CN110524872A - A kind of upper liquid level photocuring three-dimensional device and method - Google Patents
A kind of upper liquid level photocuring three-dimensional device and method Download PDFInfo
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- CN110524872A CN110524872A CN201910893644.0A CN201910893644A CN110524872A CN 110524872 A CN110524872 A CN 110524872A CN 201910893644 A CN201910893644 A CN 201910893644A CN 110524872 A CN110524872 A CN 110524872A
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- 239000007788 liquid Substances 0.000 title claims abstract description 88
- 238000000016 photochemical curing Methods 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 230000003287 optical effect Effects 0.000 claims abstract description 23
- 238000007519 figuring Methods 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 24
- 239000002356 single layer Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 abstract description 10
- 238000001723 curing Methods 0.000 description 9
- 238000007711 solidification Methods 0.000 description 7
- 230000008023 solidification Effects 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 230000005574 cross-species transmission Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000006424 Flood reaction Methods 0.000 description 1
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001914 calming effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
Abstract
The present invention relates to a kind of upper liquid level photocuring three-dimensional device and methods, including rigid frame, rigid frame is equipped with Z-direction straight line mould group, pole bracket, rigid frame is equipped with overflow launder, forming tank is equipped in overflow launder, forming tank side surface upper part is equipped with overflow port, and forming tank side bottom is equipped with the communication port connecting with booster pump, it is pressurized pump intake and is set to isopipe root, have photosensitive resin in overflow launder, forming tank；Z-direction straight line mould group is connect with forming board, and forming board is equipped with photocuring three-dimensional body that formed, and Z-direction straight line mould group can drive forming board, photocuring three-dimensional body that formed vertical shift and to position in forming tank；Pole bracket end is equipped with image-forming component, and optical figuring can be projected to the upper liquid level of photosensitive resin in forming tank by image-forming component.Rationally, on photosensitive resin liquid level Liquid level precision is high for the configuration of the present invention is simple, scheme, is easy to promote and apply in large scale, high-precision photocuring three-dimensional equipment.
Description
Technical field
The present invention relates to 3 D-printing field, especially a kind of upper liquid level photocuring three-dimensional device and method.
Background technique
Photocuring three-dimensional irradiates photosensitive resin material, solidification reaction by specific wavelength light source to be consolidated
Compound, the significant advantage fast with shaping speed, forming surface is smooth, has developed into the important class in increases material manufacturing technology field
One of.The implementation of photocuring three-dimensional is based primarily upon the basic principle of layer-by-layer exposure curing, multilayer accumulation forming, i.e., logical
The image-forming components such as liquid crystal display (LCD), Digital Light Processor (DLP), scanning galvanometer (Galvanic Scan Head) are crossed, are controlled
The exposure area of photosensitive resin thin layer processed is successively exposed with obtaining sheet, graphical curing reaction object by continuous, and
The effect of ply adhesion caused by light interlayer penetrates when single layer exposes obtains photocuring made of being accumulated as multilayer chip solidfied material
Three-dimensional body that formed.
According to layer-by-layer exposure object, that is, photosensitive resin coating position difference, photocuring three-dimensional equipment can be divided into upper liquid
Face solidification solidifies two types with lower liquid level, wherein upper liquid level photocuring refers to the direct projection optics pattern of image-forming component to liquid bath
Photosensitive resin on liquid level then will be under gained sheet solidfied material to upper liquid level thin layer exposure curing to obtain sheet solidfied material
It sinks in photosensitive resin, in a manner of the new upper liquid level thin layer exposure curing for continuing to form levelling on sheet solidfied material；Under
Liquid level photocuring refers to that the optical design of image-forming component projection passes through liquid bath clear bottom, to lower liquid level thin layer exposure curing to obtain
Sheet solidfied material then removes gained sheet solidfied material from liquid bath clear bottom, is filled out with continuing to flow sheet solidfied material following table
Fill the mode for the new lower liquid level thin layer exposure curing to be formed.
