CN110572980A - server system and server room - Google Patents
server system and server room Download PDFInfo
- Publication number
- CN110572980A CN110572980A CN201910659637.4A CN201910659637A CN110572980A CN 110572980 A CN110572980 A CN 110572980A CN 201910659637 A CN201910659637 A CN 201910659637A CN 110572980 A CN110572980 A CN 110572980A
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- Prior art keywords
- heat exchange
- server
- back plate
- server system
- cabinet
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- 239000007788 liquid Substances 0.000 claims abstract description 67
- 238000001816 cooling Methods 0.000 claims abstract description 64
- 239000002826 coolant Substances 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 238000009423 ventilation Methods 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 238000010276 construction Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000005192 partition Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
the invention relates to the field of servers, and discloses a server system and a server room, wherein the server system comprises: the system comprises a cabinet, an active heat exchange back plate, a liquid cooling server and a circulating device, wherein the liquid cooling server and the circulating device are arranged in the cabinet; the server system further includes: the pipeline assembly is connected with the circulating device, the liquid cooling server and the active heat exchange back plate, and the heat dissipation device is arranged on the active heat exchange back plate; the circulating device circularly conveys the cooling medium between the liquid cooling server and the active heat exchange back plate through the pipeline assembly; the active heat exchange back plate carries out heat exchange on the cooling medium, and the heat dissipation device discharges heat generated after the active heat exchange back plate carries out heat exchange on the cooling medium towards a direction far away from the cabinet. Compared with the prior art, need not to adopt cooling tower and cold volume controller, consequently reduced server system's construction cost, avoided complicated pipeline to build simultaneously, effectively improved the space utilization in the server computer lab to the computer lab can adopt direct new trend natural cooling, reaches energy-conserving effect.
Description
Technical Field
The invention relates to the field of servers, in particular to a server system and a server room.
background
A server, which is a device providing computing services, is widely used in various industries, such as an online retail industry, an internet industry, a financial industry, a university institution, and the like.
The temperature of the server rises due to a large amount of heat generated by the server during operation, which affects the computing capacity of the server. In order to improve the heat dissipation efficiency of the server, the liquid cooling server is inoculated. Although the liquid-cooled server has better heat dissipation capability than the conventional server, in the use process of the liquid-cooled server, as shown in fig. 1, the cooling tower 100 needs to provide the cooling capacity of the cooling water on the primary side to the cooling capacity controller 200, and then the cooling capacity controller 200 cools the cooling water on the secondary side, thereby achieving the purpose of heat exchange of the liquid-cooled server 300. However, the inventor finds that by adopting the heat exchange mode, the whole server system not only needs to use the cooling tower 100 and the refrigeration quantity controller 200, so that the cost for building the whole server system is very high. Meanwhile, corresponding circulating heat exchange pipelines need to be built between the cooling tower 100 and the cold quantity controller 200 and between the cold quantity controller 200 and the liquid cooling server 300 respectively, and the cooling tower is arranged outside the cabinet, so that the pipeline design of the whole system is very complex, the volume control of the whole server system is not facilitated, the arrangement of the whole server system in a machine room is influenced, and the space in the machine room cannot be effectively utilized.
disclosure of Invention
the invention aims to provide a server system and a server room, which can reduce the cost of the whole server system and the volume of the whole server system while ensuring the heat dissipation efficiency of a server so as to improve the space utilization rate of the server room.
in order to solve the above technical problem, the present invention provides a server system, including: the rack, set up in liquid cooling server in the rack, server system still includes:
The circulating device is arranged in the cabinet;
The active heat exchange back plate is arranged opposite to the cabinet;
The pipeline assembly is respectively connected with the circulating device, the liquid cooling server and the active heat exchange back plate;
the heat dissipation device is arranged on the active heat exchange back plate;
The circulating device is used for circularly conveying a cooling medium between the liquid cooling server and the active heat exchange back plate through the pipeline assembly;
The active heat exchange back plate is used for carrying out heat exchange on a cooling medium, and the heat dissipation device is used for discharging heat generated by the active heat exchange back plate after the active heat exchange back plate carries out heat exchange on the cooling medium towards a direction far away from the cabinet.
