CN110517868A - Inductance framework, inductance device and lamps and lanterns - Google Patents
Inductance framework, inductance device and lamps and lanterns Download PDFInfo
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- CN110517868A CN110517868A CN201910906703.3A CN201910906703A CN110517868A CN 110517868 A CN110517868 A CN 110517868A CN 201910906703 A CN201910906703 A CN 201910906703A CN 110517868 A CN110517868 A CN 110517868A
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- inductance
- end plate
- conductive solder
- joint face
- solder part
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- 241001465382 Physalis alkekengi Species 0.000 title claims abstract description 11
- 238000004804 winding Methods 0.000 claims abstract description 115
- 229910000679 solder Inorganic materials 0.000 claims abstract description 98
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 23
- 238000003780 insertion Methods 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims description 14
- 238000000926 separation method Methods 0.000 claims description 12
- 239000000696 magnetic material Substances 0.000 claims description 6
- 239000004831 Hot glue Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000006698 induction Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003447 ipsilateral effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
Abstract
This application discloses a kind of inductance framework, inductance device and lamps and lanterns.Inductance framework includes main winding section and at least two conductive solder parts；Main winding section is for fixing winding, and main winding section has joint face, and conductive solder part is located at the lower section of joint face and covers joint face, and conductive solder part is fixedly connected with main winding section and at least two conductive solder part mutually insulateds；There is conducting wire accommodating area on conductive solder part.Inductance device includes winding and inductance framework；Winding is formed around the home by the conducting wire with insulation sheath and has input lead and output lead, and winding is fixed on main winding section, and input lead and output lead are placed in respectively in the conducting wire accommodating area of mutually insulated.Lamps and lanterns include lamp body, light source module group and driving mould group；Light source module group and driving mould group are arranged on lamp body and are electrically connected between each other, and driving mould group includes wiring board, are provided with inductance device on wiring board.The embodiment of the present application can substantially reduce the occupied area of inductance device.
Description
Technical field
This application involves inductance manufacturing technology field more particularly to a kind of inductance frameworks, inductance device and lamps and lanterns.
Background technique
Inductance is the element that can be converted electrical energy into magnetic energy and store, be widely used in space flight, aviation, communication,
In each electronic product such as household electrical appliance.Inductance generally has inductance framework, winding, shielding case, encapsulating material, magnetic core or iron core
Deng composition.
With the development of patch type mounting technology, more and more electronic devices have carried out adapting to the suitable of patch assembly technology
Answering property is improved, therefore also occurs can be applied to the inductance device of patch mounting technology successively.In the related technology, these inductance
Device be typically employed in inductance framework side stretch out wrapping post, by the end of a thread of inductance around the home on wrapping post formed welding around
Group.Welding winding can directly be bonded welding with the pad on circuit board, so the fixation of completion inductance device and circuit board with
And it is electrically connected.
The patch type that can be realized inductance device and circuit board through the above way is assembled, but in order to further enhance product
Competitiveness, it is necessary to which improvement is miniaturised to inductance device.
Summary of the invention
The embodiment of the present application provides a kind of inductance framework, inductance device and lamps and lanterns, to solve the above problems.
The embodiment of the present application adopts the following technical solutions:
In a first aspect, the embodiment of the present application provides a kind of inductance framework, including main winding section and at least two conductions
Weldment；
For fixing winding, the main winding section has joint face directed downwardly, the conductive solder part for the main winding section
Positioned at the joint face lower section and at least joint face described in covering part, the conductive solder part are fixed with the main winding section
Connection and at least two conductive solder part mutually insulateds；
The conductive solder part is welding binding face away from the side of the joint face, has on the conductive solder part and leads
Line accommodating area, the conducting wire accommodating area meet: when the conducting wire of winding is placed in the conducting wire accommodating area without departing from described
Weld binding face.
Optionally, in above-mentioned inductance framework, the joint face is divided into two parts, the conductive solder by a dividing strip
Part corresponds to the joint face and is divided into two parts, and a part of conductive solder part is respectively set on joint face described in each section,
The conductive solder part mutually insulated of different piece.
Optionally, in above-mentioned inductance framework, a plurality of dividing strip that the joint face is intersected is divided into multiple portions, institute
It states conductive solder part and corresponds to the joint face and be accordingly divided into multiple portions, a part is respectively set on joint face described in each section
The conductive solder part, the conductive solder part mutually insulated of different piece.
Optionally, in above-mentioned inductance framework, the main winding section has main wrapping post, first end plate and second end
Plate, the main wrapping post is between the first end plate and second end plate, the first end plate and described second
The edge of end plate exceeds the main wrapping post and surrounds main winding slot jointly with the main wrapping post.
Optionally, in above-mentioned inductance framework, the axis of the main wrapping post perpendicular to horizontal plane, the first end plate
Side directed downwardly is the joint face.
