CN110527427B - Silicone resin composition and silicone resin coating - Google Patents
Silicone resin composition and silicone resin coating Download PDFInfo
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- CN110527427B CN110527427B CN201810714853.XA CN201810714853A CN110527427B CN 110527427 B CN110527427 B CN 110527427B CN 201810714853 A CN201810714853 A CN 201810714853A CN 110527427 B CN110527427 B CN 110527427B
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- 229920002050 silicone resin Polymers 0.000 title claims abstract description 69
- 239000011342 resin composition Substances 0.000 title claims abstract description 36
- 238000000576 coating method Methods 0.000 title abstract description 31
- 239000011248 coating agent Substances 0.000 title abstract description 27
- 239000000945 filler Substances 0.000 claims abstract description 32
- 239000003960 organic solvent Substances 0.000 claims abstract description 17
- 239000003054 catalyst Substances 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003365 glass fiber Substances 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 239000012765 fibrous filler Substances 0.000 claims description 6
- 239000004447 silicone coating Substances 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 4
- 229910052618 mica group Inorganic materials 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- 229920013822 aminosilicone Polymers 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims description 2
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 125000003944 tolyl group Chemical group 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- -1 amine compound Chemical class 0.000 claims 1
- 125000002524 organometallic group Chemical group 0.000 claims 1
- 239000000835 fiber Substances 0.000 abstract description 14
- 238000010411 cooking Methods 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 abstract description 3
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 238000001723 curing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- OGFYGJDCQZJOFN-UHFFFAOYSA-N [O].[Si].[Si] Chemical compound [O].[Si].[Si] OGFYGJDCQZJOFN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a silicone resin composition and a silicone resin coating. The silicone resin composition of the present invention comprises 5 to 20 parts by weight of a silicone resin, 75 to 92 parts by weight of a filler, 1 to 10 parts by weight of an organic solvent, and 0.25 to 2 parts by weight of a catalyst, based on 100 parts by weight of the total weight of the silicone resin, the filler and the organic solvent, wherein the filler comprises an insulating fiber filler selected from glass fibers (e.g., quartz glass fibers), metal oxide fibers (e.g., ceramic fibers) and combinations thereof. After the silicone resin composition is cured to form the silicone resin coating, the silicone resin composition can pass a high-temperature storage test and a cooking test, can resist alternating current of 2500-4000 volts, and has a voltage change rate of 0.1-1.5% after being subjected to high temperature for a long time or being cooked at high temperature.
Description
Technical Field
The invention relates to the field of coating materials, in particular to a silicon resin composition and a silicon resin coating, wherein the silicon resin coating of the cured silicon resin composition has high insulation and voltage resistance, high temperature resistance and weather resistance, and can be used as an encapsulation coating of a piezoresistor, a thermistor or a sensor.
Background
With the advancement of science and technology, the application field of electronic products is rapidly expanded, the requirements for performance are increasingly improved and gradually diversified, and the quality requirements of the market on electronic parts are improved, generally speaking, the electronic parts need to have good temperature resistance, weather resistance and voltage resistance so as to meet certain safety standards.
Regarding coating materials of piezoresistors or thermistors, coating materials generally used in the market at present can be roughly divided into two types, namely silicone resin and epoxy resin, wherein the silicone resin has better temperature resistance and weather resistance compared with the epoxy resin because the main chain is a silicon-oxygen-silicon linear structure, so that most of the piezoresistors and thermistors applied to a high-temperature environment of 125 ℃ are made of the silicone resin as a material for an encapsulating coating; however, in terms of dielectric strength properties, silicone resin does not perform as well as temperature and weather resistance, and therefore, in order to meet the requirement of the dielectric strength properties of more than 2500VAC (i.e., to withstand 2500v ac), the characteristic requirement of dielectric strength can be met only by increasing the thickness of the silicone resin coating.
Therefore, in terms of the current technical development, no coating material which can meet the market demand and has good temperature resistance, weather resistance and insulation and pressure resistance exists.
Disclosure of Invention
In view of the above problems, the present invention provides a silicone resin composition having good temperature resistance, weather resistance and dielectric and voltage resistance, and being applicable to an encapsulating coating of electronic parts.