Existing upper liquid level uv equipment is mainly used for large scale, low precision photocuring application, this is mostly derived from upper liquid
The inherent characteristic in face: upper liquid level solidfied material is not necessarily to from other sur-face peelings, good to the adaptability of large scale section solidified forming, but
The achievable precision of upper liquid level Liquid level is low, causes optical design projection multiplying power offset, causes to solidify dimensional discrepancy；And lower liquid
Face uv equipment then biases toward small size, and high precision part application, this is also derived from the inherent characteristic of lower liquid level: lower liquid level liquid
Position is constant, and optical design projection multiplying power is constant, and solidification size is accurate, but solidifies after the solidification of lower liquid level with liquid bath clear bottom adhesion
The difficulty and damage that object is removed from liquid bath clear bottom increase with solidification section and increased dramatically, so that the type equipment is not used to
Large-size components forming.Currently, being directed to large scale, high-precision photocuring three-dimensional demand, also lack a kind of optical design throwing
It penetrates multiplying power stabilization, big section solidfied material and damages the small photocuring three-dimensional method even without removing from imaging interfaces removing.
Summary of the invention
The shortcomings that the invention solves the above-mentioned prior arts provides a kind of detect without exact filling level, without accurate quantification
The high upper liquid level photocuring three-dimensional device and method of fluid infusion, level stability degree.
The technical scheme adopted by the invention to solve the technical problem: this upper liquid level photocuring three-dimensional device, including
Rigid frame, rigid frame are equipped with Z-direction straight line mould group, pole bracket, and rigid frame is equipped with overflow launder, is equipped in overflow launder
Forming tank, forming tank side surface upper part are equipped with overflow port, and forming tank side bottom is equipped with the communication port connecting with booster pump, booster pump
Entrance is set to isopipe root, has photosensitive resin in overflow launder, forming tank；Z-direction straight line mould group is connect with forming board, shapes base
Plate is equipped with photocuring three-dimensional body that formed, and Z-direction straight line mould group can drive forming board, photocuring three-dimensional body that formed in forming tank
Vertical shift simultaneously positions；Pole bracket end is equipped with image-forming component, and optical figuring can be projected to light in forming tank by image-forming component
The upper liquid level of quick resin.
Preferably, photocuring controller is connect with booster pump, Z-direction straight line mould group, image-forming component respectively.
A kind of upper liquid level photocuring three-dimensional method, Z-direction linear module drive forming board, and it is attached to forming base
The corresponding height of cured object decline monolayer immobilization thickness on plate, table is again on cured body for photosensitive resin in grooving
Levelling, forms the new upper liquid level liquid layer with a thickness of monolayer immobilization thickness, and optical figuring is projected to newly upper liquid level liquid by image-forming component
Layer leads to that photocuring reaction is occurred by optical figuring irradiation area, and then generates and image-forming component institute projection optics graphics shape
Identical current layer solidfied material, and then current layer solidfied material close adhesion carries out next layer in cured object upper surface again
Photocuring.
More specifically:
Before starting photocuring, photocuring controller issues out code to image-forming component, to close the optics of image-forming component
Figure projection；Enough photosensitive resins first is injected to grooving, until the photosensitive resin in grooving is from overflow port spill-over, Xiang Yiliu
The appropriate photosensitive resin of injection in slot, it is ensured that the photosensitive resin in overflow launder floods pressurization pump intake, and the photosensitive tree in overflow launder
Volume contraction caused by photosensitive resin solidifies in the entire Light Curing of rouge adequate remedy, grooving；Photocuring controller issues
Enabled instruction controls booster pump for the photosensitive resin in overflow launder and is slowly injected into grooving, the photosensitive tree of grooving to booster pump
Rouge is slowly spilled over to overflow launder, to establish slow, stable photosensitive resin circulation between grooving and overflow launder；Photocuring control
Device processed issues displacement commands to Z-direction straight line mould group, controls Z-direction linear module drive forming board and gently declines, until submerging into
Liquid level monolayer immobilization thickness on shape slot photosensitive resin.