Optionally, it in above-mentioned inductance framework, is provided in the first end plate downwardly convex by the middle part of the joint face
The joint face is divided into two parts, set respectively on joint face described in each section by separation boss out, the separation boss
A part of conductive solder part is set, and welds binding face and exceeds the separation boss or concordant with the separation boss.
Optionally, it in above-mentioned inductance framework, is provided in the first end plate first embedding for being embedded in the first magnetic core
Conjunction portion, the conductive solder part are divided into the two sides that two parts are separately positioned on the first fitting portion.
Optionally, in above-mentioned inductance framework, the axis of the main wrapping post is parallel to horizontal plane, the first end plate with
And the second end plate side directed downwardly is the joint face, a part of conductive solder part is located at the first end plate
Lower section, conductive solder part described in another part are located at the lower section of second end plate.
Optionally, it in above-mentioned inductance framework, is provided in the first end plate first embedding for being embedded in the first magnetic core
Conjunction portion, the second fitting portion for being embedded in the second magnetic core is provided on second end plate, and the first fitting portion will be located at institute
It states the joint face in first end plate and is divided into opposite two parts, the second fitting portion will be located on second end plate
The joint face be divided into opposite two parts, the conductive solder is all covered with below joint face described in each section
Part.
Optionally, in above-mentioned inductance framework, the insertion hole of perforation is provided in the main wrapping post.
Optionally, in above-mentioned inductance framework, the main winding section, which has, is inwardly recessed the use formed by the joint face
In the accommodating chamber of fixed winding, the conductive solder part is arranged around the accommodating chamber.
Optionally, in above-mentioned inductance framework, the conducting wire accommodating area is the wire casing being arranged on the welding binding face.
Optionally, in above-mentioned inductance framework, the wire casing is by slot bottom to notch in gradually wealthy structure.
Optionally, in above-mentioned inductance framework, the wire casing penetrates through the opposite two sides of the conductive solder part.
Optionally, in above-mentioned inductance framework, limiting slot is provided on the main winding section, one end of the limiting slot is prolonged
Extend to the wire casing.
Optionally, in above-mentioned inductance framework, the whole joint faces of conductive solder part covering, the conductive solder
The passing channel for being connected to the wire casing and the limiting slot is additionally provided on part.
Optionally, in above-mentioned inductance framework, the passing channel is cable-through hole or crosses line notch.
Optionally, in above-mentioned inductance framework, the conductive solder part is laminated structure.
Optionally, in above-mentioned inductance framework, the conductive solder part is bonded with the joint face or hot-melt adhesive paste.
Optionally, in above-mentioned inductance framework, the bottom of the main winding section is provided with area extension, the joint face
For the area extension surface directed downwardly.
Second aspect, the embodiment of the present application provide a kind of inductance device, including winding and the inductance framework；
The winding is formed around the home by the conducting wire with insulation sheath and is had input lead and output lead, it is described around
Group is fixed on the main winding section, and the input lead and the output lead are placed in the two of mutually insulated respectively
In the conducting wire accommodating area of a conductive solder part.
Optionally, in above-mentioned inductance device, when the main winding section has main wrapping post, first end plate and second end
Plate, the main wrapping post is between the first end plate and second end plate, the first end plate and described second
When the edge of end plate exceeds the main wrapping post and surrounds the main winding slot jointly with the main wrapping post, the winding around
It sets in the main winding slot.
Optionally, in above-mentioned inductance device, the main winding section is made of magnetic material.
Optionally, in above-mentioned inductance device, the main winding section is made of non magnetic material, and the inductance device also wraps
The first magnetic core and the second magnetic core are included, first magnetic core is buckled in the first end plate, and second magnetic core is buckled in described
On two end plates.
Optionally, in above-mentioned inductance device, the insertion hole of perforation, the first end plate are provided in the main wrapping post
On be provided with first fitting portion for embedded magnetic core, be provided on second end plate chimeric for the second of embedded magnetic core
Portion, the insertion hole are connected to the first fitting portion and the second fitting portion；
First magnetic core is embedded in the first fitting portion and a part of first magnetic core protrudes into the insertion hole
Interior, a part of second magnetic core is embedded in the second fitting portion and a part of second magnetic core protrudes into the insertion
In hole.
Optionally, in above-mentioned inductance device, first magnetic core and second magnetic core are in E shape, the E shape
Intermediate extension is center column, and the newel of first magnetic core and second magnetic core is inserted into the insertion hole
It is interior.
Optionally, in above-mentioned inductance device, the conducting wire with insulation sheath is flat wire, enameled wire, multi cord, three layers
Any one in line, silk-covered wire.
Optionally, it in above-mentioned inductance device, is formed when the main winding section has to be inwardly recessed by the joint face
For fixing the accommodating chamber of winding, when the conductive solder part is arranged around the accommodating chamber, the inductance device further includes ring
Shape magnetic core, for the winding around the home on the toroidal core, the toroidal core is fixed on the appearance together with the winding
It receives intracavitary.