In order to achieve the above object, the silicone resin composition of the present invention comprises 5 to 20 parts by weight of a silicone resin, 75 to 92 parts by weight of a filler, and 1 to 10 parts by weight of an organic solvent; and further comprising 0.25 to 2 parts by weight of a catalyst, based on 100 parts by weight of the total weight of the silicone resin, the filler and the organic solvent; the filler comprises an insulating fibrous filler selected from the group consisting of glass fibers (e.g., quartz glass fibers), metal oxide fibers (e.g., ceramic fibers, optionally ceramic fibers such as alumina fibers), and combinations thereof.
According to the technical means, the coating of the cured silicon resin composition has high insulation and pressure resistance, good temperature resistance and weather resistance; a coating thickness of 0.7 mm to 0.9 mm that withstands alternating current of 2500 volts to 4000 volts, in particular 3000 volts to 4000 volts; and no matter the cooking device is in a high-temperature state or a high-temperature cooking state for a long time, the voltage change rate is less than 10 percent, the market requirement is met, and the actually measured voltage change rate is between 0.10 percent and 1.50 percent.
Preferably, the silicone resin is selected from the group consisting of methyl silicone, methylphenyl silicone, vinyl silicone, methyl vinyl silicone, amino silicone, epoxy modified silicone (also known as epoxy silicone), and combinations thereof.
Preferably, the insulating fibrous filler has a diameter of 5 to 15 microns and a length of 100 to 500 microns.
Preferably, the filler comprises a modified filler selected from the group consisting of talc, quartz powder, mica powder, calcium carbonate, graphite, and combinations thereof.
The catalyst has the function of accelerating reaction. Specifically, the catalyst is an organic metal salt or an amine, and the organic metal salt may contain lead, tin, zinc or aluminum.
Preferably, the organic solvent is toluene, xylene, isopropanol or a combination thereof.
The silicone resin coating of the present invention is formed by curing the silicone resin composition, and the curing method may be normal temperature curing or heat curing, preferably heat curing.
Specifically, the silicone resin coating layer of the present invention includes 5 to 20 parts by weight of a silicone resin and 75 to 92 parts by weight of a filler; the organic solvent originally present in the silicone resin composition can gradually volatilize during the curing process, so that the silicone resin coating prepared can be substantially free of the organic solvent.
Preferably, the silicone coating having a thickness of 0.7 mm to 0.9 mm has the property of withstanding alternating current of 2500 volts to 4000 volts.
Detailed Description
Examples 1 to 10: silicon resin composition
The weight parts of the silicone resin compositions of examples 1 to 10, including the silicone resin, filler, organic solvent and catalyst, are shown in table 1.
The filler part comprises an insulating fiber filler and a modified filler, and during operation, the insulating fiber filler and the modified filler are prepared, wherein the insulating fiber filler is prepared from glass fibers (trade name: EMG13-70C) and quartz glass fibers (trade name: QCF-03-A/C) in the same weight ratio, the diameter of the insulating fiber filler is 5-15 micrometers, and the length of the insulating fiber filler is 100-500 micrometers; the modified filler is selected from quartz powder, talcum powder and mica powder, and the modified filler can be added to enable the silicone resin composition to have specific properties, for example, the quartz powder can be used for regulating and controlling a thermal expansion coefficient, the talcum powder can be used for regulating and controlling wear resistance, and the mica powder can be used for regulating and controlling cold and hot impact resistance.
Then, according to the weight ratio in table 1, the silicone resin of methyl silicone resin, vinyl silicone resin or methyl vinyl silicone resin is added into the organic solvent, and the organic solvent in which the silicone resin is dissolved is mixed with the filler uniformly to obtain the silicone resin composition, and 0.25 to 2 parts by weight of aluminum-containing organic metal salt (trade name: puno K-7064) is added as a catalyst based on 100 parts by weight of the total weight of the silicone resin, the filler and the organic solvent.
