CN110527248A - A kind of Halogen-free flame-retardant resin matrix and its manufacturing method - Google Patents

A kind of Halogen-free flame-retardant resin matrix and its manufacturing method Download PDF

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Publication number
CN110527248A
CN110527248A CN201810510698.XA CN201810510698A CN110527248A CN 110527248 A CN110527248 A CN 110527248A CN 201810510698 A CN201810510698 A CN 201810510698A CN 110527248 A CN110527248 A CN 110527248A
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Prior art keywords
resin
halogen
epoxy resin
parts
free flame
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张相一
韩淑敏
刘卫亮
王景宾
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Rivers And Mountains Shandong Fiber Science And Technology Ltd
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Rivers And Mountains Shandong Fiber Science And Technology Ltd
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Priority to CN201810510698.XA priority Critical patent/CN110527248A/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K2003/026Phosphorus
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2217Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224Magnesium hydroxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • C08K2003/387Borates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/22Halogen free composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

It includes multiple functionality epoxide resin, toughener, bisphenol A type epoxy resin, novolac epoxy resin, cycloaliphatic epoxy resin, fire retardant, curing agent and curing accelerator that the present invention, which relates to a kind of flame-retarded resin matrix and its manufacturing method, the component that flame-retarded resin matrix includes,;Its manufacturing method is that fire retardant is added in bisphenol A epoxide resin to be uniformly mixed unanimously to obtain fire retardant mixture;Toughener is added to stir in bisphenol A epoxide resin, novolac epoxy resin, cycloaliphatic epoxy resin and multiple functionality epoxide resin to toughener with fire retardant mixture and is melted completely, component A mixed solution is obtained;Curing agent and curing accelerator are added in bisphenol A epoxide resin and are stirred, after the completion of stirring, mixture is ground to obtain B component mixture;B component mixture is added in component A mixed solution and stirs to get halogen-free flame-retardant resin;The matrix has good flame resistance, good mechanical performance, the high advantage of stability, and complete Halogen.

