CN110556326A - Deposition method of chemical water bath film - Google Patents

Deposition method of chemical water bath film Download PDF

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Publication number
CN110556326A
CN110556326A CN201810548665.4A CN201810548665A CN110556326A CN 110556326 A CN110556326 A CN 110556326A CN 201810548665 A CN201810548665 A CN 201810548665A CN 110556326 A CN110556326 A CN 110556326A
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coated substrate
water bath
deposition method
roller
layer
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陈腾
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Hongyi Technology Co.,Ltd.
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Beijing Apollo Ding Rong Solar Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02425—Conductive materials, e.g. metallic silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02551—Group 12/16 materials
    • H01L21/02557—Sulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1828—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
    • H01L31/1836—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe comprising a growth substrate not being an AIIBVI compound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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Abstract

The application discloses a deposition method of a chemical water bath film, which comprises the following steps: compounding: covering the isolation protection layer on one surface of the coated substrate to form a composite layer; the reaction steps are as follows: the composite layer passes through a water bath reaction chamber, and a water bath reaction is started, so that the coated substrate is subjected to single-sided film deposition in the water bath reaction chamber; a separation step: and after deposition, separating the isolation protective layer from the coated substrate. The chemical water bath film deposition method can prevent the chemical water bath from depositing on the back of the substrate, thereby avoiding the subsequent back cleaning process treatment, improving the production efficiency and saving the production cost.

