CN110578123A - High hardness AlTiN/AlTiSiN multilayer nanocomposite coating and its preparation process - Google Patents

High hardness AlTiN/AlTiSiN multilayer nanocomposite coating and its preparation process Download PDF

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CN110578123A
CN110578123A CN201910993173.0A CN201910993173A CN110578123A CN 110578123 A CN110578123 A CN 110578123A CN 201910993173 A CN201910993173 A CN 201910993173A CN 110578123 A CN110578123 A CN 110578123A
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altisin
coating
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王铁钢
侯翔
刘艳梅
阎兵
范其香
刘迁
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Tianjin University of Technology and Education China Vocational Training Instructor Training Center
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • C23C14/022Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/024Deposition of sublayers, e.g. to promote adhesion of the coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325Electric arc evaporation

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Abstract

本发明公开了一种高硬度AlTiN/AlTiSiN多层纳米复合涂层及其制备工艺,属于复合涂层制备技术领域。所述AlTiN/AlTiSiN多层纳米复合涂层是由AlTiN层和AlTiSiN层相互交替叠加而成,涂层调制周期为150‑1000nm,周期数≥2。该复合涂层采用电弧离子镀膜技术制备,过程为:选取金属Ti靶、AlTi靶、AlTiSi靶,辉光清洗和轰击清洗后先沉积TiN过渡层,最后通入氮气作为反应气体,按照设定好的调制周期交替开启AlTi靶和AlTiSi靶沉积复合涂层。本发明制备出的涂层组织结构致密、涂层与基体间的结合力强,具有较高的硬度和强度,良好的耐磨损性能。The invention discloses a high-hardness AlTiN/AlTiSiN multi-layer nano composite coating and a preparation process thereof, belonging to the technical field of composite coating preparation. The AlTiN/AlTiSiN multi-layer nanocomposite coating is formed by alternately stacking AlTiN layers and AlTiSiN layers, the coating modulation period is 150-1000nm, and the number of periods is ≥2. The composite coating is prepared by arc ion plating technology. The process is: select metal Ti target, AlTi target, AlTiSi target, first deposit TiN transition layer after glow cleaning and bombardment cleaning, and finally pass nitrogen as the reaction gas. The modulation period of AlTi target and AlTiSi target is alternately turned on to deposit composite coatings. The coating prepared by the invention has dense structure, strong bonding force between the coating and the substrate, high hardness and strength, and good wear resistance.

Description

高硬度AlTiN/AlTiSiN多层纳米复合涂层及其制备工艺High hardness AlTiN/AlTiSiN multilayer nanocomposite coating and its preparation process

技术领域technical field

本发明涉及复合涂层制备技术领域,具体涉及一种高硬度AlTiN/AlTiSiN多层纳米复合涂层及其制备工艺。The invention relates to the technical field of composite coating preparation, in particular to a high-hardness AlTiN/AlTiSiN multi-layer nano composite coating and a preparation process thereof.

背景技术Background technique

近年来,在机械、锻造和成型器件上使用耐磨硬质涂层变得越来越重要,不仅可以节约成本,而且还能提高材料的使用寿命。AlTiN涂层因其优良的高温硬度和抗氧化性能,目前已广泛应用于高速钢和硬质合金刀具,这很大程度上归功于铝元素的增加。与二元涂层TiN相比,AlTiN涂层作为刀具的保护层,可减少磨损量及冲击所导致的断裂。虽然AlTiN涂层抗氧化性能相比其他二元涂层得到了明显改善,但仍然不能满足一些高速切削或干切削环境下提出的高硬度、高韧性和耐磨性等要求。In recent years, the use of wear-resistant hard coatings on mechanical, forged and formed components has become increasingly important to not only save costs, but also increase the service life of the material. AlTiN coating has been widely used in high-speed steel and cemented carbide tools due to its excellent high temperature hardness and oxidation resistance, which is largely due to the increase of aluminum elements. Compared with the binary coating TiN, the AlTiN coating acts as a protective layer for the tool, which can reduce the amount of wear and fracture caused by impact. Although the oxidation resistance of AlTiN coating has been significantly improved compared with other binary coatings, it still cannot meet the requirements of high hardness, high toughness and wear resistance in some high-speed cutting or dry cutting environments.