When carrying out first floor photocuring, photocuring controller maintains booster pump enabled instruction, it is ensured that the photosensitive tree in grooving
Rouge is slowly spilled over to overflow launder；Photocuring controller delay, to wait forming board to decline the photosensitive tree of caused grooving
Liquid surface fluctuation calms down naturally on rouge；Photocuring controller issues the first floor and solidifies graph data to image-forming component, controls image-forming component
First floor optical figuring is projected to liquid level on grooving photosensitive resin, photocuring controller maintain the projection of first floor optical figuring and
Image-forming component is closed after end exposure, on forming board on the photosensitive resin of monolayer immobilization thickness liquid levels layer by first floor optical figuring
It irradiates, be cured reaction, generate the first floor sheet solidfied material of respective shapes, and first floor sheet solidfied material is attached to forming board
On, first floor photocuring terminates.
When carrying out succeeding layer photocuring, photocuring controller first issues displacement commands to Z-direction straight line mould group, and it is straight to control Z-direction
Line mould group drives the corresponding height of forming board decline monolayer immobilization thickness；Photocuring controller delay, waits base to be formed
Plate declines liquid surface fluctuation on caused grooving photosensitive resin and calms down naturally, and waiting time, photocuring controller maintains booster pump
It works, liquid level liquid level is determined by grooving overflow open height on the grooving after calming down naturally；Photocuring controller issues
Current layer solidifies graph data to image-forming component, controls image-forming component for current layer optical figuring and is projected to grooving photosensitive resin
Upper liquid level, photocuring controller maintain current layer optical figuring to project and close image-forming component after end exposure, and upper one layer solid
Liquid levels layer on the photosensitive resin of monolayer immobilization thickness in compound by the irradiation of current layer optical figuring, is cured reaction, generates
The current lamellar solidfied material of respective shapes, and current lamellar solidfied material is attached to one layer of solidfied material surface, current layer light
Solidification terminates；The above process is successively implemented, and liquid level thin layer solidifies the sheet solidfied material generated and successively tires out on grooving photosensitive resin
Add, until constituting complete photocuring three-dimensional body that formed.
Liquid surface level is determined by grooving overflow open height on the photosensitive resin of grooving of the present invention, and booster pump is by overflow launder
In photosensitive resin pressurization, continue injection molding slot so that grooving photosensitive resin is constantly from overflow port spill-over, and then shaping
It is generated in slot and liquid surface level on the consistent photosensitive resin of overflow open height；The photosensitive resin of grooving of the present invention is full from overflow port
After overflowing, overflow launder is directly flowed back to, and the photosensitive resin in overflow launder continues to inject grooving by booster pump, thus in grooving
Photosensitive resin flow circuit is constituted between overflow launder；The flow of booster pump of the present invention is low, and booster pump is from communication port injection molding slot
Photosensitive resin, bottom-up slow liquid stream is constituted in grooving, grooving photosensitive resin is can avoid and stands cause for a long time
Component layering, sedimentation problem；The present invention not only may be used using the method for liquid surface level on overflow port control grooving photosensitive resin
To solve the problems, such as that volume caused by photosensitive resin cure shrinkage reduces in grooving, liquid level reduces, forming board can also compensate for
It constantly submerges the submerged member volume that grooving is caused and increases effect.
Upper liquid level photocuring three-dimensional method of the invention, the Liquid level of liquid level is not necessarily on grooving photosensitive resin
High-accuracy liquid level sensor is only recycled by the photosensitive resin liquid that booster pump drives without high precision volume compensation mechanism
It can be realized with overflow mechanism；Upper liquid level photocuring three-dimensional method of the invention, liquid level liquid on grooving photosensitive resin
Position is stablized, and image-forming component is also stable to the optical figuring projection multiplying power of upper liquid level, photocuring dimensional accuracy is high；Structure of the invention letter
Rationally, on photosensitive resin liquid level Liquid level precision is high for single, scheme, is easy to set in large scale, high-precision photocuring three-dimensional
Standby middle popularization and application.
