CN110545624B - Etching machine upper cover device for circuit board etching - Google Patents
Etching machine upper cover device for circuit board etching Download PDFInfo
- Publication number
- CN110545624B CN110545624B CN201910968938.5A CN201910968938A CN110545624B CN 110545624 B CN110545624 B CN 110545624B CN 201910968938 A CN201910968938 A CN 201910968938A CN 110545624 B CN110545624 B CN 110545624B
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- etching
- shell
- upper cover
- circuit board
- pipe
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- 238000005530 etching Methods 0.000 title claims abstract description 58
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 36
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000001301 oxygen Substances 0.000 claims abstract description 33
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 33
- 238000006243 chemical reaction Methods 0.000 claims abstract description 22
- 239000007789 gas Substances 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims description 10
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 abstract description 40
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 abstract description 13
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 abstract description 13
- 231100000572 poisoning Toxicity 0.000 abstract description 7
- 230000000607 poisoning effect Effects 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 5
- 208000005374 Poisoning Diseases 0.000 description 6
- 229910000861 Mg alloy Inorganic materials 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000012286 potassium permanganate Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 231100000614 poison Toxicity 0.000 description 4
- 230000007096 poisonous effect Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/14—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
- B01D53/1456—Removing acid components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/14—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
- B01D53/1493—Selection of liquid materials for use as absorbents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/46—Removing components of defined structure
- B01D53/54—Nitrogen compounds
- B01D53/56—Nitrogen oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/76—Gas phase processes, e.g. by using aerosols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2252/00—Absorbents, i.e. solvents and liquid materials for gas absorption
- B01D2252/10—Inorganic absorbents
Abstract
The invention relates to the technical field of circuit boards, and discloses an etching machine upper cover device for etching a circuit board, which comprises: the etching shell, the last surface movable mounting of etching shell has sealed piece, and the upper end fixed mounting of sealed piece has the upper cover body, and the last fixed surface of upper cover body installs the set casing, the lower fixed surface of lid body installs the intake pipe, and the upper end fixed mounting of intake pipe has the breather pipe, and the both sides at breather pipe middle part all have oxygen reaction shell through one-way valve fixed mounting. Through the cooperation use of breather pipe, one-way valve, oxygen reaction shell, lid, gas mixing bin and siphunculus, can be with the whole nitrogen dioxide that oxidizes of the nitric oxide that produces, later give the nitrogen dioxide through the sodium hydroxide solution that has basicity and absorb the fall, possess and to guarantee when the circuit board etching, the staff can not have the danger of poisoning when opening the etching shell, has protected staff's healthy and surrounding environment's advantage.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an etching machine upper cover device for circuit board etching.
Background
The circuit board is an electronic element commonly used by electronic appliances and the like, wherein the most commonly used metal of the circuit board is magnesium alloy which is formed by adding other elements into magnesium as a base, and the circuit board is characterized in that: the magnesium alloy has the advantages of small density, high specific strength, large specific elastic modulus, good heat dissipation, good shock absorption, larger impact load bearing capacity than aluminum alloy, and stronger chemical activity in the aspect of chemical corrosion processing, so that the magnesium alloy is easier to etch than other metal alloys, and the main alloy elements comprise aluminum, zinc, manganese, thorium, a small amount of zirconium or cadmium and the like.
The corrosive liquid of magnesium alloy corrosion board is the acid solution that nitric acid is given first place to, in the corrosion process, nitric acid and magnesium alloy reaction discharge a large amount of heat, and simultaneously, a large amount of nitric oxide has been produced, wherein nitric oxide is poisonous, after the corruption, when opening corrosion machine and getting the board, the nitric oxide in the corruption shell reacts with the oxygen in the air rapidly, produce more poisonous and have reddish brown's nitrogen dioxide, the danger of poisoning probably takes place for the corruption operating personnel, serious harm the health of corruption operating personnel and the surrounding environment has caused very big harm.
In order to solve the above problems, the inventor proposes an upper cover device of an etching machine for etching a circuit board, which has the advantages of ensuring that after the circuit board is etched, a worker can not have the risk of poisoning when opening an etching shell, and protecting the health of the worker and the surrounding environment.
