CN110552480A - Floor heating insulation board and floor heating system - Google Patents

Floor heating insulation board and floor heating system Download PDF

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Publication number
CN110552480A
CN110552480A CN201910751798.6A CN201910751798A CN110552480A CN 110552480 A CN110552480 A CN 110552480A CN 201910751798 A CN201910751798 A CN 201910751798A CN 110552480 A CN110552480 A CN 110552480A
Authority
CN
China
Prior art keywords
insulation board
floor heating
plate
board body
supporting block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910751798.6A
Other languages
Chinese (zh)
Inventor
丁欣欣
丁泽成
王文广
周东珊
黄瑞
步挺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Yasha Decoration Co Ltd
Original Assignee
Zhejiang Yasha Decoration Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Yasha Decoration Co Ltd filed Critical Zhejiang Yasha Decoration Co Ltd
Priority to CN201910751798.6A priority Critical patent/CN110552480A/en
Publication of CN110552480A publication Critical patent/CN110552480A/en
Pending legal-status Critical Current

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Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/18Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/18Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • E04F15/181Insulating layers integrally formed with the flooring or the flooring elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00Hot-water central heating systems
    • F24D3/12Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/02Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
    • E04F2290/023Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Floor Finish (AREA)

Abstract

the invention discloses a floor heating insulation board and a floor heating system, wherein the floor heating insulation board comprises a heat dissipation plate, an insulation board body and a support plate which are sequentially connected from top to bottom, the support plate comprises a base plate, a bulge is arranged at the top of the base plate, and a containing cavity for containing the insulation board body is formed between the base plate and the heat dissipation plate through the bulge. According to the modular floor heating insulation board, the heat dissipation plate, the insulation board body and the support plate are compounded to form the modular floor heating insulation board, so that the bearing capacity of the integral support of the insulation board body is increased, the insulation board is prevented from being affected with damp and deteriorated, and the loss rate of materials is reduced. In addition, all components in the floor heating insulation board are industrially produced in a factory, only simple installation is needed on a decoration site, skilled technical workers are not needed on the site, too much construction time is not needed, rapid construction is realized, and the condition that the traditional decoration operation site is dirty is avoided.