Description

Deposition method of chemical water bath film
Technical Field
the present disclosure relates generally to a method for depositing a thin film, and more particularly to a method for depositing a chemical water bath thin film.
Background
For thin film cells made from stainless steel substrates roll-to-roll, including but not limited to copper indium gallium selenide thin film cells and cadmium telluride thin film cells, it is necessary to prepare a cadmium sulfide or zinc sulfide buffer layer or n-type layer. Due to the technical defects that the target material is low in favor rate by a physical sputtering method, and the absorption layer of the battery is damaged by direct sputtering, chemical deposition methods including a chemical water bath method and a chemical spraying method are mostly adopted for preparing the buffer layer in the industry at present.
The chemical water bath method usually needs to immerse the substrate in a reaction solution for film deposition, so that the film deposition is also carried out on the back of the substrate, the subsequent cleaning process treatment is needed, and the complexity of the process and the production cost are increased; the chemical spraying method can realize the spraying of the reaction solution on the single surface of the substrate, so that the film deposition is formed on the single surface, but due to the limitation of the spraying process, the distribution of the reaction solution on the surface of the flexible substrate is difficult to reach the isotropy in the chemical water bath, so that the uniformity of the film prepared by the chemical spraying method is poor, and the performance and the appearance of the film battery are influenced.
disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it would be desirable to provide a method for depositing a chemical water bath thin film that improves production efficiency and saves production cost.
The embodiment of the invention adopts the technical scheme that:
A method for depositing a chemical water bath film comprises the following steps:
compounding: covering the isolation protection layer on one surface of the coated substrate to form a composite layer;
the reaction steps are as follows: the composite layer passes through a water bath reaction chamber, and a water bath reaction is started, so that the coated substrate is subjected to single-sided film deposition in the water bath reaction chamber;
A separation step: and after deposition, separating the isolation protective layer from the coated substrate.
the compounding step comprises:
An isolation protective layer is arranged on the first unwinding roller in a penetrating way, and a coated substrate is arranged on the second unwinding roller in a penetrating way;
and unreeling, so that the isolation protection layer covers one surface of the coated substrate to form a composite layer.
The separating step comprises:
And separating the isolation protection layer from the coated substrate, winding the isolation protection layer to a first winding roller, and winding the coated substrate to a second winding roller.
Further, after the reacting step and before the separating step, the method further comprises the following steps:
a step of cleaning the residual reaction solution on both sides of the composite layer, and
and drying the two sides of the composite layer.
the isolation protective layer is a flexible magnet, and the coated substrate is a stainless steel substrate.
The flexible magnet is a rubber magnetic strip or a magnet film with strong magnetism.
the coated substrate is provided with a back electrode metal layer and a p-type light absorption layer, and the isolation protection layer covers one surface of the coated substrate, which is far away from the back electrode metal layer.
Further, the method also comprises the following fixing steps: and winding the isolation protection layer on a first winding roller and fixing, and winding the coated substrate on a second winding roller and fixing.
The width of the isolation protection layer is the same as that of the coated substrate.
The starting water bath reaction comprises the following steps:
And (3) filling a reaction solution into a reaction tank body of the water bath reaction chamber, and heating the reaction solution until the reaction solution is over the coated substrate.
the temperature of the reaction solution is raised to 65-70 ℃, and then the temperature is kept constant.
the reaction tank body is a corrosion-resistant tank body.
The chemical water bath film deposition method can prevent the chemical water bath from depositing on the back of the substrate, thereby avoiding the subsequent back cleaning process treatment, improving the production efficiency and saving the production cost.
Drawings
other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a chemical water bath film deposition apparatus according to an embodiment of the present invention.
In the figure:
1 water bath reaction chamber, 11 reaction tank body;
2 rollers, 21 first rollers, 22 second rollers;
3, unwinding roller 31, first unwinding roller 32, second unwinding roller 32 and unwinding positioning roller 33;
4 winding rollers, 41 a first winding roller, 42 a second winding roller and 43 a winding positioning roller;
5 isolating and protecting layer;
6 coating a film substrate;
7, a spraying device;
8 drying the air knife.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
The invention provides a deposition method of a chemical water bath film, which comprises the following steps:
compounding: covering the isolation protection layer on one surface of the coated substrate to form a composite layer;
The reaction steps are as follows: the composite layer passes through a water bath reaction chamber, and a water bath reaction is started, so that the coated substrate is subjected to single-sided film deposition in the water bath reaction chamber;
A separation step: and after deposition, separating the isolation protective layer from the coated substrate.
The invention uses the isolation protective layer to cover the film-coated substrate, which can prevent the deposition of the chemical water bath on the back of the substrate, thereby avoiding the subsequent back cleaning process treatment.
Specifically, the compounding step includes:
An isolation protective layer is arranged on the first unwinding roller in a penetrating way, and a coated substrate is arranged on the second unwinding roller in a penetrating way;
Unreeling, and covering the isolation protective layer on one surface of the coated substrate to form a composite layer.
Specifically, the separating step includes:
And separating the isolation protection layer from the coated substrate, winding the isolation protection layer to a first winding roller, and winding the coated substrate to a second winding roller.
the composite layer is formed after the unreeling roller unreels, and then the reeling roller separates and winds, so that the method is simple and easy to realize.
Further, after the reacting step and before the separating step, the method further comprises the following steps:
A step of cleaning the residual reaction solution on both sides of the composite layer, and
and drying the two sides of the composite layer.
the invention cleans and dries after depositing, and separates the isolation protective layer from the film coating substrate at the position of the rolling and positioning roller.
In this embodiment, on the basis of the above embodiment, the isolation protection layer is a flexible magnet, and the coated substrate is a stainless steel substrate; the flexible magnet and the stainless steel substrate can be closely adsorbed, the connection tightness of the flexible magnet and the stainless steel substrate is ensured, and the deposition of a film on the back of the stainless steel substrate is further prevented.
In this embodiment, on the basis of the above embodiments, the flexible magnet is a rubber magnetic strip or a magnet film having strong magnetism. The strong magnetic rubber magnetic strip or the magnet film with strong adsorbability is selected to ensure the adsorbability tightness.
Preferably, the isolation protective layer released by the first unwinding roller and the coated substrate released by the second unwinding roller are compounded on the unwinding positioning shaft to form a composite layer, and then the composite layer enters the water bath reaction chamber. Further preferably, the water bath reaction chamber is internally provided with a roller (comprising a first roller and a second roller), and the composite layer passes through the water bath reaction chamber after passing around the first roller and the second roller. Still further preferably, the composite layer subjected to the deposition reaction is first passed through a winding positioning shaft, then separated, and then respectively wound on the first winding roller and the second winding roller. Unreel location axle, first roller bearing, second roller bearing and rolling location axle through setting up, guaranteed that whole working process is more convenient for operate, move more steadily.
In this embodiment, on the basis of the above embodiments, a back electrode metal layer and a p-type light absorbing layer are disposed on a coated substrate, and an isolation protection layer covers a surface of the coated substrate away from the back electrode metal layer. For convenience of explanation, the side of the coated substrate with the back electrode metal layer and the p-type light absorption layer is referred to as the front side, and the opposite side (i.e., the side away from the back electrode metal layer) is referred to as the back side. The isolation protection layer needs to cover the back of the coated substrate to realize single-sided effective deposition.
