CN100473496C - Automatic pressure regulating method - Google Patents
Automatic pressure regulating method Download PDFInfo
- Publication number
- CN100473496C CN100473496C CNB200510110712XA CN200510110712A CN100473496C CN 100473496 C CN100473496 C CN 100473496C CN B200510110712X A CNB200510110712X A CN B200510110712XA CN 200510110712 A CN200510110712 A CN 200510110712A CN 100473496 C CN100473496 C CN 100473496C
- Authority
- CN
- China
- Prior art keywords
- pressure
- grinder
- pressure sensor
- control module
- information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
An automatic pressure regulator comprises a grinder with several bar like pressure sensor in the shape of grid net loaded at the lower side, and control unit which receives pressure information from pressure sensor, with the control unit controlling the force of pressure in grinding. It establishes a data base by collecting pressure info. And information required to feedback to the grinder, through comparing selected pressure information with those of the data base, providing timely feedback to the grinder, realizing automatic regulation of the pressure. It keeps the pressure constant in the process of grinding, improving the consistence and pass rate of the silicon processing.
Description
Technical field
The present invention relates to a kind of automatic regulation system for pressure, a kind of automatic regulation system for pressure that is used for the semi-conducting material milling apparatus in the time of especially.The invention still further relates to the self-regulating method of a kind of pressure.
Background technology
Along with the continuous development of semiconductor technology, the integrated level of device is more and more higher, and integrated chip-count also just gets more and more on the single piece of silicon chip, so the quality of silicon chips periphery thickness tendency is also increasing to the influence of the yields of whole piece of silicon chip.Smooth and good peripheral thickness tendency will promote yields greatly.Traditional CMP (cmp) can't adjust after pressure parameter sets up automatically.Yet because tendency can be along with self service time of running stores, great changes will take place in the thick surface of CMP, particularly the thickness of Retainer Ring (retaining ring) can produce a very large impact the thickness tendency of CMP periphery, thick Retainer Ring, the periphery grinding rate is slower, and as Retainer Ring during to service life, thickness meeting attenuation, peripheral grinding rate can obviously accelerate.Therefore the shortening of being inclined in the thick surface of CMP along with the running stores life-span will have variation significantly, and particularly the tendency of periphery changes.Brought very big difficulty for like this management of CMP, simultaneously also to a certain degree influence yield of products.
Summary of the invention
Technical problem to be solved by this invention provides a kind of automatic pressure regulating method, can adjust automatically according to the operating position of retaining ring the pressure of abrasive disk, thus the homogeneity of raising silicon chip, and yield of products.
For solving the problems of the technologies described above, the technical scheme of the self-regulating method of pressure of the present invention is, the automatic regulation system for pressure that is adopted comprises grinder and control module, described grinder bottom is provided with grinding pad, the downside of described grinding pad is equipped with the pressure sensor of a plurality of strips, described pressure sensor is divided into transverse pressure sensor and longitudinal pressure sensor, and described transverse pressure sensor and longitudinal pressure sensor are interlaced, constitutes a square grid shape structure; Described pressure sensor is connected with control module by holding wire, and pressure information is passed to control module; Described control module is connected with grinder, the pressure size when controlling grinder work by transmitting control signal, and the self-regulating method of described pressure comprises the steps:
(1) on control module, set up database, make pressure sensor the pressure information that can measure corresponding with the control signal that control module need feed back to grinder;
(2) begin to grind after, pressure sensor passes to control module with pressure information;
(3) control module is compared the content in pressure information and the database, and control signal corresponding is sent to grinder, and grinder changes the size of pressure according to this control signal;
The described step of setting up database comprises, at first grind with the retaining ring of different-thickness, determine the normal pressure of the best grinding effect that the retaining ring of variant thickness can reach, the pressure information that pressure sensor obtains when then the retaining ring of different-thickness being worked carries out record, the difference of this pressure information and normal pressure relatively, obtain the size of required compensatory pressure, set up data-base recording different pressures information compensatory pressure information corresponding afterwards with it.
The present invention by actual pressure is measured and to since the deviation that the wearing and tearing of retaining ring cause proofread and correct, thereby make the pressure of silicon chip in process of lapping keep constant, improved the homogeneity and the yield of products of silicon chip processing.