Description

Floor heating insulation board and floor heating system
Technical Field
The invention relates to the technical field of decoration and decoration, in particular to a floor heating insulation board and a floor heating system.
Background
In the development of the decoration industry, people have more and more requirements on decoration functions, and floor heating is more and more commonly applied, especially in northern areas. At present, existing floor heating systems are classified into dry-process paving systems and wet-process paving systems according to different paving methods.
The wet paving system takes cement mortar as a filling layer, then cement mortar is leveled, the total height space occupies a large area, the construction environment is severe, the paving procedure is complex, the operation time is long, and meanwhile, operators are required to have abundant operation experience.
the wood floor or the ceramic tile are directly laid on the floor heating water pipe by the dry-method paving system, the installation is quick, the process is simple, but the existing dry-method paving system is fixed due to the fact that the heat insulation plate is not supported, the heat insulation plate is easy to burst along with the increase of the service time, and when the floor heating system is closed, the indoor temperature is rapidly reduced.
Disclosure of Invention
The invention aims to provide a floor heating insulation board and a floor heating system, which increase the bearing capacity of the integral support of an insulation board body, prevent the insulation board from being affected with damp and deteriorated and reduce the loss rate of materials.
The technical scheme includes that the floor heating insulation board comprises a heat dissipation plate, an insulation board body and a support plate which are sequentially connected from top to bottom, the support plate comprises a base plate, a protrusion is arranged at the top of the base plate, and an accommodating cavity for accommodating the insulation board body is formed between the base plate and the heat dissipation plate through the protrusion.
Furthermore, the shape of the substrate is square, the protrusions are arranged at four corners of the substrate, and the four protrusions and the heat dissipation plate enclose to form the accommodating cavity.
Furthermore, the protrusion comprises a first supporting block and a second supporting block which are arranged on the adjacent edges of the substrate, an accommodating groove corresponding to the first supporting block and the second supporting block is arranged at the end of the heat insulation board body, and the accommodating groove is clamped with the first supporting block and the second supporting block.
Furthermore, the top of the insulation board body is provided with at least one first groove for placing a heating pipe.
Furthermore, a second groove corresponding to the first groove is formed in the top of the heat dissipation plate, and the second groove is inserted into the first groove, so that the heat dissipation plate covers the heat insulation plate body.
Furthermore, the first supporting block and the second supporting block are internally provided with hollow cavities, and through holes communicated with the hollow cavities are formed in the bottom of the base plate.
Further, the heat dissipation plate is an aluminum plate.
The technical scheme of the invention also provides a floor heating system which comprises a plurality of floor heating insulation boards, wherein the floor heating insulation boards are spliced with one another.
Further, the heat dissipation plate comprises a balance plate arranged on the top of the heat dissipation plate.
Further, the balance plate comprises a decorative plate arranged on the top of the balance plate.
After adopting above-mentioned technical scheme, have following beneficial effect: through heating panel, heated board body and the compound modular floor heating heated board that forms of backup pad, increased the bearing capacity that heated board body wholly supported, prevent that the heated board from weing rotten, reduced the loss rate of material. In addition, all components in the floor heating insulation board are industrially produced in a factory, only simple installation is needed on a decoration site, skilled technical workers are not needed on the site, too much construction time is not needed, rapid construction is realized, and the condition that the traditional decoration operation site is dirty is avoided.
drawings
The disclosure of the present invention will become more readily understood by reference to the drawings. It should be understood that: these drawings are for illustrative purposes only and are not intended to limit the scope of the present disclosure. In the figure:
Fig. 1 is a schematic structural diagram of a floor heating insulation board according to an embodiment of the present invention;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a schematic structural view of the support plate shown in FIG. 1;
Fig. 4 is a schematic structural diagram of a floor heating system according to a second embodiment of the present invention.
Reference symbol comparison table:
11-a heat sink; 111-a second groove; 12-a thermal insulation board body;
121-accommodating grooves; 122 — a first groove; 13-a support plate;
131-a substrate; 132-a first support block; 133-a second support block;
134-a via; 14-a receiving cavity.
Detailed Description
The following further describes embodiments of the present invention with reference to the accompanying drawings.
it is easily understood that according to the technical solution of the present invention, those skilled in the art can substitute various structures and implementation manners without changing the spirit of the present invention. Therefore, the following detailed description and the accompanying drawings are merely illustrative of the technical aspects of the present invention, and should not be construed as limiting or restricting the technical aspects of the present invention.