Comparative examples 1 and 2: silicon resin composition
The silicone resin compositions of comparative examples 1 and 2 were prepared by mixing, in a similar manner to the silicone resin compositions of examples 1 to 10, a silicone resin, a filler, an organic solvent and a catalyst, the parts by weight of each component being shown in table 1; the difference between the comparative examples and the examples is that: the silicone resin compositions of comparative examples 1 and 2 did not contain an insulating fibrous filler, and the filler portion contained only a modified filler, without selecting an insulating fibrous filler.
Preparation example: silicone coating
The silicone resin compositions of examples 1 to 10 and comparative examples 1 and 2 were applied to a varistor (brand: xingzhen, model: TVR20821) of the same specification, respectively, and cured under a curing condition of heating at 150 ℃ for 1.5 hours to form a silicone resin coating having a thickness of 0.7 mm to 0.9 mm, to prepare a varistor sample.
Test example 1: dielectric withstand voltage test
In order to test the dielectric breakdown voltage of the silicone resin coatings made of the silicone resin compositions of examples 1 to 10 and comparative examples 1 and 2, the positive and negative terminals of the varistor sample were applied with a voltage of 2500VAC for 60 seconds, and if the varistor sample was not broken, the applied voltage was adjusted up to 100 volts, i.e., 2600VAC was applied to the positive and negative terminals of the varistor sample for the same duration of 60 seconds, and then it was observed whether the varistor sample was broken, and if not, the above procedure was repeated until the varistor sample was broken, and the applied voltage at the time of the break was recorded in table 2, representing the voltage that the cured silicone resin coating of each example or comparative example can withstand ac.
Test example 2: temperature resistance test
In order to test the temperature resistance of the silicone resin coatings made of the silicone resin compositions of examples 1 to 10 and comparative examples 1 and 2, each varistor sample was stored at a temperature of 150 ℃ for a long period of time for 1000 hours, and the voltage difference before and after was measured in volts, and the calculated voltage change rates were listed in table 2.
Test example 3: weather resistance test
In order to test the weather resistance of the silicone resin coatings made of the silicone resin compositions of examples 1 to 10 and comparative examples 1 and 2, each varistor sample was cooked at a temperature of 121 ℃ under 2 atm for a long period of time for 12 hours, and the voltage difference between before and after the measurement was measured in volts, and the calculated voltage change rates were listed in table 2.
Table 2: properties of silicone resin coatings formed by curing the silicone resin compositions of examples 1 to 10(E1 to E10) and comparative examples 1 and 2(C1 and C2).
It can be seen from the results of table 1 and table 2 that the silicone resin composition of the present invention contains the insulating fiber filler, so that the formed silicone resin coating has high dielectric strength and good temperature and weather resistance.
In view of the withstand voltage part, the silicone coating of the present invention not only meets the withstand voltage requirement (able to withstand 2500 v ac) of the encapsulation coating on the market, but also can withstand ac voltages as high as 3000 v to 4000 v, which is significantly better than the withstand voltage results (able to withstand only 1500 v ac) of comparative examples 1 and 2.
In addition, for the test of temperature resistance and weather resistance, no matter the silicon resin coating is in a high-temperature or high-temperature cooking state for a long time, the voltage change rate of the silicon resin coating meets the requirement of the industry (the voltage change rate is lower than 10%), and the actually measured voltage change rate is between 0.10% and 1.50%, which is obviously superior to the requirement of the industry on the voltage change rate.
Therefore, after the silicon resin composition is added with the insulating fiber filler, the silicon resin composition has higher insulating and pressure-resistant properties and good temperature resistance and weather resistance; after the silicone resin composition is cured to form the silicone resin coating, the silicone resin coating meets the requirements of the industry on insulation voltage resistance and voltage change rate, and can resist higher alternating current voltage. In addition, the organic solvent existing in the silicone resin composition can be gradually volatilized in the curing process, so that the silicone resin coating prepared by using the silicone resin composition can be substantially free of the organic solvent.
