CN110527446A - The preparation method of out-phase conductive shield film - Google Patents
The preparation method of out-phase conductive shield film Download PDFInfo
- Publication number
- CN110527446A CN110527446A CN201910814841.9A CN201910814841A CN110527446A CN 110527446 A CN110527446 A CN 110527446A CN 201910814841 A CN201910814841 A CN 201910814841A CN 110527446 A CN110527446 A CN 110527446A
- Authority
- CN
- China
- Prior art keywords
- powder
- shield film
- conductive shield
- product
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention relates to a kind of preparation methods of out-phase conductive shield film, comprise the technical steps that: forming shielding substrate after carrying out Vacuum Deposition on the film being made of polyethylene terephthalate, wherein the material of coating is one kind of aluminium, copper, nickel, silver；The hot melt sol solution of 5~40% conductive powder body and 60~95% is put into blender and is stirred, the mixing speed of blender is promoted to 750~1250r/min, 15~20min is stirred, is then down to 300~550r/min, stop after 4~8min of stirring, obtains conductive gluing composition；Conductive gluing composition is coated on shielding substrate on accurate coating line, the product being coated with is dried using drying tunnel, and drying temperature is 50~125 DEG C, and the product after drying is stored in the interior freezer that enters for 24 hours, and 1~5 DEG C of storage condition；Product after cold storage is carried out to take volume, out-phase conductive shield film is made.Method of the invention is easy to operate, at low cost, and can produce excellent shield effectiveness.
Description
Technical field
The present invention relates to a kind of preparation methods of out-phase conductive shield film.
Background technique
As electronic device develops towards miniaturization, portability direction, the assembling of electronic device is also more and more intensive.It scratches
Property wiring board, since it has many advantages, such as that small in size, light-weight, line density is high, gradually instead of conventional wires in electronics
The effect of device assembling.From in recent years, flex circuit application (FPC) accounts for printed wiring board (PCB) market share from less than 10%
It improves to 20% or more, also demonstrates the development of the FPC market demand.
FPC mainly plays the role of conducting electric current and transmission signal as the connecting line in electronic device.When signal passes
When defeated line is distributed in FPC outermost layer, in order to avoid signals transmission is caused distorted signals by electromagnetic interference, FPC is being pressed
One layer of conductive layer, i.e. out-phase conductive shield film can be pressed again after closing cover film, play the role of shielding outside electromagnetic interference.Mesh
Before, out-phase conductive shield film fire resistance and electric conductivity in the market is all fine, in order to further increase mechanical property, wear-resisting property
And corrosion resistance, multilayered structure can be set, and making step is more, and shield effectiveness is to be improved.
Summary of the invention
The technical problem to be solved by the present invention is overcoming the deficiencies in the existing technology, a kind of out-phase conductive shield film is provided
Preparation method.
The technical solution adopted by the present invention to solve the technical problems is: a kind of preparation method of out-phase conductive shield film,
It comprises the technical steps that:
(1) shielding substrate is formed after carrying out Vacuum Deposition on the film being made of polyethylene terephthalate, wherein
The material of coating is one kind of aluminium, copper, nickel, silver；
(2) the hot melt sol solution of 5~40% conductive powder body and 60~95% is put into blender and is stirred, by blender
Mixing speed be promoted to 750~1250r/min, stir 15~20min, be then down to 300~550r/min, stirring 4~
Stop after 8min, obtains conductive gluing composition；
(3) conductive gluing composition is coated on the shielding substrate of step (1) on accurate coating line, the production being coated with
Product are dried using drying tunnel, and drying temperature is 50~125 DEG C, and the product after drying is stored in the interior freezer that enters for 24 hours, storage condition 1
~5 DEG C；
(4) product after cold storage is carried out taking volume, out-phase conductive shield film is made.
Further, in the step (2) conductive powder body include following mass percent component:
Further, the partial size of the nickel powder, cobalt powder, silver powder, titanium valve, silver-coated copper powder, zeolite powder and copper powder be 1~
30μm。
Further, hot melt adhesive is titaniferous colloidal sol, containing silica solution, PU hot melt adhesive, PET hot melt adhesive in the step (2)
Two or more.
The beneficial effects of the present invention are: method of the invention only need to form conductive film layer on shielding substrate layer, can make
Out-phase conductive shield film is obtained, processing step significantly reduces, and it is easy to operate, it is at low cost；The out-phase as made from the method for the present invention is conductive
Screened film can produce excellent shield effectiveness because having continuous fine and close shielding substrate.
Specific embodiment
Presently in connection with preferred embodiment, the present invention is further illustrated.
Embodiment 1
Shielding substrate is formed after carrying out vacuum plating silver on the film being made of polyethylene terephthalate, by 30%
Conductive powder body (1.5% nickel powder, 0.7% cobalt powder, 0.3% silver powder, 0.02% titanium valve, 0.08% silver-coated copper powder,
0.1% zeolite powder and 97.3% copper powder) and 70% hot melt sol solution (mass ratio is the titaniferous colloidal sol of 2:6 and siliceous
Colloidal sol) it is put into blender and stirs, the mixing speed of blender is promoted to 1000r/min, 17min is stirred, is then down to
450r/min stops after stirring 6min, obtains conductive gluing composition；Conductive gluing composition is coated on accurate coating line
On shielding substrate, the product being coated with is dried using drying tunnel, and drying temperature is 100 DEG C, and the product after drying enters interior for 24 hours
3 DEG C of freezer storage；Product after cold storage is carried out to take volume, out-phase conductive shield film is made.