The terms of orientation of up, down, left, right, front, back, top, bottom, and the like referred to or may be referred to in this specification are defined relative to the configuration shown in the drawings, and are relative terms, and thus may be changed correspondingly according to the position and the use state of the device. Therefore, these and other directional terms should not be construed as limiting terms.
Example one
As shown in fig. 1 to 3, fig. 1 is a schematic structural view of a floor heating insulation board according to an embodiment of the present invention, fig. 2 is an exploded view of fig. 1, fig. 3 is a bottom view of a support plate shown in fig. 1, the floor heating insulation board includes a heat dissipation plate 11, an insulation board body 12, and a support plate 13, which are sequentially connected from top to bottom, the support plate 13 includes a substrate 131, a protrusion (not shown) is disposed on a top of the substrate 131, and an accommodation cavity 14 for accommodating the insulation board body 12 is formed between the substrate 131 and the heat dissipation plate 11 through the protrusion.
The heat dissipation plate 11 is used for diffusing heat on the heat insulation plate body 12, so that a quick heat dissipation effect is achieved, and the heat insulation plate is more energy-saving and environment-friendly.
The insulation board body 12 is made of Expandable Polystyrene (EPS) material by foaming. The insulation board body 12 is used to provide heat.
The support plate 13 is made of Polystyrene (PS) material by injection molding. The supporting plate 13 is used for supporting the heat insulation board body 12, and a protrusion extends upwards from the top edge of the supporting plate 13, so that a containing cavity 14 for containing the heat insulation board body 12 is formed between the substrate 131 and the heat dissipation plate 11.
In the preferred embodiment, the protrusions are integrally formed with the support plate 13 to enhance structural strength and connection stability.
During installation, the heat insulation board body 12 is placed in the accommodating cavity 14, and the heat dissipation plate 11 covers the upper surface of the heat insulation board body 12, so that a modular floor heating heat insulation board is formed. When laying warms up and warms up, only need directly closely piece together a plurality of heated board that warm up, do not have the connecting piece between the heated board that warm up respectively, guaranteed lower production manufacturing cost, when guaranteeing the effect of mating formation, saved man-hour.
The top and the bottom are referred to in this embodiment, in terms of the ground, the end far away from the ground is the top, and the end near the ground is the bottom.
The floor heating insulation board that this embodiment provided, through heating panel, insulation board body and backup pad complex formation modular floor heating insulation board, increased the bearing capacity that insulation board body wholly supported, prevent that the insulation board from weing rotten, reduced the loss rate of material. In addition, all components in the floor heating insulation board are industrially produced in a factory, only simple installation is needed on a decoration site, skilled technical workers are not needed on the site, too much construction time is not needed, rapid construction is realized, and the condition that the traditional decoration operation site is dirty is avoided.
alternatively, as shown in fig. 2, the base plate 131 is square, the protrusions are disposed at four corners of the base plate 131, and the four protrusions surround the heat dissipation plate 11 to form the receiving cavity 14.
Alternatively, as shown in fig. 2, the protrusion includes a first supporting block 132 and a second supporting block 133 disposed on adjacent edges of the substrate 131, the end of the insulation board body 12 is provided with a receiving groove 121 corresponding to the first supporting block 132 and the second supporting block 133, and the receiving groove 121 is engaged with the first supporting block 132 and the second supporting block 133.
In the preferred embodiment, the first and second supporting blocks 132 and 133 are integrally formed to enhance structural strength and connection stability.
Optionally, as shown in fig. 2, the top of the insulation board body 12 is provided with at least one first groove 122 for placing a heating pipe.
The top surface of the insulation board body 12 is provided with at least one U-shaped first groove 122, the first grooves 122 on the insulation board body 12 are mutually connected to form a loop, and during installation, the heating pipe is laid in the loop. Through set up first recess 122 on insulation board body 12, guaranteed that the heating pipe can be even lay indoor, guaranteed good heating effect.
In this preferred embodiment, in order to increase the flexibility of laying the heating pipes, the first grooves 122 are different in opening manner according to the arrangement of the heating pipes of the floor heating system, and may be divided into double straight pipe grooves, single bent pipe grooves and double bent pipe grooves. Two straight tube grooves are two straight line shaped U-shaped grooves are formed in the surface of the insulation board body 12, a single bent tube groove is a curved U-shaped groove formed in the surface of the insulation board body 12 in the extending direction, two bent tube grooves are curved U-shaped grooves formed in the surface of the insulation board body 12 in the extending direction, and the distance between the two straight tube grooves in the insulation board body 12 is equal to the distance between the two bent tube grooves in the insulation board body 12.