Claims (5)
1. A silicone resin composition, which consists of:
5 to 20 parts by weight of a silicone resin, wherein the silicone resin is selected from the group consisting of methyl silicone, methylphenyl silicone, vinyl silicone, methyl vinyl silicone, amino silicone, epoxy modified silicone and combinations thereof;
75 to 92 parts by weight of a filler; wherein the filler is an insulating fibrous filler selected from glass fibers, wherein the insulating fibrous filler has a diameter of 5 to 15 micrometers and a length of 100 to 500 micrometers;
1 to 10 parts by weight of an organic solvent; and
a catalyst;
wherein the catalyst is contained in an amount of 0.25 to 2 parts by weight, based on 100 parts by weight of the total weight of the silicone resin, the filler and the organic solvent.
2. The silicone resin composition of claim 1, wherein the modified filler is selected from the group consisting of talc, quartz powder, mica powder, calcium carbonate, and combinations thereof.
3. The silicone resin composition of claim 1, wherein the catalyst is an organometallic salt or an amine compound; wherein the organic solvent is toluene, xylene, isopropanol or a combination thereof.
4. A silicone resin coating layer which is obtained by curing the silicone resin composition according to any one of claims 1 to 3.
5. The silicone coating of claim 4, wherein the silicone coating having a thickness of 0.7 mm to 0.9 mm can withstand an alternating current of 2500 volts to 4000 volts.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107117635A TWI660006B (en) | 2018-05-23 | 2018-05-23 | Silicone resin composition and silicone resin coating |
| TW107117635 | 2018-05-23 |
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| Publication Number | Publication Date |
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| CN110527427A CN110527427A (en) | 2019-12-03 |
| CN110527427B true CN110527427B (en) | 2022-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810714853.XA Active CN110527427B (en) | 2018-05-23 | 2018-07-03 | Silicone resin composition and silicone resin coating |
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| Country | Link |
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| CN (1) | CN110527427B (en) |
| TW (1) | TWI660006B (en) |
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| CN114121344B (en) * | 2021-11-17 | 2024-01-05 | 固德电材系统（苏州）股份有限公司 | Insulating busbar and preparation method and application thereof |
| CN116144262A (en) * | 2023-03-27 | 2023-05-23 | 天津灯塔涂料工业发展有限公司 | Organosilicon compound coating and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4496469A (en) * | 1982-01-12 | 1985-01-29 | Otsuka Kagaku Yakuhin Kabushiki Kaisha | Heat-insulating refractory material consisting alkali titanate and silicon resin |
| CN101942260A (en) * | 2010-05-25 | 2011-01-12 | 耿世达 | High-temperature resistant insulated thermally conductive paint with low expansion coefficient |
| CN107880746A (en) * | 2018-01-02 | 2018-04-06 | 马鞍山佳夫尼电气科技有限公司 | A kind of power equipment external application coatings and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004040265A1 (en) * | 2004-08-19 | 2006-02-23 | Wacker-Chemie Gmbh | Mineral fiber-containing silicone rubber composition |
| CN103756509B (en) * | 2014-01-09 | 2015-12-09 | 成都理工大学 | A kind of anti-electromagnetic radiation anti-contamination function coating and preparation method thereof |
| CN107163834A (en) * | 2017-05-31 | 2017-09-15 | 兴勤（常州）电子有限公司 | A kind of organic resin coating composition |
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2018
- 2018-05-23 TW TW107117635A patent/TWI660006B/en active
- 2018-07-03 CN CN201810714853.XA patent/CN110527427B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4496469A (en) * | 1982-01-12 | 1985-01-29 | Otsuka Kagaku Yakuhin Kabushiki Kaisha | Heat-insulating refractory material consisting alkali titanate and silicon resin |
| CN101942260A (en) * | 2010-05-25 | 2011-01-12 | 耿世达 | High-temperature resistant insulated thermally conductive paint with low expansion coefficient |
| CN107880746A (en) * | 2018-01-02 | 2018-04-06 | 马鞍山佳夫尼电气科技有限公司 | A kind of power equipment external application coatings and preparation method thereof |
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| Publication number | Publication date |
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| CN110527427A (en) | 2019-12-03 |
| TWI660006B (en) | 2019-05-21 |
| TW202003700A (en) | 2020-01-16 |
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