The third aspect, the embodiment of the present application provide a kind of lamps and lanterns, including lamp body, light source module group and driving mould group；Institute
It states light source module group and the driving mould group is arranged on the lamp body and is electrically connected between each other, the driving mould group includes
Wiring board is provided with the inductance device on the wiring board.
The embodiment of the present application use at least one above-mentioned technical solution can reach it is following the utility model has the advantages that
Inductance framework, inductance device provided by the embodiment of the present application and lamps and lanterns on the joint face of main winding section by covering
Lid conductive solder part accommodating conducting wire is simultaneously bonded with circuit board, and the area occupied of inductance device can be made to be greatly reduced.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the configuration schematic diagram of vertical inductance device provided by the embodiments of the present application；
Fig. 2 is the stereochemical structure view of vertical inductance framework shown in FIG. 1；
Fig. 3 is the main view of vertical inductance device shown in FIG. 1；
Fig. 4 is the horizontal inductance device that the first magnetic core provided by the embodiments of the present application and the second magnetic core fasten along the horizontal plane
Configuration schematic diagram；
Fig. 5 is the stereochemical structure view of horizontal inductance framework shown in Fig. 4；
Fig. 6 is the bottom view of horizontal inductance device shown in Fig. 4；
Fig. 7 is the horizontal inductance device that the first magnetic core provided by the embodiments of the present application and the second magnetic core are fastened along vertical plane
Configuration schematic diagram；
Fig. 8 is the stereochemical structure view of horizontal inductance framework shown in Fig. 7；
Fig. 9 is the bottom view of horizontal inductance device shown in Fig. 7；
Figure 10 is the explosion knot of the inductance device provided by the embodiments of the present application using inductance framework made of magnetic material
Structure schematic diagram；
Figure 11 is the stereochemical structure view of inductance framework shown in Fig. 10；
Figure 12 is the bottom view of inductance device shown in Fig. 10；
Figure 13 is that the detonation configuration provided by the embodiments of the present application using accommodating chamber and the inductance device of toroidal core shows
It is intended to；
Figure 14 is the stereochemical structure view of inductance framework shown in Figure 13；
Figure 15 is the bottom view of inductance device shown in Figure 13.
Description of symbols:
The main winding section 1- inductance framework, 10-, the main winding slot of 100-, the main wrapping post of 101-, 101a- are inserted into hole, 102- first
End plate, 102a- first fitting portion, the second end plate of 103-, 103a- second fitting portion, 104- limiting slot, 105- area extension,
106- joint face, 107- separate boss, 108- accommodating chamber, 11- conductive solder part, 110- welding binding face, the accommodating of 111- conducting wire
Area/wire casing, 111a- notch, 111b- slot bottom, 112- passing channel, 2- winding, 20- input lead, 21- output lead, 3-
One magnetic core, 30- newel, the second magnetic core of 4-, 40- newel, 5- adhesive tape, 6- toroidal core.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall in the protection scope of this application.
Below in conjunction with attached drawing, the technical scheme provided by various embodiments of the present application will be described in detail.
The embodiment of the present application discloses a kind of inductance device, the inductance device can be applied to LED illumination product such as floodlight tube,
In all kinds of illuminator products such as ball bubble, illumination module, ceiling lamp, street lamp, bulkhead lamp, in addition to this, which can also
To be applied in the product of other electronic fields.Lamps and lanterns product usually may include lamp body, light source module group and driving mould group, light source
Mould group and driving mould group are arranged on lamp body and are electrically connected between each other, and light source module group drives for issuing illuminating ray
Mould group is for driving light source module group, and driving mould group includes wiring board, and inductance device is just arranged in the circuit board.Such as Fig. 1 to Figure 15
It is shown, including inductance framework 1 and winding 2, in addition to this, inductance device usually may also include the first magnetic core 3, the second magnetic core 4
And obstrusive tape 5.
Inductance framework 1 in the present embodiment includes main winding section 10 and at least two conductive solder parts 11, specifically, master
Winding section 10 can be manufactured using insulating materials.For fixing winding 2, winding 2 can use flat wire, enamel-cover for main winding section 10
The conducting wire with insulation sheath such as line, multi cord, three layer lines or silk-covered wire is around the home.Main winding section 10 is also equipped with connection directed downwardly
Face 106.Those skilled in the art should know, the joint face 106 in the present embodiment is the face for being originally used for connecting PCB board, because
This its bottom that should be located at main winding section 10.
