CN110549077A - Processing method for cutting small round hole with inner diameter of 0.2mm by slow-speed wire - Google Patents

Processing method for cutting small round hole with inner diameter of 0.2mm by slow-speed wire Download PDF

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Publication number
CN110549077A
CN110549077A CN201910835779.1A CN201910835779A CN110549077A CN 110549077 A CN110549077 A CN 110549077A CN 201910835779 A CN201910835779 A CN 201910835779A CN 110549077 A CN110549077 A CN 110549077A
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CN
China
Prior art keywords
plate
steel wire
wire
inner diameter
rectangular groove
Prior art date
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Pending
Application number
CN201910835779.1A
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Chinese (zh)
Inventor
刘斐
赖忠文
王周燕
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Chengdu Homin Technology Co Ltd
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Chengdu Homin Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Homin Technology Co Ltd filed Critical Chengdu Homin Technology Co Ltd
Priority to CN201910835779.1A priority Critical patent/CN110549077A/en
Publication of CN110549077A publication Critical patent/CN110549077A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

the invention discloses a processing method for cutting a small round hole with the inner diameter of 0.2mm by a slow-speed wire, which comprises the following steps: s1, manufacturing a mold: s2, selecting a plate A (4) and a plate B (5); s3, forming a plurality of semi-circular grooves A (6) with margins along the length direction on the right end surface of the plate A (4), and forming a plurality of semi-circular grooves B (7) with margins along the length direction on the left end surface of the plate B (5); s5, putting the spliced plate A and plate B into the rectangular groove (2); s6, penetrating a steel wire of the wire cutting machine into an area defined by the semicircular groove A (6) and the semicircular groove B (7), starting wire cutting after the steel wire is installed, wherein the steel wire moves in a circular shape with the diameter of 0.2mm, and the steel wire cuts the allowance left on the plate A and the plate B in the moving process, so that the female die with the inner diameter of 0.2mm is finally obtained. The invention has the beneficial effects that: the manufacturing process is simple, the production cost is reduced, and the machining precision of the small round hole is improved.

