CN110548655A - Greeting card surface gold scattering process - Google Patents
Greeting card surface gold scattering process Download PDFInfo
- Publication number
- CN110548655A CN110548655A CN201910821126.8A CN201910821126A CN110548655A CN 110548655 A CN110548655 A CN 110548655A CN 201910821126 A CN201910821126 A CN 201910821126A CN 110548655 A CN110548655 A CN 110548655A
- Authority
- CN
- China
- Prior art keywords
- greeting card
- gold
- powder
- hot melt
- melt adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/12—Applying particulate materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
- B05D1/38—Successively applying liquids or other fluent materials, e.g. without intermediate treatment with intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
- B05D5/067—Metallic effect
- B05D5/068—Metallic effect achieved by multilayers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
the invention discloses a greeting card surface gold-scattering process, which comprises the following steps: gluing the position needing powder scattering, heating to soften the hot melt adhesive so that the hot melt adhesive is more uniform and sticky; then, the gold powder is scattered by using the automatic powder scattering machine, so that the labor cost is reduced, and the powder scattering uniformity and high efficiency are ensured; the gold powder on the surface of the greeting card is pressurized and reinforced, then is fixed by transparent glue on the surface, and finally is dried, so that the gold powder is fixed on a corresponding position, the hot melt glue powder is reliably attached to the ink, the quality of the heat transfer printing label is ensured, and the qualification rate of the product is ensured. The gold powder at the position where no gold is needed to be scattered is cleaned and recovered, and the process cost is further reduced.
Description
Technical Field
the invention belongs to the technical field of printed matter manufacturing processes, and particularly relates to a process for scattering gold on the surface of a greeting card.
Background
The gold scattering, also called gold scattering and powder scattering, is a process for attaching the glitter powder to the printed matter, and plays a role in improving the grade of the printed matter. Gold dusting is often used on greeting cards. Along with the increasing living standard of people, the requirement on the exquisite degree of the greeting card is higher and higher, so the requirement on the gold scattering technology on the surface of the greeting card is higher and higher.
The existing gold scattering process is to coat hot melt adhesive on the position of the surface needing to scatter gold, and then manually coat gold powder and wait for drying. The gold scattering mode can not realize that the hot melt adhesive is reliably adhered to the ink, and the gold scattering on the surface of the greeting card is easy to fall off and is not beautiful. The product qualification rate is low, and the labor cost is high. With the increase of the demand of gold scattering of the greeting card, a gold scattering process which is efficient, low in cost and good in gold scattering effect on the surface of the greeting card is urgently needed to be sought.
Disclosure of Invention
the invention provides a greeting card surface gold scattering process, which solves the technical problems of low qualification rate, high cost and poor gold scattering effect.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: a process for spreading gold on the surface of a greeting card is characterized by comprising the following steps:
S1, coating hot melt adhesive on the surface of the greeting card to be scattered with gold;
S2, placing the glued greeting card on a heating device, and heating and softening for a period of time;
S3, after the hot melt adhesive on the surface is softened, uniformly scattering gold powder on the place where the hot melt adhesive is coated on the surface of the greeting card;
s4, moving the greeting card into a pressurizing device, pressurizing and reinforcing the gold powder on the surface of the greeting card, and blowing the redundant gold powder on the surface of the greeting card after the reinforcement is finished;
And S5, fixing the surface of the greeting card by using transparent glue, and drying the greeting card after the fixation is finished.
Further, in the step S2, the softening time by heating is 5 ~ 10min, and the temperature is 80 ~ 105 ℃.
Further, in step S3, the gold powder is applied by an automatic powder spreader. The gold powder spraying device has the effects of reducing labor cost and efficiently and uniformly spraying gold powder.
Further, in step S4, the pressurization is gravity pressurization.
Further, in the step S5, the drying is oven drying, the drying temperature is 40 ~ 50 ℃, and the drying time is 6 ~ 8 min.
further, in the step S5, the drying is UV light drying, and the drying time is 3 ~ 5 min.
further, in step S1, the hot melt adhesive is uniformly coated on the surface where gold needs to be spread. If the hot melt adhesive coating is uneven coating, the softening time of the step S2 needs to be longer, so that the hot melt adhesive can flow uniformly in the place where the gold needs to be scattered, and the hot melt adhesive coating is even, thereby reducing the softening time.
Further, in step S4, the excess gold powder is recovered and reused after being purged. The effect of saving cost is achieved.
Further, in step S2, the heating device is a heating pipe, a heat sink, or a hot air circulating device connected to a power supply.