As shown, conductive solder part 11 is located at the lower section of joint face 106 and at least covering part joint face 106, it is conductive
Weldment 11 is fixedly connected with main winding section 10, and conductive solder part 11 can be by modes and the joint face 106 such as being bonded or heating
It is directly connected to, or (or being referred to as to fix) In can also be covered by way of being connected and fixed with the other positions in main winding section 10
The lower section of joint face 106.I.e. conductive solder part 11 will replace the position of script joint face 106 to connect with pcb board.Conductive solder part
11 can be entirely located in the lower section of joint face 106, may lead to conduction since 106 area of joint face is smaller in some embodiments
Weldment 11 needs drop shadow spread of the part beyond joint face 106 and main winding section 10, but the lower section due to there is joint face 106
Region can be used, therefore usually without departing from too many.And, it is generally the case that when needing the area of conductive solder part 11 super
It, can be by the way that the biggish area extension 105 of area be formed on the bottom of main winding section 10 out when 106 area of joint face of script
(Fig. 5,8,14) extend the area of joint face 106, to guarantee that conductive solder part 11 is still entirely located under joint face 106
Citing, is illustrated by side below.
As shown in Fig. 2,3,5,6,8,9,11,12,14,15, conductive solder part 11 is away from joint face 106 in the present embodiment
Side is welding binding face 110, i.e., for being bonded the face of welding with pcb board, at the same time, has conducting wire on conductive solder part 11
Accommodating area 111, the present embodiment there are certain requirements the size of conducting wire accommodating area 111, should meet: when the conducting wire of winding 2 is held
Without departing from welding binding face 110 when being placed in conducting wire accommodating area 111.Conducting wire accommodating area 111 in the present embodiment be through-hole or its
It does not extend to the structure of welding binding face 110, and conducting wire accommodating area 111 can be using the structure that can arbitrarily accommodate conducting wire at this time
Form not will lead to conducting wire beyond welding binding face 110.
In addition, the conducting wire accommodating area 111 in the present embodiment may be the wire casing being arranged on welding binding face 110.This
When in order to make conducting wire without departing from welding binding face 110, wire casing 111 (for ease of description, hereafter continues to use the attached drawing of conducting wire accommodating area
Label) depth at least will be equal to conducting wire diameter.Compared with through-hole, wire casing 111 is due to easily facilitating and leading for Open architecture
Line enters, and scolding tin can also be accommodated, to obtain better welding effect in addition to that can accommodate conducting wire in wire casing 111.Line
Slot 111 is designed to by slot bottom 111b to notch 111a in gradually wealthy structure, for example, its cross section can with semicircular in shape, it is trapezoidal,
The various possible gradually wealthy structures such as triangle, toroidal.This gradually wealthy structure on the one hand conducting wire can be guided to width compared with
Small slot bottom is positioned, and on the other hand can also be accommodated more scolding tin and be possessed bigger scolding tin contact surface, be conducive to
Promote welding effect.Wire casing 111 can penetrate through the opposite two sides of conductive solder part 11, and the extending direction of wire casing 111 can basis
The conducting wire lead direction of winding 2 is designed, can also be towards any direction, and makes the extending direction of conducting wire cooperation wire casing 111
Carry out cabling.
As shown in Fig. 1,2,3,10,11, the input lead 20 and output lead 21 of winding 2 are extended to by main winding section 10
Wire casing 111 is required to extend a certain distance along main winding section 10.If this section lead do not have relatively-stationary track or
Path, can arbitrarily move, then may cause cabling inefficiency, even result in the relaxation of winding 2 or scatter.Therefore, this implementation
Example can be provided with limiting slot 104 on main winding section 10, and limiting slot 104 extends to wire casing 111 by main winding section 10.Conducting wire
It can be extended in the wire casing 111 of conductive solder part 11 along limiting slot 104 by main winding section 10, and when completing around postponing,
This section lead can be limited in limiting slot 104, can not arbitrarily move, to avoid the relaxation of winding 2.
In some embodiments, conductive solder part 11 would generally cover the whole region of joint face, and conducting wire needs logical at this time
The wire casing being located on welding binding face 110 can be arrived at by crossing the top that conductive solder part 11 is crossed in a more rapid bending
In 111.Especially when conductive solder part 11 itself is laminated structure, the bending amplitude of conducting wire is especially huge when thinner thickness, inconvenient
Assembly.Therefore as shown in Figures 2 and 3, the present embodiment can be additionally provided with connection wire casing 111 and limit on conductive solder part 11
The passing channel 112 of slot 104.Passing channel 112 can be the cable-through hole or notch being provided on conductive solder part 11.
11 one side of conductive solder part can be such that entire inductance device is welded on pcb board in the present embodiment, while may be used also
So that winding 2 accesses the circuit of pcb board by conductive solder part 11.Since winding 2 needs positive and negative both ends while accessing circuit, because
This is short-circuit in order to prevent, needs to access circuit by different conductive solder parts 11 respectively, therefore the present embodiment is in setting conductive solder
Part 11 is up to 11 mutually insulated of major general's two of them conductive solder part.The two conductive solder parts 11 can be respectively used to be electrically connected
The input lead 20 and output lead 21 of winding 2, so that winding 2 is smoothly accessed circuit.