In the preferred embodiment, the two first grooves 122 are formed in the insulation board body 12, so that the heating pipes are effectively densely laid.
In the preferred embodiment, the heat insulation board body 12 and the first groove 122 are integrally formed, so that the structural strength and the connection stability are enhanced.
In the preferred embodiment, the heating pipe is a heating water pipe, so that the cost is reduced.
Alternatively, as shown in fig. 2, the top of the heat dissipation plate 11 is provided with a second groove 111 corresponding to the first groove 122, and the second groove 111 is inserted into the first groove 122, so that the heat dissipation plate 11 covers the insulation board body 12.
The top of heating panel 11 is provided with at least one second recess 111, second recess 111 is the same with first recess 122's shape and structure, the return circuit that second recess 111 formed is also the same with the return circuit that first recess 122 formed, during the installation, the heating pipe is laid in second recess 111 to make heating panel 11 can cover heated board body 12 safely, when guaranteeing the radiating effect, can prevent heated board body 12 perk through heating panel 11 crimping heated board body 12.
In the preferred embodiment, the heat dissipation plate 11 is integrally formed with the second groove 111, so as to enhance the structural strength and the connection stability.
Optionally, as shown in fig. 3, fig. 3 is a schematic bottom structure diagram of the support plate 13, hollow cavities (not shown) are disposed in the first support block 132 and the second support block 133, a through hole 134 communicated with the hollow cavities is disposed at the bottom of the substrate 131, and a part of heat can be stored through the hollow cavities and the through hole 134, so that when the floor heating system is turned off, the indoor temperature does not drop rapidly, and the weight of the support plate 13 can be reduced.
Alternatively, to increase the heat dissipation effect and reduce the weight, the heat dissipation plate 11 is an aluminum plate.
example two
On the basis of the first embodiment, the second embodiment is a floor heating system structure including the first embodiment, and therefore, the same parts as those in the first embodiment are not described again. As shown in fig. 4, the floor heating system comprises a plurality of floor heating insulation boards 10, and the floor heating insulation boards 10 are spliced with each other.
When the floor heating system is paved, the floor heating insulation boards 10 are sequentially spliced to form a tight connection plane, the extending directions of the second grooves 111 on any two floor heating insulation boards 10 are consistent, and the conduction between the parallel grooves can be realized by laying two floor heating insulation boards 10 provided with double bent pipe grooves on one edge of the tight connection plane for two adjacent floor heating insulation boards 10. To being located return circuit inflection point position department, starting point position department, terminal point position department, the different ground heating insulation board 10 of seting up the mode of accessible concatenation is adjusted according to the operation condition on-the-spot in a flexible way and is arranged, has realized the effective close shop of heating pipe, has guaranteed simultaneously that the return circuit that is used for laying the heating pipe can carry out nimble adjustment according to the on-the-spot condition, and the operation personnel of being convenient for mat formation have guaranteed lower production manufacturing cost, when guaranteeing the effect of mat formation, have saved man-hour.
It should be noted that the loop formed by the second groove 111 for placing the heating tube shown in fig. 4 is only one of the loops, and the loop of the second groove 111 can be set according to the requirement of the user, and is not limited by the embodiment.
Optionally, a balance plate (not shown) is further included on top of the heat dissipation plate in order to enable uniform heat dissipation.
Optionally, a decorative plate (not shown) is further included on top of the balancing plate for aesthetic enhancement.
The decorative board can be made of ceramic tiles, plastic composite boards, wood base plates and other materials, and can meet various paving requirements. The decorative board is preferably polygonal, can splice according to the field operation condition, and application scope is wider.
In conclusion, the floor heating insulation board and the floor heating system provided by the invention form the modularized floor heating insulation board through the heat dissipation plate, the insulation board body and the support plate, so that the bearing capacity of the integral support of the insulation board body is increased, the insulation board is prevented from being affected with damp and deteriorated, and the loss rate of materials is reduced. In addition, all components in the floor heating insulation board are industrially produced in a factory, only simple installation is needed on a decoration site, skilled technical workers are not needed on the site, too much construction time is not needed, rapid construction is realized, and the condition that the traditional decoration operation site is dirty is avoided.
The foregoing is considered as illustrative only of the principles and preferred embodiments of the invention. It should be noted that, for those skilled in the art, several other modifications can be made on the basis of the principle of the present invention, and the protection scope of the present invention should be regarded.

