CN110568344A

CN110568344A - Test module and test equipment

Info

Publication number: CN110568344A
Application number: CN201910912600.8A
Authority: CN
Inventors: 陈春银; 沈祖勇; 王向荣; 冯玉林; 梁庆宇
Original assignee: Sea Shenzhen Can Reach Communication Co Ltd
Current assignee: Sea Shenzhen Can Reach Communication Co Ltd
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2019-12-13

Abstract

The invention discloses a test module and test equipment. Wherein, the test module includes last faller gill subassembly and lower faller gill subassembly. The lower needle plate assembly comprises a bottom plate and a carrier plate, wherein a placing position for placing a test plate is arranged on the carrier plate, the carrier plate is connected with the bottom plate in a sliding mode, and the carrier plate can slide in and out of a feed inlet of the test equipment relative to the bottom plate. The upper needle plate assembly is located above the lower needle plate assembly and used for testing a test plate located on the lower needle plate assembly, and the upper needle plate assembly can move up and down relative to the carrier plate. Through setting the test module to the sliding mode of the drawer type, the working efficiency can be improved, and the test equipment is more convenient to operate.

Description

Test module and test equipment

Technical Field

The invention relates to the field of testing, in particular to a testing module and testing equipment.

Background

In the manufacture of electronic devices, a large number of PCB boards are used, for example, in the communication equipment industry, and a large number of PCB boards with power amplification are used. In order to ensure the reliability of the device, the manufactured PCB is required to be tested to ensure the quality of the PCB. When the existing test equipment tests the PCB, the efficiency is lower and the use is inconvenient.

Disclosure of Invention

To the inconvenient problem of test, provide a test module and test equipment.

the application provides a test module. The test module comprises an upper needle board assembly and a lower needle board assembly. The lower needle plate assembly comprises a bottom plate and a carrier plate, wherein a placing position for placing a test plate is arranged on the carrier plate, the carrier plate is connected with the bottom plate in a sliding manner, and the carrier plate can slide in and out of a feed port of the test equipment relative to the bottom plate; and the upper needle plate assembly is positioned above the lower needle plate assembly and used for testing a test plate positioned on the lower needle plate assembly, and the upper needle plate assembly can move up and down relative to the carrier plate.

Preferably, a guide rail and a first driving piece are arranged on the bottom plate, the carrier plate is slidably arranged on the guide rail, and the first driving piece is used for pushing the carrier plate to slide in and out the guide rail, and the feeding hole of the test equipment is formed in the base plate.

Preferably, the lower needle plate assembly comprises a heat dissipation device, the heat dissipation device is fixed on the bottom plate, and the heat dissipation device is located between the carrier plate and the bottom plate after sliding into the feed port.

preferably, the needle assembly further comprises a guide device, the guide device is connected with the upper needle plate assembly and the bottom plate, and the guide device is used for enabling the upper needle plate assembly to move up and down.

Preferably, the guiding device comprises a connecting column and a second driving member, one end of the connecting column is fixed on the bottom plate, the connecting column penetrates through the upper needle plate assembly, and the second driving member is used for driving the upper needle plate assembly to slide along the connecting column.

preferably, go up the needle board subassembly and include radio frequency head test component, third driving piece and mounting panel, the mounting panel dorsad one side of bottom plate is fixed with the installing support, the third driving piece is fixed in on the installing support, radio frequency head test component connect in on the third driving piece, be equipped with on the mounting panel with the just right through-hole of radio frequency head test component, the third driving piece can drive radio frequency head test component up-and-down reciprocating motion, so that the radio frequency head passes the through-hole.

Preferably, still include an assembly board, the assembly board is located the mounting panel dorsad one side of bottom plate, at least two radio frequency head test component is fixed in on the assembly board, the assembly board with the third driving piece is connected, the third driving piece can drive reciprocating motion about the assembly board.

Preferably, the radio frequency head test component includes a base, a radio frequency head and an elastic member, the base is fixed on the assembly board, two ends of the radio frequency head respectively pass through the assembly board and the base, and can move up and down within a range limited by the assembly board and the base together, the elastic member is connected with the radio frequency head to buffer the upward movement of the radio frequency head.

