and control system is used for analyzing the pressure cloud picture, the quantized actual pressure value and the pre-stored standard pressure value and correcting a motion control program in the robot in real time; the visualization system is used for quantifying the actual pressure values and carrying out visual display according to the analysis result. The invention can automatically modify the motion control program according to the analysis result to obtain the modified technological parameters of the polishing head, and the motion control program can be transplanted to a plurality of similar polishing robots, thereby obviously reducing the polishing debugging cost and time.
Description
Technical Field
The invention belongs to the technical field of mechanical equipment, and particularly relates to a polishing debugging system.
Background
The polishing of workpieces such as plastic, metal, glass and the like is an industrial process with serious pollution, which can cause irreversible damage to the bodies of polishing workers, but the polishing process is indispensable in the industry, particularly in the 3c industry; although robots are used in batches to replace manual work at present, the polishing process is complex, and sometimes, the debugging of a product can be completed within days or even tens of days, so that the rapid debugging of a polishing program becomes a problem which needs to be solved urgently, and a quantitative polishing debugging standard is particularly needed.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art and provides a polishing debugging system.
In order to solve the technical problem, an embodiment of the invention provides a polishing debugging system, which comprises a robot, a film pressure sensor, a sensor installation mechanism assembly, a data acquisition system, a data analysis and control system and a visualization system, wherein the film pressure sensor is arranged on the robot;
the sensor mounting mechanism assembly is used for fixing the polishing head at the tail end of the robot and fixing the film pressure sensor at the tail end of the polishing head;
the data acquisition system is connected with the film pressure sensor and is used for acquiring a plurality of actual pressure values of the current point position acquired by the film pressure sensor and acquiring a pressure cloud chart;
the data analysis and control system is connected with the data acquisition system and is used for analyzing the pressure cloud chart, the quantized actual pressure value of the current point location and the prestored standard pressure value of the current point location and correcting the motion control program in the robot in real time according to the analysis result;
the visualization system is connected with the data acquisition system and the data analysis and control system, and is used for quantifying a plurality of acquired actual pressure values of the current point location and performing three-dimensional visualization display of the polishing process and visualization display of process parameters according to the analysis result.
The invention has the beneficial effects that: the sensor mounting mechanism assembly can realize the mounting of the film pressure sensor and the robot; the data acquisition system can realize the drawing of a pressure cloud picture and the acquisition of a plurality of actual pressure values of the current point; the visualization system can realize the quantification of the actual pressure value of the current point location and realize the display of the pressure cloud chart, a plurality of actual pressure values of the current point location and the quantified actual pressure value; the data analysis and control system can acquire the pressure cloud picture acquired by the data acquisition system, can acquire the actual pressure value quantized by the visualization system, and can correct the motion control program in the data analysis and control system according to the pressure cloud picture and the quantized actual pressure value to acquire the corrected polishing head process parameters, and the corrected polishing head process parameters are displayed by the visualization system to realize visualization of the debugging process. The motion control program can be transplanted to a plurality of similar grinding robots, so that the grinding debugging cost and time are greatly reduced.
On the basis of the technical scheme, the invention can be further improved as follows.
Further, the sensor mounting mechanism assembly comprises a flange plate, a polishing head and a sensor attaching plate;
the flange plate is fixed at the tail end of the robot through a first bolt, and the polishing head fixes a mounting plate of the polishing head on the flange plate through a mounting bolt;
the sensor attaching plate is fixed at the tail end of the polishing head in a flocking mode;
the film pressure sensor is fixed to the sensor attachment plate.
The beneficial effect of adopting the further scheme is that: the sensor attaching plate in the sensor mounting mechanism assembly can realize the mounting of the film pressure sensor, and the actual pressure value of each polishing point position can be obtained through the film pressure sensor, so that the polishing and debugging are facilitated.
Further, the sensor mounting mechanism assembly further comprises a bolt with scales, and the bolt with scales penetrates through the sensor attaching plate and the mounting plate.
The beneficial effect of adopting the further scheme is that: the device is used for adjusting the position of the sensor attaching plate relative to the polishing head, and the distance between the sensor attaching plate and the polishing head is consistent relative to the generated standard when the motion control program is transplanted.
