CN110567663A - Method and device for detecting abnormality of connection part - Google Patents
Method and device for detecting abnormality of connection part Download PDFInfo
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- CN110567663A CN110567663A CN201910780703.3A CN201910780703A CN110567663A CN 110567663 A CN110567663 A CN 110567663A CN 201910780703 A CN201910780703 A CN 201910780703A CN 110567663 A CN110567663 A CN 110567663A
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
- G01M7/025—Measuring arrangements
Abstract
The invention discloses a method and a device for detecting connection part abnormity. Wherein the method comprises the following steps: collecting a normal vibration signal A of a connecting part, and carrying out reverse processing on the normal vibration signal A to obtain a reverse signal A1; collecting a daily vibration signal B of a connecting part, and superposing the reverse signal A1 and the daily vibration signal B to obtain a superposed signal P; comparing the superimposed signal P with a preset amplitude P0: when P is more than or equal to P0, an abnormal signal is output. The invention has the technical effects that: the abnormal condition of the connecting part can be accurately detected.
Description
Technical Field
The present invention relates to the field of vibration sensing technology, and more particularly, to a method and a device for detecting an abnormality of a connection portion.
Background
when the human bone joint or the robot joint is abnormal, the normal movement of the human bone joint or the robot joint is influenced. However, it is often difficult to detect such joint abnormalities.
In fact, once an abnormality occurs in a human bone joint or a robot joint, extra friction vibration is usually generated, and detection of the abnormality is helpful for timely finding the abnormality of the joint and taking corresponding measures to remedy the abnormality as soon as possible. However, it has not been found in the prior art that joint abnormalities can be timely found by detecting such additional frictional vibrations.
Therefore, a new technical solution is needed to solve the above technical problems.
Disclosure of Invention
an object of the present invention is to provide a method for detecting an abnormality of a connection portion and a new technical solution of a detection apparatus.
According to a first aspect of the present invention, there is provided a method of detecting a connection site abnormality, comprising:
Collecting a normal vibration signal A of a connecting part, and carrying out reverse processing on the normal vibration signal A to obtain a reverse signal A1;
Collecting a daily vibration signal B of a connecting part, and superposing the reverse signal A1 and the daily vibration signal B to obtain a superposed signal P;
Comparing the superimposed signal P with a preset amplitude P0:
When P is more than or equal to P0, an abnormal signal is output.
optionally, when P is larger than or equal to P0, alarm information is sent out to remind abnormality.
Optionally, when P ≧ P0, the current superposition signal P is stored.
optionally, the connection site is a human bone joint site or a joint site of a robot.
according to a second aspect of the present invention, there is provided a detection apparatus implementing the method of detecting a connection site abnormality, including a vibration sensing apparatus configured to: the vibration signal acquisition device is used for acquiring a normal vibration signal A of the connecting part and a daily vibration signal B of the connecting part.
Optionally, the vibration sensing device comprises:
A housing having an open end, a cavity being formed inside the housing;
An elastic element disposed within the cavity;
A mass element suspended within the chamber by the resilient element and moveable with the resilient element within the chamber to vary the pressure within the chamber; and
A vibration sensor in communication with the cavity, the vibration sensor configured to: the vibration sensor is used for sensing the pressure in the cavity or the pressure difference of different areas in the cavity and calculating the vibration state of the position of the vibration sensor according to the pressure difference.
Optionally, the vibration sensor includes a package structure formed by a substrate and a housing and having a receiving cavity, and a sensing element and a signal amplifier received in the receiving cavity and fixedly disposed on the substrate;
The base plate is sealingly connected at the open end of the housing.
Optionally, a pad is disposed on an outer surface of the substrate, the pad being connected to the sensing element by a metalized via through the substrate.
Optionally, the sensing element is a MEMS chip;
the MEMS chip comprises a substrate and an induction film;
the substrate is of a hollow structure;
The induction film is arranged at one end of the substrate and covers the hollow structure, the hollow structure forms a back cavity, and the other end of the substrate is fixedly connected with the base plate.
optionally, the sensing membrane is a piezoelectric element, a capacitive element, or a piezoresistive element.