Description

processing method for cutting small round hole with inner diameter of 0.2mm by slow-speed wire
Technical Field
the invention relates to the technical field of micro round hole processing, in particular to a processing method for cutting a small round hole with the inner diameter of 0.2mm by a slow-speed wire.
Background
A small round hole with the diameter of 0.2mm needs to be processed on the female die, and due to the fact that the hole diameter is very small, processing cannot be achieved through traditional stamping. At present, etching processing and laser processing are mainly adopted, wherein the etching processing mode is to adopt a film to be attached to a non-corrosion area of a blank to ensure that the diameter of the corrosion area is 0.2mm, and then the film is put into an etching groove for processing, so that a female die with the aperture of 0.2mm is processed. However, although the small circular holes can be processed by etching, the thin film needs to be torn off after etching, and the thin film needs to be attached before etching, which increases the workload and reduces the processing efficiency.
although the laser processing method can process a hole diameter of 0.2mm, a small circular hole can be processed only on a blank with a thickness of 0.8 ~ 2mm, the thickness of the die is usually 8 ~ 10mm, the laser cutting cost is high, and the production cost is increased, so that the laser processing method cannot be popularized and used.
disclosure of Invention
the invention aims to overcome the defects of the prior art and provide the processing method for cutting the small round hole with the inner diameter of 0.2mm by the slow-moving wire, which has the advantages of simple manufacturing process, reduced production cost and improved processing precision of the small round hole.
The purpose of the invention is realized by the following technical scheme: a processing method for cutting a small round hole with an inner diameter of 0.2mm by a slow-speed wire comprises the following steps:
S1, manufacturing a mold:
s11, selecting a plate with a certain thickness, and forming a rectangular groove on the top surface of the plate;
s12, arranging blind holes at four corners of the rectangular groove on the plate, and enabling the blind holes to be communicated with the rectangular groove, so that the die is manufactured;
s2, selecting the plate A and the plate B, and ensuring that the total width of the plate A and the plate B is equal to the width of the rectangular groove after the plate A and the plate B are spliced;
s3, forming a plurality of semicircular grooves A with margins in the length direction on the right end face of the plate A, and forming a plurality of semicircular grooves B with margins in the length direction on the left end face of the plate B;
S4, splicing the right end face of the plate A and the left end face of the plate B, and simultaneously ensuring that the semicircular groove A is opposite to the semicircular groove B;
S5, placing the spliced plate A and the spliced plate B into the rectangular groove together; the width of the rectangular groove is equal to the total width of the plate A and the plate B after splicing, so that the movement of the plate is limited
s6, inserting a steel wire of a wire cutting machine into an area enclosed by the semicircular groove A and the semicircular groove B, starting wire cutting after the steel wire is installed, wherein the steel wire moves in a circular shape with the diameter of 0.2mm, and the steel wire cuts off the allowance left on the plate A and the plate B in the moving process, so that a female die with the inner diameter of 0.2mm is finally obtained;
s7, welding the contact part of the plate A and the plate B to obtain the required part; and respectively embedding the fingers into the blind holes arranged diagonally to take out the finished product female die.
the invention has the following advantages: the invention has simple manufacturing process, reduces the production cost and improves the processing precision of the small round hole.
Drawings
FIG. 1 is a schematic structural view of a plate A;
FIG. 2 is a schematic structural view of a plate B;
FIG. 3 is a schematic structural view of a mold;
FIG. 4 is a schematic diagram of the operation of the present invention;
In the figure, 1-plate, 2-rectangular groove, 3-blind hole, 4-plate A, 5-plate B, 6-semicircular groove A, 7-semicircular groove B.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
As shown in fig. 1 ~ 4, a method for cutting a small round hole with an inner diameter of 0.2mm by a slow-moving wire comprises the following steps:
S1, manufacturing a mold:
S11, selecting a plate with a certain thickness, and arranging a rectangular groove 2 on the top surface of the plate 1;
s12, arranging blind holes 3 at four corners of the rectangular groove 2 on the plate 1, and enabling the blind holes 3 to be communicated with the rectangular groove 2, thereby realizing the manufacture of the die;
s2, selecting a plate A4 and a plate B5, and ensuring that the total width of the plate A4 and the plate B5 is equal to the width of the rectangular groove 2 after the plate A4 is spliced with the plate B5;
s3, forming a plurality of semi-circular grooves A6 with allowance along the length direction on the right end surface of the plate A4, and forming a plurality of semi-circular grooves B7 with allowance along the length direction on the left end surface of the plate B5;
S4, splicing the right end face of the plate A4 and the left end face of the plate B5, and ensuring that the semicircular groove A6 is opposite to the semicircular groove B7;
S5, placing the spliced plate A4 and the spliced plate B5 into the rectangular groove 2;
S6, inserting a steel wire of a wire cutting machine into an area defined by the semicircular groove A6 and the semicircular groove B7, starting wire cutting after the steel wire is installed, wherein the steel wire moves in a circular shape with the diameter of 0.2mm, and the steel wire cuts off the residual quantity left on the plate A4 and the plate B5 in the moving process, so that a female die with the inner diameter of 0.2mm is finally obtained;
S7, welding the contact part of the plate A4 and the plate B5 to obtain the required part; and respectively embedding the male die into the blind holes 3 arranged diagonally by fingers so as to take out the finished female die.
therefore, in the whole process of processing the small round hole, the small round hole with the diameter of 0.2mm does not need to be processed by etching and laser. In addition, the allowance that the slow-moving wire cuts the plate along the outer contour of the cylinder is adopted, so that the machining precision of the small round hole is improved, no burr is generated, and the machining quality of the product is improved.
the foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (1)