Furthermore, the flocking mode is that a first flocking surface is arranged on the working surface of the polishing head, a second flocking surface is arranged on the first flocking surface, and the sensor attaching plate is fixed on the second flocking surface.
The beneficial effect of adopting the further scheme is that: reliable mounting of the membrane pressure sensor can be achieved.
Furthermore, the data acquisition system comprises a data acquisition card and a data acquisition module;
the data acquisition card is used for acquiring a plurality of actual pressure values of the current point location;
the data acquisition module is used for acquiring a pressure cloud picture according to a plurality of actual pressure values acquired by the data acquisition card;
the data acquisition card is connected with the film pressure sensor, and the data acquisition module is connected with the data acquisition card in a wireless mode.
The beneficial effect of adopting the further scheme is that: the data acquisition system acquires the actual pressure value of the current point location detected by the film pressure sensor through the data acquisition card, transmits the actual pressure value of the current point location to the data acquisition module, acquires a pressure cloud chart through the data acquisition module and displays the actual pressure value curve of the current point location in real time, and the data acquisition module can export the actual pressure values of the pressure cloud chart and the current point location to the visualization system and the data analysis and control system through the interconnection interface to realize the display of the actual pressure values of the pressure cloud chart and the current point location and the correction of a motion control program.
Furthermore, the data analysis and control system comprises a first storage module, a robot tool module, an analysis and calculation module, a program re-control module and a robot motion control module;
the first storage module is used for storing the current point location and a standard pressure value corresponding to the current point location;
the robot tool module is used for calibrating coordinates of the pressure cloud picture and the workpiece;
the analysis calculation module is used for analyzing according to the pressure cloud picture, the quantized actual pressure value and the standard pressure value to obtain an analysis result;
the program re-control module is used for generating a parameter modification instruction according to the analysis result, sending the parameter modification instruction to the robot motion control module and controlling and modifying six-dimensional process parameters of a polishing head in an internal motion control program; the six-dimensional process parameters are position parameters and deflection angle parameters of the polishing head;
and the robot motion control module is used for controlling the motion of the polishing head according to the modified motion control program and sending the six-dimensional technological parameters of the polishing head to the visualization system.
The beneficial effect of adopting the further scheme is that: and realizing automatic correction of the six-dimensional parameters of the polishing head in the motion control program through each module in the data analysis and control system.
Further, the analysis and calculation module is specifically configured to: when the difference between the quantized actual pressure value and the standard pressure value is larger than a preset error value, sending a first analysis result to the program re-control module;
according to the obtained pressure cloud picture, obtaining a deflection angle to be adjusted through a preset deflection angle calculation method, and sending a second analysis result containing the deflection angle to be adjusted to the program re-control module;
the preset deflection angle calculation method is realized by the following formula:
Δz＝(F2-F1)/k
θ＝arctan(Δz/Δx)
in the above formula: k is the material coefficient of the film pressure sensor; f1 is the actual pressure value at the coordinate origin in the pressure cloud picture; f2 is the actual pressure value at coordinates (Δ x, Δ z) in the pressure cloud; theta is a deflection angle to be adjusted; the origin of coordinates and coordinates (Δ x, Δ z) are obtained from the robot tool module calibration pressure cloud.
The beneficial effect of adopting the further scheme is that: and the program re-control module is controlled by comparing an actual value with a standard value in the analysis and calculation module and a preset deflection angle calculation method.
Further, the program re-control module is specifically configured to:
controlling and modifying the position parameter of the polishing head in the motion control program according to the first analysis result, and performing stepping adjustment on the position of the polishing head;
and modifying the deflection angle parameter of the polishing head in the motion control program according to the second analysis result, and adjusting the deflection angle of the polishing head.
The beneficial effect of adopting the further scheme is that: the stepping adjustment of the position of the polishing head and the adjustment of the deflection angle of the polishing head are realized.
