CN110516199A - To the disturbance degree calculation method and wiring board of the influence factor of characteristic impedance - Google Patents

To the disturbance degree calculation method and wiring board of the influence factor of characteristic impedance Download PDF

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CN110516199A
CN110516199A CN201910790623.6A CN201910790623A CN110516199A CN 110516199 A CN110516199 A CN 110516199A CN 201910790623 A CN201910790623 A CN 201910790623A CN 110516199 A CN110516199 A CN 110516199A
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influence factor
influence
value
characteristic impedance
impedance
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CN110516199B (en
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陈丽琴
王国
李艳国
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Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
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Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
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    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10Complex mathematical operations
    • G06F17/18Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/025Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0005Apparatus or processes for manufacturing printed circuits for designing circuits by computer

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Abstract

The invention discloses the disturbance degree calculation methods and wiring board of the influence factor of a kind of pair of characteristic impedance.Disturbance degree calculation method to the influence factor of characteristic impedance is the following steps are included: obtain the corresponding coefficient value of influence factor;Obtain the corresponding deviation calculated value of influence factor;Corresponding influence factor is calculated to the influence value of characteristic impedance according to the first equation and based on coefficient value and deviation calculated value;All influence factors are calculated to the disturbance degree of characteristic impedance according to second equation and based on calculated each influence value.The disturbance degree calculation method of the influence factor to characteristic impedance, single influence factor is calculated to the influence value of characteristic impedance by the first equation, later, all influence factors are calculated to the influence degree of characteristic impedance by second equation again, so that each influence factor is calculated as possibility to the disturbance degree of characteristic impedance.