in addition, an embodiment of the present invention further provides a server room, including: the server system comprises a machine room body and at least one server system, wherein each server system is arranged in the machine room body;
The computer lab body includes: the server system comprises an accommodating chamber and a heat collecting chamber, wherein each server system is arranged in the accommodating area, and the heat collecting chamber is communicated with the outside;
The computer lab body still includes: the ventilation pipeline is arranged in the accommodating chamber and used for communicating the accommodating chamber with the heat collecting chamber, and the ventilation pipeline is used for sending heat discharged by the heat dissipation devices of the server systems into the heat collecting chamber and discharging the heat outwards from the heat collecting chamber;
and ventilation holes communicated with the outside are distributed on the side wall of the accommodating chamber.
Compared with the prior art, the embodiment of the invention has the advantages that the active heat exchange back plate is arranged at the opposite position of the cabinet for placing the server in the whole server system, the heat dissipation device is arranged in the direction of the active heat exchange back plate departing from the cabinet, and the circulating device is arranged in the cabinet. In addition, the whole server system further includes: and the pipeline assembly is respectively connected with the circulating device, the liquid cooling server and the active heat exchange back plate through the pipeline assembly. Therefore, when the circulating device works, the cooling medium can be circularly conveyed between the liquid cooling server and the active heat exchange back plate by virtue of the pipeline assembly, namely, the cooling medium can directly enter the active heat exchange back plate through the pipeline assembly after flowing out of the liquid cooling server, the active heat exchange back plate is used for exchanging heat with the cooling medium, heat generated by the active heat exchange back plate after heat exchange is discharged towards the direction far away from the cabinet by virtue of the bulk device, and the cooling medium subjected to heat exchange and cooling by virtue of the active heat exchange back plate can be returned to the liquid cooling server again by virtue of the circulating device so as to meet the cooling requirement on the liquid cooling server. From this it is difficult to see that whole server system can realize the effective cooling to liquid cooling server based on circulating device and initiative heat exchange backplate to need not to adopt cooling tower and cold volume controller, reduced whole server system's cost, also avoided complicated pipeline to build simultaneously, make whole server system's volume greatly reduced, thereby space utilization in the server computer lab has been improved, and but the computer lab ventilation hole adopts direct new trend natural cooling, reach energy-conserving effect.
In addition, the liquid cooling server is provided with a liquid inlet end and a liquid outlet end, the circulating device is provided with an inlet end and an outlet end, and the active heat exchange back plate is provided with a liquid inlet and a liquid outlet;
the piping component includes:
the first pipeline is respectively connected with the liquid inlet end of the liquid cooling server and the outlet end of the circulating device;
the second pipeline is respectively connected with the liquid outlet end of the liquid cooling server and the liquid inlet of the active heat exchange back plate;
and the third pipeline is respectively connected with the liquid outlet of the active heat exchange back plate and the inlet end of the circulating device.
in addition, the active heat exchange back plate is movably arranged on the machine cabinet and used for opening and closing the machine cabinet.
In addition, the active heat exchange back plate is hinged with the cabinet or is connected with the cabinet in a sliding mode.
in addition, the heat dissipation device is arranged on one side of the active heat exchange back plate, which is far away from the cabinet.
In addition, the heat dissipation device comprises at least one fan radiator.
In addition, the server system further includes: the main control module is respectively in communication connection with the detection module, each fan radiator and the circulating device, and the circulating device is provided with a pump body; the detection module is used for detecting the temperature in the cabinet and the temperature of the cooling medium and uploading the detected temperatures to the main control module, and the main control module is used for controlling the rotating speed of each fan radiator and the rotating speed of the pump body of the circulating device according to the temperatures uploaded by the detection module.
Additionally, the active heat exchange backplate comprises: the heat exchange tube is arranged in the back plate body in a penetrating mode and is provided with a liquid inlet and a liquid outlet which are exposed outside the back plate body.
in addition, the pump body is a circulating pump.
Drawings
FIG. 1 is a schematic diagram of a prior art server system;
FIG. 2 is a schematic structural diagram of a server system according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an active heat exchange backing plate according to a first embodiment of the present invention;
fig. 4 is a block diagram of circuit modules of a server system according to a first embodiment of the present invention;
FIG. 5 is a schematic view of the connection between an active heat exchange backplane and a cabinet according to a second embodiment of the present invention;
fig. 6 is a schematic structural diagram of a server room according to a third embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solutions claimed in the claims of the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a server system, as shown in fig. 2, including: the heat exchanger comprises a cabinet 1, a liquid cooling server 2, an active heat exchange back plate 3, a circulating device 4, a heat radiating device 5 and a pipeline assembly 6.