为研制结构致密、高硬度、耐磨性的多层纳米复合涂层,本专利采用电弧离子镀膜技术在金属或合金基体上沉积AlTiN/AlTiSiN多层纳米复合涂层,进一步提高单层涂层的机械性能和实现多层涂层的使役寿命和优良性能。In order to develop a multi-layer nano-composite coating with dense structure, high hardness and wear resistance, this patent adopts the arc ion plating technology to deposit AlTiN/AlTiSiN multi-layer nano-composite coating on the metal or alloy substrate to further improve the performance of the single-layer coating. Mechanical properties and service life and excellent performance of multi-layer coatings are achieved.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种高硬度AlTiN/AlTiSiN多层纳米复合涂层及其制备工艺,所制备的AlTiN/AlTiSiN多层纳米复合涂层兼具高硬度、高耐磨性和高热稳定性能。The purpose of the present invention is to provide a high-hardness AlTiN/AlTiSiN multilayer nanocomposite coating and a preparation process thereof. The prepared AlTiN/AlTiSiN multilayer nanocomposite coating has both high hardness, high wear resistance and high thermal stability.

为实现上述目的,本发明所采用的技术方案如下:For achieving the above object, the technical scheme adopted in the present invention is as follows:

一种高硬度AlTiN/AlTiSiN多层纳米复合涂层,沉积于金属或硬质合金基体上,所述AlTiN/AlTiSiN多层纳米复合涂层是由AlTiN层和AlTiSiN层相互交替叠加而成,涂层调制周期为150-1000nm,周期数≥2。A high-hardness AlTiN/AlTiSiN multi-layer nanocomposite coating is deposited on a metal or cemented carbide substrate. The AlTiN/AlTiSiN multi-layer nanocomposite coating is formed by alternately stacking AlTiN layers and AlTiSiN layers. The modulation period is 150-1000nm, and the number of periods is ≥2.

所述AlTiN层和AlTiSiN层的调制比为1:1,沉积涂层总厚度为3μm。The modulation ratio of the AlTiN layer and the AlTiSiN layer is 1:1, and the total thickness of the deposited coating is 3 μm.

所述AlTiN/AlTiSiN多层纳米复合涂层均为面心立方结构,没有硬度低的六方相生成,涂层的择优取向晶面为(Ti,Al)N(200)的衍射峰。The AlTiN/AlTiSiN multi-layer nanocomposite coatings all have a face-centered cubic structure, no hexagonal phase with low hardness is formed, and the preferred orientation crystal plane of the coating is the diffraction peak of (Ti, Al)N (200).

所述AlTiN/AlTiSiN多层纳米复合涂层的硬度大于28GPa,与基材结合力大于100N。The hardness of the AlTiN/AlTiSiN multi-layer nanocomposite coating is greater than 28GPa, and the bonding force with the substrate is greater than 100N.

所述高硬度AlTiN/AlTiSiN多层纳米复合涂层的制备工艺,是采用电弧离子镀膜技术在基体上沉积AlTiN/AlTiSiN多层纳米复合涂层,靶材选择纯金属Ti靶、AlTi合金靶和AlTiSi合金靶(所述靶材纯度均为99.9wt.%);沉积AlTiN/AlTiSiN多层纳米复合涂层时,先开启Ti靶,然后交替开启AlTi靶和AlTiSi靶沉积相应的AlTiN层和AlTiSiN层,并控制沉积AlTiN层和AlTiSiN层时的沉积压强、通入气体的流量以及各个靶的弧流参数,从而在基体上制备出AlTiN层和AlTiSiN层相互交替叠加的AlTiN/AlTiSiN多层纳米复合涂层。The preparation process of the high-hardness AlTiN/AlTiSiN multi-layer nanocomposite coating is to deposit the AlTiN/AlTiSiN multi-layer nanocomposite coating on the substrate by using the arc ion plating technology, and the target materials are selected from pure metal Ti target, AlTi alloy target and AlTiSi Alloy target (the purity of the target material is 99.9wt.%); when depositing the AlTiN/AlTiSiN multi-layer nanocomposite coating, first open the Ti target, then alternately open the AlTi target and the AlTiSi target to deposit the corresponding AlTiN layer and AlTiSiN layer, The AlTiN/AlTiSiN multilayer nanocomposite coatings with AlTiN layers and AlTiSiN layers alternately superimposed on the substrate are prepared by controlling the deposition pressure, the flow rate of the gas and the arc flow parameters of each target when depositing the AlTiN layer and the AlTiSiN layer. .