Embodiment 2
Shielding substrate is formed after carrying out vacuum plating silver on the film being made of polyethylene terephthalate, by 35%
Conductive powder body (1.8% nickel powder, 0.7% cobalt powder, 0.4% silver powder, 0.08% titanium valve, 0.07% silver-coated copper powder,
0.1% zeolite powder and 96.95% copper powder) and 65% hot melt sol solution (mass ratio is the titaniferous colloidal sol of 1:4 and siliceous
Colloidal sol) it is put into blender and stirs, the mixing speed of blender is promoted to 800r/min, 15min is stirred, is then down to
330r/min stops after stirring 7min, obtains conductive gluing composition；Conductive gluing composition is coated on accurate coating line
On shielding substrate, the product being coated with is dried using drying tunnel, and drying temperature is 90 DEG C, and the product after drying enters 4 interior for 24 hours
DEG C freezer storage；Product after cold storage is carried out to take volume, out-phase conductive shield film is made.
Embodiment 3
Shielding substrate is formed after carrying out vacuum plating silver on the film being made of polyethylene terephthalate, by 25%
Conductive powder body (2% nickel powder, 1.2% cobalt powder, 0.5% silver powder, 0.08% titanium valve, 0.02% silver-coated copper powder,
0.2% zeolite powder and 96% copper powder) and 75% hot melt sol solution (mass ratio is the titaniferous colloidal sol of 3:4 and siliceous molten
Glue) it is put into blender and stirs, the mixing speed of blender is promoted to 1150r/min, 15min is stirred, is then down to 500r/
Min stops after stirring 4min, obtains conductive gluing composition；Conductive gluing composition is coated on screen on accurate coating line
It covers on substrate, the product being coated with is dried using drying tunnel, and drying temperature is 110 DEG C, and the product after drying enters 1 DEG C interior for 24 hours
Freezer storage；Product after cold storage is carried out to take volume, out-phase conductive shield film is made.
Out-phase conductive shield film made from above three embodiments carries out Characteristics Detection, as shown in table 1:
The Characteristics Detection of 1 three embodiments of table is verified
As seen from the above table, shield effectiveness, impedance behavior, the flexural property of out-phase conductive shield film made from three embodiments
It is all satisfied examination criteria.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand the contents of the present invention and be implemented, and it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the scope of protection of the present invention.
Claims (4)
1. a kind of preparation method of out-phase conductive shield film, it is characterised in that comprise the technical steps that:
(1) shielding substrate is formed after carrying out Vacuum Deposition on the film being made of polyethylene terephthalate, wherein coating
Material be aluminium, copper, nickel, silver one kind；
(2) the hot melt sol solution of 5~40% conductive powder body and 60~95% is put into blender and is stirred, by stirring for blender
It mixes speed and is promoted to 750~1250r/min, stir 15~20min, be then down to 300~550r/min, after stirring 4~8min
Stop, obtaining conductive gluing composition；
(3) conductive gluing composition is coated on the shielding substrate of step (1) on accurate coating line, the product being coated with makes
It is dried with drying tunnel, drying temperature is 50~125 DEG C, and the product after drying is stored in the interior freezer that enters for 24 hours, storage condition 1~5
℃；
(4) product after cold storage is carried out taking volume, out-phase conductive shield film is made.
2. the preparation method of out-phase conductive shield film according to claim 1, it is characterised in that: led in the step (2)
Electric powder includes the component of following mass percent:
Remaining is copper powder.
3. the preparation method of out-phase conductive shield film according to claim 2, it is characterised in that: the nickel powder, cobalt powder, silver
Powder, titanium valve, silver-coated copper powder, zeolite powder and copper powder partial size be 1~30 μm.