Further, the visualization system comprises a coordinate change module, a three-dimensional display module, a pressure value quantification module, a process parameter display module and a second storage module;
the coordinate change module is used for converting the six-dimensional technological parameters of the polishing head output by the robot motion control module into three-dimensional technological parameters of the polishing head by utilizing Euler rotation matrix conversion, and the three-dimensional technological parameters comprise position parameters and direction parameters of the polishing head;
the three-dimensional display module is used for displaying a pressure cloud picture and is also used for displaying the three-dimensional process parameters, the three-dimensional workpiece model and the polishing head model of the polishing head together;
the pressure value quantization module is used for quantizing a plurality of acquired actual pressure values of the current point location to obtain quantized actual pressure values;
the process parameter display module is used for displaying the quantized actual pressure values, a plurality of actual pressure values of the current point location and six-dimensional process parameters of the polishing head;
and the second storage module is used for storing the quantized actual pressure values, a plurality of actual pressure values of the current point position and six-dimensional technological parameters of the polishing head.
The beneficial effect of adopting the further scheme is that: the pressure value quantization module is adopted, so that the acquired actual pressure value of the current point location can be quantized, and the quantized actual pressure value can be displayed through the process parameter display module; the technical parameter display module is adopted to realize the display of the actual pressure value of the current point position acquired by the data acquisition system and the display of the six-dimensional technical parameter of the polishing head, and the six-dimensional technical parameter is stored by the second storage module; and the three-dimensional display module is adopted to realize the common display of the pressure cloud picture, the three-dimensional process parameters of the polishing head, the three-dimensional workpiece model and the polishing head model.
Further, the three-dimensional display module is specifically configured to:
displaying a three-dimensional workpiece model and a polishing head model in a first coordinate system; the first coordinate system is also used for adjusting the first coordinate system, so that the three-dimensional process parameters of the polishing head are displayed in the first coordinate system under the condition that the coordinates of the preset characteristic points on the workpiece to be polished in the first coordinate system and the second coordinate system are completely the same;
the first coordinate system is a coordinate system calibrated by the three-dimensional display module, and the second coordinate system is a coordinate system calibrated by the robot tool module by taking a preset feature point on the workpiece to be polished as a reference.
The beneficial effect of adopting the further scheme is that: and the same coordinate system is adopted to realize the common display of the three-dimensional process parameters of the polishing head, the three-dimensional workpiece model and the polishing head model.
Drawings
Fig. 1 is a schematic structural diagram of a polishing debugging system according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a sensor mounting mechanism assembly according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a closed-loop control debugging structure of a polishing debugging system according to an embodiment of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. the device comprises a flange plate, 2, a sensor attaching plate, 3, a mounting plate, 4, a polishing head, 5, mounting bolts, 6, bolts with scales, 7, a first flocking surface, 8, a second flocking surface, 9 and a thin film pressure sensor.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1, a polishing debugging system provided by an embodiment of the present invention includes a robot, a film pressure sensor, a sensor mounting mechanism assembly, a data acquisition system, a data analysis and control system, and a visualization system;
the sensor mounting mechanism assembly is used for fixing the polishing head at the tail end of the robot and fixing the film pressure sensor at the tail end of the polishing head;
the data acquisition system is connected with the film pressure sensor and is used for acquiring a plurality of actual pressure values of the current point position acquired by the film pressure sensor and acquiring a pressure cloud chart;
the data analysis and control system is connected with the data acquisition system and is used for analyzing the pressure cloud chart, the quantized actual pressure value of the current point location and the prestored standard pressure value of the current point location and correcting the motion control program in the robot in real time according to the analysis result;
the visualization system is connected with the data acquisition system and the data analysis and control system, and is used for quantifying a plurality of acquired actual pressure values of the current point location and performing three-dimensional visualization display of the polishing process and visualization display of process parameters according to the analysis result.
In the above embodiment, the sensor mounting mechanism assembly can realize the mounting of the film pressure sensor and the robot; the data acquisition system can realize the drawing of a pressure cloud picture and the acquisition of a plurality of actual pressure values of the current point; the visualization system can realize the quantification of the actual pressure value of the current point location and realize the display of the pressure cloud chart, a plurality of actual pressure values of the current point location and the quantified actual pressure value; the data analysis and control system can acquire the pressure cloud picture acquired by the data acquisition system, can acquire the actual pressure value quantized by the visualization system, and can correct the motion control program in the data analysis and control system according to the pressure cloud picture and the quantized actual pressure value to acquire the corrected polishing head process parameters, and the corrected polishing head process parameters are displayed by the visualization system to realize visualization of the debugging process. The motion control program can be transplanted to a plurality of similar grinding robots, so that the grinding debugging cost and time are greatly reduced.
