CN110527190A - A kind of polymer matrix heat-conducting interface material and preparation method thereof - Google Patents
A kind of polymer matrix heat-conducting interface material and preparation method thereof Download PDFInfo
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Abstract
The invention belongs to Heat Conduction Material technical fields, and in particular to a kind of polymer matrix heat-conducting interface material and preparation method thereof.The invention discloses a kind of polymer matrix heat-conducting interface materials, by weight, including following components: 32-36 parts of polymer material, 48-52 parts of heat filling, 12-16 parts of heat conducting fiber, 1-3 parts of vinylsiloxane；The polymer material is selected from least one of polypropylene, polyisoprene, polybutadiene, polyvinyl chloride, polyethylene, Kynoar, polystyrene.
Description
Technical field
The invention belongs to Heat Conduction Material technical fields, and in particular to a kind of polymer matrix heat-conducting interface material and its preparation side
Method.
Background technique
The continuous development of material science is so that application percentage of the Heat Conduction Material in national defense industry and civil use material increases year by year
Greatly, have the characteristics that light weight, mechanical property are good, electrical insulating property is strong, price is low Heat Conduction Material becomes the trend of future development,
There is very broad application prospect in today that electronics industry is quickly grown.Electronic industrial products such as LED, microelectronic packaging material
With semiconductor devices constantly to miniaturization, the development of lightening and intelligent direction, therefore people mention the heating conduction of material
Higher requirement is gone out.
Matrix as Heat Conduction Material should have following performance: good mechanical property and machine-shaping property are able to achieve
The high quality score of filler is filled；Good electrical insulating property, higher thermal conductivity, low CTE, raw material sources are extensive.Heat Conduction Material
The resin used is substantially divided to thermosetting property and thermoplasticity two classes.From the point of view of current research situation, common matrix has: HDPE, LDPE,
PP,PS,PC,PA-6,PA-66,POM,PVC,PVDF；PU,SBS；Epoxy, phenolic aldehyde, span and its modified resin, organosilicon tree
Rouge, silicon rubber, butadiene-styrene rubber, PMR polyimides and other new modified high performance resins etc..But the thermal conductivity of these matrixes
The cooling requirements of existing electronic product can be unable to satisfy, therefore prepares high-performance heat-conducting interface material and is asked as urgently to be resolved
Topic.
Summary of the invention
In order to solve the above-mentioned technical problem, the first aspect of the invention provides a kind of polymer matrix thermally-conductive interface material
Material, which is characterized in that by weight, including following components: it is 32-36 parts of polymer material, 48-52 parts of heat filling, thermally conductive
12-16 parts of fiber, 1-3 parts of vinylsiloxane；
The polymer material is selected from polypropylene, polyisoprene, polybutadiene, polyvinyl chloride, polyethylene, polyvinylidene fluoride
At least one of alkene, polystyrene.
As a kind of perferred technical scheme, the polyacrylic melt index is 1-3g/10min.
As a kind of perferred technical scheme, the polyacrylic melt index is 1.9g/10min.
As a kind of perferred technical scheme, the heat filling is metal packing and/or metallic compound filler.
As a kind of perferred technical scheme, the metal packing, metallic compound filler weight ratio be (0.5-3):
1。
As a kind of perferred technical scheme, the average grain diameter of the metal packing is 5-40 microns.
As a kind of perferred technical scheme, the vinylsiloxane is selected from 1- vinyl -1,1,3,3,3- pentamethyls
Disiloxane, 1,3,5- trivinyl -1,1,3,5,5- pentamethyl trisiloxanes, vinyl three (dimethyl siloxane) silicon
Alkane, 1,3- divinyl tetraethoxy disiloxane, vinyl three (trimethylsiloxane group) silane, vinyl trimethoxy silicon
At least one of alkane.
As a kind of perferred technical scheme, the vinylsiloxane is vinyltrimethoxysilane.