Detailed description of the invention
Fig. 1 is general structure schematic diagram of the invention；
Fig. 2 is photosensitive resin circulating circuit figure of the invention；
Fig. 3 is upper liquid level single layer photocuring schematic diagram of the invention；
Fig. 4 is control signal connection figure of the invention；
Description of symbols: rigid frame 1, overflow launder 2, forming tank 3, photosensitive resin 4, booster pump 5, entrance 501, outlet
502, overflow port 6, communication port 7, Z-direction straight line mould group 8, forming board 9, photocuring three-dimensional body that formed 10, pole bracket 11, imaging
Element 12, cured object 13, new upper liquid level liquid layer 14, current layer solidfied material 15, photocuring controller 20.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings:
Embodiment:
A kind of upper liquid level photocuring three-dimensional device, such as Fig. 1 have overflow launder 2 on rigid frame 1, have into overflow launder 2
Type groove 3, there is photosensitive resin 4 in overflow launder 2, grooving 3, overflow launder 2 also in have booster pump 5；3 side surface upper part of forming tank has overflow
Mouth 6,3 side bottom of forming tank has communication port 7, and the entrance of booster pump 5 is placed in 2 bottom of overflow launder, the outlet and molding of booster pump 5
The communication port 7 of slot 3 connects；There is Z-direction straight line mould group 8 on rigid frame 1, Z-direction straight line mould group 8 is connected with forming board 9, shapes base
There is photocuring three-dimensional body that formed 10 on plate 9, and Z-direction straight line mould group 8 can drive forming board 9, photocuring three-dimensional body that formed 10 to exist
It vertical shift and is positioned in forming tank 3；There are also pole bracket 11 on rigid frame 1, there is image-forming component 12 in 11 end of pole bracket,
Optical figuring can be projected to the upper liquid level of photosensitive resin 4 in forming tank 3 by image-forming component 12.
Such as Fig. 4, photocuring controller 20 is connect with booster pump 5, and photocuring controller 20 is connect with Z-direction straight line mould group 8, light
Solidification controller 20 is connect with image-forming component 12；Photocuring controller 20 sends an electrical signal to booster pump 5, to control booster pump 5
By the photosensitive resin 7 in overflow launder 2, pass through the pressurization injection molding slot 3 of communication port 7；Photocuring controller 20 sends an electrical signal to Z
To straight line mould group 8, to control Z-direction straight line mould group 8: forming board 9 being driven to submerge the photosensitive tree of grooving 3 when photocuring starts
Liquid level places an order a layer cured thickness on rouge, drives forming board 9 to decline monolayer immobilization thickness institute after every layer of exposure curing right
Highly, and it should drive forming board 9 that photocuring three-dimensional body that formed 10 is lifted out grooving 3 after the completion of photocuring；Photocuring
Controller 20 sends an electrical signal to image-forming component 12, to control image-forming component 12 during every layer of exposure curing, by equivalent layer
Optical figuring projects the upper liquid level of photosensitive resin 4 in grooving 3.
A kind of upper liquid level photocuring three-dimensional method:
If the entrance 501 of Fig. 2, booster pump 5 extract the photosensitive resin 4 in overflow launder 2 from 2 bottom of overflow launder, booster pump 5
Outlet 502 is injected into type groove 3 by communication port 7 after the photosensitive resin 4 in overflow launder 2 pressurizes, from 7 injection moulding of communication port
The photosensitive resin 4 of slot 3 persistently increases, so that the upper liquid surface level of photosensitive resin 4 reaches 6 height of overflow port in forming tank 3, in turn
Lead to the photosensitive resin 4 in forming tank 3 from 6 spill-over of overflow port and flows back to overflow launder 2；5 note of booster pump in unit time when stable state
The photosensitive resin volume for entering grooving 3 is equal to the photosensitive resin volume that overflow launder 2 is flowed back to from overflow port 6, so that the light of grooving 3
Liquid level on quick resin 4, liquid level maintain 6 height of overflow port, and the bottom-up slow flowing of photosensitive resin 4 in grooving 3；
Such as Fig. 3, after upper one layer of photocuring, Z-direction straight line mould group 8 drives forming board 9, and is attached to forming board
Cured object 13 on 9 declines the corresponding height of monolayer immobilization thickness, and the photosensitive resin 4 in grooving 3 is on cured body 13
Again optical figuring is projected to table by levelling, formation with a thickness of new above liquid level liquid layer 14, the image-forming component 12 of monolayer immobilization thickness
Newly upper liquid level liquid layer 14 leads to that photocuring reaction is occurred by optical figuring irradiation area, and then generates and thrown with image-forming component 12
Penetrate the identical current layer solidfied material 15 of optical figuring shape, and 15 close adhesion of current layer solidfied material table on cured object 13
Face.