Description of drawings
Below in conjunction with drawings and Examples the present invention is further described:
Fig. 1 is the schematic diagram that the grinder of pressure sensor is installed;
Fig. 2 is the schematic diagram of pressure sensor of the present invention and control module;
Fig. 3 is the pressure data table of the embodiment of the invention.
The specific embodiment
The structure of automatic regulation system for pressure of the present invention can be referring to Fig. 1 and Fig. 2, comprise grinder and control module 6, described grinder bottom is provided with grinding pad 3, the downside of described grinding pad 3 is equipped with the device 1 of one deck gaging pressure, it includes the pressure sensor 5 of a plurality of strips, described pressure sensor 5 is divided into transverse pressure sensor and longitudinal pressure sensor, and described transverse pressure sensor and longitudinal pressure sensor are interlaced, constitutes a square grid shape structure; Described pressure sensor 5 is connected with control module 6 by holding wire, and pressure information is passed to control module 6, and this control module can adopt computer; Described control module 6 is connected with grinder, the pressure size when controlling grinder work by transmitting control signal.During work, silicon chip 4 is positioned on the grinding pad 3, by grinder silicon chip is adsorbed on then and carries out attrition process on the abrasive disk.
As mentioned above, the wearing and tearing of grinder mainly are the wearing and tearing of retaining ring 2.Retaining ring 2 is installed on the grinding pad, is placed in outside the processing silicon chip, can prevent that silicon chip from flying out man-hour adding.
Utilize said system, can realize the automatic adjustment of grinding pressure by the following method.This method comprises the steps: at first to set up database on control module, make pressure sensor the pressure information that can measure corresponding with the control signal that control module need feed back to grinder.After beginning then to grind, pressure sensor passes to control module with pressure information.Control module is compared the content in pressure information and the database afterwards, and control signal corresponding is sent to grinder, and grinder changes the size of pressure according to this control signal.
When setting up database, at first grind with the retaining ring of different-thickness, determine the normal pressure of the best grinding effect that the retaining ring of variant thickness can reach, the pressure information that pressure sensor obtains when then the retaining ring of different-thickness being worked carries out record, the difference of this pressure information and normal pressure relatively, obtain the size of required compensatory pressure, set up data-base recording different pressures information compensatory pressure information corresponding afterwards with it.
Specifically, be the signal of telecommunication because pressure sensor is transferred to the signal of control module, therefore can represent the difference of grinding pressure with different voltages.Lift an example earlier, its tables of data can be referring to Fig. 3, and by the magnitude of voltage of pressure sensor, deducibility goes out the current thickness of retaining ring.Condition of work during best grinding effect that the desired value in the table is that the retaining ring of different-thickness can reach, and setting value is constant when producing in batches, therefore will set value with desired value and compare, obtain feeding back compensating value, this compensating value is acted on grinder, thereby make grinder regulate pressure.Though the pressure of grinder is regulated,, guaranteed that therefore the grinding pressure that acts on silicon chip keeps constant, has improved the homogeneity and the yield of products of silicon chip grinding greatly because the thickness of retaining ring is changing.
Claims (1)
1. self-regulating method of pressure, the automatic regulation system for pressure that is adopted comprises grinder and control module, described grinder bottom is provided with grinding pad, the downside of described grinding pad is equipped with the pressure sensor of a plurality of strips, described pressure sensor is divided into transverse pressure sensor and longitudinal pressure sensor, described transverse pressure sensor and longitudinal pressure sensor are interlaced, constitute a square grid shape structure; Described pressure sensor is connected with control module by holding wire, and pressure information is passed to control module; Described control module is connected with grinder, the pressure size when controlling grinder work by transmitting control signal, and the self-regulating method of described pressure comprises the steps:
(1) on control module, set up database, make pressure sensor the pressure information that can measure corresponding with the control signal that control module need feed back to grinder;
(2) begin to grind after, pressure sensor passes to control module with pressure information;