The second aspect of the present invention provides the preparation method of the heat-conducting interface material, comprising the following steps:
S1: vinylsiloxane, heat filling are added sequentially in 100-300 parts by weight of isopropyl alcohol, 60-100 is Celsius
Degree lower reaction 1-3 hours, filtering was to get the modified heat filling of vinylsiloxane；
S2: stir evenly in a reactor by the modified heat filling of vinylsiloxane, polymer material, heat conducting fiber,
It is added in double screw extruder, extruder temperature is 180-200 DEG C, and revolving speed 20-40rad/s will be mixed from extruder discharging mouth
Close extruded stock be packed into material feeding bucket, in 170-200 DEG C of injection molding machine injection molding to get.
The third aspect of the invention provides the application of the heat-conducting interface material, and the boundary material is produced for electronics
The heat dissipation of product.
The utility model has the advantages that heat-conducting interface material of the present invention, has superior heating conduction, can be good at being applied to electricity
The heat dissipation of sub- product scope.
Specific embodiment
For the purpose of following detailed description, it should be understood that the present invention can be used various substitutions variation and step it is suitable
Sequence, unless specifically stated on the contrary.In addition, being indicated in the case where in addition in any operational instances or otherwise pointing out
Such as all numbers of the amount of ingredient used in description and claims should be understood in all cases by term
" about " it modifies.Therefore, unless indicated to the contrary, the numerical parameter otherwise illustrated in the following description and appended dependent claims is root
The approximation changed according to the expected performance of the invention to be obtained.It is at least not intended to for the applicable of doctrine of equivalents being limited in
In the scope of the claims, each numerical parameter should at least be given up according to the number of the effective digital of report and by the way that application is common
Enter technology to explain.
Although illustrating that broad range of numberical range and parameter of the invention are approximations, listed in specific example
Numerical value is reported as accurately as possible.However, any numerical value inherently includes the standard deviation by finding in its each self-test measurement
The certain errors necessarily led to.
When a numberical range disclosed herein, above range is considered as continuously, and the minimum value including the range and most
Big value and each value between this minimum value and maximum value.Further, when range refers to integer, including the model
Each integer between minimum value and maximum value enclosed.In addition, when providing multiple range Expressive Features or characteristic, Ke Yihe
And the range.In other words, unless otherwise specified, otherwise all ranges disclosed herein are understood to include and are wherein included into
Any and all subrange.For example, should be regarded as including between minimum value 1 and maximum value 10 from the specified range of " 1 to 10 "
Any and all subrange.The Exemplary range of range 1 to 10 include but is not limited to 1 to 6.1,3.5 to 7.8,5.5 to
10 etc..
To solve the above-mentioned problems, the present invention provides a kind of polymer matrix heat-conducting interface materials, by weight, including
Following components: 32-36 parts of polymer material, 48-52 parts of heat filling, 12-16 parts of heat conducting fiber, 1-3 parts of vinylsiloxane.
As a preferred embodiment, the polymer matrix heat-conducting interface material, by weight, including with the following group
Point: 34.5 parts of polymer material, 50.4 parts of heat filling, 14.6 parts of heat conducting fiber, 2.5 parts of vinylsiloxane.
Polymer material
As an implementation, the polymer material is selected from polypropylene, polyisoprene, polybutadiene, polychlorostyrene second
At least one of alkene, polyethylene, Kynoar, polystyrene.
As a preferred embodiment, the polymer material is polypropylene.
In the application, the polypropylene is formed by propylene sudden reaction, appearance transparent and light, acid and alkali resistance, salt and more
The corrosion of kind organic solvent.
As a preferred embodiment, the polyacrylic melt index is 1-3g/10min.
Preferably, the polyacrylic melt index is 1.9g/10min.
In the application, the test reference standard ASTM D1238 of the melt index, 230 degrees Celsius/2.16kg.
In the application, the polyacrylic model C133-02 is bought in Tao Shi Du Pont.
Heat filling
As an implementation, the heat filling is metal packing and/or metallic compound filler.
As a preferred embodiment, the heat filling is metal packing and metallic compound filler.
Preferably, the metal packing, metallic compound filler weight ratio be (0.5-3): 1.
It is furthermore preferred that the weight ratio of the metal packing, metallic compound filler is 2:1.