Alternatively, as shown in fig. 2, the sensor mounting mechanism assembly comprises a flange plate 1, a polishing head 4 and a sensor attachment plate 2;
the flange plate 1 is fixed at the tail end of the robot through a first bolt, and the polishing head 4 fixes a mounting plate 3 of the polishing head on the flange plate 1 through a mounting bolt 5;
the sensor attaching plate 2 is fixed at the tail end of the polishing head 4 in a flocking mode;
the film pressure sensor 9 is fixed to the sensor attachment plate 2.
In the above embodiment, the sensor attachment plate 2 in the sensor mounting mechanism assembly can realize the mounting of the film pressure sensor 9, and the actual pressure value of each polishing point can be obtained through the film pressure sensor 9, so that the polishing and debugging are facilitated.
Optionally, a graduated bolt 6 is also included, the graduated bolt 6 extending through the sensor attachment plate 2 and the mounting plate 3. The bolt 6 with the scale is used for adjusting the position of the sensor attaching plate 2 relative to the polishing head, and the consistent distance relative to the generation standard when the motion control program is transplanted is ensured.
Optionally, the flocking manner is that a first flocking surface 7 is arranged on the working surface of the polishing head 4, a second flocking surface 8 is arranged on the first flocking surface 7, and the sensor attaching plate 2 is fixed on the second flocking surface 8. This flocking allows a reliable mounting of the film pressure sensor 9.
Optionally, the data acquisition system includes a data acquisition card and a data acquisition module;
the data acquisition card is used for acquiring a plurality of actual pressure values of the current point location;
the data acquisition module is used for acquiring a pressure cloud picture according to a plurality of actual pressure values acquired by the data acquisition card;
the data acquisition card is connected with the film pressure sensor, and the data acquisition module is connected with the data acquisition card in a wireless mode.
In the above embodiment, the data acquisition system acquires the actual pressure value of the current point location detected by the film pressure sensor 9 through the data acquisition card, and transmits the actual pressure value of the current point location to the data acquisition module, the data acquisition module acquires the pressure cloud chart and displays the actual pressure value curve of the current point location in real time, and the data acquisition module can export the pressure cloud chart and the actual pressure value of the current point location to the visualization system and the data analysis and control system through the interconnection interface, so as to realize the display of the actual pressure values of the pressure cloud chart and the current point location and the correction of the motion control program.
Optionally, the data analysis and control system includes a first storage module, a robot tool module, an analysis and calculation module, a program re-control module, and a robot motion control module;
the first storage module is used for storing the current point location and a standard pressure value corresponding to the current point location;
the robot tool module is used for calibrating coordinates of the pressure cloud picture and the workpiece;
the analysis calculation module is used for analyzing according to the pressure cloud picture, the quantized actual pressure value and the standard pressure value to obtain an analysis result;
the program re-control module is used for generating a parameter modification instruction according to the analysis result, sending the parameter modification instruction to the robot motion control module and controlling and modifying six-dimensional process parameters of a polishing head in an internal motion control program; the six-dimensional process parameters are position parameters and deflection angle parameters of the polishing head;
and the robot motion control module is used for controlling the motion of the polishing head according to the modified motion control program and sending the six-dimensional technological parameters of the polishing head to the visualization system.
In the above embodiment, the data analysis and control system has a secondary development interface, and by developing the secondary development interface, the data acquisition software and the visualization system can be matched, data transmission is realized through the network cable and the switch, and by interconnecting each module in the data analysis and control system and the data of the data acquisition software and the visualization system, automatic correction of the six-dimensional parameters of the polishing head in the motion control program is realized.