The method for detecting the abnormality of the connecting part can accurately detect the abnormality of the connecting part, such as a human bone joint or a robot joint, and is favorable for finding the abnormality of the connecting part in time. Moreover, the method is simple and easy to operate.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a flow chart of a method of detecting a connection site abnormality according to one embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a vibration sensing device according to one embodiment of the present disclosure.
Description of reference numerals:
1: a substrate; 101: a through hole; 2: a housing; 201: an accommodating chamber; 3: metallized via, 4: a sensing element; 401: a substrate; 402: an induction film; 403: a back cavity; 5: a signal amplifier; 6: a pad; 7: a housing; 8: an elastic element; 9: a mass element.
Detailed Description
various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
According to one embodiment of the present invention, a method of detecting a connection site abnormality is provided. As shown in fig. 1, the method includes:
collecting a normal vibration signal A of a connecting part, and carrying out reverse processing on the normal vibration signal A to obtain a reverse signal A1;
acquiring a daily vibration signal B of a connection part, and performing superposition processing on a reverse signal A1 and the daily vibration signal B to obtain a superposed signal P;
The superimposed signal P is compared with a preset amplitude P0:
When P is more than or equal to P0, an abnormal signal is output, which indicates that the connection part is abnormal.
In the present invention, the connection site may be a human bone joint site, a robot joint, an animal bone joint site, or the like, but is not limited thereto.
In the invention, a vibration sensing device can be adopted when collecting the normal vibration signal A of the connecting part and the daily vibration signal B of the connecting part. The vibration sensing device may be, for example, a bone voiceprint sensor or an accelerometer, but may be other vibration sensors known to those skilled in the art, without limitation. In addition, when performing detection, the vibration sensing device needs to be closely attached to the connection portion to be detected.
In the present invention, when the normal vibration signal a of the connection portion is reversely processed, a signal reverse processor may be used to obtain a reverse signal a1 of the normal vibration signal a. And (3) adopting a signal superimposer to perform superposition processing on the reverse signal A1 and the acquired daily vibration signal B to obtain a superimposed signal P. The preset amplitude P0 is inputted into the processor in advance, the processor compares the superimposed signal P with the preset amplitude P0, and determines whether there is an abnormality at the joint (e.g., a human bone joint or a robot joint) according to the comparison result.
In one example, when the superimposed signal P is greater than or equal to the preset amplitude P0, it may be determined that the connection portion is abnormal, and at this time, besides outputting the abnormal signal, the alarm or the buzzer may be triggered to send an alarm message, so that it is more clear to remind that there is an abnormality, so that corresponding measures can be taken in time to avoid the abnormal deterioration of the connection portion.
in one example, when the superimposed signal P is greater than or equal to the preset amplitude P0, the processor may further store the current superimposed signal P for subsequent analysis and processing to determine the specific cause of the abnormality at the connection portion for treatment.
In addition, according to the method for detecting the abnormality of the connection portion provided by the embodiment of the invention, when the superimposed signal P is less than the preset amplitude P0, it indicates that the abnormality is not found at the connection portion, that is, the connection portion is normal. At this time, the step of collecting the daily vibration signal B of the connection portion may be returned to, the daily vibration signal B of the connection portion is continuously collected, and then is superimposed with the reverse signal a1 to obtain a new superimposed signal, and then the new superimposed signal is compared with the preset amplitude P0 to determine whether there is an abnormality again, and the process may be continued. Of course, the detection may be stopped directly when no abnormality is found in the connection site. The person skilled in the art can adapt it to the specific situation without limitation.
in order to implement the method for detecting the abnormality of the connection portion, an embodiment of the invention further provides a detection device, which includes a vibration sensing device, a signal inversion processor, a signal superposition device and a processor.
and when in detection, the vibration sensing device is arranged at the position of the connecting part to be detected. The vibration sensing device is configured to: the vibration signal acquisition device is used for acquiring a normal vibration signal A of the connecting part and a daily vibration signal B of the connecting part. The vibration sensing device may be a bone voiceprint sensor, an accelerometer, or other vibration sensors, and those skilled in the art may flexibly select the vibration sensor according to the needs without limitation.
As shown in fig. 2, a vibration sensing apparatus according to an embodiment of the present invention includes: a housing 7, a spring element 8, a mass element 9 and a vibration sensor.