本发明在沉积AlTiN/AlTiSiN多层纳米复合涂层时,弧流均设置为40~100A;开启AlTi靶沉积AlTiN涂层时,设置偏压60~150V(占空比50%~90%),通入氩气和氮气使沉积压强调节至0.5~2Pa;开启AlTiSi靶沉积AlTiSiN涂层时,设置偏压80~100V(占空比50%~90%),通入氩气和氮气使沉积压强调节至1~3Pa;根据所需涂层的厚度设置涂层的不同调制周期和沉积时间。When depositing the AlTiN/AlTiSiN multi-layer nanocomposite coating in the present invention, the arc current is set to 40-100A; when the AlTi target is turned on to deposit the AlTiN coating, the bias voltage is set to 60-150V (duty ratio 50%-90%), Pour in argon and nitrogen to adjust the deposition pressure to 0.5~2Pa; when the AlTiSi target is turned on to deposit AlTiSiN coating, set the bias voltage to 80~100V (duty ratio 50%~90%), and pass in argon and nitrogen to make the deposition pressure Adjust to 1-3Pa; set different modulation periods and deposition times of the coating according to the desired thickness of the coating.

沉积AlTiN涂层时,通入氩气的流量为50sccm,通入氮气的流量为350sccm,总流量400sccm;沉积AlTiSiN涂层时,通入氩气的流量为50sccm,通入氮气的流量为600sccm,总流量650sccm。When depositing the AlTiN coating, the flow rate of argon gas is 50sccm, the flow rate of nitrogen gas is 350sccm, and the total flow rate is 400sccm; when the AlTiSiN coating is deposited, the flow rate of argon gas is 50sccm, and the flow rate of nitrogen gas is 600sccm, The total flow is 650sccm.

所述高硬度AlTiN/AlTiSiN多层纳米复合涂层的制备工艺,具体包括如下步骤:The preparation process of the high-hardness AlTiN/AlTiSiN multilayer nanocomposite coating specifically includes the following steps:

(1)各靶材均匀分布在电弧离子镀设备真空室内周围,以保证沉积过程中炉腔内具有较高的等离子体浓度;将预处理后的基片放入镀膜室中央转架上;采用机械泵和分子泵抽真空使真空室气压达到3×10-3Pa以下;(1) The targets are evenly distributed around the vacuum chamber of the arc ion plating equipment to ensure a high plasma concentration in the furnace chamber during the deposition process; the pretreated substrates are placed on the central turntable of the coating chamber; Mechanical pump and molecular pump are evacuated to make the vacuum chamber pressure below 3×10 -3 Pa;

(2)辉光轰击清洗:先采用高的负偏压辉光清洗基体10~30min,辉光清洗后开启Ti靶,调整偏压依次至-800V、-600V、-400V和-200V对基体表面分别进行2分钟的轰击清洗;(2) Glow bombardment cleaning: first use a high negative bias glow to clean the substrate for 10 to 30 minutes, then turn on the Ti target after glow cleaning, and adjust the bias voltage to -800V, -600V, -400V and -200V in turn for the surface of the substrate Carry out bombardment cleaning for 2 minutes respectively;

(3)沉积TiN过渡层:辉光轰击清洗后在基体表面沉积一层厚度10~350nm的TiN过渡层以提高涂层与基体之间的结合力;(3) Deposition of TiN transition layer: after glow bombardment cleaning, a TiN transition layer with a thickness of 10-350 nm is deposited on the surface of the substrate to improve the bonding force between the coating and the substrate;

(4)沉积多层复合涂层:开启合金AlTi靶和AlTiSi靶沉积多层复合涂层。(4) Deposition of multi-layer composite coating: The alloy AlTi target and AlTiSi target are turned on to deposit the multi-layer composite coating.

上述步骤(2)中,所述辉光清洗的过程为:将炉腔加热至200~500℃,通入氩气200~400sccm,设置脉冲偏压-600~-1000V,对基体进行辉光清洗;In the above step (2), the glow cleaning process is as follows: heating the furnace chamber to 200-500° C., feeding 200-400 sccm of argon gas, setting a pulse bias voltage of -600--1000V, and performing glow cleaning on the substrate ;

上述步骤(2)中,所述轰击清洗过程为:辉光清洗后,开启Ti靶,调整氩气流量为50~100sccm,在-800V、-600V、-400V和-200V负偏压条件下各清洗2min。In the above step (2), the bombardment cleaning process is as follows: after glow cleaning, turn on the Ti target, adjust the argon flow rate to be 50-100sccm, and under negative bias conditions of -800V, -600V, -400V and -200V, respectively. Wash for 2 minutes.