As the example of metal packing, including but not limited to copper powder, aluminium powder, silver powder, iron powder, zinc powder, nickel powder, glass putty；
As a preferred embodiment, the metal packing is aluminium powder.
As a preferred embodiment, the metal packing is spherical structure powder.
As a preferred embodiment, the grain average grain diameter of the metal packing is 1-70 microns；Preferably, described
The average grain diameter of metal packing is 5-40 microns；It is furthermore preferred that the average grain diameter of the metal packing is 20 microns.
As the example of metallic compound filler, including but not limited to aluminium oxide, iron oxide, zinc oxide, magnesia, oxidation
Calcium, titanium oxide, copper oxide, silicon carbide, aluminium nitride, alumina silicate, zirconium oxide.
As a preferred embodiment, the metallic compound filler includes aluminium oxide and aluminium nitride.
The aluminium oxide is a kind of compound of high rigidity, is the ionic crystals of trigonal system, O2-Ion is most close by six sides
Stacked arrangement has excellent chemical corrosion resistance and insulation performance.
The aluminium nitride be covalent key compound, be hexagonal wurtzite structure, white or canescence, Al atom with it is adjacent
N atom formed distortion (AIN4) tetrahedron.The theoretical density of AIN is 3.269, and Mohs' hardness 7-8 takes the photograph in 2200-22500
Family name's degree decomposes, and stability is fine in the high temperature non-oxygenated atmosphere within 2000 DEG C, and thermal shock resistance might as well.In addition, the nitridation
Aluminium has the characteristic not corroded by aluminium and other molten metals and gallium arsenide, and aluminium nitride also has excellent electrical insulating property and Jie
Electrical property.
Preferably, the weight ratio of the aluminium oxide and aluminium nitride is (0.5-2): 1.
It is furthermore preferred that the weight ratio of the aluminium oxide and aluminium nitride is 1:1.
As a preferred embodiment, the metallic compound filler is spherical structure powder.
As a preferred embodiment, the average grain diameter of the aluminium oxide is 400-800nm.
As a preferred embodiment, the average grain diameter of the aluminium oxide is 600nm.
As a preferred embodiment, the average grain diameter of the aluminium nitride is 0.4-5 microns.
As a preferred embodiment, the aluminium nitride by average grain diameter be 0.4-1 micron aluminium nitride and be averaged
The aluminium nitride that partial size is 4-6 microns forms；
Preferably, the weight ratio of the 0.4-1 microns of aluminium nitride and 4-6 microns of aluminium nitride is (0.8-1.2): 1.
It is further preferred that the weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is (0.8-1.2): 1.
It is further preferred that the weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is 1:1.
Heat conducting fiber
As a preferred embodiment, the heat conducting fiber is selected from metallic fiber, stainless steel fibre, carbon fiber, gathers
Close fibres.
As a preferred embodiment, the heat conducting fiber is carbon fiber.
As a preferred embodiment, the average length of the carbon fiber is 50~200 microns.
Preferably, the average length of the carbon fiber is 150 microns.
Carbon fiber described herein has the thermal conductivity and mechanical strength of superelevation, and thermal conductivity can reach 700W/ (mK),
Mainly using the layer crystal lattice of hexagon C atom as structural motif inside carbon fiber, covalent bond be connected with each other between C atom (bond distance=
Principal mode 0.1421mn)；And the stabilization of each layer structure relies primarily on Van der Waals force to maintain, level spacing is in 0.3360-
Within the scope of 0.3440nm.It is excellent that the special micro crystal graphite structure of the carbon fiber makes it play huge heat dissipation in heat transfer process
Gesture.
Vinylsiloxane
In the application, the thermal coefficient with higher such as described heat filling, but due to lacking active group, surface energy
It is lower, it is poor with the compatibility of polymer, it will affect the performances such as thermal conductivity, the hardness of Heat Conduction Material.The application is by being added second
Alkenyl siloxane is surface-treated heat filling, and the compatibility between increasing improves interface binding force.