on the basis of the above embodiment, the present embodiment further includes a fixing step: and winding the isolation protection layer to a first winding roller and fixing the isolation protection layer by using a strong adhesive tape, and winding the coated substrate to a second winding roller and fixing the coated substrate by using the strong adhesive tape.
And an isolation protective layer or a coated substrate wound on the winding roller is fixed, so that the continuous stability of winding is ensured.
in this embodiment, on the basis of the above embodiment, the widths of the isolation protection layer and the coated substrate are the same, the back surface of the coated substrate faces the isolation protection layer, the coated substrate is aligned with the flexible magnet to make the coated substrate and the flexible magnet closely magnetically attracted, and the flexible magnet covers the back surface of the coated substrate.
The width of the flexible magnet is the same as that of the coated substrate, so that the flexible magnet can completely cover the back of the coated substrate, and the back of the coated substrate is not subjected to thin film deposition.
In this embodiment, based on the above embodiments, the specific operations for starting the water bath reaction are as follows: and (3) filling a reaction solution into a reaction tank body of the water bath reaction chamber, and heating the reaction solution until the reaction solution is over the coated substrate. Preferably, the temperature of the reaction solution is raised to 65 ℃ to 70 ℃ and then maintained at a constant temperature.
The conditions of the water bath reaction are limited, the temperature of the reaction solution is controlled, and the effective proceeding of the water bath reaction is ensured.
in this embodiment, on the basis of the above embodiments, the reaction tank body is a corrosion-resistant reaction tank body, and the roller is a teflon roller. The material of the reaction tank body and the roller is limited to be corrosion-resistant, so that the service life of the reaction tank body and the service life of the roller can be prolonged.
The chemical water bath film deposition method has the advantages that: an isolation protective layer is effectively introduced on the surface of the coated substrate in the water bath deposition process, so that the single-side high-quality water bath film deposition is realized, the invalid deposition of the coated side which is not required by the conventional water bath method is avoided, the subsequent removal process step is not required, the production efficiency is improved, and the production cost is saved.
The invention also provides a deposition device for the chemical water bath film for realizing the deposition method, and the specific structure is shown in figure 1.
Referring to fig. 1, a chemical water bath film deposition apparatus includes an unwinding roller 3, a water bath reaction chamber 1 and a winding roller 4, wherein,
the unwinding roller 3 includes a first unwinding roller 31 and a second unwinding roller 32, wherein the first unwinding roller 31 is used for winding the isolation protection layer 5, the second unwinding roller 32 is used for winding the coated substrate 6, and the first unwinding roller 31 and the second unwinding roller 32 are configured such that the isolation protection layer 5 covers the coated substrate 6 to form a composite layer;
the water bath reaction chamber 1 is configured to accommodate the composite layer for deposition reaction; namely, the composite layer enters the water bath reaction chamber 1 from the unwinding roller, and single-side film coating reaction is carried out in the water bath reaction chamber.
The wind-up roll 4 is configured to receive the composite layer which completes the deposition reaction, i.e. the composite layer which completes the reaction passes out of the water bath reaction chamber and is wound on the wind-down roll.
the device can cover the isolation protective layer on the back of the coated substrate, can realize single-side water bath film deposition, and avoids the process step of removing the back deposited film.
In this embodiment, on the basis of the above embodiment, the wind-up roll 4 includes a first wind-up roll 41 and a second wind-up roll 42, wherein the first wind-up roll 41 is configured to receive the isolation protection layer 5 that completes the deposition reaction, and the second wind-up roll 42 is configured to receive the coated substrate 6 that completes the deposition reaction.
in this embodiment, on the basis of the above embodiment, the unwinding roller 3 further includes an unwinding positioning roller 33, and the unwinding positioning roller 33 is disposed on one side of the first unwinding roller 31 and one side of the second unwinding roller 32 close to the water bath reaction chamber 1.
the invention respectively positions the isolation protective layer and the coated substrate by limiting the specific components of the unwinding roller, so that the isolation protective layer can cover the coated substrate.
In this embodiment, on the basis of the above embodiment, the winding roller 4 further includes a winding positioning roller 43, and the winding positioning roller 43 is disposed on one side of the first winding roller 41 and the second winding roller 42 close to the water bath reaction chamber 1.
The invention ensures that the isolation protective layer and the coated substrate can be conveniently separated by limiting the specific components of the winding roller.
In the present embodiment, on the basis of the above embodiments, the roller 2 is disposed in the water bath reaction chamber 1, the roller 2 includes the first roller 21 and the second roller 22, the first roller 21 is disposed obliquely below the unwinding positioning roller 33, and the second roller 22 is disposed obliquely below the winding positioning roller 43.
Through setting up first roller bearing and second roller bearing, guarantee the stable transmission of composite bed in the reaction tank, guarantee the stability of water bath reaction.
preferably, the unwinding roller 3 and the winding roller 4 are symmetrically arranged above the side of the water bath reaction chamber 1 for smooth unwinding and winding.
In the present embodiment, on the basis of the above-mentioned embodiments, a cleaning and spraying device 7 and a drying device are disposed between the second roller 22 and the winding positioning roller 43, and the drying device is preferably a drying air knife 8.
through setting up deionized water washing spray set and dry air knife for the remaining reaction solution of composite bed both sides can be washd, and make the composite bed of winding to the wind-up roll dry, the subsequent processing of being convenient for.
In this embodiment, on the basis of the above embodiments, the water bath reaction chamber 1 includes a corrosion-resistant reaction tank 11, a heating thermostat, a reaction solution discharge device, and a reaction solution supply device, and the roller 2 is placed in the corrosion-resistant reaction tank 11.
The reaction tank body and the rolling shaft are made of corrosion-resistant materials, so that the effective proceeding of the water bath reaction is ensured.
the invention is further illustrated by the following specific examples:
by adopting the deposition device, taking the deposition of the cadmium sulfide film on the stainless steel substrate plated with the molybdenum metal and the copper indium gallium selenide absorption layer as an example, the specific deposition method is as follows:
The first step is to perform manual coil penetration and fixation:
the stainless steel substrate plated with the metal molybdenum and copper indium gallium selenide absorption layer is wound on the second unwinding roller 32, the strong magnetic rubber magnetic strip is wound on the first unwinding roller 31, the rubber magnetic strip and the stainless steel substrate are as wide as each other, the stainless steel substrate and the rubber magnetic strip are aligned to be closely magnetically adsorbed, the front side of the stainless steel substrate faces downwards, and the back side of the stainless steel substrate faces towards the rubber magnetic strip. The stainless steel substrate and the rubber magnetic strip which are adsorbed together sequentially pass through a unreeling positioning roller 33, a first roller 21, a second roller 22 and a reeling positioning roller 43 of polytetrafluoroethylene in a reaction tank body, then the stainless steel substrate and the rubber magnetic strip which are adsorbed together are separated, the rubber magnetic strip is wound to a first reeling roller 41 of a flexible magnet and fixed by using a strong adhesive tape, and the coated stainless steel substrate is wound to a second reeling roller 42 of a coated substrate and fixed by using the strong adhesive tape.
and secondly, starting a water bath reaction, supplementing and heating a reaction solution, wherein the reaction solution is a mixed solution of cadmium sulfate, thiourea, ammonia water and deionized water, the reaction solution submerges in a stainless steel substrate, the temperature of the reaction solution is raised to 65-70 ℃, then keeping the constant temperature, and starting the deionized water to clean the spraying device 7 and the drying air knife 8.
and finally, starting the first winding roller 41, the second winding roller 42, the first unwinding roller 31 and the second unwinding roller 32 in sequence to deposit the single-sided cadmium sulfide film on the stainless steel substrate in the reaction tank body 11, cleaning residual reaction solution on two sides by the deionized water spraying device 7 after deposition, drying two sides by the drying air knife 7, separating the residual reaction solution from the rubber magnetic strip at the winding positioning roller 43, and finally winding the residual reaction solution on the second winding roller 42 of the coated substrate to finish the whole water bath deposition process.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (12)