Claims (10)

1. The utility model provides a warm up heated board, its characterized in that includes from last heating panel, heated board body and the backup pad that connects gradually extremely down, the backup pad includes the base plate, the top of base plate is provided with the arch, the base plate with pass through between the heating panel protruding formation holds the cavity that holds of heated board body.
2. A floor heating insulation board according to claim 1, wherein the base plate is square, the protrusions are arranged at four corners of the base plate, and the four protrusions and the heat dissipation plate enclose to form the accommodating cavity.
3. The floor heating insulation board of claim 2, wherein the protrusion comprises a first supporting block and a second supporting block arranged on adjacent edges of the base plate, and a receiving groove corresponding to the first supporting block and the second supporting block is arranged at an end of the insulation board body and is clamped with the first supporting block and the second supporting block.
4. The floor heating insulation board of claim 3, wherein at least one first groove for placing a heating pipe is formed in the top of the insulation board body.
5. The floor heating insulation board according to claim 4, wherein a second groove corresponding to the first groove is formed in the top of the heat dissipation plate, and the second groove is inserted into the first groove, so that the heat dissipation plate covers the insulation board body.
6. the floor heating insulation board according to claim 5, wherein a hollow cavity is arranged in each of the first supporting block and the second supporting block, and a through hole communicated with the hollow cavity is formed in the bottom of the base plate.
7. A floor heating insulation board according to claim 6, wherein the heat dissipation plate is an aluminum plate.
8. A floor heating system is characterized by comprising a plurality of floor heating insulation boards according to any one of claims 1 to 7, wherein the floor heating insulation boards are spliced with one another.
9. The floor heating system of claim 8, further comprising a balancing plate disposed on top of the heat spreader plate.
10. The floor heating system of claim 9, further comprising a trim panel disposed on top of the balance panel.
CN201910751798.6A 2019-08-15 2019-08-15 Floor heating insulation board and floor heating system Pending CN110552480A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910751798.6A CN110552480A (en) 2019-08-15 2019-08-15 Floor heating insulation board and floor heating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910751798.6A CN110552480A (en) 2019-08-15 2019-08-15 Floor heating insulation board and floor heating system

Publications (1)

Publication Number Publication Date
CN110552480A true CN110552480A (en) 2019-12-10

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ID=68737407

Family Applications (1)

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CN201910751798.6A Pending CN110552480A (en) 2019-08-15 2019-08-15 Floor heating insulation board and floor heating system

Country Status (1)

Country Link
CN (1) CN110552480A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06147520A (en) * 1992-10-30 1994-05-27 Tokyo Gas Co Ltd Installing apparatus for floor heating mat
JPH0821074A (en) * 1994-02-17 1996-01-23 Nakano Kensetsu:Kk Bed panel, heating device, floor heating floor, and constructing method
JP2003222345A (en) * 2001-11-20 2003-08-08 Toshio Iizuka Hot water type floor heating panel and method for constructing floor heating
KR200362128Y1 (en) * 2004-04-26 2004-09-16 이영국 Heating panel for fabrication
US20080096400A1 (en) * 2006-10-18 2008-04-24 Chih-Jung Chen Solid floor board assembly with duct raceway cavity
CN206347632U (en) * 2016-12-14 2017-07-21 浙江亚厦装饰股份有限公司 A kind of modularization floor heating cabling substrate cassette and functional composite board
CN107965117A (en) * 2018-01-12 2018-04-27 四川德顿郎陈暖通设备有限公司 Easy to the combined floor heating tiles of splicing
CN108149887A (en) * 2017-12-30 2018-06-12 浙江亚厦装饰股份有限公司 Real paving floor heating structure and floor heating method for paving
CN211229342U (en) * 2019-08-15 2020-08-11 浙江亚厦装饰股份有限公司 Floor heating insulation board and floor heating system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06147520A (en) * 1992-10-30 1994-05-27 Tokyo Gas Co Ltd Installing apparatus for floor heating mat
JPH0821074A (en) * 1994-02-17 1996-01-23 Nakano Kensetsu:Kk Bed panel, heating device, floor heating floor, and constructing method
JP2003222345A (en) * 2001-11-20 2003-08-08 Toshio Iizuka Hot water type floor heating panel and method for constructing floor heating
KR200362128Y1 (en) * 2004-04-26 2004-09-16 이영국 Heating panel for fabrication
US20080096400A1 (en) * 2006-10-18 2008-04-24 Chih-Jung Chen Solid floor board assembly with duct raceway cavity
CN206347632U (en) * 2016-12-14 2017-07-21 浙江亚厦装饰股份有限公司 A kind of modularization floor heating cabling substrate cassette and functional composite board
CN108149887A (en) * 2017-12-30 2018-06-12 浙江亚厦装饰股份有限公司 Real paving floor heating structure and floor heating method for paving
CN107965117A (en) * 2018-01-12 2018-04-27 四川德顿郎陈暖通设备有限公司 Easy to the combined floor heating tiles of splicing
CN211229342U (en) * 2019-08-15 2020-08-11 浙江亚厦装饰股份有限公司 Floor heating insulation board and floor heating system

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