As shown in fig. 2, the liquid cooling server 2 and the circulating device 4 are both disposed in the cabinet 1, and the active heat exchange backplane 3 is disposed opposite to the cabinet 1. In addition, the pipeline assembly 6 is respectively connected with the circulating device 4, the liquid cooling server 2 and the active heat exchange back plate 3.
when the circulating device 4 works, the cooling medium can be circularly conveyed between the liquid cooling server 2 and the active heat exchange back plate 3 by the aid of the pipeline assembly 6, namely after flowing out of the liquid cooling server 2, the cooling medium can directly enter the active heat exchange back plate 3 through the pipeline assembly 6, the cooling medium is subjected to heat exchange by the active heat exchange back plate 3, heat generated after the cooling medium is subjected to heat exchange by the active heat exchange back plate 3 is discharged in a direction away from the cabinet 1 by the aid of the bulk device 5, and the cooling medium subjected to heat exchange and cooling by the active heat exchange back plate 3 can be sent into the liquid cooling server 2 again through the circulating device so as to meet the cooling requirement on the liquid cooling server 2.
Through the content, the whole server system can effectively cool the liquid cooling server 2 based on the circulating device 4 and the active heat exchange back plate 3, so that a cooling tower and a cold quantity controller are not needed, the construction cost of the whole server system is reduced, the complex pipeline construction is avoided, the volume of the whole server system can be effectively controlled, and the space utilization rate in a server room is effectively improved.
Specifically, as shown in fig. 2, in the present embodiment, the liquid cooling server 2 has an inlet end 21 and an outlet end 22. The active heat exchange back plate 3 has an inlet 321 and an outlet 322. The circulation device 4 has a pump body which is a circulation pump and has an inlet end 41 and an outlet end 42.
as shown in fig. 2, in the present embodiment, the piping component 6 includes: a first line 61, a second line 62 and a third line 63. First, the first pipeline 61 is connected to the liquid inlet 21 of the liquid cooling server 2 and the outlet 42 of the circulation device 4, respectively, and the liquid cooling server 2 and the circulation device 4 are communicated with each other through the first pipeline 61. Secondly, the second pipeline 62 is connected to the liquid outlet 22 of the liquid cooling server 2 and the liquid inlet 321 of the active heat exchange back plate 3, and the liquid cooling server 2 and the active heat exchange back plate 3 are communicated with each other through the second pipeline 62. Finally, the third pipeline 63 is connected to the liquid outlet 322 of the active heat exchange back plate 3 and the inlet 41 of the circulation device 4, respectively, and the connection between the active heat exchange back plate 3 and the circulation device 4 is realized through the third pipeline 63. Therefore, after the circulation device 4 is turned on, the cooling medium in the liquid-cooling server 2 can enter the active heat exchange back plate 3 through the second pipeline 62, and the cooling medium is subjected to heat exchange through the active heat exchange back plate 3, and the cooling medium subjected to heat exchange can be sent back to the liquid-cooling server 2 under the action of the circulation device 4 to cool the liquid-cooling server 2, so that the liquid-cooling server 2 is continuously cooled along the direction of the arrow in the figure by means of circulation and reciprocation. Because the pipeline assembly 6 in the embodiment can realize the pipeline building among the liquid cooling server 2, the circulating device 4 and the active heat exchange back plate 3 directly through the first pipeline 61, the second pipeline 62 and the third pipeline 63, the whole server system is ensured to have smaller volume.