Description

A kind of Halogen-free flame-retardant resin matrix and its manufacturing method
Technical field
The present invention relates to technical field of composite materials more particularly to a kind of Halogen-free flame-retardant resin matrixes and its manufacturing method.
Background technique
Composite material brings huge contribution and unlimited in the development process of last 100 years, for the production and life of the mankind It is convenient, but since resin matrix belongs to inflammable product mostly, the production for the product for having fire-retardant requirement is restricted.For Adaptation flame-retardancy requirements, the epoxy resin with certain flame retardant effect has been a hot spot of research, and domestic market master If using the fire retardant production flame retardant plastics preparation containing halogen organic and antimony oxide compounding.Bromide fire retardant in recent years By the puzzlement of dioxin problem, while with its (bromine-antimony system) fire-retardant high molecular material in thermal cracking and burning Shi Huisheng At a large amount of flue dust and corrosive gas, foreign countries are largely substituted with halogen-free flame retardants at present, wherein with phosphorus flame retardant Based on.
Summary of the invention
In order to solve deficiency in the prior art, the purpose of the present invention is to provide a kind of Halogen-free flame-retardant resin matrix and its Manufacturing method.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of halogen-free flame-retardant resin, which is characterized in that it includes component and parts by weight are as follows:
5-20 parts of multiple functionality epoxide resin;
12-21 parts of toughener;
48-63 parts of bisphenol A type epoxy resin;
5-10 parts of novolac epoxy resin;
6-12 parts of cycloaliphatic epoxy resin;
18-30 parts of fire retardant;
4-10 parts of curing agent;
1-5.5 parts of curing accelerator.
The multiple functionality epoxide resin includes four glycidyl group dimethylphenylene diamine, four glycidyl group diamino hexichol Methylmethane, four glycidyl amine of m-xylene diamine, novolac epoxy resin, o-cresol formaldehyde epoxy resin, four glycidols One of ether tetraphenyl ethane, triglycidyl group para-aminophenol are a variety of.
The epoxy novolac includes one of novolac epoxy resin, o-cresol formaldehyde epoxy resin or more Kind.
The bisphenol A type epoxy resin include NPEL127, NPEL127E, NPEL128, NPEL128E, DER300, One or more of NPEL128S, NPES901, NPES902, NPES903, NPES903H, NPES904, NPES907;
The bisphenol A type epoxy resin is liquid or solid-state.
The fire retardant be red phosphorus, tricresyl phosphate, triaryl phosphate, phosphoric acid tri-isopropyl benzene ester, tributyl phosphate, Trioctyl phosphate, cresyl diphenyl phosphate, aluminium hydroxide, magnesium hydroxide, 1- oxygen -4- methylol -2,6,7- trioxa - 1- phosphabicyclo [2,2,2] octane, N- methylol Propionamides methyl phosphonate, dimethyl methyl phosphonate, zinc borate, melamine One of amine cyanuric acid, DOPO, DOPO epoxy resin, molybdenum oxide, zinc molybdate, antimony oxide, hexaphenoxycyclotriphosphazene Or it is several.
The toughener is that thermoplastic resin or methyl methacrylate-butyl acrylate-methyl methacrylate three are embedding Section copolymer.
The thermoplastic resin is one of polyether sulfone, poly(aryl ether ketone), polyether-ether-ketone, phenoxy resin, polyphenylene oxide or more Kind.
The curing agent is 4,4' diaminodiphenyl sulfone, 4,4 '-diaminodiphenylmethane, m-phenylene diamine (MPD), m-xylene diamine One or more of.
The curing accelerator be modified imidazole, organic phosphorus compound, boron trifluoride complex, organic ureas one kind or It is a variety of.
A kind of preparation method of halogen-free flame-retardant resin, which comprises the following steps:
Fire retardant mixture unanimously is obtained firstly, fire retardant is added in bisphenol A epoxide resin and is uniformly mixed, is stirred Mix temperature: 50-60 DEG C, mixing time: 30-45 minutes, and fire retardant mixture is ground by three-roll grinder;By toughener Bisphenol A epoxide resin, novolac epoxy resin, cycloaliphatic epoxy resin and multi-functional epoxy tree are added to fire retardant mixture Stirring melts completely to toughener in rouge, and whipping temp is 120-180 DEG C, mixing time 1.5-6h, to stirring in whipping process It mixes container and carries out vacuumize process, obtain component A mixed solution;