1. A processing method for cutting a small round hole with an inner diameter of 0.2mm by a slow-speed wire is characterized by comprising the following steps of: it comprises the following steps:
s1, manufacturing a mold:
S11, selecting a plate with a certain thickness, and arranging a rectangular groove (2) on the top surface of the plate (1);
s12, arranging blind holes (3) in the plate (1) and at the four corners of the rectangular groove (2), and enabling the blind holes (3) to be communicated with the rectangular groove (2), thereby realizing the manufacture of the die;
s2, selecting the plate A (4) and the plate B (5), and ensuring that the total width of the plate A (4) and the plate B (5) is equal to the width of the rectangular groove (2) after the plate A (4) and the plate B (5) are spliced;
s3, forming a plurality of semi-circular grooves A (6) with margins along the length direction on the right end surface of the plate A (4), and forming a plurality of semi-circular grooves B (7) with margins along the length direction on the left end surface of the plate B (5);
S4, splicing the right end face of the plate A (4) and the left end face of the plate B (5), and ensuring that the semicircular groove A (6) is opposite to the semicircular groove B (7);
s5, placing the spliced plate A (4) and the spliced plate B (5) into the rectangular groove (2) together;
s6, inserting a steel wire of a wire cutting machine into an area surrounded by the semicircular groove A (6) and the semicircular groove B (7), starting wire cutting after the steel wire is installed, wherein the steel wire moves in a circular shape with the diameter of 0.2mm, and the steel wire cuts off the residual quantity left on the plate A (4) and the plate B (5) in the moving process, so that a female die with the inner diameter of 0.2mm is finally obtained;
s7, welding the contact part of the plate A (4) and the plate B (5) to obtain a required part; and fingers are respectively embedded into blind holes (3) which are arranged diagonally so as to take out the finished product female die.
CN201910835779.1A 2019-09-05 2019-09-05 Processing method for cutting small round hole with inner diameter of 0.2mm by slow-speed wire Pending CN110549077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910835779.1A CN110549077A (en) 2019-09-05 2019-09-05 Processing method for cutting small round hole with inner diameter of 0.2mm by slow-speed wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910835779.1A CN110549077A (en) 2019-09-05 2019-09-05 Processing method for cutting small round hole with inner diameter of 0.2mm by slow-speed wire

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CN110549077A true CN110549077A (en) 2019-12-10

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102152060A (en) * 2011-01-26 2011-08-17 宁波江丰电子材料有限公司 Target processing method
CN102303221A (en) * 2011-08-29 2012-01-04 西南铝业(集团)有限责任公司 Method for processing female die with large square hole
CN102554292A (en) * 2010-12-23 2012-07-11 宁波江丰电子材料有限公司 Target machining tool
CN103212759A (en) * 2013-03-20 2013-07-24 淮海工学院 Method for processing plastic profile shape extrusion die cavity by slow feeding
US9312066B2 (en) * 2012-01-09 2016-04-12 Apple Inc. Magnetic shape optimization
CN107914054A (en) * 2017-10-16 2018-04-17 信维创科通信技术(北京)有限公司 Capillary processing method and microcellular structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102554292A (en) * 2010-12-23 2012-07-11 宁波江丰电子材料有限公司 Target machining tool
CN102152060A (en) * 2011-01-26 2011-08-17 宁波江丰电子材料有限公司 Target processing method
CN102303221A (en) * 2011-08-29 2012-01-04 西南铝业(集团)有限责任公司 Method for processing female die with large square hole
US9312066B2 (en) * 2012-01-09 2016-04-12 Apple Inc. Magnetic shape optimization
CN103212759A (en) * 2013-03-20 2013-07-24 淮海工学院 Method for processing plastic profile shape extrusion die cavity by slow feeding
CN107914054A (en) * 2017-10-16 2018-04-17 信维创科通信技术(北京)有限公司 Capillary processing method and microcellular structure

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Application publication date: 20191210

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