Disclosure of Invention
The invention adopts the following technical scheme for realizing the technical purpose: an etching machine upper cover device for etching a circuit board comprises: the etching shell, the last surface movable mounting of etching shell has sealed piece, and the upper end fixed mounting of sealed piece has the upper cover body, and the last fixed surface of upper cover body installs the set casing, the lower fixed surface of lid body installs the intake pipe, and the upper end fixed mounting of intake pipe has the breather pipe, and the both sides at breather pipe middle part all have oxygen reaction shell through one-way valve fixed mounting, and the upper end of oxygen reaction shell runs through the upper end of upper cover body and extends to the inside fixed mounting of set casing has the lid, the upper end fixed mounting of breather pipe has the gas mixing storehouse, the equal fixedly connected with siphunculus in both sides in gas mixing storehouse.
Furthermore, the air inlet pipe is located inside the sealing block, and a leak hole is formed in the outer surface of the air inlet pipe and is mainly used for air inlet.
Furthermore, the upper surface of the oxygen reaction shell is provided with a feed inlet matched with the cover body, and the feed inlet is mainly used for feeding potassium permanganate.
Furthermore, the through pipe is arranged at the upper end of the gas mixing bin, and the sodium hydroxide solution arranged in the fixed shell is not higher than the level of the joint of the through pipe and the gas mixing bin, so that the sodium hydroxide solution flows into the gas mixing bin through the through pipe mainly in order to avoid the effect of the communicating vessel, and when the communicating vessel is far away and the same liquid in the communicating vessel does not flow, the liquid level in each container directly contacting with the atmosphere always keeps the same height.
Furthermore, the one-way valve is an oxygen one-way valve, oxygen can only be introduced into the vent pipe, and nitric oxide in the vent pipe cannot enter the oxygen reaction shell.
Further, the length of the air inlet pipe is matched with that of the sealing block.
Furthermore, a sealing gasket is added at the joint of the vent pipe and the one-way valve, so that nitric oxide leakage is avoided.
Furthermore, one side of the oxygen reaction shell, which is far away from the breather pipe, is fixedly installed on the inner wall of the upper cover body.
The invention has the following beneficial effects:
1. this etching machine upper cover device is used in circuit board etching uses through the cooperation of breather pipe, one-way valve, oxygen reaction shell, lid, gas mixing bin and siphunculus, can give the absorption through the sodium hydroxide solution that has basicity with the nitrogen dioxide that produces all oxidation to nitrogen dioxide, when possessing and to guarantee the circuit board etching, the staff opens and can not have the danger of poisoning in the etching shell, has protected staff's healthy and surrounding environment's advantage.
2. This etching machine upper cover device is used in circuit board etching, through the etching shell, sealed piece, the cooperation of upper cover body and intake pipe is used, can go in leading-in the breather pipe with a large amount of nitric oxide of production in the etching shell, avoid at the etching shell cohesion, avoid the staff to open the upper cover body, the nitric oxide in the corruption shell reacts with the oxygen in the air rapidly, produces the more poisonous and have reddish brown nitrogen dioxide, corrode the dangerous condition of poisoning that operating personnel may take place.
Drawings
Fig. 1 is a schematic diagram of the overall explosion structure of the present invention.
Fig. 2 is a schematic perspective view of the upper cover of the present invention.
Fig. 3 is a front sectional structure diagram of the upper cover of the invention.
In the figure: the device comprises an etching shell 1, a sealing block 2, an upper cover body 3, a fixing shell 4, an air inlet pipe 5, an air vent pipe 6, a one-way valve 7, an oxygen reaction shell 8, a cover body 9, a gas mixing bin 10 and a through pipe 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, an upper cover device of an etching machine for etching a circuit board includes: the shell 1 is etched.
As shown in fig. 1: the upper surface movable mounting of etching shell 1 has sealed piece 2, and the upper end fixed mounting of sealed piece 2 has upper cover body 3, and the lateral wall of upper cover 3 is seted up with the feed inlet of lid 9 looks adaptation, mainly used deposits potassium permanganate, and the last fixed surface of upper cover body 3 installs set casing 4.
As shown in fig. 2: an air inlet pipe 5 is fixedly mounted on the lower surface of the cover body 3.