Optionally, the analysis calculation module is specifically configured to: when the difference between the quantized actual pressure value and the standard pressure value is larger than a preset error value, sending a first analysis result to the program re-control module;
according to the obtained pressure cloud picture, obtaining a deflection angle to be adjusted through a preset deflection angle calculation method, and sending a second analysis result containing the deflection angle to be adjusted to the program re-control module;
the preset deflection angle calculation method is realized by the following formula:
Δz＝(F2-F1)/k
θ＝arctan(Δz/Δx)
in the above formula: k is the material coefficient of the film pressure sensor; f1 is the actual pressure value at the coordinate origin in the pressure cloud picture; f2 is the actual pressure value at coordinates (Δ x, Δ z) in the pressure cloud; theta is a deflection angle to be adjusted; the origin of coordinates and coordinates (Δ x, Δ z) are obtained from the robot tool module calibration pressure cloud.
In the above embodiment, the program re-control module is controlled by comparing the actual value with the standard value in the analysis and calculation module and by using a preset deflection angle calculation method.
Optionally, the program re-control module is specifically configured to:
controlling and modifying the position parameter of the polishing head in the motion control program according to the first analysis result, and performing stepping adjustment on the position of the polishing head;
and modifying the deflection angle parameter of the polishing head in the motion control program according to the second analysis result, and adjusting the deflection angle of the polishing head.
In the above embodiment, the step adjustment of the position of the polishing head and the adjustment of the deflection angle of the polishing head can be realized according to the analysis result.
Optionally, the visualization system comprises a coordinate change module, a three-dimensional display module, a pressure value quantification module, a process parameter display module and a second storage module;
the coordinate change module is used for converting the six-dimensional technological parameters of the polishing head output by the robot motion control module into three-dimensional technological parameters of the polishing head by utilizing Euler rotation matrix conversion, and the three-dimensional technological parameters comprise position parameters and direction parameters of the polishing head;
the three-dimensional display module is used for displaying a pressure cloud picture and is also used for displaying the three-dimensional process parameters, the three-dimensional workpiece model and the polishing head model of the polishing head together;
the pressure value quantization module is used for quantizing a plurality of acquired actual pressure values of the current point location to obtain quantized actual pressure values;
the process parameter display module is used for displaying the quantized actual pressure values, a plurality of actual pressure values of the current point location and six-dimensional process parameters of the polishing head;
and the second storage module is used for storing the quantized actual pressure values, a plurality of actual pressure values of the current point position and six-dimensional technological parameters of the polishing head.
In the above embodiment, the pressure value quantization module is adopted, so that the acquired actual pressure value of the current point location can be quantized, and the quantized actual pressure value can be displayed through the process parameter display module; the technical parameter display module is adopted to realize the display of the actual pressure value of the current point position acquired by the data acquisition system and the display of the six-dimensional technical parameters of the polishing head, and the actual pressure value and the pressure cloud chart corresponding to the current three point positions are recorded by the second storage module one by one if the second storage module stores the actual pressure value and the six-dimensional technical parameters, such as the point P1, the point P2 and the point P3 in a program. For example, the actual pressure value after quantization at the point P1 is 3N, and the peak value in the pressure cloud graph is 7N, then the actual pressure values in the cloud graph region where 7N is located are all recorded in detail. And a three-dimensional visualization module is adopted to realize the common display of the pressure cloud chart, the three-dimensional technological parameters of the polishing head, the three-dimensional workpiece model and the polishing head model.
Optionally, the three-dimensional display module is specifically configured to:
displaying a three-dimensional workpiece model and a polishing head model in a first coordinate system; the first coordinate system is also used for adjusting the first coordinate system, so that the three-dimensional process parameters of the polishing head are displayed in the first coordinate system under the condition that the coordinates of the preset characteristic points on the workpiece to be polished in the first coordinate system and the second coordinate system are completely the same;
the first coordinate system is a coordinate system calibrated by the three-dimensional display module, and the second coordinate system is a coordinate system calibrated by the robot tool module by taking a preset feature point on the workpiece to be polished as a reference.
In the above embodiment, the same coordinate system is adopted to realize the common display of the three-dimensional process parameters of the polishing head, the three-dimensional workpiece model and the polishing head model.