1. The method for depositing the chemical water bath film is characterized by comprising the following steps of:
Compounding: covering the isolation protection layer on one surface of the coated substrate to form a composite layer;
The reaction steps are as follows: the composite layer passes through a water bath reaction chamber, and a water bath reaction is started, so that the coated substrate is subjected to single-sided film deposition in the water bath reaction chamber;
A separation step: and after deposition, separating the isolation protective layer from the coated substrate.
2. The deposition method according to claim 1, wherein the step of compositing comprises:
An isolation protective layer is arranged on the first unwinding roller in a penetrating way, and a coated substrate is arranged on the second unwinding roller in a penetrating way;
And unreeling, so that the isolation protection layer covers one surface of the coated substrate to form a composite layer.
3. The deposition method of claim 1, wherein the separating step comprises:
And separating the isolation protection layer from the coated substrate, winding the isolation protection layer to a first winding roller, and winding the coated substrate to a second winding roller.
4. the deposition method of claim 1, further comprising, after the reacting step and before the separating step:
A step of cleaning the residual reaction solution on both sides of the composite layer, and
And drying the two sides of the composite layer.
5. The deposition method according to any one of claims 1 to 4, wherein the isolation and protection layer is a flexible magnet and the coated substrate is a stainless steel substrate.
6. the deposition method according to claim 5, wherein the flexible magnet is a rubber magnetic strip or a magnetic thin film having a strong magnetism.
7. The deposition method according to claim 1-4, wherein the coated substrate is provided with a back electrode metal layer and a p-type light absorption layer, and the isolation protection layer covers the surface of the coated substrate away from the back electrode metal layer.
8. The deposition method according to any one of claims 1 to 4, further comprising a fixing step of: and winding the isolation protection layer on a first winding roller and fixing, and winding the coated substrate on a second winding roller and fixing.
9. the deposition method according to any of claims 1 to 4, wherein the isolation protection layer and the coated substrate have the same width.
10. The deposition method of any one of claims 1 to 4, wherein the initiating the water bath reaction comprises:
And (3) filling a reaction solution into a reaction tank body of the water bath reaction chamber, and heating the reaction solution until the reaction solution is over the coated substrate.
11. The deposition method according to claim 10, wherein the temperature of the reaction solution is raised to 65 ℃ to 70 ℃ and then maintained at a constant temperature.
12. The deposition method of claim 10, wherein the reaction cell is a corrosion resistant cell.
CN201810548665.4A 2018-05-31 2018-05-31 Deposition method of chemical water bath film Pending CN110556326A (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN114420789A (en) * 2021-12-30 2022-04-29 南京同宁新材料研究院有限公司 Film coating device and method for solar thin film battery