上述步骤(3)中,沉积TiN过渡层的过程为:辉光轰击清洗后,设置偏压为50~100V(占空比60%~90%),开启Ti靶,通入氩气流量为50sccm,氮气流量为200sccm,使沉积压强调节至0.5~1.2Pa,沉积10~30min的过渡层TiN。In the above step (3), the process of depositing the TiN transition layer is as follows: after the glow bombardment cleaning, set the bias voltage to 50-100V (duty ratio of 60%-90%), turn on the Ti target, and pass in the argon gas flow rate of 50sccm , the nitrogen flow rate is 200sccm, the deposition pressure is adjusted to 0.5-1.2Pa, and the transition layer TiN is deposited for 10-30min.

本发明设计机理如下:The design mechanism of the present invention is as follows:

本发明在AlTiN涂层中添加Si元素,利用Al、Ti元素的固溶强化作用和非晶Si3N4细化晶粒以及提高硬度,同时将AlTiN涂层与AlTiSiN进行交替排布形成多层纳米复合涂层,可使AlTiN/AlTiSiN多层复合涂层具有明显优于单层涂层的优异特性并满足人们在耐磨材料领域的广泛需求。In the present invention, Si element is added to the AlTiN coating, and the solid solution strengthening effect of Al and Ti elements and amorphous Si 3 N 4 are used to refine crystal grains and improve hardness, and at the same time, AlTiN coating and AlTiSiN are alternately arranged to form multiple layers The nanocomposite coating can make the AlTiN/AlTiSiN multi-layer composite coating have excellent properties significantly better than the single-layer coating and meet people's extensive needs in the field of wear-resistant materials.

本发明制备的纳米多层膜是一个调制结构,即一个具有一定重复周期的结构。将两种不同涂层以纳米级尺寸交替沉积,所获得的多层纳米复合结构会出现硬度异常升高的超硬现象,并且集中不同材料的优点,克服单层膜的不足,相比于具有更好的综合机械性能,尤其表现在高硬度、高韧性和优异的耐磨性能。The nano-multilayer film prepared by the invention is a modulation structure, that is, a structure with a certain repetition period. By alternately depositing two different coatings with nanometer size, the obtained multi-layer nanocomposite structure will exhibit a superhard phenomenon with abnormally increased hardness, and concentrate the advantages of different materials to overcome the shortcomings of single-layer films. Better comprehensive mechanical properties, especially in high hardness, high toughness and excellent wear resistance.

本发明的优点如下:The advantages of the present invention are as follows:

1、本发明研制的AlTiN/AlTiSiN多层纳米复合涂层具有较高的硬度和韧性,摩擦系数低,耐磨性能好。1. The AlTiN/AlTiSiN multi-layer nanocomposite coating developed by the present invention has high hardness and toughness, low friction coefficient and good wear resistance.

2、本发明研制的AlTiN/AlTiSiN纳米复合涂层具有较高的高温热稳定性能和耐蚀性能,可用于高速干切削加工领域。2. The AlTiN/AlTiSiN nanocomposite coating developed by the present invention has high high temperature thermal stability and corrosion resistance, and can be used in the field of high-speed dry cutting.

3、本发明研制的AlTiN/AlTiSiN纳米复合涂层厚度均匀且结构致密,与基体具有良好的结合强度。3. The AlTiN/AlTiSiN nanocomposite coating developed by the present invention has uniform thickness and compact structure, and has good bonding strength with the substrate.

4、本发明研制的AlTiN/AlTiSiN纳米复合涂层制备工艺重复性好,应用范围广,具有非常强的实用性。4. The preparation process of the AlTiN/AlTiSiN nanocomposite coating developed by the present invention has good repeatability, wide application range and very strong practicability.

附图说明Description of drawings

图1为采用电弧离子镀技术制备的AlTiN/AlTiSiN纳米复合涂层的衍射图谱。Figure 1 shows the diffraction pattern of the AlTiN/AlTiSiN nanocomposite coating prepared by arc ion plating technology.

图2为采用电弧离子镀技术制备的AlTiN/AlTiSiN纳米复合涂层的表面形貌图。Figure 2 shows the surface topography of the AlTiN/AlTiSiN nanocomposite coating prepared by arc ion plating technology.

图3为采用电弧离子镀技术制备的AlTiN/AlTiSiN纳米复合涂层的截面形貌图。Figure 3 is a cross-sectional topography of the AlTiN/AlTiSiN nanocomposite coating prepared by arc ion plating technology.