The invention achieves the following beneficial effects: gluing the position needing powder scattering, heating to soften the hot melt adhesive so that the hot melt adhesive is more uniform and sticky; then, the gold powder is scattered by using the automatic powder scattering machine, so that the labor cost is reduced, and the powder scattering uniformity and high efficiency are ensured; the gold powder on the surface of the greeting card is pressurized and reinforced, then is fixed by transparent glue on the surface, and finally is dried, so that the gold powder is fixed on a corresponding position, the hot melt glue powder is reliably attached to the ink, the quality of the heat transfer printing label is ensured, and the qualification rate of the product is ensured. The gold powder at the position where no gold is needed to be scattered is cleaned and recovered, and the process cost is further reduced.
Detailed Description
The invention is further described below. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
A process for spreading gold on the surface of a greeting card comprises the following steps:
S1, coating hot melt adhesive on the surface of the greeting card to be scattered with gold;
S2, placing the glued greeting card on a heating device, and heating and softening for a period of time;
s3, after the hot melt adhesive on the surface is softened, uniformly scattering gold powder on the place where the hot melt adhesive is coated on the surface of the greeting card;
S4, moving the greeting card into a pressurizing device, pressurizing and reinforcing the gold powder on the surface of the greeting card, and blowing the redundant gold powder on the surface of the greeting card after the reinforcement is finished;
And S5, fixing the surface of the greeting card by using transparent glue, and drying the greeting card after the fixation is finished.
the first embodiment,
A process for spreading gold on the surface of a greeting card comprises the following steps:
And S1, hot melt adhesive coating is carried out at the position where the greeting card needs to be spread with gold.
And S2, heating and softening the hot melt adhesive on the surface of the greeting card by using a heating pipe connected with a power supply, wherein the heating temperature is 70 ℃, and the softening time is 7 min.
s3, after the softening of the hot melt adhesive on the surface is finished, uniformly scattering gold powder on the place coated with the hot melt adhesive by using an automatic powder scattering machine, and adjusting the rotating speed of the carving roller according to actual requirements to control the amount of the gold powder.
s4, moving the greeting card into a pressurizing device, and pressurizing the gold powder on the surface of the greeting card by gravity for further reinforcement; and blowing and recovering the redundant gold powder on the surface of the greeting card after the reinforcement is finished. The blowing and recovering are specifically blowing by using a tool with blowing force, and bagging and recovering after blowing and gathering.
And S5, fixing the surface of the greeting card by using transparent glue, and drying the greeting card in an oven at the temperature of 45 ℃ for 4 min.
Example II,
a process for spreading gold on the surface of a greeting card comprises the following steps:
And S1, uniformly coating the hot melt adhesive at the position where the greeting card needs to be spread with gold.
And S2, heating and softening the hot melt adhesive on the surface of the greeting card by using a radiating fin connected with a power supply, wherein the heating temperature is 90 ℃, and the softening time is 6 min.
S3, after the softening of the hot melt adhesive on the surface is finished, uniformly scattering gold powder on the place coated with the hot melt adhesive by using an automatic powder scattering machine, and adjusting the rotating speed of the carving roller according to actual requirements to control the amount of the gold powder.
S4, moving the greeting card into a pressurizing device, and pressurizing the gold powder on the surface of the greeting card by gravity for further reinforcement; and blowing and recovering the redundant gold powder on the surface of the greeting card after the reinforcement is finished. The blowing and recovering are specifically manual blowing, and the redundant gold powder is blown and gathered for bagging and recovering.
And S5, fixing the surface of the greeting card by using transparent glue, and drying the greeting card by using UV light for 5 min.
Example III,
A process for spreading gold on the surface of a greeting card comprises the following steps:
and S1, uniformly coating the hot melt adhesive at the position where the greeting card needs to be spread with gold.
And S2, heating and softening the hot melt adhesive on the surface of the greeting card by using a hot air circulating device connected with a power supply, wherein the heating temperature is 100 ℃, and the softening time is 5 min.
S3, after the softening of the hot melt adhesive on the surface is finished, uniformly scattering gold powder on the place coated with the hot melt adhesive by using an automatic powder scattering machine, and adjusting the rotating speed of the carving roller according to actual requirements to control the amount of the gold powder.
S4, moving the greeting card into a pressurizing device, and pressurizing the gold powder on the surface of the greeting card by gravity for further reinforcement; and blowing and recovering the redundant gold powder on the surface of the greeting card after the reinforcement is finished.