As a preferred embodiment, the vinylsiloxane is selected from 1- vinyl -1,1,3,3,3- pentamethyls
Disiloxane, 1,3,5- trivinyl -1,1,3,5,5- pentamethyl trisiloxanes, vinyl three (dimethyl siloxane) silicon
Alkane, 1,3- divinyl tetraethoxy disiloxane, vinyl three (trimethylsiloxane group) silane, vinyl trimethoxy silicon
At least one of alkane.
As a preferred embodiment, the vinylsiloxane is vinyltrimethoxysilane.
Applicants have discovered that the heating conduction of Heat Conduction Material is influenced by many factors, such as polymer material type,
Polymer material hardness, melt index, the specific type of heat filling, partial size, specific type of modifying agent etc., each component
Small change can all produce a very large impact the heating conduction of material.The applicant passes through discovery of concentrating on studies, the polypropylene
Melt index be 1-3g/10min, and when the heat filling is made of a certain proportion of aluminium powder, aluminium oxide and aluminium nitride, obtain
To thermal conductivity of material improve a lot.May be because are as follows: be scattered in the filler, thermally conductive of the different-grain diameter in polypropylene rubber
Fiber contacts with each other, and the connection of similar reticular structure is formed inside polypropylene rubber；And due to different heat fillings or
The influence of the identical various sizes of interface compatibility of filler, ultimately forms optimal filling network.
The second aspect of the present invention provides the preparation method of the polymer matrix thermally-conductive interface, comprising the following steps:
S1: vinylsiloxane, heat filling are added sequentially in 100-300 parts by weight of isopropyl alcohol, 60-100 is Celsius
Degree lower reaction 1-3 hours, filtering was to get the modified heat filling of vinylsiloxane.
S2: stir evenly in a reactor by the modified heat filling of vinylsiloxane, polymer material, heat conducting fiber,
It is added in double screw extruder, extruder temperature is 180-200 DEG C, and revolving speed 20-40rad/s will be mixed from extruder discharging mouth
Close extruded stock be packed into material feeding bucket, in 170-200 DEG C of injection molding machine injection molding to get.
The third aspect of the present invention provides the application of the heat-conducting interface material, and the boundary material is produced for electronics
The heat dissipation of product.
What the electronic product can be enumerated have wrist-watch, smart phone, phone, television set, video disc player (VCD, SVCD,
DVD), video recorder, video camera, radio, radio cassette player, combination sound box, compact disc player (CD), computer, game machine etc..
The present invention is specifically described below by embodiment.It is necessarily pointed out that following embodiment is only used
In the invention will be further described, it should not be understood as limiting the scope of the invention, professional and technical personnel in the field
The some nonessential modifications and adaptations made according to the content of aforementioned present invention, still fall within protection scope of the present invention.
In addition, if without other explanations, it is raw materials used to be all commercially available.
Embodiment
Embodiment 1
A kind of polymer matrix heat-conducting interface material, by weight, including following components: it 34.5 parts of polymer material, leads
50.4 parts of hot filler, 14.6 parts of heat conducting fiber, 2.5 parts of vinylsiloxane.
The polymer material is polypropylene, and the polyacrylic melt index is 1.9g/10min, model C133-
02, it buys in Tao Shi Du Pont.
The heat filling is metal packing and metallic compound filler, the metal packing, metallic compound filler
Weight ratio is 2:1；The metal packing is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler
Including aluminium oxide and aluminium nitride, the weight ratio of the aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is
600nm；The aluminium nitride that the aluminium nitride and average grain diameter that the aluminium nitride is 0.6 micron by average grain diameter are 5 microns forms；It is described
The weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is 1:1.
The heat conducting fiber is carbon fiber.The average length of the carbon fiber is 150 microns.
The vinylsiloxane is vinyltrimethoxysilane.
The preparation method of the polymer matrix thermally-conductive interface, comprising the following steps:
S1: vinylsiloxane, heat filling are added sequentially in 200 parts by weight of isopropyl alcohol, react 2 under 80 degrees Celsius
Hour, filtering is to get the modified heat filling of vinylsiloxane；
S2: stir evenly in a reactor by the modified heat filling of vinylsiloxane, polymer material, heat conducting fiber,
It is added in double screw extruder, extruder temperature is 190 DEG C, revolving speed 30rad/s, will mix extruded stock from extruder discharging mouth
Be packed into material feeding bucket, in 180 DEG C of injection molding machine injection molding to get.