图4为采用电弧离子镀技术制备的AlTiN/AlTiSiN纳米复合涂层的纳米压痕曲线图。FIG. 4 is a nanoindentation curve diagram of an AlTiN/AlTiSiN nanocomposite coating prepared by arc ion plating technology.

图5为采用电弧离子镀技术制备的AlTiN/AlTiSiN纳米复合涂层划痕测试后的形貌图。Figure 5 is the topography of the AlTiN/AlTiSiN nanocomposite coating prepared by arc ion plating technology after scratch test.

图6为采用电弧离子镀技术制备的AlTiN/AlTiSiN涂层的摩擦系数测试曲线图。FIG. 6 is a graph showing the friction coefficient test curve of AlTiN/AlTiSiN coatings prepared by arc ion plating technology.

具体实施方式Detailed ways

下面通过实施例对本发明作进一步详细说明。The present invention will be described in further detail below through examples.

实施例1Example 1

本实施例为在经抛光处理的304不锈钢片上沉积AlTiN/AlTiSiN多层纳米复合涂层,试样尺寸为25×30×1mm。In this example, an AlTiN/AlTiSiN multi-layer nanocomposite coating is deposited on a polished 304 stainless steel sheet, and the size of the sample is 25×30×1 mm.

基片先进行预处理:依次在丙酮、酒精中各超声清洗15分钟,然后用高纯氮气吹干,再放置于真空室内的试样架上。The substrate was pretreated first: ultrasonically cleaned in acetone and alcohol for 15 minutes, then dried with high-purity nitrogen, and then placed on the sample holder in the vacuum chamber.

镀膜过程在AIP-650型电弧离子镀膜机上进行,采用直径均为100mm的纯金属Ti靶、合金AlTi靶、合金AlTiSi靶(纯度均为99.9wt.%)作为靶材,工作气体和反应气体分别选用高纯氩气和氮气。The coating process was carried out on an AIP-650 arc ion coating machine. Pure metal Ti targets, alloy AlTi targets, and alloy AlTiSi targets (all with a purity of 99.9 wt.%) with a diameter of 100 mm were used as targets. The working gas and reaction gas were respectively Use high-purity argon and nitrogen.

各靶材均匀分布在电弧离子镀设备的炉体内壁上,以保证沉积过程中炉腔内具有较高的等离子体浓度;将预处理后的基片放入镀膜室中央转架上;The targets are evenly distributed on the inner wall of the furnace of the arc ion plating equipment to ensure a high plasma concentration in the furnace cavity during the deposition process; the pretreated substrates are placed on the central turntable of the coating chamber;

采用机械泵和分子泵抽真空使真空室气压达到3×10-3Pa以下打开加热系统升温至430℃,然后在真空室内通入氩气400sccm,设置偏压为-800V对试样表面进行辉光放电清洗20min。Use mechanical pump and molecular pump to evacuate the vacuum chamber pressure below 3×10 -3 Pa, turn on the heating system and raise the temperature to 430℃, then pass argon gas for 400sccm into the vacuum chamber, set the bias voltage to -800V to illuminate the surface of the sample Photodischarge cleaning for 20min.

随后开启Ti靶,调整氩气流量为50~100sccm,调整负偏压依次为-800V、-600V、-400V、-200V各进行2分钟的轰击清洗;Then turn on the Ti target, adjust the argon flow rate to 50-100sccm, and adjust the negative bias voltage to -800V, -600V, -400V, -200V for 2 minutes of bombardment cleaning;

之后设置偏压为100V(占空比60%),开启Ti靶,通入50sccm的氩气,200sccm的氮气,调节沉积压强0.8Pa,沉积20min的过渡层TiN;Then set the bias voltage to 100V (duty ratio 60%), turn on the Ti target, pass 50sccm of argon, 200sccm of nitrogen, adjust the deposition pressure to 0.8Pa, and deposit 20min of transition layer TiN;