In the present embodiment, as shown in fig. 3, the heat sink 5 includes: at least one fan radiator 51. Therefore, after the active heat exchange back plate 3 exchanges heat with the cooling medium, the heat generated by the active heat exchange back plate 3 exchanging heat with the cooling medium can be discharged in a direction away from the cabinet 1 through the fan radiator 51. However, preferably, the fan radiators 51 in the present embodiment are all disposed on a side of the active heat exchange backplane 3 away from the cabinet 1, so that each fan radiator 51 can discharge heat in a direction away from the cabinet 1, so as to avoid influence of heat on the liquid cooling servers 2 in the cabinet 1 as much as possible. Of course, in practical application, the fan radiator 51 can be disposed at other positions of the active heat exchange backplate 3, such as: the fan radiator 51 may be disposed at a top or a bottom of the active heat exchange backplate 3, and the position of the fan radiator 51 on the active heat exchange backplate 3 is not particularly limited in this embodiment. Meanwhile, it should be noted that, in the present embodiment, the number of the heat dissipation devices 5 may also be increased or decreased according to the actual heat dissipation requirement.
further, it is noted that, as a preferable aspect, as shown in fig. 4, the server system of the present embodiment further includes: the main control module and the detection module arranged in the cabinet 1. The main control module is electrically connected to the detection module, the fan radiators 51 and the circulation device 4. Wherein, in this embodiment, the detection module may adopt two temperature sensors, two thermocouples or two thermistors to detect the temperature inside the cabinet 1 and the temperature of the cooling medium, for example, when the detection module adopts two temperature sensors, one of the temperature sensors may be disposed inside the cabinet to detect the temperature inside the cabinet 1, and the other one of the temperature sensors may be disposed on the pipeline assembly 6 or inside the pipeline assembly 6 to detect the temperature of the cooling medium, the two temperature sensors may respectively upload the collected temperatures to the main control module, the main control module controls the rotation speed of each fan radiator 51 and the rotation speed of the circulation pump of the circulation device 4 according to the temperatures uploaded by the two temperature sensors, so as to keep the temperature inside the cabinet 1 at a lower constant temperature all the time, so as to ensure the normal operation of the liquid cooling server. For example, a limit temperature value may be set for the temperature inside the cabinet 1 by the main control module in advance, when the temperature value detected by the temperature sensor for detecting the temperature inside the cabinet 1 is greater than the limit temperature value, which indicates that the liquid cooling server is in high-load and high-load operation, the main control module may increase the rotation speed of the fan radiator 51 to increase the heat dissipation amount of the fan radiator 51, and when the detection module detects that the temperature inside the cabinet 1 is less than the limit temperature value, the main control module may control the fan radiator 51 to maintain a normal rotation speed. Meanwhile, the main control module can also perform adaptive adjustment on the rotating speed of the pump body of the circulating device according to the temperature detected by the temperature sensor for detecting the temperature of the cooling medium so as to accelerate or decelerate the circulating speed of the cooling medium, and thus the liquid cooling server 2 can be always in a better working state.
in addition, in the present embodiment, as shown in fig. 3, the active heat exchange back plate 3 includes: the back plate comprises a back plate body 31 and a heat exchange pipe 32 penetrating through the back plate body 31, wherein the heat exchange pipe 32 is provided with a liquid inlet 321 and a liquid outlet 322 exposed outside the back plate body 31. In the present embodiment, the back plate body 31 is a metal plate, so that the metal plate can exchange heat with the cooling medium in the heat exchange tube 32 by its own cooling capacity.
a second embodiment of the present invention relates to a server system, and is a further improvement of the first embodiment, and the main improvements are: in this embodiment, as shown in fig. 5, the active heat exchanging back panel 3 is movably disposed on the cabinet 1 for opening and closing the cabinet 1, that is, the active heat exchanging back panel 3 can serve as a cabinet door of the cabinet 1.
Specifically, as shown in fig. 4, the back plate body 31 may be hinged to the cabinet 1, so that the entire active heat exchange back plate 3 may be turned around the hinged portion of the cabinet 1, which is similar to the design of a vertical hinged door, and thus the active heat exchange back plate 3 may open and close the cabinet 1. In order to ensure that the active heat exchange back plate 3 cannot interfere with the active heat exchange back plate 3 in the overturning process, the second pipeline 62 and the third pipeline 63 of the pipeline assembly 6 can adopt telescopic hoses, so that when the active heat exchange back plate 3 is overturned, the second pipeline 62 and the third pipeline 63 can freely stretch along with the overturning of the active heat exchange back plate 3, and the active heat exchange back plate 3 can be normally opened and closed to the cabinet.
of course, it should be noted that, in this embodiment, the back plate body 31 of the active heat exchange back plate 3 may be slidably connected to the cabinet 1, so that the active heat exchange back plate 3 may slide relative to the cabinet 1, and the active heat exchange back plate 3 is similar to a sliding door in design, and the cabinet 1 may be opened and closed by sliding the active heat exchange back plate 3.