Embodiment 2
A kind of polymer matrix heat-conducting interface material, by weight, including following components: it is 32 parts of polymer material, thermally conductive
48 parts of filler, 12 parts of heat conducting fiber, 1 part of vinylsiloxane.
The polymer material is polypropylene, and the polyacrylic melt index is 1.9g/10min, model C133-
02, it buys in Tao Shi Du Pont.
The heat filling is metal packing and metallic compound filler, the metal packing, metallic compound filler
Weight ratio is 2:1；The metal packing is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler
Including aluminium oxide and aluminium nitride, the weight ratio of the aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is
600nm；The aluminium nitride that the aluminium nitride and average grain diameter that the aluminium nitride is 0.6 micron by average grain diameter are 5 microns forms；It is described
The weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is 0.8:1.
The heat conducting fiber is carbon fiber.The average length of the carbon fiber is 150 microns.
The vinylsiloxane is vinyltrimethoxysilane.
The preparation method of the polymer matrix thermally-conductive interface, the specific steps are the same as those in embodiment 1.
Embodiment 3
A kind of polymer matrix heat-conducting interface material, by weight, including following components: it is 36 parts of polymer material, thermally conductive
52 parts of filler, 16 parts of heat conducting fiber, 3 parts of vinylsiloxane.
The polymer material is polypropylene, and the polyacrylic melt index is 1.9g/10min, model C133-
02, it buys in Tao Shi Du Pont.
The heat filling is metal packing and metallic compound filler, the metal packing, metallic compound filler
Weight ratio is 2:1；The metal packing is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler
Including aluminium oxide and aluminium nitride, the weight ratio of the aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is
600nm；The aluminium nitride that the aluminium nitride and average grain diameter that the aluminium nitride is 0.6 micron by average grain diameter are 5 microns forms；It is described
The weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is 1.2:1.
The heat conducting fiber is carbon fiber.The average length of the carbon fiber is 150 microns.
The vinylsiloxane is vinyltrimethoxysilane.
The preparation method of the polymer matrix thermally-conductive interface, the specific steps are the same as those in embodiment 1.
Embodiment 4
A kind of polymer matrix heat-conducting interface material, by weight, including following components: it 34.5 parts of polymer material, leads
50.4 parts of hot filler, 14.6 parts of heat conducting fiber, 2.5 parts of vinylsiloxane.
The polymer material is polypropylene, and the polyacrylic melt index is 5g/10min, model HL457L, purchase
It buys in the Basel Li Ande.
The heat filling is metal packing and metallic compound filler, the metal packing, metallic compound filler
Weight ratio is 2:1；The metal packing is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler
Including aluminium oxide and aluminium nitride, the weight ratio of the aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is
600nm；The aluminium nitride that the aluminium nitride and average grain diameter that the aluminium nitride is 0.6 micron by average grain diameter are 5 microns forms；It is described
The weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is 1:1.
The heat conducting fiber is carbon fiber.The average length of the carbon fiber is 150 microns.
The vinylsiloxane is vinyltrimethoxysilane.
The preparation method of the polymer matrix thermally-conductive interface, the specific steps are the same as those in embodiment 1.
Embodiment 5
A kind of polymer matrix heat-conducting interface material, by weight, including following components: it 34.5 parts of polymer material, leads
50.4 parts of hot filler, 14.6 parts of heat conducting fiber, 2.5 parts of vinylsiloxane.
The polymer material be polypropylene, the polyacrylic melt index be 0.3g/10min, model EA095T,
It buys in Borealis.
The heat filling is metal packing and metallic compound filler, the metal packing, metallic compound filler
Weight ratio is 2:1；The metal packing is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler
Including aluminium oxide and aluminium nitride, the weight ratio of the aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is
600nm；The aluminium nitride that the aluminium nitride and average grain diameter that the aluminium nitride is 0.6 micron by average grain diameter are 5 microns forms；It is described
The weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is 1:1.