最后交替开启AlTi靶和AlTiSi靶,弧流均设置为80A;开启AlTi靶沉积每层AlTiN层时:设置偏压80V(占空比80%),通入流量为50sccm的氩气和350sccm的氮气,调节沉积压强为1Pa;开启AlTiSi靶沉积每层AlTiSiN层时,设置偏压100V(占空比80%),通入流量为50sccm的氩气和600sccm的氮气,调节沉积压强为2.8Pa,设置涂层调制周期为750nm,沉积4个周期(共8层),两种涂层调制比为1:1,沉积涂层总厚度为3μm。Finally, the AlTi target and the AlTiSi target are turned on alternately, and the arc flow is set to 80A; when the AlTi target is turned on to deposit each layer of AlTiN layer: set the bias voltage to 80V (80% duty cycle), and flow 50sccm of argon and 350sccm of nitrogen , adjust the deposition pressure to 1Pa; when the AlTiSi target is turned on to deposit each layer of AlTiSiN layer, set a bias voltage of 100V (80% duty cycle), pass argon with a flow rate of 50sccm and nitrogen with a flow rate of 600sccm, adjust the deposition pressure to 2.8Pa, set The modulation period of the coating is 750 nm, 4 periods (8 layers in total) are deposited, the modulation ratio of the two coatings is 1:1, and the total thickness of the deposited coating is 3 μm.

图1为本实施例制备的AlTiN/AlTiSiN纳米复合涂层的衍射谱图,可以看出涂层由面心立方结构的涂层组成,没有硬度低的六方相生成,涂层的择优取向晶面为(Ti,Al)N(200)的衍射峰。Fig. 1 is the diffraction spectrum of the AlTiN/AlTiSiN nanocomposite coating prepared in this example. It can be seen that the coating is composed of a face-centered cubic structure, and no hexagonal phase with low hardness is generated. The preferred orientation crystal plane of the coating is is the diffraction peak of (Ti, Al)N (200).

图2为纳米复合涂层的表面形貌图,涂层表现为典型电弧离子镀涂层特征,组织结构致密均匀,表面有少量的大颗粒生成。Figure 2 shows the surface topography of the nanocomposite coating. The coating exhibits the characteristics of a typical arc ion plating coating, with a dense and uniform structure and a small amount of large particles on the surface.

图3为纳米复合涂层的截面形貌图,涂层的厚度约为3μm,涂层与基体结合良好。Figure 3 is a cross-sectional topography of the nanocomposite coating, the thickness of the coating is about 3 μm, and the coating is well combined with the substrate.

图4为采用纳米压痕技术测试的纳米复合涂层的硬度值变化曲线图。随着纳米压痕探针的压入,测试涂层硬度值先快速增加,达到一个平台值,随后由于基底效应硬度逐渐降低。一般取平台值作为涂层的平均硬度值。由图可知,本实施例纳米复合涂层的硬度约为29GPa。FIG. 4 is a graph showing the change of hardness value of the nanocomposite coating tested by the nanoindentation technique. With the indentation of the nanoindentation probe, the hardness value of the tested coating increases rapidly at first, reaching a plateau value, and then gradually decreases due to the substrate effect. Generally, the plateau value is taken as the average hardness value of the coating. It can be seen from the figure that the hardness of the nanocomposite coating in this example is about 29GPa.

图5为采用划痕测试仪测试的纳米复合涂层的划痕形貌变化图。从图中可以看到,涂层结合力良好,达到102N。FIG. 5 is a graph showing the change of scratch morphology of the nanocomposite coating tested by a scratch tester. As can be seen from the figure, the coating adhesion is good, reaching 102N.

图6为采用高温摩擦机测试的纳米复合涂层的摩擦曲线图。由于多层的结构或者涂层表面不平的原因致使摩擦曲线出现波动。Figure 6 is a graph of the friction curve of the nanocomposite coating tested by a high temperature friction machine. The friction curve fluctuates due to the multi-layer structure or the uneven surface of the coating.

实施例2Example 2

本实施例为在经抛光处理的硬质合金基片上沉积AlTiN/AlTiSiN多层纳米复合涂层,试样尺寸为25×30×3mm。In this example, the AlTiN/AlTiSiN multi-layer nanocomposite coating is deposited on the polished cemented carbide substrate, and the size of the sample is 25×30×3 mm.

基片先进行预处理:依次在丙酮、酒精中各超声清洗15mim,然后用高纯氮气吹干,再放置于真空室试样架上。The substrate was pretreated first: ultrasonically cleaned in acetone and alcohol for 15mim each, then dried with high-purity nitrogen, and then placed on a sample holder in a vacuum chamber.

镀膜过程在AIP-650型电弧离子镀膜机上进行,靶材采用直径均为100mm的纯金属Ti靶、合金AlTi靶、AlTiSi合金靶(纯度均为wt.99.9%)作为靶材,工作气体和反应气体分别选用高纯氩气和氮气。The coating process was carried out on an AIP-650 arc ion coating machine. The target materials were pure metal Ti targets, alloy AlTi targets, and AlTiSi alloy targets (all with a purity of wt. 99.9%) with a diameter of 100 mm as targets. The gases used were high-purity argon and nitrogen.