As shown in fig. 3, the closed-loop control debugging of the polishing debugging system is to select the polishing head and the type of consumable by using the workpiece information, design process parameters, a motion path and a beat, and set a standard pressure value so as to control the motion of the polishing head. In the debugging stage, off-line programming and coordinate calibration are utilized to adjust the technological parameters of the polishing head, so that qualified products are output, and then a qualified standard or a detection method is utilized: and (3) judging the output qualified product through surface roughness, paint spraying detection and visual detection, and if the output qualified product is the qualified product, feeding back the adjusted six-dimensional technological parameters of the polishing head to a process design link through a feedback debugging process to realize the transplantation of a standard program. The visualization of a motion path, process parameters, a pressure cloud chart and a polishing pressure value can be realized in the debugging process.
The polishing debugging system provided by the invention adopts the data analysis and control system to acquire the pressure cloud picture acquired by the data acquisition system and the actual pressure value of the current point, adopts the pressure value quantization module to realize quantization of the actual pressure value of the current point, corrects a motion control program in the data analysis and control system according to the pressure cloud picture and the quantized actual pressure value, and acquires the corrected six-dimensional technological parameters of the polishing head, and the corrected six-dimensional technological parameters of the polishing head are displayed by the visualization system, so that the polishing debugging is completely known by the visualization system, the polishing debugging time is shortened, the equipment debugging outage rate is shortened, and the equipment utilization rate is greatly improved. The motion control program can be transplanted to a plurality of similar grinding robots, so that the grinding debugging cost and time are greatly reduced.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (5)
1. A polishing and debugging system is characterized by comprising a robot, a film pressure sensor, a sensor mounting mechanism assembly, a data acquisition system, a data analysis and control system and a visualization system;
the sensor mounting mechanism assembly is used for fixing the polishing head at the tail end of the robot and fixing the film pressure sensor at the tail end of the polishing head; the sensor mounting mechanism assembly comprises a flange plate (1), a polishing head (4), a sensor attaching plate (2) and a bolt (6) with scales;
the flange plate (1) is fixed at the tail end of the robot through a first bolt, and the polishing head (4) fixes a mounting plate (3) of the polishing head on the flange plate (1) through a mounting bolt (5); the sensor attaching plate (2) is fixed at the tail end of the polishing head (4) in a flocking mode; the film pressure sensor (9) is fixed on the sensor attaching plate (2); the bolt (6) with the scales penetrates through the sensor attaching plate (2) and the mounting plate (3); the flocking mode is that a first flocking surface (7) is arranged on the working surface of the polishing head (4), a second flocking surface (8) is arranged on the first flocking surface (7), and the sensor attaching plate (2) is fixed on the second flocking surface (8);
the data acquisition system is connected with the film pressure sensor and is used for acquiring a plurality of actual pressure values of the current point position acquired by the film pressure sensor and acquiring a pressure cloud chart;
the data analysis and control system is connected with the data acquisition system and is used for analyzing the pressure cloud chart, the quantized actual pressure value of the current point location and the prestored standard pressure value of the current point location and correcting the motion control program in the robot in real time according to the analysis result; the data analysis and control system comprises a first storage module, a robot tool module, an analysis and calculation module, a program re-control module and a robot motion control module; the first storage module is used for storing the current point location and a standard pressure value corresponding to the current point location; the robot tool module is used for calibrating coordinates of the pressure cloud picture and the workpiece; the analysis calculation module is used for analyzing according to the pressure cloud picture, the quantized actual pressure value and the standard pressure value to obtain an analysis result; the program re-control module is used for generating a parameter modification instruction according to the analysis result, sending the parameter modification instruction to the robot motion control module and controlling and modifying six-dimensional process parameters of a polishing head in an internal motion control program; the six-dimensional process parameters are position parameters and deflection angle parameters of the polishing head; the robot motion control module is used for controlling the motion of the polishing head according to the modified motion control program and sending the six-dimensional technological parameters of the polishing head to the visualization system;
the analysis calculation module is specifically configured to: when the difference between the quantized actual pressure value and the standard pressure value is larger than a preset error value, sending a first analysis result to the program re-control module; according to the obtained pressure cloud picture, obtaining a deflection angle to be adjusted through a preset deflection angle calculation method, and sending a second analysis result containing the deflection angle to be adjusted to the program re-control module; the preset deflection angle calculation method is realized by the following formula:
Δz＝(F2-F1)/k
θ＝arctan(Δz/Δx)
in the above formula: k is the material coefficient of the film pressure sensor; f1 is the actual pressure value at the coordinate origin in the pressure cloud picture; f2 is the actual pressure value at coordinates (Δ x, Δ z) in the pressure cloud; theta is a deflection angle to be adjusted; the origin of coordinates and coordinates (Δ x, Δ z) are obtained from the robot tool module calibration pressure cloud; the visualization system is connected with the data acquisition system and the data analysis and control system, and is used for quantifying a plurality of acquired actual pressure values of the current point location and performing three-dimensional visualization display of the polishing process and visualization display of process parameters according to the analysis result.