Preferably, the base further comprises a base and a sliding plate, the base is provided with a sliding groove, one side of the base, which is provided with a notch, is fixed on the plate surface of the assembly plate, which is opposite to the mounting plate, the radio frequency head penetrates through the groove bottom of the sliding groove, and a guide column is convexly arranged on the groove bottom of the sliding groove, which faces the notch; the sliding plate is located in the sliding groove, the radio frequency head and the guide column penetrate through the sliding plate, the elastic piece is sleeved on the guide column, the radio frequency head can stretch out and draw back within the range of the sliding groove, and when the radio frequency head retracts, the sliding plate is driven to slide towards the groove bottom of the sliding groove and compress the elastic piece.

The application also provides a test device. The test equipment comprises a rack and the test module, wherein the test module is installed in the rack, a feed inlet is formed in the rack, and a carrier plate of the test module can slide in and out of the feed inlet.

The PCB board that needs the test is changed with changing to above-mentioned gliding drawer mode through setting the test module, just so need not to open test equipment with when changing, only need make the support plate roll-off feed inlet can, make changing with of PCB board very convenient, improve work efficiency.

Drawings

FIG. 1 is a schematic diagram of an embodiment of a test apparatus of the present application;

FIG. 2 is a schematic diagram of a state of the test apparatus shown in FIG. 1;

FIG. 3 is a schematic view of the test module of FIG. 2 with the upper and lower die assemblies in a separated state;

FIG. 4 is a schematic view of the upper die assembly shown in FIG. 3 in a state;

Fig. 5 is a schematic diagram of the rf head test assembly shown in fig. 4.

description of reference numerals: base 131 of mounting plate 110 of third cylinder 120 rf head testing part 130 on probe card assembly 100 of test module 10, base 1311 of guide column 1315 of guide column 1312 tank bottom 1313 of notch 1314 of rf head 132 blocking part 1321 of elastic piece 133 of mounting plate 134 mounting bracket 140 of probe card 150 of mounting plate 160 of test probe 170 bottom plate 210 of guide rail 211 of first cylinder 212 carrier plate 220 guide 230 of guide device 240 of guide rail 221 of connecting plate 160 of test probe 170 bottom plate 210 of second cylinder 242 of test device 20 chassis 21, cover 24 of main body 23 of test device 20, feed port 22 of PCB 30

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

in addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

as shown in fig. 1-3, the present application discloses a test apparatus 20. The test apparatus 20 is used to test PCB | boards. The testing device 20 comprises a rack 21 and a testing module 10, wherein the testing module 10 is installed in the rack 21, and a feeding hole 22 is formed in the rack 21. The test module 10 includes a lower pin plate assembly 200 and an upper pin plate assembly 100. The lower pin plate assembly 200 includes a bottom plate 210 and a carrier plate 220, the carrier plate 220 is provided with a placing position for placing a testing board (in this embodiment, the PCB 30 is taken as an example for illustration), the carrier plate 220 is slidably connected to the bottom plate 210, and the carrier plate 220 can slide in and out of the feeding hole 22 of the testing device 20 relative to the bottom plate 210. The upper pin plate assembly 100 is located above the lower pin plate assembly 200 for testing the test board located on the lower pin plate assembly 200, and the upper pin plate assembly 100 can move up and down relative to the carrier plate 220.

For ease of illustration and understanding, a rectangular coordinate system is established in FIG. 1 as shown. The rack 210 includes a main body 23 and an upper cover 24, the test module 10 is mounted on the main body 23, the upper cover 24 is used for covering the test module 10, the feeding port 22 is located on the upper cover 24, and a computer and other related electrical components for testing are also mounted in the main body 23.