And S5, fixing the surface of the greeting card by using transparent glue, and drying the greeting card by using UV light for 4 min.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (9)
1. A process for spreading gold on the surface of a greeting card is characterized by comprising the following steps:
S1, coating hot melt adhesive on the surface of the greeting card to be scattered with gold;
S2, placing the glued greeting card on a heating device, and heating and softening for a period of time;
s3, after the hot melt adhesive on the surface is softened, uniformly scattering gold powder on the place where the hot melt adhesive is coated on the surface of the greeting card;
S4, moving the greeting card into a pressurizing device, pressurizing and reinforcing the gold powder on the surface of the greeting card, and blowing the redundant gold powder on the surface of the greeting card after the reinforcement is finished;
And S5, fixing the surface of the greeting card by using transparent glue, and drying the greeting card after the fixation is finished.
2. The process for spreading gold on the surface of greeting card as claimed in claim 1, wherein in step S2, the softening time is 5 ~ 10min and the temperature is 80 ~ 105 ℃.
3. the greeting card surface gold dusting process of claim 1 wherein, in step S3, the gold powder is applied by an automatic powder spreader.
4. The process of claim 1 wherein the step S4 is carried out by applying pressure to the greeting card.
5. the process of claim 1 wherein in step S5, the drying is oven drying at 40 ~ 50 ℃ for 6 ~ 8 min.
6. The process of claim 1 wherein in step S5, the drying is UV light drying for 3 ~ 5 min.
7. the process of claim 1 wherein in step S1, the hot melt adhesive is applied uniformly to the surface where gold is to be applied.
8. The process of claim 1 wherein in step S4, the excess gold powder is purged and recycled.
9. The process of claim 1 wherein in step S2, the heating device is a heating tube, a heat sink or a hot air circulation device connected to a power source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910821126.8A CN110548655A (en) | 2019-09-02 | 2019-09-02 | Greeting card surface gold scattering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910821126.8A CN110548655A (en) | 2019-09-02 | 2019-09-02 | Greeting card surface gold scattering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110548655A true CN110548655A (en) | 2019-12-10 |
Family
ID=68738656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910821126.8A Pending CN110548655A (en) | 2019-09-02 | 2019-09-02 | Greeting card surface gold scattering process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110548655A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112477498A (en) * | 2020-11-03 | 2021-03-12 | 黄腾星 | Gold powder decorative board manufacturing equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010411A (en) * | 2016-05-26 | 2016-10-12 | 温州宏达激光图像有限公司 | Glitter powder sequin membrane and preparation method thereof |
-
2019
- 2019-09-02 CN CN201910821126.8A patent/CN110548655A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010411A (en) * | 2016-05-26 | 2016-10-12 | 温州宏达激光图像有限公司 | Glitter powder sequin membrane and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112477498A (en) * | 2020-11-03 | 2021-03-12 | 黄腾星 | Gold powder decorative board manufacturing equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101531114B (en) | A surface treatment process of wall decorative board | |
| CN106883672B (en) | UV ink transfer printing process and UV ink | |
| CN104533043A (en) | Decoration board and preparation method thereof | |
| CN107167868B (en) | production method of glass light guide plate | |
| CN204526413U (en) | A kind of gilding press | |
| CN110548655A (en) | Greeting card surface gold scattering process | |
| CN106457602B (en) | Method for manufacturing decorated wood plank and the panel made of the wood plank | |
| CN106205358B (en) | A kind of molding equipment of thermal transfer silica gel trademark | |
| CN208993248U (en) | Assembly line for laminating PUR hot melt plate | |
| CN107037529B (en) | A kind of bend glass light guide plate preparation method | |
| CN208682334U (en) | A kind of automatic temperature control device based on laminating machine | |
| CN202319327U (en) | Surface coating-free heat transfer film | |
| KR101019410B1 (en) | Method and apparatus for manufacturing decorative flat glass using decorative sheets | |
| CN109862294A (en) | A kind of backlight module reflection slice mounting structure and its installation method | |
| CN208912351U (en) | A kind of epoxy resin generation wooden material feeding film covering device | |
| CN203021838U (en) | Artificial leather manufacturing machine adopting novel coating method | |
| CN106985469B (en) | A kind of crocodile line illusion-colour gold stampped shell fabric and its preparation process | |
| CN207274137U (en) | A kind of common ink and the printable compound offset press of polychrome of UV compound oil inks | |
| CN205816108U (en) | A kind of edge band coating apparatus | |
| CN202727513U (en) | Energy-saving laminating machine | |
| CN201921809U (en) | Automatic gluing device | |
| CN211910813U (en) | Paster nail processing equipment | |
| CN110272692B (en) | Sprayable weather-resistant transparent environment-friendly PET (polyethylene terephthalate) processing technology with coating | |
| CN111942049A (en) | Printing method of adhesive label | |
| CN205762047U (en) | A kind of sticker adhesive face glue spreader |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191210 |
|
| RJ01 | Rejection of invention patent application after publication |