The housing 7 is of a dish-like structure having an open end. A cavity is formed inside the housing 7. For example, the material of the case 7 is a metal material, a plastic material, a PCB, or the like. The casing 7 has a cylindrical shape, a rectangular parallelepiped shape, or the like. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.
the resilient element 8 is arranged within the cavity. The elastic element 8 is used to provide a certain elastic restoring force to the mass element 9. In the present embodiment, the elastic element 8 may be, for example, an elastic membrane. Of course, the elastic element 8 may be other elastic members known to those skilled in the art, and is not limited thereto.
In one example, as shown in fig. 2, the elastic member 8 includes an elastic portion and an edge portion provided around the elastic portion. Wherein the elastic part can be elastically deformed so as to provide elastic restoring force. The rim portion is adapted to be connected to the inner wall of the housing 7 so as to stably locate the resilient member 8 within the cavity.
The mass element 9 is suspended inside the chamber by the resilient element 8 and is movable with the resilient element 8 within the chamber to vary the pressure within the chamber. In one example, the mass element 9 and the elastic part of the elastic element 8 are connected through an adhesive, that is, the mass element 9 is attached to the surface of the elastic element 8, so that the mass element 9 and the elastic element 8 are firmly combined together, and the mass element 9 can stably move along with the elastic element 8. Of course, the mass element 9 and the spring element 8 may be connected together in other ways known to the person skilled in the art.
Further, in the present embodiment, the mass element 9 is a mass of a predetermined weight. The weight of the mass block can be flexibly adjusted by a person skilled in the art according to needs, and is not limited to the above.
as shown in fig. 2, when the mass member 9 and the elastic member 8 are coupled together, the entire chamber can be divided into two parts of the first chamber and the second chamber. Wherein the first chamber and the second chamber both have a set volume. And, a gas of a predetermined pressure is sealed in the first chamber and the second chamber. Wherein the predetermined pressure may be 0.01 to 10 atmospheres. The gas may be, for example, air, nitrogen, inert gas, etc., and those skilled in the art can flexibly select the gas according to the needs without limitation.
in the vibration sensing apparatus provided by the embodiment of the present invention, as shown in fig. 2, the vibration sensor is communicated with the cavity in the housing 7. The vibration sensor is configured to: the vibration sensor is used for sensing the pressure in the cavity or the pressure difference of different areas in the cavity and calculating the vibration state of the position of the vibration sensor according to the pressure difference. The vibration sensor may be, for example, an electrodynamic sensor, a piezoelectric sensor, an eddy current sensor, an inductive sensor, a capacitive sensor, etc., and those skilled in the art may flexibly select the vibration sensor according to the needs without limitation.
As shown in fig. 2, the vibration sensor according to an embodiment of the present invention includes a package structure formed by a substrate 1 and a housing 2 and having a receiving cavity 201, and a sensing element 4 and a signal amplifier 5 which are received in the receiving cavity 203 and fixedly disposed on the substrate 1. The base plate 1 is sealingly attached to the open end of the housing 7.
At least one pad 6 is provided on the outer surface of the substrate 1. The pads 6 are connected to the sensing elements 4 by metallized vias 3 through the substrate 1. The pads 6 are used for connection to an external circuit.
it should be noted that, the skilled person may need to adjust the number of the pads 6, which is not limited to this. For example, two pads 6 may be provided on the substrate 1.
in the present invention, the pads 6 are provided directly on the substrate 1 of the vibration sensor. When in use, the bonding pad 6 is welded with an external circuit, and the use is very convenient. This design has changed the traditional mode that sets up the pad on vibration sensor's shell, can avoid appearing the mode that the product chamber wall walked the line, has simplified the overall structure of product, has reduced the preparation degree of difficulty of product and has improved the reliability of product. There are various ways to arrange the pads 6 on the substrate 1, and those skilled in the art can flexibly arrange the pads according to actual situations.
in one example, as shown in fig. 2, the pads 6 are disposed on the outer side of the substrate 1, and the pads 6 are located on the same side as the case 7. A metallized through hole 3 is provided in the substrate 1. The metallized via 3 has good electrical conductivity. The pads 6 are electrically connected to the sensing elements 4 through the metallized vias 3. In use, the pad 6 may be soldered to an external circuit.
In this case, a conductor or a plated through hole may be provided in the case 2, and the pad 6 may be electrically connected to the substrate 1 through the conductor or the plated through hole.