Wherein, use through the cooperation of etching shell 1, sealed piece 2, upper cover body 3 and intake pipe 5, can be with the leading-in 6 interior of breather pipe of leading-in of a large amount of nitric oxide of production in the etching shell 1, avoid gathering in etching shell 1, avoid the staff to open upper cover body 3, the nitric oxide in the corruption shell reacts with the oxygen in the air rapidly, produces the more poisonous and have reddish brown nitrogen dioxide, corrode the dangerous condition of poisoning probably takes place for operating personnel.
As shown in fig. 3: the length of intake pipe 5 and the length looks adaptation of sealed piece 2, intake pipe 5 is located the inside of sealed piece 2, and the small opening has been seted up to the surface of intake pipe 5, it is mainly used to admit air, the upper end fixed mounting of intake pipe 5 has breather pipe 6, the junction of breather pipe 6 and one-way valve 7 adds there is sealed the pad, mainly in order to avoid nitric oxide to reveal, the both sides at breather pipe 6 middle part are all through one-way valve 7 fixed mounting has oxygen reaction shell 8, one-way valve 7 is the oxygen one-way valve, can only let oxygen let in breather pipe 6, nitric oxide in breather pipe 6 can not enter into oxygen reaction shell 8, the feed inlet with lid 9 looks adaptation is seted up to the upper surface of oxygen reaction shell 8, mainly for putting potassium permanganate, the one side that oxygen reaction shell 8 kept away from breather pipe 6 and the inner wall fixed mounting of upper cover body 3, the inside fixed mounting that the upper end of oxygen reaction shell 8 runs through the upper end of upper cover body 3 and extends The utility model discloses a gas mixing bin 10, the upper end fixed mounting of breather pipe 6 has gas mixing bin 10, the equal fixedly connected with siphunculus 11 in both sides of gas mixing bin 10, siphunculus 11 is installed in the upper end of gas mixing bin 10, and the sodium hydroxide solution that sets up in set casing 4 is not higher than the level of siphunculus 11 and the junction of gas mixing bin 10, mainly be to avoid the communicating vessel effect, make the sodium hydroxide solution through siphunculus 11 toward gas mixing bin 10 internal flow, when the communicating vessel is kept away from, when same liquid in the communicating vessel does not flow, direct liquid level with atmosphere contact always keeps same height in each container.
Wherein, through the cooperation of breather pipe 6, one-way through valve 7, oxygen reaction shell 8, lid 9, thoughtlessly gas storehouse 10 and siphunculus 11 use, can be with the whole nitrogen oxide oxidation one-way through the nitrogen oxide that produces to become nitrogen dioxide, later give the absorption of nitrogen dioxide through having alkaline sodium hydroxide solution and fall, possess and to guarantee when the circuit board etching, the staff opens and can not have the danger of poisoning in the etching shell 1, has protected staff's healthy and the advantage of surrounding environment.
When the etching shell is used, the lower end of the sealing block 2 is screwed on the etching shell 1, then when the circuit board is corroded in the etching shell 1, the generated nitric oxide enters the vent pipe 6 through the air inlet pipe 5, meanwhile, when the circuit board is corroded in the etching shell 1, a large amount of heat is generated, potassium permanganate in the oxygen reaction shell 8 can be heated and decomposed, oxygen is generated, the oxygen enters the vent pipe 6 through the one-way valve 7 and is mixed with the nitric oxide in the vent pipe 6, the nitric oxide in the vent pipe 6 and the oxygen are subjected to oxidation reaction, nitrogen dioxide is generated, the reacted nitrogen dioxide is gathered in the gas mixing bin 10, and then the nitrogen dioxide enters the sodium hydroxide solution in the fixing shell 4 through the vent pipe 11 and is absorbed by the sodium hydroxide solution.