In the embodiment of the present application, area occupied by inductance device is the occupied area of conductive solder part 11, and is led
A part of area of the electric welding fitting 11 due to that can utilize 106 lower section of joint face, can make the area occupied of inductance device
It is greatly reduced, to save the area of the circuit board of occupancy, keeps board structure of circuit more compact or other more necessary members of arrangement
Part is to reduce cost.
In the present embodiment, for the ease of layout, joint face 106 can be divided into two parts by a dividing strip, simultaneously
Conductive solder part 11 is correspondingly connected with face and is also classified into two parts, a part of conductive weldering is respectively set on each section joint face 106
Fitting 11 can be spaced larger distance between the conductive solder part 11 of different piece, to realize mutually insulated.Winding
2 input lead 20 and output lead 21 can be electrically connected by opposite two sides and not ipsilateral conductive solder part 11 respectively
It connects, implements and be also relatively easy to.Dividing strip can be entity, such as be tied by slot, hole, the boss etc. on joint face 106
Joint face 106 is truly divided into two parts by structure.Alternatively, dividing strip may also be only imaginary, practical joint face 106 remains as one
A entirety.
As shown in Figures 1 to 12, in some embodiments of the present application, main winding section 10 can have main wrapping post 101,
End plate 102 and the second end plate 103, main wrapping post 101 are located between first end plate 102 and the second end plate 103, first end
The edge of plate 102 and the second end plate 103 exceeds main wrapping post 101 and surrounds main winding slot jointly with main wrapping post 101
100, winding 2 is around the home in main winding slot 100.
Main winding section 10 can be made of nonmagnetic material, and in order to reduce cost, material is recommended to use phenoplasts.
At this time as shown in Figures 1 to 9, the first fitting portion for being embedded in the first magnetic core 3 can be set in first end plate 102
102a, while the second fitting portion 103a for being embedded in the second magnetic core 4 can be set on the second end plate 103.Main wrapping post
The insertion hole 101a of perforation, insertion hole 101a connection first fitting portion 102a and second fitting portion are also provided in 101
103a。
In assembly, the first magnetic core 3 will be embedded in first fitting portion 102a, and a part of the first magnetic core 3 will protrude into
It is inserted into the 101a of hole, such as the first magnetic core 3 is in E shape, the intermediate extension of E shape is center column 30, then newel 30 will protrude into
It is inserted into the 101a of hole.At the same time, a part of the second magnetic core 4 will be embedded in second fitting portion 103a, and the second magnetic core 4
A part also protrudes into insertion hole 101a, such as the second magnetic core 4 can also be in E shape, and the intermediate extension of E shape is center column
40, then newel 40 will protrude into insertion hole 101a.Then it is covered the extension of 4 two sides of first magnetic core 3 and the second magnetic core
Cover the periphery in winding 2.It is fixedly secured the first magnetic core 3 and the second magnetic core 4, it can be in the periphery of the first magnetic core 3 and the second magnetic core 4
Winding adhesive tape 5 is fixed.
On the basis of above structure, according to the difference of the axis direction of main wrapping post 101, and inductance device can be divided into
Vertical inductance device and horizontal inductance device.
As shown in Figure 1 to Figure 3, for vertical inductance device, the axis of the main wrapping post 101 of inductance framework 1 perpendicular to
Horizontal plane, first end plate 102 are in the bottom of main wrapping post 101, and the second end plate 103 is in the top of main wrapping post 101, at this time
The side directed downwardly of first end plate 102 is joint face 106.It, can be in first end when vertical inductance device applies above-mentioned layout
Two parts conductive solder part 11 is respectively set in the opposite two sides in the lower section of plate 102.As shown in Figures 2 and 3, due to first fitting portion
102a just can be used as marker, divide joint face 106 for two parts by dividing strip of first fitting portion 102a, two parts are led
Electric welding fitting 11 can be separately positioned on the two sides of first fitting portion 102a.First fitting portion 102a can will connect for slot structure etc.