The placement position for placing the PCB 30 on the carrier 220 means that the PCB 30 can be stably located at the position. In the embodiment, a placement groove 221 is provided at this place, and the PCB board 30 is placed in the placement groove 221 when it is to be tested; it is also possible to provide a jig at the place where the PCB board 30 is fixed by the jig. With the above arrangement, when the PCB 30 is to be tested, the carrier board 220 slides forward and slides out of the feeding hole 22, and at this time, the PCB 30 to be tested can be placed in the placing groove 221. Then, the carrier board 220 slides backward and slides into the feeding hole 22, at this time, the carrier board 220 is located below the upper pin board assembly 100, the upper pin board assembly 100 moves downward until the upper pin board assembly 100 moves to a preset position, and the PCB 30 assembly on the carrier board 220 can be tested by the upper pin board assembly 100. After testing is completed, upper pin header assembly 100 is moved upward, and carrier board 220 is slid out of feed port 22 to replace PCB board 30 to be tested. The test module 10 is arranged in the sliding drawer mode to replace the PCB 30 to be tested, so that the test equipment 20 does not need to be opened when replacing the PCB, the carrier plate 220 only needs to slide out of the feed port 22, the PCB 30 can be replaced conveniently, and the working efficiency is improved.

The base plate 210 is provided with a guide rail 211 and a first driving member, the carrier plate 220 is slidably disposed on the guide rail 211, and the first driving member is used for pushing the carrier plate 220 to slide in and out of the feeding hole 22 of the testing apparatus 20 along the guide rail 211. Specifically, a guide rail 211 extending in the front-rear direction is provided on the upper surface of the bottom plate 210, and the carrier plate 220 is slidably disposed on the guide rail 211, so that the carrier plate 220 can slide in the front-rear direction with respect to the bottom plate 210 to slide in and out of the inlet 22. The first driving member includes a first cylinder 212, the first cylinder 212 is fixed to the rear side of the base plate 210, and drives the carrier plate 220 to slide back and forth along the guide rail 211.

The lower pin plate assembly 200 includes a heat sink 230, the heat sink 230 is fixed on the carrier plate 220, and the heat sink 230 is located between the carrier plate 220 and the bottom plate 210 after sliding into the feeding hole 22. After carrier plate 220 is slid into throat 22, heat sink 230 is positioned below carrier plate 220. The bottom of the placement groove 221 is hollow, so that the PCB 30 on the carrier 220 directly faces the heat sink 230, and the two are relatively close to each other. When the PCB 30 is tested, the PCB 30 may emit a large amount of heat, and the heat sink 230 may quickly dissipate the heat of the PCB 30, so as to prevent the PCB 30 from being at an excessively high temperature.

And a guide 240, wherein the guide 240 connects the upper needle plate assembly 100 and the base plate 210, and the guide 240 is used for moving the upper needle plate assembly 100 up and down. The upper needle assembly 100 is moved up and down by the guide 240. The guide device 240 includes a connecting column 1312 and a second driving member, one end of the connecting column 1312 is fixed on the bottom plate 210, the connecting column 1312 penetrates through the upper needle assembly 100, and the second driving member is used for driving the upper needle assembly 100 to slide along the connecting column 1312. In this embodiment, there are 4 connecting posts 1312 evenly distributed on the four corners of the bottom plate 210, so that the upper needle assembly 100 can slide up and down stably along the connecting posts 1312. The second driving member includes two sets of second cylinders 242, the two sets of second cylinders 242 are respectively fixed on the left and right sides of the bottom plate 210, and the two second cylinders 242 are connected with the upper needle assembly 100, and the upper needle assembly 100 is driven by the two second cylinders 242 to stably slide up and down along the connecting column 1312.

The upper pin plate assembly 100 includes an rf head testing component 130, a third driving component and a mounting plate 110, wherein a mounting bracket 140 is fixed on a side of the mounting plate 110 opposite to the bottom plate 210, the third driving component is fixed on the mounting bracket 140, the rf head testing component 130 is connected to the third driving component, a through hole (not shown in the figure) opposite to the rf head 132 of the rf head testing component 130 is arranged on the mounting plate 110, and the third driving component can drive the rf head testing component 130 to reciprocate up and down so that the rf head 132 passes through the through hole.