Then, curing agent and curing accelerator are added in bisphenol A epoxide resin and are stirred, whipping temp is protected always It holds at 70 DEG C hereinafter, mixing time is 20-25min, after the completion of stirring, mixture is carried out two grinding to obtain to three rollers three times B component mixture;
Halogen-free flame-retardant resin is stirred to get finally, B component mixture is added in component A mixed solution, whipping temp It is 70 DEG C -80 DEG C, mixing time 15-20min.
Preferably, it is 40 DEG C -50 DEG C that curing agent and curing accelerator, which are added to the whipping temp in bisphenol A epoxide resin,.
The beneficial effects of the present invention are: the flame-retarded resin matrix has good flame resistance, good mechanical performance, stability is high Advantage, and it is completely non-halogen.
The halogen-free flame-retardant resin adopted this technical solution not only has good flame retardant property, meets UL94V0 grades Flame-retardancy requirements, but also have good mechanical property and ageing resistance performance.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the test result schematic diagram of differential scanning calorimeter of the present invention.
Fig. 2 is the test result schematic diagram of differential scanning calorimeter of the present invention.
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book is understood other advantages and efficacy of the present invention easily.
Embodiment one
Equipment prepare: equipment required for the technical program include equipped with blender reaction kettle, heating temperature controller and Pumped vacuum systems.
The fire retardant of 30 parts by weight is added to be uniformly mixed in the bisphenol A epoxide resin of 16 parts by weight and is unanimously obtained Fire retardant mixture, whipping temp: 50-60 DEG C, mixing time: 30-45 minutes, and fire retardant mixture is ground by three rollers Machine grinding;The toughener of 21 parts by weight and fire retardant mixture are added to the bisphenol A epoxide resin of 31 parts by weight, 5 parts by weight Novolac epoxy resin, in the cycloaliphatic epoxy resin of 6 parts by weight and the multiple functionality epoxide resin of 20 parts by weight stirring to increasing Tough dose of melting completely, whipping temp are 140 DEG C, mixing time 2h, carry out vacuumizing place to stirring container in whipping process Reason, obtains component A mixed solution;
The curing accelerator of the curing agent of 10 parts by weight and 5.5 parts by weight is added to the bisphenol-A asphalt mixtures modified by epoxy resin of 16 parts by weight It is stirred in rouge, whipping temp is mixing time 20min, after the completion of stirring, carries out two to three rollers three times to mixture Grinding obtains B component mixture;
B component mixture is added in component A mixed solution and stirs to get halogen-free flame-retardant resin, whipping temp 80 DEG C, mixing time 20min.
Embodiment two:
Equipment prepare: equipment required for the technical program include equipped with blender reaction kettle, heating temperature controller and Pumped vacuum systems.
The fire retardant of 26 parts by weight is added to be uniformly mixed in the bisphenol A epoxide resin of 13 parts by weight and is unanimously obtained Fire retardant mixture, whipping temp: 50-60 DEG C, mixing time: 30-45 minutes, and fire retardant mixture is ground by three rollers Machine grinding;The toughener of 18 parts by weight and fire retardant mixture are added to 6 parts by weight of bisphenol A epoxide resin of 32 parts by weight Novolac epoxy resin, in the cycloaliphatic epoxy resin of 7 parts by weight and the multiple functionality epoxide resin of 15 parts by weight stirring to increasing Tough dose of melting completely, whipping temp are 140 DEG C, mixing time 2h, carry out vacuumizing place to stirring container in whipping process Reason, obtains component A mixed solution;