各靶材均匀放置在电弧离子镀设备真空室内周围,以保证沉积过程中炉腔内具有较高的等离子体浓度;将预处理后的基片放入镀膜室中央转架上;Each target is evenly placed around the vacuum chamber of the arc ion plating equipment to ensure a high plasma concentration in the furnace chamber during the deposition process; the pretreated substrate is placed on the central turntable of the coating chamber;

采用机械泵和分子泵先将真空室的本底真空抽至3×10-3Pa以下,打开加热系统升温至430℃,然后在真空室内通入氩气400sccm,设置偏压为-800V对试样表面进行辉光放电清洗20min。First, the background vacuum of the vacuum chamber was evacuated to below 3×10 -3 Pa by mechanical pump and molecular pump, the heating system was turned on and the temperature was raised to 430°C, then argon gas was introduced into the vacuum chamber for 400sccm, and the bias voltage was set to -800V. The surface of the sample was cleaned by glow discharge for 20 min.

随后开启Ti靶,调整氩气流量为50~100sccm,调整负偏压依次为-800V、-600V、-400V、-200V各进行2分钟的轰击清洗;Then turn on the Ti target, adjust the argon flow rate to 50-100sccm, and adjust the negative bias voltage to -800V, -600V, -400V, -200V for 2 minutes of bombardment cleaning;

之后设置偏压为100V(占空比60%),开启Ti靶,通入50sccm的氩气,200sccm的氮气,调节沉积压强0.8Pa,沉积20min的过渡层TiN;Then set the bias voltage to 100V (duty ratio 60%), turn on the Ti target, pass 50sccm of argon, 200sccm of nitrogen, adjust the deposition pressure to 0.8Pa, and deposit 20min of transition layer TiN;

最后交替开启AlTi靶和AlTiSi靶,弧流均设置为80A;开启AlTi靶沉积每层AlTiN层时:设置偏压80V(占空比80%),通入流量为50sccm的氩气和350sccm的氮气,通入氩气和氮气调节沉积压强为1Pa;开启AlTiSi靶沉积每层AlTiSiN层时,设置偏压100V(占空比80%),通入流量为50sccm的氩气和600sccm的氮气,通入氩气和氮气调节沉积压强为2.8Pa,设置涂层调制周期为375nm,两种涂层调制比为1:1,沉积涂层总厚度为3μm。Finally, the AlTi target and the AlTiSi target are turned on alternately, and the arc flow is set to 80A; when the AlTi target is turned on to deposit each layer of AlTiN layer: set the bias voltage to 80V (80% duty cycle), and flow 50sccm of argon and 350sccm of nitrogen , pass argon and nitrogen to adjust the deposition pressure to 1Pa; when the AlTiSi target is turned on to deposit each layer of AlTiSiN layer, set the bias voltage to 100V (duty ratio 80%), pass 50sccm of argon and 600sccm of nitrogen, pass Argon and nitrogen were used to adjust the deposition pressure to 2.8 Pa, the coating modulation period was set to 375 nm, the modulation ratio of the two coatings was 1:1, and the total thickness of the deposited coating was 3 μm.

本实施例制备的纳米复合涂层的相组成和组织结构与实施例1中涂层相同,由面心立方结构的涂层组成。涂层总厚度约为3μm,硬度高达32Gpa。The phase composition and microstructure of the nanocomposite coating prepared in this example are the same as those of the coating in Example 1, and consist of a coating with a face-centered cubic structure. The total thickness of the coating is about 3μm, and the hardness is as high as 32Gpa.

Claims (10)