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CN105235116A (en) * 2015-09-25 2016-01-13 惠州易晖能源科技股份有限公司 Roll-to-roll dipping and film coating system
CN105355706A (en) * 2015-09-25 2016-02-24 惠州易晖能源科技股份有限公司 Roll-to-roll dipping coating system and preparation method of flexible transparent conductive material
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Publication number Priority date Publication date Assignee Title
JPS5899120A (en) * 1981-12-09 1983-06-13 Nec Corp Formation of cadmium sulfide film
CN103643225A (en) * 2013-11-27 2014-03-19 中国科学院上海硅酸盐研究所 Method of preparing large-dimension cadmium sulfide film by chemical water-bath method
CN204497541U (en) * 2015-04-23 2015-07-22 林学构 A kind of cellular phone data line fluorescence film-coating mechanism
CN105235116A (en) * 2015-09-25 2016-01-13 惠州易晖能源科技股份有限公司 Roll-to-roll dipping and film coating system
CN105355706A (en) * 2015-09-25 2016-02-24 惠州易晖能源科技股份有限公司 Roll-to-roll dipping coating system and preparation method of flexible transparent conductive material
CN106244989A (en) * 2016-07-26 2016-12-21 华南师范大学 Produce the method and apparatus of flexible micro-nano metalolic network transparent conductive film continuously

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CN114420789A (en) * 2021-12-30 2022-04-29 南京同宁新材料研究院有限公司 Film coating device and method for solar thin film battery
CN114420789B (en) * 2021-12-30 2023-11-03 南京同宁新材料研究院有限公司 Film plating device and film plating method for solar thin film battery

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