The substrate 1 is also provided with a through hole 101. The through hole 101 is used to communicate the cavity formed in the housing 7 with the sensing element 4. In this embodiment, the through hole 101 is a round hole, a square hole, etc., and those skilled in the art can flexibly adjust the through hole according to specific needs, which is not limited thereto. Further, the difficulty of forming the through hole 101 in the substrate 1 is small, and the processing is easy.
According to the vibration sensing device provided by the embodiment of the invention, the pressure difference between the first chamber and the second chamber can be obtained through the vibration sensor; and calculating the vibration state of the position of the vibration sensor through the pressure difference.
in actual use, the vibration sensing device is arranged at the position of the connecting part to be detected. The vibration of the connection part to be detected drives the housing 7 to vibrate, and the mass element 9 vibrates relative to the housing 7 due to the combined action of the inertia of the mass element 9 and the elastic restoring force of the elastic element 8. The vibration of the mass element 9 and the elastic element 8 causes a change in the volume of the first and second chambers, the pressure of the gas in the first and second chambers being changed as both chambers are closed chambers.
In this example, the vibration sensor senses a pressure difference between the first chamber and the second chamber and converts the pressure difference into an electrical signal, such as a voltage signal, a current signal, or a capacitance signal. And calculating the electric signal to obtain the vibration state of the object to be detected. Such as amplitude magnitude, vibration frequency, etc.
the inventor of the present invention found that in the prior art, it is common to provide a vibration sensor only in the first chamber or the second chamber, and then sense the pressure change of only one chamber to detect the vibration state of the object to be detected. In the embodiment of the invention, the vibration sensor can sense the pressure difference between the first chamber and the second chamber, and has the characteristic of high sensitivity for sensing vibration.
The sensing element 4 is, for example, a MEMS chip. Of course, other sensing elements known in the art may be used, without limitation.
As shown in fig. 2, the MEMS chip includes a substrate 401 and a sensing film 402. The substrate 401 has a hollow structure. The sensing film 402 is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film 402 is disposed at one end of the substrate 401 and covers the hollow structure. The hollow structure forms a back cavity 403, and the back cavity 403 can be communicated with the cavity of the shell 7 through a through hole 101 formed in the substrate 1. The other end of the substrate 401 is fixedly connected to the base plate 1.
Wherein the signal amplifier 5 is provided on the substrate 1. The sensing element 4 is connected to a signal amplifier 5. In one example, the signal amplifier 5 is, for example, an ASIC chip. The ASIC chip is integrated on the substrate 1. The MEMS chip is connected with the ASIC chip through a metal wire. The ASIC chip may be used to amplify the signals collected by the MEMS chip 4.
according to the vibration sensor provided by the embodiment of the invention, the shell 2 and the substrate 1 are fixedly connected together, and the shell 2 and the substrate 1 can enclose the accommodating cavity 201. The receiving cavity 201 may be used to receive the sensing element 4 and the signal amplifier 5.
In one example, the structure of the housing 2 is: including a sidewall portion disposed around the sensing element 4 and the signal amplifier 5, and a top portion opposite the substrate 1. The top is made of a metal material, a plastic material, a PCB, etc., for example, which is not limited in the present invention. The top part and the side wall part can be integrated or can be manufactured separately and then combined together in a fixed connection mode. The top and side walls may be made of the same material or different materials. The substrate 1 is, for example, a PCB board.
the housing 2 and the substrate 1 can be fixed together by adhesive bonding or solder paste welding. Similarly, the substrate 1 and the case 7 may be bonded and fixed by adhesive bonding or solder paste welding. The skilled person can flexibly select the required ones without limitation.
When the vibration sensing device is adopted, the accuracy of detecting whether the connection part is abnormal or not can be effectively improved.
although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A method of detecting an abnormality at a junction, characterized by: the method comprises the following steps:
Collecting a normal vibration signal A of a connecting part, and carrying out reverse processing on the normal vibration signal A to obtain a reverse signal A1;
Collecting a daily vibration signal B of a connecting part, and superposing the reverse signal A1 and the daily vibration signal B to obtain a superposed signal P;
Comparing the superimposed signal P with a preset amplitude P0:
When P is more than or equal to P0, an abnormal signal is output.