The heat conducting fiber is carbon fiber.The average length of the carbon fiber is 150 microns.
The vinylsiloxane is vinyltrimethoxysilane.
The preparation method of the polymer matrix thermally-conductive interface, the specific steps are the same as those in embodiment 1.
Embodiment 6
A kind of polymer matrix heat-conducting interface material, by weight, including following components: it 34.5 parts of polymer material, leads
50.4 parts of hot filler, 14.6 parts of heat conducting fiber, 2.5 parts of vinylsiloxane.
The polymer material is polypropylene, and the polyacrylic melt index is 1.9g/10min, model C133-
02, it buys in Tao Shi Du Pont.
The heat filling is metal packing and metallic compound filler, the metal packing, metallic compound filler
Weight ratio is 2:1；The metal packing is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler
Including aluminium oxide and aluminium nitride, the weight ratio of the aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is
600nm；The aluminium nitride that the aluminium nitride and average grain diameter that the aluminium nitride is 0.6 micron by average grain diameter are 5 microns forms；It is described
The weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is 2:1.
The heat conducting fiber is carbon fiber.The average length of the carbon fiber is 150 microns.
The vinylsiloxane is vinyltrimethoxysilane.
The preparation method of the polymer matrix thermally-conductive interface, the specific steps are the same as those in embodiment 1.
Embodiment 7
A kind of polymer matrix heat-conducting interface material, by weight, including following components: it 34.5 parts of polymer material, leads
50.4 parts of hot filler, 14.6 parts of heat conducting fiber, 2.5 parts of vinylsiloxane.
The polymer material is polypropylene, and the polyacrylic melt index is 1.9g/10min, model C133-
02, it buys in Tao Shi Du Pont.
The heat filling is metal packing and metallic compound filler, the metal packing, metallic compound filler
Weight ratio is 2:1；The metal packing is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler
Including aluminium oxide and aluminium nitride, the weight ratio of the aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is
600nm；The aluminium nitride that the aluminium nitride and average grain diameter that the aluminium nitride is 0.6 micron by average grain diameter are 5 microns forms；It is described
The weight ratio of 0.6 micron of aluminium nitride and 5 microns of aluminium nitride is 0.5:1.
The heat conducting fiber is carbon fiber.The average length of the carbon fiber is 150 microns.
The vinylsiloxane is vinyltrimethoxysilane.
The preparation method of the polymer matrix thermally-conductive interface, the specific steps are the same as those in embodiment 1.
Embodiment 8
A kind of polymer matrix heat-conducting interface material, concrete component is with embodiment 1, the difference lies in that the heat filling is
Metal packing and metallic compound filler, the metal packing, metallic compound filler weight ratio be 2:1；The metal is filled out
Material is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler includes aluminium oxide and aluminium nitride, described
The weight ratio of aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is 600nm；The aluminium nitride is by average grain diameter
The aluminium nitride composition for being 10 microns for 0.6 micron of aluminium nitride and average grain diameter；0.6 micron of aluminium nitride and 10 microns of nitridations
The weight ratio of aluminium is 1:1.
The preparation method of the polymer matrix thermally-conductive interface, the specific steps are the same as those in embodiment 1.
Embodiment 9
A kind of polymer matrix heat-conducting interface material, concrete component is with embodiment 1, the difference lies in that the heat filling is
Metal packing and metallic compound filler, the metal packing, metallic compound filler weight ratio be 2:1；The metal is filled out
Material is aluminium powder, and the average grain diameter of the aluminium powder is 20 microns.The metallic compound filler includes aluminium oxide and aluminium nitride, described
The weight ratio of aluminium oxide and aluminium nitride is 1:1；The average grain diameter of the aluminium oxide is 600nm；The aluminium nitride is by average grain diameter
The aluminium nitride composition for being 1 micron for 0.6 micron of aluminium nitride and average grain diameter；0.6 micron of aluminium nitride and 1 micron of aluminium nitride
Weight ratio be 1:1.
The preparation method of the polymer matrix thermally-conductive interface, the specific steps are the same as those in embodiment 1.