The curing accelerator of the curing agent of 8 parts by weight and 4 parts by weight is added in the bisphenol A epoxide resin of 13 parts by weight It is stirred, whipping temp is mixing time 20min, after the completion of stirring, carries out two to mixture and grinds to three rollers three times Obtain B component mixture;
B component mixture is added in component A mixed solution and stirs to get halogen-free flame-retardant resin, whipping temp 80 DEG C, mixing time 20min.
Embodiment three:
Equipment prepare: equipment required for the technical program include equipped with blender reaction kettle, heating temperature controller and Pumped vacuum systems.
The fire retardant of 22 parts by weight is added to be uniformly mixed in the bisphenol A epoxide resin of 10 parts by weight and is unanimously obtained Fire retardant mixture, whipping temp: 50-60 DEG C, mixing time: 30-45 minutes, and fire retardant mixture is ground by three rollers Machine grinding;The toughener of 15 parts by weight and fire retardant mixture are added to the bisphenol A epoxide resin of 33 parts by weight, 6 parts by weight Novolac epoxy resin, in the cycloaliphatic epoxy resin of 8 parts by weight and the multiple functionality epoxide resin of 10 parts by weight stirring to increasing Tough dose of melting completely, whipping temp are 140 DEG C, mixing time 2h, carry out vacuumize process to stirring container in whipping process, Obtain component A mixed solution;
The curing accelerator of the curing agent of 6 parts by weight and 2.5 parts by weight is added to the bisphenol-A asphalt mixtures modified by epoxy resin of 10 parts by weight It is stirred in rouge, whipping temp is mixing time 20min, after the completion of stirring, carries out two to three rollers three times to mixture Grinding obtains B component mixture;
B component mixture is added in component A mixed solution and stirs to get halogen-free flame-retardant resin, whipping temp 80 DEG C, mixing time 20min.
Example IV:
Equipment prepare: equipment required for the technical program include equipped with blender reaction kettle, heating temperature controller and Pumped vacuum systems.
The fire retardant of 18 parts by weight is added to be uniformly mixed in the bisphenol A epoxide resin of 7 parts by weight and is unanimously obtained Fire retardant mixture, whipping temp: 50-60 DEG C, mixing time: 30-45 minutes, and fire retardant mixture is ground by three rollers Machine grinding;The toughener of 12 parts by weight and fire retardant mixture are added to 10 parts by weight of bisphenol A epoxide resin of 34 parts by weight Novolac epoxy resin, in the cycloaliphatic epoxy resin of 12 parts by weight and the multiple functionality epoxide resin of 5 parts by weight stirring to increasing Tough dose of melting completely, whipping temp are 140 DEG C, mixing time 2h, carry out vacuumize process to stirring container in whipping process, Obtain component A mixed solution;
The curing accelerator of the curing agent of 4 parts by weight and 1 parts by weight is added in the bisphenol A epoxide resin of 7 parts by weight It is stirred, whipping temp is mixing time 20min, after the completion of stirring, carries out two to mixture and grinds to three rollers three times Obtain B component mixture;
B component mixture is added in component A mixed solution and stirs to get halogen-free flame-retardant resin, whipping temp 80 DEG C, mixing time 20min.
With reference to the accompanying drawings shown in 1,2: the multiple functionality epoxide resin in above embodiments uses o-cresol formaldehyde epoxy resin, Bisphenol A type epoxy resin is using a variety of mixtures such as NPEL128,903, and fire retardant is using a variety of mixing such as aluminium hydroxide, DOPO Object, meanwhile, DSC (differential scanning is carried out by differential scanning calorimeter to the halogen-free flame-retardant resin that above four groups of embodiments obtain Calorimetry), obtain test result.
The casting resin performance test for the halogen-free flame-retardant resin that above four groups of embodiments obtain, test result such as subordinate list 1 It is shown:
Subordinate list 1
The above description is only a preferred embodiment of the present invention, as long as achieving the object of the present invention skill with essentially identical means Art scheme, belongs within protection scope of the present invention.