The side of the mounting plate 110 facing away from the bottom plate 210 is the upper side of the mounting plate 110, and the third driving member includes a third cylinder 120 and a connecting plate 160, and the third cylinder 120 is fixed on the connecting plate 160. The mounting bracket 140 is located on the upper surface of the mounting plate 110. When the pin plate assembly 100 is assembled, the rf head testing component 130 and the third cylinder 120 may be connected, and then the third cylinder 120 and the connecting plate 160 may be connected, so that the rf head testing component 130, the third cylinder 120 and the connecting plate 160 form a whole, and then the whole is fixed on the mounting bracket 140, so that the third cylinder 120 and the rf head testing component 130 may be mounted on the mounting plate 110. This modular mounting arrangement may facilitate the mounting of the upper needle assembly 100. The connecting plate 160 is located above the third cylinder 120, the rf head testing component 130 is located below the third cylinder 120, and the third cylinder 120 drives the rf head testing component 130 to move up and down, so that the rf head 132 of the rf head testing component 130 can penetrate through the mounting plate 110 through the through hole to expose a part of the mounting plate, and thus when the upper pin plate assembly 100 moves down to a certain position, the rf head 132 abuts against the PCB 30 on the carrier plate 220, and the PCB 30 is tested. The upper pin plate assembly 100 further includes a test pin 170 and a shield plate (not shown), the test pin 170 being located on the upper plate surface of the mounting plate 110, and the shield plate being located on the lower plate surface of the mounting plate 110.

Referring to fig. 4 and 5, the upper plate assembly 100 further includes a collecting plate 150, the collecting plate 150 is located on a side of the mounting plate 110 opposite to the bottom plate 210, the at least two rf head testing units 130 are fixed on the collecting plate 150, and the collecting plate 150 is connected to a third driving unit, which can drive the collecting plate 150 to reciprocate up and down. In this example, there are a plurality of rf head test parts 130, and rf head test parts 130 are all fixed on assembly board 150, and assembly board 150 is installed on third cylinder 120 again, and third cylinder 120 reciprocates through driving assembly board 150 like this, and then can drive a plurality of rf head test parts 130 to reciprocate together simultaneously. Through the arrangement, the upper needle plate assembly 100 is more convenient to mount and simpler in structure.

The rf head testing unit 130 includes a base 131, an rf head 132 and an elastic member 133, the base 131 is fixed on the assembly plate 150, two ends of the rf head 132 respectively penetrate the assembly plate 150 and the base 131 and can move up and down within a range limited by both the assembly plate 150 and the base 131, and the elastic member 133 is connected to the rf head 132 to buffer the upward movement of the rf head 132. The base 131 is fixed in the last face of set board 150, set board 150 and base 131 are last all to be equipped with the hole of stepping down that supplies radio frequency head 132 both ends to pass respectively, the part that radio frequency head 12 is located set board 150 and base 131 between both holes of stepping down has one and blocks portion 1321, it is big than two holes of stepping down to block portion 1321, just so can avoid radio frequency head 132 from set board 150 or from base 131 roll-off, make radio frequency head 132 can reciprocate in a scope that both restrict jointly. The elastic member 133 is connected to the rf head 132, so that when the upper pin plate assembly 100 moves downward under the action of the second cylinder 242 to test the PCB 30, and the rf head 132 abuts against the PCB 30, the rf head 132 can retract upward due to the elastic member 133, thereby preventing hard contact between the rf head 132 and the PCB 30, and facilitating protection of the PCB 30 and the rf head 132.

Referring to fig. 5, the base 131 further includes a base 1311 and a sliding plate 134, the base 1311 has a sliding slot 1315, one side of the base 1311 having the slot 1314 is fixed to a plate surface of the gathering plate 150 facing away from the mounting plate 110, the rf head 132 passes through a slot bottom 1313 of the sliding slot 1315, and the slot bottom 1313 of the sliding slot 1315 is provided with a guiding post 241 protruding toward the slot 1314. The sliding plate 134 is located in the sliding slot 1315, the rf head 132 and the guide post 241 both pass through the sliding plate, the elastic member 133 is sleeved on the guide post 241, the rf head 132 can extend and retract within the range of the sliding slot 1315, and when the rf head retracts, the sliding plate 134 is driven to slide towards the slot bottom 1313 of the sliding slot 1315, and the elastic member 133 is compressed.