Junction 106 separates a part, or even is divided into mutually independent two parts completely.Therefore, two parts conduction need to only be welded at this time
Fitting 11 is separately positioned on the two sides of first fitting portion 102a, and separation and insulation knot can be served as using first fitting portion 102a
Structure makes two parts conductive solder part 11 of two sides insulate naturally.It, can be by order to adapt to the conductive solder part 11 of larger area
The size of end plate 102 integrally do it is larger, make its than the second end plate 103 have bigger area to carry conductive solder part
11。
As shown in Figures 4 to 6, for horizontal inductance device, the axis of main wrapping post 101 will be parallel to horizontal plane, this
When first end plate 102 and the second end plate 103 be located at the left and right ends of main wrapping post 101, at this time can be by first end plate
102 and the side directed downwardly of the second end plate 103 be used as joint face 106.Due between first end plate 102 and the second end plate 103
This two parts joint face 106 for being separated by main wrapping post 101, therefore being located on first end plate 102 and the second end plate 103
It itself can regard the mutually independent two parts being separated to form by first dividing strip as.It at this time only need to be by a part of conductive weldering
Fitting 11 is set to the lower section of first end plate 102, and another part conductive solder part 11 is set under the second end plate 103
Side, just can also make two-part conductive solder part 11 insulate naturally.In the present embodiment, due to first end plate 102 and second end
The finite thickness of plate 103, therefore in order to accept the conductive solder part 11 of larger area, it can be in first end plate 102 and second
The bottom of end plate 103 is respectively provided with an area extension 105 to increase joint face in the size of the axis direction of main wrapping post 101,
And then improve the area of joint face.
For some inductance devices, may thereon winding 2 around the home quantity more than one, such as while around the home
There are two even more windings 2, and the quantity of input lead 20 and output lead 21 also needs double at this time, therefore also just need
The conductive solder part 11 of more mutually insulateds.Or inductance framework 1 needs to adapt to different types of winding 2, and every kind around
2 input leads 20 drawn of group and the extraction location of output lead 21 are not quite similar, in order to make input lead 20 with it is defeated
Conducting wire 21 is not necessarily to too long transport path out, therefore conductive solder can also be respectively set in multiple angles on inductance framework 1
Part 11.
Either for which kind of above purpose, a plurality of dividing strip that can be intersected joint face 106 is divided into multiple
Part, while conductive solder part 11 is correspondingly connected with face and is also accordingly divided into multiple portions, and is divided on each section joint face 106
A part of conductive solder part 11 is not set, and makes 11 mutually insulated of conductive solder part of different piece.Just there is sufficient amount in this way
And the conductive solder part 11 in orientation enough is available, makes the versatility of inductance framework 1 more preferably.
It is one of since there are two types of manners for the first magnetic core 3 and the second magnetic core 4 for horizontal inductance device
Mode is that (referring to fig. 4 to Fig. 6), magnetic core by the bottom of main winding section 10 without being passed through for fastening along the horizontal plane.And another way
It is that (referring to Fig. 7 to Fig. 9), magnetic core will still be passed through by the bottom of main winding section 10 in this mode, therefore along vertical plane fastening
First fitting portion 102a and second fitting portion 103a needs to extend respectively to the bottom of first end plate 102 and the second end plate 103.
It on this basis, can be using first fitting portion 102a and second fitting portion 103a as second intersected with first dividing strip
Dividing strip, first fitting portion 102a are a part of Article 2 dividing strip, for by the joint face 106 in first end plate 102
It is divided into opposite two parts again, at the same time, second fitting portion 103a is another part of Article 2 dividing strip, and being used for will
Joint face 106 on second end plate 103 is divided into opposite two parts again, i.e., joint face 106 is divided into altogether four at this time
Part, the lower section of each section joint face 106 are all covered with conductive solder part 11.At this time due to the face of every part joint face 106
Product is smaller, therefore can correspond to each section joint face and be respectively provided with an area extension 105, and area extension 105 exists at this time
The axis direction of main wrapping post 101 and with can exceed first end plate 102 and the second end plate on the direction of axis perpendicular
103, to obtain bigger joint face to carry conductive solder part 11.
As shown in Figure 10 to 12, the main winding section 10 in the present embodiment can also be made of magnetic material, at this time inductance
Device can integrally save additional magnetic core.When the axis of main wrapping post 101 is perpendicular to horizontal plane, first end plate 102 it is directed downwardly
When side is joint face 106, the separation boss downwardly projecting by the middle part of joint face 106 can be set in first end plate 102
107, joint face 106 can be divided into two parts by separating boss 107, and a part is respectively set on each section joint face 106 and leads
It is welded fitting 11, therefore the conductive solder part 11 for being located at different piece can be with natural separation, to reach mutually insulated.Separate boss
107 cannot protrude too much, it is ensured that welding binding face 110 is concordant beyond separation boss 107 or with boss 107 is separated, with satisfaction
Welding requirements.
In addition to the foregoing structure, the embodiment of the present application also provides another inductance device structures.Such as the institute of Figure 13 to 15
Show can there is the accommodating chamber 108 for being used to fix winding 2 for being inwardly recessed and being formed by joint face 106, conduction weldering on main winding section 10
Fitting 11 is arranged on joint face 106 around accommodating chamber 108.At the same time, which further includes toroidal core 6, winding 2
Around the home on toroidal core 6, toroidal core 6 and winding 2 are together fixed in accommodating chamber 108.