Claims (11)

1. a kind of halogen-free flame-retardant resin, which is characterized in that it includes component and parts by weight are as follows:
5-20 parts of multiple functionality epoxide resin;
12-21 parts of toughener;
48-63 parts of bisphenol A type epoxy resin;
5-10 parts of novolac epoxy resin;
6-12 parts of cycloaliphatic epoxy resin;
18-30 parts of fire retardant;
4-10 parts of curing agent;
1-5.5 parts of curing accelerator.
2. a kind of halogen-free flame-retardant resin according to claim 1, it is characterised in that: the multiple functionality epoxide resin includes Four glycidyl group dimethylphenylene diamine, four glycidyl group diaminodiphenyl-methane, four glycidyl amine of m-xylene diamine, line Type novolac epoxy resin, o-cresol formaldehyde epoxy resin, four glycidol ether tetraphenyl ethane, triglycidyl group p-aminophenyl One of phenol is a variety of.
3. a kind of halogen-free flame-retardant resin according to claim 1, it is characterised in that: the epoxy novolac includes line style phenolic aldehyde One of epoxy resin, o-cresol formaldehyde epoxy resin are a variety of.
4. a kind of halogen-free flame-retardant resin according to claim 1, it is characterised in that: the bisphenol A type epoxy resin includes NPEL127、NPEL127E、NPEL128、NPEL128E、DER300、NPEL128S、NPES901、NPES902、NPES903、 One or more of NPES903H, NPES904, NPES907;
The bisphenol A type epoxy resin is liquid or solid-state.
5. a kind of halogen-free flame-retardant resin according to claim 1, it is characterised in that: the fire retardant is red phosphorus, tricresyl phosphate Toluene ester, triaryl phosphate, phosphoric acid tri-isopropyl benzene ester, tributyl phosphate, trioctyl phosphate, cresyl diphenyl phosphate, Aluminium hydroxide, magnesium hydroxide, 1- oxygen -4- methylol -2,6,7- trioxa -1- phosphabicyclo [2,2,2] octane, N- methylol third Amides methyl phosphonate, dimethyl methyl phosphonate, zinc borate, melamine cyanurate, DOPO, DOPO epoxy resin, oxidation One or more of molybdenum, zinc molybdate, antimony oxide, hexaphenoxycyclotriphosphazene.
6. a kind of halogen-free flame-retardant resin according to claim 1, it is characterised in that: the toughener be thermoplastic resin or Methyl methacrylate-butyl acrylate-methyl methacrylate triblock copolymer.
7. a kind of halogen-free flame-retardant resin according to claim 1, it is characterised in that: the thermoplastic resin be polyether sulfone, One of poly(aryl ether ketone), polyether-ether-ketone, phenoxy resin, polyphenylene oxide are a variety of.
8. a kind of halogen-free flame-retardant resin according to claim 1, it is characterised in that: the curing agent is 4,4 '-diamino One or more of diphenyl sulphone (DPS), 4,4 '-diaminodiphenylmethane, m-phenylene diamine (MPD), m-xylene diamine.
9. a kind of halogen-free flame-retardant resin according to claim 1, it is characterised in that: the curing accelerator is modified miaow Azoles, organic phosphorus compound, boron trifluoride complex, organic ureas it is one or more.
10. a kind of preparation method of halogen-free flame-retardant resin, which comprises the following steps:
Fire retardant mixture is unanimously obtained firstly, fire retardant is added in bisphenol A epoxide resin and is uniformly mixed, stirring temperature Degree: 50-60 DEG C, mixing time: 30-45 minutes, and fire retardant mixture is ground by three-roll grinder;By toughener and resistance Combustion agent mixture is added in bisphenol A epoxide resin, novolac epoxy resin, cycloaliphatic epoxy resin and multiple functionality epoxide resin Stirring melts completely to toughener, and whipping temp is 120-180 DEG C, mixing time 1.5-6h, holds in whipping process to stirring Device carries out vacuumize process, obtains component A mixed solution;
Then, curing agent and curing accelerator are added in bisphenol A epoxide resin and are stirred, whipping temp is always held at 70 DEG C hereinafter, mixing time is 20-25min, after the completion of stirring, carry out two grinding to obtain B group to three rollers three times to mixture Part mixture;
Halogen-free flame-retardant resin is stirred to get finally, B component mixture is added in component A mixed solution, whipping temp 70 DEG C -80 DEG C, mixing time 15-20min.
11. a kind of halogen-free flame-retardant resin according to claim 10, it is characterised in that: curing agent and curing accelerator are added Whipping temp into bisphenol A epoxide resin is 40 DEG C -50 DEG C.
CN201810510698.XA 2018-05-24 2018-05-24 A kind of Halogen-free flame-retardant resin matrix and its manufacturing method Pending CN110527248A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114752336A (en) * 2021-12-20 2022-07-15 上海都昱新材料科技有限公司 Solvent-free epoxy adhesive with good flame retardance and application thereof
CN116874988A (en) * 2023-08-02 2023-10-13 常州天启新新科技有限公司 High-flame-retardance medium-temperature curing epoxy resin premix and preparation method and application thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201425447A (en) * 2012-12-21 2014-07-01 Elite Electronic Material Kunshan Co Ltd Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same
CN107286583A (en) * 2017-06-20 2017-10-24 苏州生益科技有限公司 A kind of resin combination and the low flow prepreg made using it

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201425447A (en) * 2012-12-21 2014-07-01 Elite Electronic Material Kunshan Co Ltd Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same
CN107286583A (en) * 2017-06-20 2017-10-24 苏州生益科技有限公司 A kind of resin combination and the low flow prepreg made using it

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114752336A (en) * 2021-12-20 2022-07-15 上海都昱新材料科技有限公司 Solvent-free epoxy adhesive with good flame retardance and application thereof
CN114752336B (en) * 2021-12-20 2023-09-19 上海都昱新材料科技有限公司 Solvent-free epoxy adhesive with good flame retardance and application thereof
CN116874988A (en) * 2023-08-02 2023-10-13 常州天启新新科技有限公司 High-flame-retardance medium-temperature curing epoxy resin premix and preparation method and application thereof
CN116874988B (en) * 2023-08-02 2024-01-26 常州天启新新科技有限公司 High-flame-retardance medium-temperature curing epoxy resin premix and preparation method and application thereof

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Application publication date: 20191203