the sliding range of the rf head 132 is between the notch 1314 of the sliding slot 1315 and the slot bottom 1313, and four guiding pillars 241 are provided, the four guiding pillars 241 are uniformly distributed around, and the elastic member 133 includes a spring. The rf head 132 has a blocking portion 1321, the blocking portion 1321 is located between the sliding plate 134 and the collecting plate 150, and in the process of moving upwards and retracting after the rf head 132 abuts against the PCB 30, the rf head 132 drives the sliding plate to slide upwards along the guide post 241 through the blocking portion 1321, and compresses the spring, so as to buffer the retraction of the rf head 132. Wherein the cooperation between slide and the guide post 241, compression spring that can be more even makes the back of contracting of radio frequency head 132 more stable, avoids the atress inhomogeneous.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A test module, comprising:

The lower needle plate assembly comprises a bottom plate and a carrier plate, wherein a placing position for placing a test plate is arranged on the carrier plate, the carrier plate is connected with the bottom plate in a sliding manner, and the carrier plate can slide in and out of a feed port of the test equipment relative to the bottom plate;

And the upper needle plate assembly is positioned above the lower needle plate assembly and used for testing a test plate positioned on the lower needle plate assembly, and the upper needle plate assembly can move up and down relative to the carrier plate.

2. The test module of claim 1, wherein a guide rail and a first driving member are disposed on the bottom plate, the carrier is slidably disposed on the guide rail, and the first driving member is configured to push the carrier to slide into and out of the feeding hole of the test equipment along the guide rail.

3. The test module of claim 1, wherein the lower pin plate assembly includes a heat sink secured to the bottom plate and located between the carrier plate and the bottom plate after sliding into the feed opening.

4. The test module of claim 1, further comprising a guide connecting the upper pin plate assembly and the base plate, the guide for moving the upper pin plate assembly up and down.

5. The test module of claim 4, wherein the guiding device comprises a connecting column and a second driving member, one end of the connecting column is fixed on the bottom plate, the connecting column penetrates through the upper needle plate assembly, and the second driving member is used for driving the upper needle plate assembly to slide along the connecting column.

6. The test module according to any one of claims 1 to 5, wherein the upper needle board assembly comprises an RF head test component, a third driving component and a mounting board, a mounting bracket is fixed on a side of the mounting board opposite to the bottom board, the third driving component is fixed on the mounting bracket, the RF head test component is connected to the third driving component, a through hole opposite to the RF head of the RF head test component is arranged on the mounting board, and the third driving component can drive the RF head test component to reciprocate up and down to enable the RF head to pass through the through hole.

7. The test module as claimed in claim 6, further comprising a collection plate, wherein the collection plate is located on a side of the mounting plate opposite to the bottom plate, at least two of the RF head test units are fixed on the collection plate, the collection plate is connected to the third driving member, and the third driving member can drive the collection plate to reciprocate up and down.

8. The test module of claim 7, wherein the rf head testing unit comprises a base, an rf head and an elastic member, the base is fixed on the assembly board, two ends of the rf head respectively penetrate through the assembly board and the base and can move up and down within a range limited by both the assembly board and the base, and the elastic member is connected to the rf head to buffer the upward movement of the rf head.

9. The test module according to claim 8, wherein the base further comprises a base and a sliding plate, the base is provided with a sliding groove, one side of the base, which is provided with a notch, is fixed on the plate surface of the assembly plate, which faces away from the mounting plate, the radio frequency head penetrates through the groove bottom of the sliding groove, and a guide column is convexly arranged on the groove bottom of the sliding groove towards the notch;

The sliding plate is located in the sliding groove, the radio frequency head and the guide column penetrate through the sliding plate, the elastic piece is sleeved on the guide column, the radio frequency head can stretch out and draw back within the range of the sliding groove, and when the radio frequency head retracts, the sliding plate is driven to slide towards the groove bottom of the sliding groove and compress the elastic piece.

10. Test equipment, characterized in that test equipment includes the frame and the test module of any one of claims 1-9, the test module is installed in the frame, be equipped with the feed inlet in the frame, the carrier plate of test module can slide in and slide out the feed inlet.