Can be with a winding 2 around the home on same toroidal core 6, it can also multiple windings 2 around the home simultaneously.Toroidal core 6 with
Winding 2 can be fixed in accommodating chamber 108 by modes such as clamping, gluings.Under normal conditions, the profile of accommodating chamber 108 is
Circle, and the whole outer profile of main winding section 10 can be for square prism structure that joint face 106 is bottom, positive eight prism structure
Or other prism structures.
In the present embodiment, due to joint face 106 be usually around accommodating chamber 108 one circle narrow side, limited area, therefore
Above-described embodiment is referred in the different parts setting area extension 105 around accommodating chamber 108, to extend joint face 106
Area.
Also, the main winding section 10 in the present embodiment can be both made of nonmagnetic material, can also use magnetic cup
Material is covered to be made.When main winding section 10 is made of magnetic shielding material, good Magnetic Shielding Effectiveness can be realized, reduce inductance
Magnetic disturbance of the device to other elements around.
In conclusion inductance framework, inductance device provided by the embodiment of the present application and lamps and lanterns can substantially reduce inductance
The occupied area of device.
Emphasis describes the difference between each embodiment, difference between each embodiment in the application foregoing embodiments
As long as optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, then no longer superfluous at this
It states.
The above is only embodiments herein, are not intended to limit this application.To those skilled in the art,
Various changes and changes are possible in this application.It is all within the spirit and principles of the present application made by any modification, equivalent replacement,
Improve etc., it should be included within the scope of the claims of this application.
Claims (29)
1. a kind of inductance framework, which is characterized in that including main winding section and at least two conductive solder parts；
The main winding section is for fixing winding, and the main winding section has joint face directed downwardly, and the conductive solder part is located at
Joint face described in the lower section of the joint face and at least covering part, the conductive solder part are fixedly connected with the main winding section
And at least two conductive solder part mutually insulated；
The conductive solder part is welding binding face away from the side of the joint face, on the conductive solder part there is conducting wire to hold
Area is set, the conducting wire accommodating area meets: when the conducting wire of winding is placed in the conducting wire accommodating area without departing from the welding
Binding face.
2. inductance framework according to claim 1, which is characterized in that the joint face is divided into two by a dividing strip
Point, the conductive solder part corresponds to the joint face and is divided into two parts, and a part is respectively set on joint face described in each section
The conductive solder part, the conductive solder part mutually insulated of different piece.
3. inductance framework according to claim 1, which is characterized in that a plurality of dividing strip that the joint face is intersected separates
For multiple portions, the conductive solder part corresponds to the joint face and is accordingly divided into multiple portions, on joint face described in each section
A part of conductive solder part, the conductive solder part mutually insulated of different piece is respectively set.
4. inductance framework according to claim 1, which is characterized in that the main winding section has main wrapping post, first end
Plate and the second end plate, the main wrapping post is between the first end plate and second end plate, the first end plate
And the edge of second end plate exceeds the main wrapping post and surrounds main winding slot jointly with the main wrapping post.
5. inductance framework according to claim 4, which is characterized in that the axis of the main wrapping post perpendicular to horizontal plane,
The side directed downwardly of the first end plate is the joint face.
6. inductance framework according to claim 5, which is characterized in that be provided in the first end plate by the joint face
The downwardly projecting separation boss in middle part, the joint face is divided into two parts, connected described in each section by the separation boss
A part of conductive solder part is respectively set in junction, and welds binding face and exceeds the separation boss or convex with the separation
Platform is concordant.
7. inductance framework according to claim 5, which is characterized in that be provided in the first end plate for being embedded in first
The first fitting portion of magnetic core, the conductive solder part are divided into the two sides that two parts are separately positioned on the first fitting portion.
8. inductance framework according to claim 4, which is characterized in that the axis of the main wrapping post is parallel to horizontal plane,
The first end plate and the second end plate side directed downwardly are the joint face, and a part of conductive solder part is located at
The lower section of the first end plate, conductive solder part described in another part are located at the lower section of second end plate.
9. inductance framework according to claim 8, which is characterized in that be provided in the first end plate for being embedded in first
The first fitting portion of magnetic core is provided with the second fitting portion for being embedded in the second magnetic core on second end plate, and described first is embedding
The joint face being located in the first end plate is divided into opposite two parts by conjunction portion, and the second fitting portion will be located at institute
It states the joint face on the second end plate and is divided into opposite two parts, institute is all covered with below joint face described in each section
State conductive solder part.
10. inductance framework according to any one of claims 7 to 9, which is characterized in that be provided with and pass through in the main wrapping post
Logical insertion hole.
11. inductance framework according to claim 1, which is characterized in that the main winding section have by it is described connection towards
What is be inside concavely formed is used to fix the accommodating chamber of winding, and the conductive solder part is arranged around the accommodating chamber.
12. according to claim 1 to 9,11 described in any item inductance frameworks, which is characterized in that the conducting wire accommodating area is to set
Set the wire casing on the welding binding face.