(3) control module is compared the content in pressure information and the database, and control signal corresponding is sent to grinder, and grinder changes the size of pressure according to this control signal;
It is characterized in that, the described step of setting up database comprises, at first grind with the retaining ring of different-thickness, determine the normal pressure of the best grinding effect that the retaining ring of variant thickness can reach, the pressure information that pressure sensor obtains when then the retaining ring of different-thickness being worked carries out record, the difference of this pressure information and normal pressure relatively obtains the size of required compensatory pressure, sets up data-base recording different pressures information compensatory pressure information corresponding with it afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510110712XA CN100473496C (en) | 2005-11-24 | 2005-11-24 | Automatic pressure regulating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510110712XA CN100473496C (en) | 2005-11-24 | 2005-11-24 | Automatic pressure regulating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1970229A CN1970229A (en) | 2007-05-30 |
| CN100473496C true CN100473496C (en) | 2009-04-01 |
Family
ID=38111350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200510110712XA Expired - Fee Related CN100473496C (en) | 2005-11-24 | 2005-11-24 | Automatic pressure regulating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100473496C (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101758436B (en) * | 2010-01-19 | 2011-11-02 | 上海龙磁电子科技有限公司 | Method for improving grinding intensity of magnetic tile |
| CN104029124A (en) * | 2014-05-15 | 2014-09-10 | 湖南标立通用科技有限公司 | Polishing pressure tester for cover plate faces in precise grinding and polishing operation of glass cover plates |
| CN104942690B (en) * | 2015-07-17 | 2018-10-12 | 厦门理工学院 | A kind of elastic polished equipment and method of special-shaped workpiece |
| CN105269420A (en) * | 2015-11-21 | 2016-01-27 | 中国船舶重工集团公司第七一六研究所 | Full-automatic polishing tool clamp and mounting method thereof |
| CN107687940A (en) * | 2016-08-04 | 2018-02-13 | 邬惠林 | The automatic checkout system of spank window breaker |
| US20200055160A1 (en) * | 2018-08-14 | 2020-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method and apparatus |
| KR20200043214A (en) * | 2018-10-17 | 2020-04-27 | 주식회사 케이씨텍 | Conditioner of chemical mechanical polishing apparatus |
| CN110587472B (en) * | 2019-08-30 | 2020-09-01 | 重庆智能机器人研究院 | Polishing debugging system |
| CN110553941A (en) * | 2019-09-12 | 2019-12-10 | 江苏星光新材料科技有限公司 | wear-resistant paper wear-resistant test device |
-
2005
- 2005-11-24 CN CNB200510110712XA patent/CN100473496C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1970229A (en) | 2007-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100473496C (en) | Automatic pressure regulating method | |
| CN100380600C (en) | Double side polishing device for wafer and double side polishing method | |
| CN102858495A (en) | Closed-loop control for improved polishing pad profiles | |
| CN102652049B (en) | The Ginding process of the lapping device of columnar component, columnar component and columnar component | |
| EP2548696A1 (en) | Polishing apparatus, polishing pad, and polishing information management system | |
| CN101801605B (en) | Work polishing head, and polishing apparatus having the polishing head | |
| CN103817589A (en) | Substrate holding apparatus and polishing apparatus | |
| CN102554788B (en) | Dressing method of polishing pad | |
| CN100591482C (en) | Method for determining abrasive time in chemical mechanical polishing process | |
| CN105500203B (en) | Equipment for grinding grinding head lifting flexible control device | |
| CN108723976A (en) | Leakage detection method and record are useful for executing the computer-readable recording medium of the program of the leakage detection method | |
| CN100473501C (en) | Method for prolonging service-life of grinding pad in chemical-mechanical polishing | |
| CN205363589U (en) | Flexible controlling means of grinding equipment bistrique lift | |
| CN106891241A (en) | The control method and control program of lapping device, the lapping device | |
| TWI274368B (en) | Platen assembly having a topographically altered platen surface | |
| US20060099893A1 (en) | Retainer and wafer polishing apparatus | |
| CN1981992A (en) | Method for automatically adjusting silicon wafer grinding pressure of chemical-mechanical polisher | |
| EP3799583B1 (en) | Cutting equipment and its controllers | |
| CN102962760A (en) | Device for maintaining stable grinding rate and method thereof | |
| JP7128635B2 (en) | Grinder | |
| US7419419B2 (en) | Slurry supply unit for CMP apparatus | |
| CN104416447B (en) | Optical fiber head grinding device | |
| US20230330809A1 (en) | Wafer polishing method and wafer polishing device | |
| CN205363479U (en) | Optical lens piece grinding gauge control device | |
| US20210276150A1 (en) | Control Method of Grinding Water Flow Rate During Double Side Grinding Process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090401 Termination date: 20201124 |