2. The sanding conditioning system of claim 1 wherein the data acquisition system comprises a data acquisition card and a data acquisition module;
the data acquisition card is used for acquiring a plurality of actual pressure values of the current point location;
the data acquisition module is used for acquiring a pressure cloud picture according to a plurality of actual pressure values acquired by the data acquisition card;
the data acquisition card is connected with the film pressure sensor, and the data acquisition module is connected with the data acquisition card in a wireless mode.
3. The sanding commissioning system of claim 1, wherein the program re-control module is specifically configured to:
controlling and modifying the position parameter of the polishing head in the motion control program according to the first analysis result, and performing stepping adjustment on the position of the polishing head;
and modifying the deflection angle parameter of the polishing head in the motion control program according to the second analysis result, and adjusting the deflection angle of the polishing head.
4. The sanding debugging system of claim 1, wherein the visualization system comprises a coordinate variation module, a three-dimensional display module, a pressure value quantification module, a process parameter display module and a second storage module;
the coordinate change module is used for converting the six-dimensional technological parameters of the polishing head output by the robot motion control module into three-dimensional technological parameters of the polishing head by utilizing Euler rotation matrix conversion, and the three-dimensional technological parameters comprise position parameters and direction parameters of the polishing head;
the three-dimensional display module is used for displaying a pressure cloud picture and is also used for displaying the three-dimensional process parameters, the three-dimensional workpiece model and the polishing head model of the polishing head together;
the pressure value quantization module is used for quantizing a plurality of acquired actual pressure values of the current point location to obtain quantized actual pressure values;
the process parameter display module is used for displaying the quantized actual pressure values, a plurality of actual pressure values of the current point location and six-dimensional process parameters of the polishing head;
and the second storage module is used for storing the quantized actual pressure values, a plurality of actual pressure values of the current point position and six-dimensional technological parameters of the polishing head.
5. The sanding commissioning system of claim 4, wherein the three-dimensional display module is specifically configured to:
displaying a three-dimensional workpiece model and a polishing head model in a first coordinate system; the first coordinate system is also used for adjusting the first coordinate system, so that the three-dimensional process parameters of the polishing head are displayed in the first coordinate system under the condition that the coordinates of the preset characteristic points on the workpiece to be polished in the first coordinate system and the second coordinate system are completely the same;
the first coordinate system is a coordinate system calibrated by the three-dimensional display module, and the second coordinate system is a coordinate system calibrated by the robot tool module by taking a preset feature point on the workpiece to be polished as a reference.
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| CN113787382A (en) * | 2021-09-08 | 2021-12-14 | 上海飞机制造有限公司 | Polishing method of polishing system and polishing system |
| CN114227452A (en) * | 2021-12-08 | 2022-03-25 | 东莞长盈精密技术有限公司 | Polishing device, polishing equipment and polishing method |
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| CN203317173U (en) * | 2013-06-04 | 2013-12-04 | 上海无线电设备研究所 | Slot array sheet burring device |
| CN105014525B (en) * | 2015-07-03 | 2017-07-07 | 浙江工业大学 | Self-adapting regulation method based on grinding and polishing workpiece degree-of-freedom adjusting mechanism |
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