Performance test
Thermal coefficient: utilizing laser heat conducting instrument, tested with reference to ASTM E1461 standard, and the calculating of thermal coefficient is public
Formula: λ=α × Cp × ρ；Wherein λ is the thermal coefficient of sample, and α is the thermal diffusion coefficient of sample, and Cp is the specific heat of sample, and ρ is sample
The density of product.Thermal coefficient unit: W/ (mK) is specifically shown in Table 1.
Table 1
The above described is only a preferred embodiment of the present invention, be not the limitation for making other forms to invention, it is any
Those skilled in the art are changed or are changed to the equivalent of equivalent variations possibly also with the technology contents of the disclosure above
Embodiment, but without departing from the technical solutions of the present invention, above embodiments are made according to the technical essence of the invention
Any simple modification, equivalent variations and remodeling, still fall within the protection scope of technical solution of the present invention.
Claims (10)
1. a kind of polymer matrix heat-conducting interface material, which is characterized in that by weight, including following components: polymer material
32-36 parts, 48-52 parts of heat filling, 12-16 parts of heat conducting fiber, 1-3 parts of vinylsiloxane；
The polymer material be selected from polypropylene, polyisoprene, polybutadiene, polyvinyl chloride, polyethylene, Kynoar,
At least one of polystyrene.
2. heat-conducting interface material as described in claim 1, which is characterized in that the polyacrylic melt index is 1-3g/
10min。
3. heat-conducting interface material as claimed in claim 2, which is characterized in that the polyacrylic melt index is 1.9g/
10min。
4. heat-conducting interface material as described in claim 1, which is characterized in that the heat filling is metal packing and/or gold
Belong to compound filler.
5. heat-conducting interface material as claimed in claim 4, which is characterized in that the metal packing, metallic compound filler
Weight ratio is (0.5-3): 1.
6. heat-conducting interface material as described in claim 4 or 5, which is characterized in that the average grain diameter of the metal packing is 5-
40 microns.
7. heat-conducting interface material as described in claim 1, which is characterized in that the vinylsiloxane is selected from 1- vinyl-
1,1,3,3,3- pentamethyl disiloxane, 1,3,5- trivinyl -1,1,3,5,5- pentamethyl trisiloxanes, vinyl three (two
Methyl siloxane-based) silane, 1,3- divinyl tetraethoxy disiloxane, vinyl three (trimethylsiloxane group) silane,
At least one of vinyltrimethoxysilane.
8. heat-conducting interface material as claimed in claim 1 or 7, which is characterized in that the vinylsiloxane is vinyl three
Methoxy silane.
9. a kind of preparation method of such as described in any item heat-conducting interface materials of claim 1-8, which is characterized in that including following
Step:
S1: vinylsiloxane, heat filling are added sequentially in 100-300 parts by weight of isopropyl alcohol, under 60-100 degrees Celsius
Reaction 1-3 hours, filtering is to get the modified heat filling of vinylsiloxane；
S2: it stir evenly in a reactor by the modified heat filling of vinylsiloxane, polymer material, heat conducting fiber, is added
Into double screw extruder, extruder temperature is 180-200 DEG C, revolving speed 20-40rad/s, is squeezed from extruder discharging mouth by mixing
Discharging be packed into material feeding bucket, in 170-200 DEG C of injection molding machine injection molding to get.
10. a kind of application of such as described in any item heat-conducting interface materials of claim 1-8, which is characterized in that the interface material
Material is used for the heat dissipation of electronic product.
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| WO2022133850A1 (en) * | 2020-12-24 | 2022-06-30 | Dow Global Technologies Llc | Thermal interface material |
| CN117603660A (en) * | 2024-01-24 | 2024-02-27 | 北京泰派斯特电子技术有限公司 | Ultrathin breakdown voltage-resistant heat-conducting insulating gasket and preparation method thereof |
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| CN117603660A (en) * | 2024-01-24 | 2024-02-27 | 北京泰派斯特电子技术有限公司 | Ultrathin breakdown voltage-resistant heat-conducting insulating gasket and preparation method thereof |
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