2. the method of detecting a connection site abnormality according to claim 1, characterized in that: and when P is more than or equal to P0, sending alarm information to remind abnormality.
3. The method of detecting a connection site abnormality according to claim 1, characterized in that: and when the P is more than or equal to P0, storing the current superposed signal P.
4. The method of detecting a connection site abnormality according to claim 1, characterized in that: the connecting part is a human bone joint part or a robot joint part.
5. A test device for carrying out the method according to any one of claims 1 to 4, characterized in that: comprising a vibration sensing device configured to: the vibration signal acquisition device is used for acquiring a normal vibration signal A of the connecting part and a daily vibration signal B of the connecting part.
6. The detection device according to claim 5, wherein: the vibration sensing device includes:
A housing having an open end, a cavity being formed inside the housing;
An elastic element disposed within the cavity;
a mass element suspended within the chamber by the resilient element and moveable with the resilient element within the chamber to vary the pressure within the chamber; and
a vibration sensor in communication with the cavity, the vibration sensor configured to: the vibration sensor is used for sensing the pressure in the cavity or the pressure difference of different areas in the cavity and calculating the vibration state of the position of the vibration sensor according to the pressure difference.
7. The detecting device for detecting the vibration of the motor rotor as claimed in claim 6, wherein the vibration sensor comprises a packaging structure which is formed by a substrate and a shell and is provided with a containing cavity, and a sensing element and a signal amplifier which are contained in the containing cavity and fixedly arranged on the substrate;
The base plate is sealingly connected at the open end of the housing.
8. The inspection device of claim 7, wherein a pad is disposed on an outer surface of the substrate, the pad being connected to the sensing element by a metalized via through the substrate.
9. The detection device according to claim 7 or 8, wherein the sensing element is a MEMS chip;
The MEMS chip comprises a substrate and an induction film;
The substrate is of a hollow structure;
The induction film is arranged at one end of the substrate and covers the hollow structure, the hollow structure forms a back cavity, and the other end of the substrate is fixedly connected with the base plate.
10. The sensing device of claim 9, wherein the sensing membrane is a piezoelectric element, a capacitive element, or a piezoresistive element.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210302227A1 (en) * | 2020-03-25 | 2021-09-30 | Merry Electronics Co., Ltd. | Vibration sensor |
| US20210364346A1 (en) * | 2020-03-25 | 2021-11-25 | Merry Electronics Co., Ltd. | Vibration sensor |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5531111A (en) * | 1994-04-28 | 1996-07-02 | Nippondenso Co., Ltd. | Structure of a volumetric measuring apparatus |
| JP2009300142A (en) * | 2008-06-11 | 2009-12-24 | Espec Corp | Complex environmental test method, failure detection method, failure detection program, and recording medium for recording failure detection program |
| EP2431137A2 (en) * | 2010-09-15 | 2012-03-21 | Kabushiki Kaisha Yaskawa Denki | Reducer abnormality determination method, abnormality determination device, and robot system |
| US20130205899A1 (en) * | 2012-02-14 | 2013-08-15 | Asia Pacific Microsystems, Inc. | Combo Transducer and Combo Transducer Package |
| JP2013247244A (en) * | 2012-05-25 | 2013-12-09 | Toshiba Corp | Electronic device, breakage estimation method and life estimation method |
| CN105041631A (en) * | 2015-07-21 | 2015-11-11 | 莱芜钢铁集团电子有限公司 | Method and system for detecting vibration signal of driving shaft of gas compressor |