Potassium permanganate (KMnO)4) Preparing oxygen: 2KMnO4Heating K2MnO4+MnO2+O2↑
Sodium hydroxide (NaOH) reacts with nitrogen dioxide (NO 2): 2NaOH +2NO2＝NaNO3+NaNO2+H2O
Nitric Oxide (NO) and oxygen (O)2) Reaction: 2NO + O2＝2NO2
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An etching machine upper cover device for etching a circuit board comprises: etched shell (1), characterized in that: the etching device comprises an etching shell (1), a sealing block (2) is movably mounted on the upper surface of the etching shell (1), an upper cover body (3) is fixedly mounted at the upper end of the sealing block (2), a fixing shell (4) is fixedly mounted on the upper surface of the upper cover body (3), an air inlet pipe (5) is fixedly mounted on the lower surface of the cover body (3), an air vent pipe (6) is fixedly mounted at the upper end of the air inlet pipe (5), oxygen reaction shells (8) are fixedly mounted at two sides of the middle part of the air vent pipe (6) through one-way valve (7), the upper end of each oxygen reaction shell (8) penetrates through the upper end of the upper cover body (3) and extends to the inside of the fixing shell (4) and is fixedly mounted with a cover body (9), a gas mixing bin (10) is fixedly mounted at the upper end of the air vent; the air inlet pipe (5) is located inside the sealing block (2), and a leak hole is formed in the outer surface of the air inlet pipe (5).
2. The upper cover device of the etching machine for etching the circuit board as claimed in claim 1, wherein: the upper surface of the oxygen reaction shell (8) is provided with a feed inlet matched with the cover body (9).
3. The upper cover device of the etching machine for etching the circuit board as claimed in claim 1, wherein: the through pipe (11) is arranged at the upper end of the gas mixing bin (10), and the sodium hydroxide solution arranged in the fixed shell (4) is not higher than the horizontal height of the joint of the through pipe (11) and the gas mixing bin (10).
4. The upper cover device of the etching machine for etching the circuit board as claimed in claim 1, wherein: the one-way valve (7) is an oxygen one-way valve.
5. The upper cover device of the etching machine for etching the circuit board as claimed in claim 1, wherein: the length of the air inlet pipe (5) is matched with that of the sealing block (2).
6. The upper cover device of the etching machine for etching the circuit board as claimed in claim 1, wherein: and a sealing gasket is added at the joint of the vent pipe (6) and the one-way valve (7).
7. The upper cover device of the etching machine for etching the circuit board as claimed in claim 1, wherein: one side of the oxygen reaction shell (8) far away from the breather pipe (6) is fixedly installed with the inner wall of the upper cover body (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910968938.5A CN110545624B (en) | 2019-10-12 | 2019-10-12 | Etching machine upper cover device for circuit board etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910968938.5A CN110545624B (en) | 2019-10-12 | 2019-10-12 | Etching machine upper cover device for circuit board etching |
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| Publication Number | Publication Date |
|---|---|
| CN110545624A CN110545624A (en) | 2019-12-06 |
| CN110545624B true CN110545624B (en) | 2021-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910968938.5A Active CN110545624B (en) | 2019-10-12 | 2019-10-12 | Etching machine upper cover device for circuit board etching |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5498311A (en) * | 1994-06-15 | 1996-03-12 | Quatro Corporation | Process for manufacture of printed circuit boards |
| CN106409656A (en) * | 2015-07-27 | 2017-02-15 | 东京毅力科创株式会社 | Etching method and etching apparatus |
| CN207947954U (en) * | 2018-03-09 | 2018-10-09 | 昆山市线路板厂 | A kind of circuit board processing Etaching device |
| CN109395561A (en) * | 2018-11-18 | 2019-03-01 | 湖南冠颜料有限公司 | A kind of crystal seed tail gas treatment device and processing method |
| JP2019110182A (en) * | 2017-12-18 | 2019-07-04 | 株式会社テオス | Raw fabric processing unit of multilayer flexible printed wiring board |
-
2019
- 2019-10-12 CN CN201910968938.5A patent/CN110545624B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5498311A (en) * | 1994-06-15 | 1996-03-12 | Quatro Corporation | Process for manufacture of printed circuit boards |
| CN106409656A (en) * | 2015-07-27 | 2017-02-15 | 东京毅力科创株式会社 | Etching method and etching apparatus |
| JP2019110182A (en) * | 2017-12-18 | 2019-07-04 | 株式会社テオス | Raw fabric processing unit of multilayer flexible printed wiring board |
| CN207947954U (en) * | 2018-03-09 | 2018-10-09 | 昆山市线路板厂 | A kind of circuit board processing Etaching device |
| CN109395561A (en) * | 2018-11-18 | 2019-03-01 | 湖南冠颜料有限公司 | A kind of crystal seed tail gas treatment device and processing method |
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|---|---|
| CN110545624A (en) | 2019-12-06 |
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