1. The high-hardness AlTiN/AlTiSiN multilayer nano composite coating is characterized in that: the coating is deposited on a metal or hard alloy matrix, the AlTiN/AlTiSiN multilayer nano composite coating is formed by alternately overlapping AlTiN layers and AlTiSiN layers, the modulation period of the coating is 150-1000nm, and the periodicity is more than or equal to 2.
2. The high hardness AlTiN/AlTiSiN multilayer nanocomposite coating of claim 1, wherein: the modulation ratio of the AlTiN layer to the AlTiSiN layer is 1:1, the total thickness of the deposited coating is 3 μm.
3. The high hardness AlTiN/AlTiSiN multilayer nanocomposite coating of claim 1, wherein: the AlTiN/AlTiSiN multilayer nano composite coating is of a face-centered cubic structure, no low-hardness hexagonal phase is generated, and the preferred orientation crystal face of the coating is a diffraction peak of (Ti, Al) N (200).
4. The high hardness AlTiN/AlTiSiN multilayer nanocomposite coating of claim 1, wherein: the hardness of the AlTiN/AlTiSiN multilayer nano composite coating is more than 28GPa, and the bonding force with a base material is more than 100N.
5. The process for preparing high-hardness AlTiN/AlTiSiN multilayer nano composite coating according to any one of claims 1 to 4, wherein: the process is characterized in that an AlTiN/AlTiSiN multilayer nano composite coating is deposited on a substrate by adopting an arc ion coating technology, and a target material is selected from a pure metal Ti target, an AlTi alloy target and an AlTiSi alloy target (the target material purity is 99.9 wt%); when depositing the AlTiN/AlTiSiN multilayer nano composite coating, the Ti target is firstly started, then the AlTi target and the AlTiSi target are alternately started to deposit the corresponding AlTiN layer and AlTiSiN layer, and the deposition pressure, the gas flow and the arc flow parameters of each target when depositing the AlTiN layer and the AlTiSiN layer are controlled, so that the AlTiN/AlTiSiN multilayer nano composite coating with the AlTiN layer and the AlTiSiN layer alternately superposed with each other is prepared on the substrate.
6. The preparation process of the high-hardness AlTiN/AlTiSiN multilayer nano composite coating according to claim 5, characterized in that: when depositing the AlTiN/AlTiSiN multilayer nano composite coating, setting arc flow to be 40-100A; when an AlTi target is started to deposit an AlTiN coating, setting a bias voltage of 60-150V (duty ratio of 50% -90%), and introducing argon and nitrogen to adjust the deposition pressure to 0.5-2 Pa; when an AlTiSi target is started to deposit an AlTiSiN coating, setting a bias voltage of 80-100V (duty ratio of 50% -90%), and introducing argon and nitrogen to adjust the deposition pressure to 1-3 Pa; different modulation periods and deposition times of the coating are set according to the desired thickness of the coating.
7. The preparation process of the high-hardness AlTiN/AlTiSiN multilayer nano composite coating according to claim 6, characterized in that: when depositing the AlTiN coating, the flow of the introduced argon is 50sccm, the flow of the introduced nitrogen is 350sccm, and the total flow is 400 sccm; when the AlTiSiN coating is deposited, the flow rate of argon is 50sccm, the flow rate of nitrogen is 600sccm, and the total flow rate is 650 sccm.
8. The process for preparing high-hardness AlTiN/AlTiSiN multilayer nano composite coating according to claim 7, characterized in that: the process specifically comprises the following steps:
(1) Placing the pretreated substrate on a central rotating stand of a coating chamber, and controlling the air pressure of the vacuum chamber to be 3 x 10-3pa below;
(2) Glow bombardment cleaning: firstly, glow washing the substrate for 10-30 min by adopting high negative bias glow, starting a Ti target after glow washing, and adjusting the bias to-800V, -600V, -400V and-200V in sequence to respectively carry out bombardment washing on the surface of the substrate for 2 min;
(3) And (3) depositing a TiN transition layer: depositing a TiN transition layer with the thickness of 10-350 nm on the surface of the substrate after glow bombardment cleaning so as to improve the binding force between the coating and the substrate;
(4) Depositing a multi-layer composite coating: and starting the alloy AlTi target and the AlTiSi target to deposit the multilayer composite coating.
9. The process for preparing high-hardness AlTiN/AlTiSiN multilayer nano composite coating according to claim 8, wherein: in the step (2), the glow cleaning process comprises the following steps: heating the furnace chamber to 200-500 ℃, introducing argon gas of 200-400 sccm, setting pulse bias voltage of-600-1000V, and performing glow cleaning on the substrate; the bombardment cleaning process comprises the following steps: after glow cleaning, starting the Ti target, adjusting the argon flow to be 50-100 sccm, and cleaning for 2min under negative bias conditions of-800V, -600V, -400V and-200V respectively.
10. The process for preparing high-hardness AlTiN/AlTiSiN multilayer nano composite coating according to claim 8, wherein: in the step (3), the process of depositing the TiN transition layer comprises the following steps: after glow bombardment cleaning, setting a bias voltage of 50-100V (duty ratio of 60% -90%), starting the Ti target, introducing argon gas flow of 50sccm and nitrogen gas flow of 200sccm, adjusting the deposition pressure to 0.5-1.2 Pa, and depositing a transition layer TiN for 10-30 min.
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Application publication date: 20191217

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