| CN106762456A (en) * | 2017-02-22 | 2017-05-31 | 许继集团有限公司 | A kind of blower fan main shaft is broken detection method and system |
| CN207167862U (en) * | 2017-09-19 | 2018-04-03 | 歌尔科技有限公司 | A kind of defibrillation Intelligent glove |
| CN108175381A (en) * | 2018-01-10 | 2018-06-19 | 中山大学附属第医院 | A kind of knee joint endoprosthesis surface damage detecting system and its application method |
| CN109219738A (en) * | 2016-06-07 | 2019-01-15 | 三菱电机株式会社 | Apparatus for diagnosis of abnormality and abnormality diagnostic method |
| CN109222909A (en) * | 2018-09-30 | 2019-01-18 | 李莉 | A kind of wearable intelligent monitoring device and the method for monitoring movement, spinal curvature and joint wear |
| CN208524863U (en) * | 2018-01-15 | 2019-02-22 | 潍坊歌尔电子有限公司 | Utilize the wearable device of bone-conduction microphone detection heart rate |
| JP2019063884A (en) * | 2017-09-28 | 2019-04-25 | 株式会社デンソーウェーブ | Abnormality diagnostic device |
| WO2019148154A1 (en) * | 2018-01-29 | 2019-08-01 | Lang Philipp K | Augmented reality guidance for orthopedic and other surgical procedures |
-
2019
- 2019-08-22 CN CN201910780703.3A patent/CN110567663B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5531111A (en) * | 1994-04-28 | 1996-07-02 | Nippondenso Co., Ltd. | Structure of a volumetric measuring apparatus |
| JP2009300142A (en) * | 2008-06-11 | 2009-12-24 | Espec Corp | Complex environmental test method, failure detection method, failure detection program, and recording medium for recording failure detection program |
| EP2431137A2 (en) * | 2010-09-15 | 2012-03-21 | Kabushiki Kaisha Yaskawa Denki | Reducer abnormality determination method, abnormality determination device, and robot system |
| US20130205899A1 (en) * | 2012-02-14 | 2013-08-15 | Asia Pacific Microsystems, Inc. | Combo Transducer and Combo Transducer Package |
| JP2013247244A (en) * | 2012-05-25 | 2013-12-09 | Toshiba Corp | Electronic device, breakage estimation method and life estimation method |
| CN105041631A (en) * | 2015-07-21 | 2015-11-11 | 莱芜钢铁集团电子有限公司 | Method and system for detecting vibration signal of driving shaft of gas compressor |
| CN109219738A (en) * | 2016-06-07 | 2019-01-15 | 三菱电机株式会社 | Apparatus for diagnosis of abnormality and abnormality diagnostic method |
| CN106762456A (en) * | 2017-02-22 | 2017-05-31 | 许继集团有限公司 | A kind of blower fan main shaft is broken detection method and system |
| CN207167862U (en) * | 2017-09-19 | 2018-04-03 | 歌尔科技有限公司 | A kind of defibrillation Intelligent glove |
| JP2019063884A (en) * | 2017-09-28 | 2019-04-25 | 株式会社デンソーウェーブ | Abnormality diagnostic device |
| CN108175381A (en) * | 2018-01-10 | 2018-06-19 | 中山大学附属第医院 | A kind of knee joint endoprosthesis surface damage detecting system and its application method |
| CN208524863U (en) * | 2018-01-15 | 2019-02-22 | 潍坊歌尔电子有限公司 | Utilize the wearable device of bone-conduction microphone detection heart rate |
| WO2019148154A1 (en) * | 2018-01-29 | 2019-08-01 | Lang Philipp K | Augmented reality guidance for orthopedic and other surgical procedures |
| CN109222909A (en) * | 2018-09-30 | 2019-01-18 | 李莉 | A kind of wearable intelligent monitoring device and the method for monitoring movement, spinal curvature and joint wear |
Non-Patent Citations (3)
| Title |
|---|
| SRIDHAR KRISHNAN、RANGARAJ M. RANGAYYAN、G. DOUGLAS BELL ET AL: "Auditory display of knee-joint vibration signals", 《J. ACOUST. SOC. AM.》 * |
| 李琳、李杞仪、谢存禧: "平面关节型机器人故障诊断智能系统的设计", 《机械设计》 * |
| 潘秀明著: "《老旧核心城区地铁建造技术》", 31 March 2014, 中国铁道出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210302227A1 (en) * | 2020-03-25 | 2021-09-30 | Merry Electronics Co., Ltd. | Vibration sensor |
| US20210364346A1 (en) * | 2020-03-25 | 2021-11-25 | Merry Electronics Co., Ltd. | Vibration sensor |
| US11619544B2 (en) * | 2020-03-25 | 2023-04-04 | Merry Electronics Co., Ltd. | Vibration sensor having vent for pressure enhancing member |
| US11781901B2 (en) * | 2020-03-25 | 2023-10-10 | Merry Electronics Co., Ltd. | Vibration sensor with pressure enhancement |
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