13. inductance framework according to claim 12, which is characterized in that the wire casing is by slot bottom to notch in gradually wealthy knot
Structure.
14. inductance framework according to claim 12, which is characterized in that it is opposite that the wire casing penetrates through the conductive solder part
Two sides.
15. inductance framework according to claim 12, which is characterized in that be provided with limiting slot on the main winding section, institute
The one end for stating limiting slot extends to the wire casing.
16. inductance framework according to claim 15, which is characterized in that conductive solder part covering all connections
Face is additionally provided with the passing channel for being connected to the wire casing and the limiting slot on the conductive solder part.
17. inductance framework according to claim 16, which is characterized in that the passing channel is cable-through hole or line lacks excessively
Mouthful.
18. according to claim 1 to 9,11 described in any item inductance frameworks, which is characterized in that the conductive solder part is piece
Shape structure.
19. according to claim 1 to 9,11 described in any item inductance frameworks, which is characterized in that the conductive solder part and institute
State joint face fitting or hot-melt adhesive paste.
20. according to claim 1 to 9,11 described in any item inductance frameworks, which is characterized in that the bottom of the main winding section
It is provided with area extension, the joint face is the area extension surface directed downwardly.
21. a kind of inductance device, which is characterized in that including winding and the described in any item inductance frameworks of claim 1 to 20；
The winding is formed around the home by the conducting wire with insulation sheath and has input lead and output lead, the winding quilt
It is fixed on the main winding section, the input lead and the output lead are placed in two institutes of mutually insulated respectively
It states in the conducting wire accommodating area of conductive solder part.
22. inductance device according to claim 21, which is characterized in that when the main winding section has main wrapping post, the
End plate and the second end plate, the main wrapping post is between the first end plate and second end plate, and described first
The edge of end plate and second end plate exceed the main wrapping post and with the main wrapping post surround jointly the master around
When wire casing, the winding is around the home in the main winding slot.
23. inductance device according to claim 22, which is characterized in that the main winding section is made of magnetic material.
24. inductance device according to claim 22, which is characterized in that the main winding section is made of non magnetic material,
The inductance device further includes the first magnetic core and the second magnetic core, and first magnetic core is buckled in the first end plate, and described
Two magnetic cores are buckled on second end plate.
25. inductance device according to claim 24, which is characterized in that be provided with the insertion of perforation in the main wrapping post
Hole is provided with the first fitting portion for embedded magnetic core in the first end plate, is provided on second end plate for being embedded in
The second fitting portion of magnetic core, the insertion hole are connected to the first fitting portion and the second fitting portion；
First magnetic core is embedded in the first fitting portion and a part of first magnetic core protrude into it is described insert in the hole, institute
The a part for stating the second magnetic core is embedded in the second fitting portion and a part of second magnetic core protrudes into described insert in the hole.
26. inductance device according to claim 25, which is characterized in that first magnetic core and second magnetic core are equal
In E shape, the intermediate extension of the E shape is center column, the newel of first magnetic core and second magnetic core
Insert in the hole described in insertion.
27. inductance device according to claim 21, which is characterized in that when the main winding section has by the joint face
It is inwardly recessed the accommodating chamber for being used to fix winding to be formed, when the conductive solder part is arranged around the accommodating chamber, the electricity
Induction device further includes toroidal core, and the winding is around the home on the toroidal core, and the toroidal core is together with the winding
It is fixed in the accommodating chamber.
28. according to the described in any item inductance devices of claim 21 to 27, which is characterized in that be with the conducting wire of insulation sheath
Flat wire, enameled wire, multi cord, three layer lines, any one in silk-covered wire.
29. a kind of lamps and lanterns, which is characterized in that including lamp body, light source module group and driving mould group；
The light source module group and the driving mould group are arranged on the lamp body and are electrically connected between each other, the driving mould
Group includes wiring board, is provided with the described in any item inductance devices of claim 21 to 28 on the wiring board.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910906703.3A CN110517868A (en) | 2019-09-24 | 2019-09-24 | Inductance framework, inductance device and lamps and lanterns |
| PCT/CN2020/115510 WO2021057566A1 (en) | 2019-09-24 | 2020-09-16 | Inductive framework, inductive device, and lamp |
| EP20867268.3A EP3979274B1 (en) | 2019-09-24 | 2020-09-16 | Inductive framework, inductive device, and lamp |
| US17/565,308 US20220122764A1 (en) | 2019-09-24 | 2021-12-29 | Inductor framework, inductor device and lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910906703.3A CN110517868A (en) | 2019-09-24 | 2019-09-24 | Inductance framework, inductance device and lamps and lanterns |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110517868A true CN110517868A (en) | 2019-11-29 |
Family
ID=68633643
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910906703.3A Pending CN110517868A (en) | 2019-09-24 | 2019-09-24 | Inductance framework, inductance device and lamps and lanterns |
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| CN (1) | CN110517868A (en) |
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