A third embodiment of the present invention relates to a server room, as shown in fig. 6, including: a machine room body 7, at least one server system 10 as described in the first embodiment or the second embodiment. Each server system 10 is provided in the machine room main body 7.
Wherein, computer lab body 7 includes: the accommodating chamber 71 and the heat collecting chamber 72, each server system 10 is disposed in the accommodating chamber 71, and the heat collecting chamber 72 is communicated with the outside, i.e. an air hole 721 is opened on a side wall of the heat collecting chamber 72. In addition, this machine room body 7 further includes: and a ventilation pipe 73 disposed in the accommodating chamber 71 and communicating the accommodating chamber 71 with the heat collecting chamber 72, wherein the ventilation pipe 73 can integrate heat discharged from the heat sink 5 of each server system 10 into the heat collecting chamber, and the heat collecting chamber 72 discharges the heat to the outside.
Specifically, the heat collecting chamber 72 is located above the accommodating chamber 71, and the heat collecting chamber and the accommodating chamber are separated from each other by a partition 74, a plurality of ventilation holes 741 are opened on the partition 74, and a hole wall of each ventilation hole 741 vertically extends towards the direction of the accommodating chamber 71, respectively, to form the ventilation pipeline 73. Each server system 10 is disposed in the housing 71. Meanwhile, in order to make the arrangement of the server systems 10 in the accommodating chamber 71 more reasonable, as shown in fig. 4, each ventilation pipeline 73 is provided with two server systems 10 on two sides perpendicular to the axial direction thereof, and the two server systems 10 are arranged back to back, i.e. the active heat exchange back plates 3 of the two server systems are opposite to each other, and the two server systems can share one ventilation pipeline 73, so that the heat discharged from the heat dissipation devices 5 of the two server systems can directly enter the heat collection chamber 72 through the ventilation pipeline 73 and can be discharged from the heat collection chamber 72 through the air holes 721.
Meanwhile, in the present embodiment, the side wall of the accommodating chamber 71 is further provided with a vent hole 711 communicating with the outside, and the vent hole 711 allows outside cold air to rapidly enter the accommodating chamber 71, so that the heat exchange efficiency of the active heat exchange back plate 3 of each server system 10 can be improved. Moreover, since the heat collecting chamber 72 is separated from the accommodating chamber 71 by the partition 74, the hot air entering the heat collecting chamber 72 does not flow into the accommodating chamber 71, so that the accommodating chamber 71 can be always in a low temperature environment, and the normal operation of each server system 10 is ensured.
As can be seen from the above, based on the server systems of the first and second embodiments, the accommodating chamber 71 of the machine room 7 can be naturally cooled by direct fresh air through the ventilation holes 721, so as to achieve the energy saving effect.
Of course, in the present embodiment, the heat collecting chamber 72 is only described above the accommodating chamber 71, but in practical application, the heat collecting chamber 72 may be located at other positions of the accommodating chamber 71, and the present embodiment does not limit the position between the heat collecting chamber 72 and the accommodating chamber 71. In addition, in the present embodiment, the arrangement of the server systems 10 in the accommodating chamber 71 is only described by taking two sets of the server systems arranged opposite to each other along the axial direction perpendicular to the ventilation pipeline 73 as an example, and in the process of practical application, the positional relationship between the ventilation pipeline 73 and the server systems 10 may be various, for example, one ventilation pipeline 73 is matched with one server system, and the present embodiment does not specifically limit the positional relationship between the ventilation pipeline 73 and the server systems.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. A server system, comprising: the rack, set up in liquid cooling server in the rack, its characterized in that: the server system further includes:
The circulating device is arranged in the cabinet;
The active heat exchange back plate is arranged opposite to the machine body;
The pipeline assembly is respectively connected with the circulating device, the liquid cooling server and the active heat exchange back plate;
The heat dissipation device is arranged on the active heat exchange back plate;
the circulating device is used for circularly conveying a cooling medium between the liquid cooling server and the active heat exchange back plate through the pipeline assembly;
the active heat exchange back plate is used for carrying out heat exchange on a cooling medium, and the heat dissipation device is used for discharging heat generated by the active heat exchange back plate after the active heat exchange back plate carries out heat exchange on the cooling medium towards a direction far away from the cabinet.