4. the preparation method of out-phase conductive shield film according to claim 1, it is characterised in that: hot in the step (2)
Two or more of melten gel for titaniferous colloidal sol, containing silica solution, PU hot melt adhesive, PET hot melt adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910814841.9A CN110527446A (en) | 2019-08-30 | 2019-08-30 | The preparation method of out-phase conductive shield film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910814841.9A CN110527446A (en) | 2019-08-30 | 2019-08-30 | The preparation method of out-phase conductive shield film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110527446A true CN110527446A (en) | 2019-12-03 |
Family
ID=68665507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910814841.9A Pending CN110527446A (en) | 2019-08-30 | 2019-08-30 | The preparation method of out-phase conductive shield film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110527446A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669957A (en) * | 2020-06-15 | 2020-09-15 | 江苏百旭电子新材料科技有限公司 | FPC hot-pressing shielding film and production method thereof |
| CN111718663A (en) * | 2020-06-15 | 2020-09-29 | 江苏百旭电子新材料科技有限公司 | Conductive non-woven fabric adhesive tape and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665672A (en) * | 2009-10-26 | 2010-03-10 | 山东天诺光电材料有限公司 | Electricity conductive cloth tape, preparation method thereof and use thereof |
| CN106118528A (en) * | 2016-06-24 | 2016-11-16 | 海宁卓泰电子材料有限公司 | A kind of manufacture method of electromagnetic shielding film |
| CN106604623A (en) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film and preparation method thereof |
| CN107426957A (en) * | 2017-08-16 | 2017-12-01 | 苏州城邦达力材料科技有限公司 | Conducting resinl film layer, preparation method and electromagnetic shielding film |
| KR20180115037A (en) * | 2017-04-12 | 2018-10-22 | 주식회사 영우 | Conductive heat-sealable adhesive composition and an electromagnetic wave shielding sheet comprising the same |
| CN110157363A (en) * | 2019-06-11 | 2019-08-23 | 莱芜职业技术学院 | A kind of preparation method of electromagnetic shielding conductive glue conductive powder |
-
2019
- 2019-08-30 CN CN201910814841.9A patent/CN110527446A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665672A (en) * | 2009-10-26 | 2010-03-10 | 山东天诺光电材料有限公司 | Electricity conductive cloth tape, preparation method thereof and use thereof |
| CN106118528A (en) * | 2016-06-24 | 2016-11-16 | 海宁卓泰电子材料有限公司 | A kind of manufacture method of electromagnetic shielding film |
| CN106604623A (en) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film and preparation method thereof |
| KR20180115037A (en) * | 2017-04-12 | 2018-10-22 | 주식회사 영우 | Conductive heat-sealable adhesive composition and an electromagnetic wave shielding sheet comprising the same |
| CN107426957A (en) * | 2017-08-16 | 2017-12-01 | 苏州城邦达力材料科技有限公司 | Conducting resinl film layer, preparation method and electromagnetic shielding film |
| CN110157363A (en) * | 2019-06-11 | 2019-08-23 | 莱芜职业技术学院 | A kind of preparation method of electromagnetic shielding conductive glue conductive powder |
Non-Patent Citations (1)
| Title |
|---|
| 付秀华等: "基于PET基底透明屏蔽膜的制备研究 ", 《光子学报》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669957A (en) * | 2020-06-15 | 2020-09-15 | 江苏百旭电子新材料科技有限公司 | FPC hot-pressing shielding film and production method thereof |
| CN111718663A (en) * | 2020-06-15 | 2020-09-29 | 江苏百旭电子新材料科技有限公司 | Conductive non-woven fabric adhesive tape and manufacturing method thereof |
| CN111718663B (en) * | 2020-06-15 | 2021-10-26 | 江苏百旭电子新材料科技有限公司 | Conductive non-woven fabric adhesive tape and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6425805B2 (en) | Free ground film and method of manufacturing the same, shielded circuit board including free ground film and ground method | |
| CN102711428B (en) | Ultra-thin shielding film of a kind of high screening effectiveness and preparation method thereof | |
| CN102792784B (en) | Printed circuit board | |
| CN108323145A (en) | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film | |
| CN108323144A (en) | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film | |
| CN103525340B (en) | A kind of soluble epoxide modified acrylic ester resin sizing agent and the electromagnetic shielding glued membrane using this sizing agent to prepare thereof | |
| CN108323143A (en) | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film | |
| TWI706864B (en) | Electromagnetic interference shielding film having conductive fiber and the methods for preparing the same | |
| CN103763893A (en) | Electromagnetic wave shielding film and method for manufacturing circuit board with same | |
| KR102602674B1 (en) | Shielding film with multilayer metal structure | |
| CN110527446A (en) | The preparation method of out-phase conductive shield film | |
| CN203722915U (en) | Electromagnetic wave shielding film used for printed circuit board and printed circuit board containing shielding film | |
| TW200941818A (en) | Flat cable | |
| JP2012104710A (en) | Electromagnetic wave shield material for fpc | |
| CN103687459A (en) | Electromagnetic wave shielding structure and flexible printed circuit board with same | |
| CN208754632U (en) | Electromagnetic shielding film and wiring board | |
| CN208708070U (en) | Electromagnetic shielding film and wiring board | |
| CN100546451C (en) | Electromagnetic wave absorb | |
| CN208095043U (en) | Electromagnetic shielding film and wiring board | |
| CN202121860U (en) | Flexible circuit board used for precision electronic device | |
| CN204795828U (en) | Use flexible printed wiring board structure of ferrite as substrate | |
| CN106659108A (en) | Electromagnetic shielding film and preparation method thereof | |
| CN208754590U (en) | Electromagnetic shielding film and wiring board | |
| CN204305452U (en) | Free ground film and comprise the shielded line plate of free ground film | |
| CN108239388A (en) | It is a kind of can laser activation high-temperature-resistant thermoplastic composition and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191203 |
|
| RJ01 | Rejection of invention patent application after publication |