Booster pump of the invention can be also placed in outside overflow launder in addition to being placed directly within the mode in overflow launder in the present embodiment
Booster pump outlet correspondingly, isopipe root need to be connected to by pump intake is pressurized with pipeline, and is connected to forming with pipeline by portion
Slot communication port, the injection molding slot so that booster pump can pressurize the photosensitive resin in overflow launder.
Other slots also can be used in addition to the structure type for completely surrounding grooving in the present embodiment in overflow launder of the invention
Body structure, such as put side by side with grooving；Correspondingly, grooving whole overflow port is intended to be connected to overflow launder by pipeline,
To recycle the photosensitive resin from grooving spill-over.
In addition to the implementation, the present invention can also have other embodiments.It is all to use equivalent substitution or equivalent transformation shape
At technical solution, fall within the scope of protection required by the present invention.
Claims (3)
1. a kind of upper liquid level photocuring three-dimensional device, including rigid frame (1), rigid frame (1) is equipped with Z-direction straight line mould
Group (8), pole bracket (11) are equipped with forming tank it is characterized in that: rigid frame (1) is equipped with overflow launder (2) in overflow launder (2)
(3), forming tank (3) side surface upper part is equipped with overflow port (6), and forming tank (3) side bottom is equipped with the connection connecting with booster pump (5)
Mouth (7), booster pump (5) entrance are set to overflow launder (2) bottom, have photosensitive resin (4) in overflow launder (2), forming tank (3)；Z-direction is straight
Line mould group (8) is connect with forming board (9), and forming board (9) is equipped with photocuring three-dimensional body that formed (10), Z-direction straight line mould group
(8) forming board (9), photocuring three-dimensional body that formed (10) can be driven in the interior vertical shift of forming tank (3) and positioned；Pole bracket
(11) end is equipped with image-forming component (12), and optical figuring can be projected to forming tank (3) interior photosensitive resin by image-forming component (12)
Upper liquid level.
2. upper liquid level photocuring three-dimensional device according to claim 1, it is characterized in that: photocuring controller (20) point
It is not connect with booster pump (5), Z-direction straight line mould group (8), image-forming component (12).
3. the upper liquid level photocuring three-dimensional method of device according to claim 1, it is characterized in that: Z-direction straight line mould group (8)
It drives forming board (9), and height corresponding to cured object (13) the decline monolayer immobilization thickness being attached on forming board (9)
Degree, photosensitive resin (4) in grooving (3) the table levelling again on cured body (13), forms with a thickness of monolayer immobilization thickness
New upper liquid level liquid layer (14), optical figuring is projected to newly upper liquid level liquid layer (14), caused by optical picture by image-forming component (12)
Photocuring reaction occurs for shape irradiation area, and then generates current layer identical with image-forming component (12) institute's projection optics graphics shape
Solidfied material (15), and then current layer solidfied material (15) close adhesion carries out next layer in cured object (13) upper surface again
Photocuring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910893644.0A CN110524872A (en) | 2019-09-20 | 2019-09-20 | A kind of upper liquid level photocuring three-dimensional device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910893644.0A CN110524872A (en) | 2019-09-20 | 2019-09-20 | A kind of upper liquid level photocuring three-dimensional device and method |
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| Publication Number | Publication Date |
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| CN110524872A true CN110524872A (en) | 2019-12-03 |
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| CN201910893644.0A Pending CN110524872A (en) | 2019-09-20 | 2019-09-20 | A kind of upper liquid level photocuring three-dimensional device and method |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980029992U (en) * | 1996-11-28 | 1998-08-17 | 구자홍 | Optical molding equipment |
| CN211105626U (en) * | 2019-09-20 | 2020-07-28 | 杭州德迪智能科技有限公司 | Upper liquid surface photocuring three-dimensional forming device |
-
2019
- 2019-09-20 CN CN201910893644.0A patent/CN110524872A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980029992U (en) * | 1996-11-28 | 1998-08-17 | 구자홍 | Optical molding equipment |
| CN211105626U (en) * | 2019-09-20 | 2020-07-28 | 杭州德迪智能科技有限公司 | Upper liquid surface photocuring three-dimensional forming device |
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