2. The server system according to claim 1, wherein: the liquid cooling server is provided with a liquid inlet end and a liquid outlet end, the circulating device is provided with an inlet end and an outlet end, and the active heat exchange back plate is provided with a liquid inlet and a liquid outlet;
The piping component includes:
the first pipeline is respectively connected with the liquid inlet end of the liquid cooling server and the outlet end of the circulating device;
The second pipeline is respectively connected with the liquid outlet end of the liquid cooling server and the liquid inlet of the active heat exchange back plate;
And the third pipeline is respectively connected with the liquid outlet of the active heat exchange back plate and the inlet end of the circulating device.
3. The server system according to claim 1, wherein: the active heat exchange back plate is movably arranged on the machine cabinet and used for opening and closing the machine cabinet.
4. The server system according to claim 3, wherein: the active heat exchange back plate is hinged with the cabinet or is in sliding connection with the cabinet.
5. the server system according to claim 1, wherein: the heat dissipation device is arranged on one side departing from the cabinet.
6. The server system according to claim 1 or 5, characterized in that: the heat dissipation device comprises at least one fan radiator.
7. The server system according to claim 6, wherein: the server system further includes: the main control module is respectively in communication connection with the detection module, each fan radiator and the circulating device, and the circulating device is provided with a pump body;
The detection module is used for detecting the temperature in the cabinet and the temperature of the cooling medium and uploading the detected temperatures to the main control module, and the main control module is used for controlling the rotating speed of each fan radiator and the rotating speed of the pump body of the circulating device according to the temperatures uploaded by the detection module.
8. The server system according to claim 7, wherein: the pump body is a circulating pump.
9. The server system according to claim 2, wherein: the active heat exchange backplate comprises: the back plate body, wear to locate the heat exchange tube in the backplate, the heat exchange tube have expose in this external inlet of backplate with the liquid outlet.
10. A server room is characterized in that; the method comprises the following steps: a machine room body, at least one server system according to any one of claims 1 to 9, each of the server systems being disposed in the machine room body;
The computer lab body includes: the server system comprises an accommodating chamber and a heat collecting chamber, wherein each server system is arranged in the accommodating area, and the heat collecting chamber is communicated with the outside;
The computer lab body still includes: the ventilation pipeline is arranged in the accommodating chamber and used for communicating the accommodating chamber with the heat collecting chamber, and the ventilation pipeline is used for sending heat discharged by the heat dissipation devices of the server systems into the heat collecting chamber and discharging the heat outwards from the heat collecting chamber;
And ventilation holes communicated with the outside are distributed on the side wall of the accommodating chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910659637.4A CN110572980A (en) | 2019-07-22 | 2019-07-22 | server system and server room |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910659637.4A CN110572980A (en) | 2019-07-22 | 2019-07-22 | server system and server room |
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| CN110572980A true CN110572980A (en) | 2019-12-13 |
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| CN201910659637.4A Pending CN110572980A (en) | 2019-07-22 | 2019-07-22 | server system and server room |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112203481A (en) * | 2020-10-30 | 2021-01-08 | 上海德衡数据科技有限公司 | Container module prefabricated data center |
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| CN107396599A (en) * | 2017-07-14 | 2017-11-24 | 华南理工大学 | A kind of heat abstractor and thermal management algorithm of movable cabinet level server system |
| CN107743354A (en) * | 2017-10-25 | 2018-02-27 | 北京百度网讯科技有限公司 | The refrigeration system of data center machine room and data center |
| CN109195424A (en) * | 2018-11-06 | 2019-01-11 | 北京中热信息科技有限公司 | A kind of heat pipe exchanging type electronic equipment liquid cooling system |
| CN210694704U (en) * | 2019-07-22 | 2020-06-05 | 上海柯垓冷却技术有限公司 | Server system and server room |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112203481A (en) * | 2020-10-30 | 2021-01-08 | 上海德衡数据科技有限公司 | Container module prefabricated data center |
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