Description

To the disturbance degree calculation method and wiring board of the influence factor of characteristic impedance
Technical field
The present invention relates to wiring board processing technique fields, more particularly to the influence of the influence factor of a kind of pair of characteristic impedance Spend calculation method.
Background technique
With the continuous development of electronic information industry, more and more high speed signal PCB have characteristic impedance consistency It is required that the allowance control of characteristic impedance increasingly tests the technical level of wiring board production manufacturer.
The influence factor that can be had an impact to characteristic impedance is more, however, the undulating value up and down of each influence factor is to spy The disturbance degree of property impedance value does not have correlation model that can calculate, and leads to not each influence in front end on influencing characterisitic impedance value Factor is adjusted and manages, and brings puzzlement to quality control.
Summary of the invention
Based on this, it is necessary to the disturbance degree calculation method and wiring board of the influence factor of a kind of pair of characteristic impedance are provided, it should What each influence factor finally generated characteristic impedance can be calculated to the disturbance degree calculation method of the influence factor of characteristic impedance Influence degree;The wiring board use in process of production the disturbance degree calculation method of the influence factor above-mentioned to characteristic impedance into Row calculates the disturbance degree of the influence factor of characteristic impedance.
Its technical solution is as follows:
On the one hand, the disturbance degree calculation method of the influence factor of a kind of pair of characteristic impedance is provided, to the shadow of characteristic impedance The factor of sound at least one, disturbance degree calculation method to the influence factor of characteristic impedance the following steps are included:
Obtain the corresponding coefficient value of influence factor;
Obtain the corresponding deviation calculated value of influence factor;
Corresponding influence factor is calculated to the shadow of characteristic impedance according to the first equation and based on coefficient value and deviation calculated value Ring value;
All influence factors are calculated to the shadow of characteristic impedance according to second equation and based on calculated each influence value Loudness;
First equation are as follows:
Yi=ki*Xi
Second equation are as follows:
Z=[∑ (Yi 2)]0.5
Wherein, i is the number of influence factor and takes positive integer, kiFor the corresponding coefficient value of i-th of influence factor, XiIt is The corresponding deviation calculated value of i influence factor, YiBe i-th of influence factor to the influence value of characteristic impedance, Z by had an impact because Disturbance degree of the element to characteristic impedance.
Single influence is calculated by the first equation in the disturbance degree calculation method of the above-mentioned influence factor to characteristic impedance All influence factors are calculated to the shadow of characteristic impedance to the influence value of characteristic impedance, and then by second equation in factor The degree of sound, so that each influence factor is calculated as possibility to the disturbance degree of characteristic impedance.
Technical solution is illustrated further below:
Coefficient value is transferred from presetting database based on the first preset requirement and is obtained in one of the embodiments,.
Corresponding coefficient value is true by following steps in the preset database for influence factor in one of the embodiments, It is fixed:
It obtains the deviation calculated value of influence factor and obtains multiple groups deviation calculated value;
Influence factor is obtained to the influence value of characteristic impedance and obtains multiple groups influence value;
Deviation calculated value and influence value are handled according to the first presetting method and obtain calculating influence value and deviation Coefficient value in a linear relationship between value.
The first presetting method is linear regression method in one of the embodiments,.
The step of obtaining the corresponding coefficient value of influence factor in one of the embodiments, include:
Obtain the circuit types of the impedance line of wiring board:
Based on circuit types and obtain coefficient value corresponding with circuit types.
Deviation calculated value is deviation percent or/and deviation in one of the embodiments,.
Influence factor includes in line width, line thicknesses, dielectric thickness and resist thickness in one of the embodiments, Wherein at least one.
The corresponding deviation calculated value of line width uses deviation percent in one of the embodiments,;
The corresponding deviation calculated value of line thicknesses uses deviation;
The corresponding deviation calculated value of dielectric thickness uses deviation percent;
The corresponding deviation calculated value of resist thickness uses deviation percent.
The line width range of line width is 3.0mil-15mil in one of the embodiments,;
The thickness range of line thicknesses is 0.5mil-2.0mil;
The thickness range of dielectric thickness is 3.0mil-10mil;
It is 0.5mil-3.0mil in the Thickness Method of resist thickness.
On the other hand, additionally provide a kind of wiring board, using as described in any one above-mentioned technical solution to characteristic impedance The disturbance degree calculation method of influence factor the disturbance degree of the influence factor of characteristic impedance is calculated.
Above-mentioned wiring board is calculated by the disturbance degree of the influence factor to characteristic impedance, so as in production Each influence factor is adjusted and is managed, the processing quality for the wiring board for obtaining processing is more preferable.
Detailed description of the invention
Fig. 1 is the flow chart of the disturbance degree calculation method in embodiment to the influence factor of characteristic impedance;
Fig. 2 is the coefficient value curve graph of the line width in embodiment and treated rectilinear.
Specific embodiment
The embodiment of the present invention is described in detail with reference to the accompanying drawing:
It should be noted that it can be directly in another element when alleged element is with another element " fixation " in text Above or there may also be elements placed in the middle.When an element is considered as with another element " connection ", it be can be directly It is connected to another element in succession or may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element When "upper", intermediary element is not present.Term as used herein "vertical", "horizontal", "left" and "right" and similar table It states for illustrative purposes only, is not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more Any and all combinations of relevant listed item.
Please refer to Fig. 1, the disturbance degree calculation method of the influence factor of a kind of pair of characteristic impedance, influence to characteristic impedance because Element at least one, disturbance degree calculation method to the influence factor of characteristic impedance the following steps are included:
Obtain the corresponding coefficient value of influence factor;
Obtain the corresponding deviation calculated value of influence factor;
Corresponding influence factor is calculated to the shadow of characteristic impedance according to the first equation and based on coefficient value and deviation calculated value Ring value;
All influence factors are calculated to the shadow of characteristic impedance according to second equation and based on calculated each influence value Loudness;
First equation are as follows:
Yi=ki*Xi
Second equation are as follows:
Z=[∑ (Yi 2)]0.5
Wherein, i is the number of influence factor and takes positive integer, kiFor the corresponding coefficient value of i-th of influence factor, XiIt is The corresponding deviation calculated value of i influence factor, YiBe i-th of influence factor to the influence value of characteristic impedance, Z by had an impact because Disturbance degree of the element to characteristic impedance.
The disturbance degree calculation method of the influence factor to characteristic impedance, by the first equation be calculated it is single influence because Influence of all influence factors to characteristic impedance is calculated to the influence value of characteristic impedance, and then by second equation in element Degree, so that each influence factor is calculated as possibility to the disturbance degree of characteristic impedance.
Characteristic impedance: also known as " characteristic impedance ", in high-frequency range, in signals transmission, the place that signal edge reaches, Between signal wire and reference planes (power supply or ground level), due to the foundation of electric field, an immediate current can be generated, if transmission Line is isotropic, as long as there is an electric current I always then signal is transmitting, and if the output level of signal is V, in signals transmission, transmission line will be equivalent at a resistance, and size V/I is known as this equivalent resistance to pass The characteristic impedance Z of defeated line.During transmission, if the characteristic impedance in transmission path changes, signal will for signal Reflection is generated in the node of impedance discontinuity.Therefore, characteristic impedance is affected to the performance of wiring board.
The factor of influencing characterisitic impedance is more, and different influence factors is different to the influence degree of characteristic impedance, moreover, In In the case where difference, the effect for the factor that makes some difference is big, and the effect for the factor that makes some difference is small, needs to carry out according to specific circumstances Judgement.Therefore, in specific calculate, it can rule of thumb judge that the effect of which influence factor is big, the work of which influence factor With small, for can be ignored or the relatively small factor of influence factor, can not calculate directly, or rule of thumb will It is classified as some influence value, and others can play the influence factor of more influence then according to mode provided in this embodiment It is calculated, that is: firstly, obtaining the corresponding coefficient value of each influence factor and deviation calculated value;Then, according to the first equation Calculate the corresponding influence value of each influence factor;Then, by second equation on the corresponding influence of each influence factor Value carries out quadratic sum calculating, and opens radical sign processing, to obtain all influence factors to the entire effect of characteristic impedance.
It should be understood that i can take 1,2,3 ..., what is referred to is the number of influence factor;
∑ is the summation symbol in mathematical meaning, and those skilled in the art should know, repeat no more;
Deviation calculated value refers to influence factor difference relatively under normal circumstances or fluctuation percentage, to pass through influence value Coefficient value between deviation calculated value converts, and repeats no more.
In one embodiment, coefficient value is transferred from presetting database based on the first preset requirement and is obtained.
For the coefficient value of each influence factor, in specific calculate, system directly transfers the numerical value, without temporarily counting It calculates, promotes treatment effeciency when calculating.
Further, corresponding coefficient value is determined influence factor by following steps in the preset database:
It obtains the deviation calculated value of influence factor and obtains multiple groups deviation calculated value;
Influence factor is obtained to the influence value of characteristic impedance and obtains multiple groups influence value;
Deviation calculated value and influence value are handled according to the first presetting method and obtain calculating influence value and deviation Coefficient value in a linear relationship between value.
Namely: firstly, obtaining the multiple groups deviation calculated value of one of influence factor;Then, the same influence is obtained The influence value corresponding with said deviations calculated value of factor;Then, by the corresponding deviation calculated value of the influence factor and influence value It is corresponded to, and is handled, obtain the linear relationship between influence factor and deviation calculated value, that is, obtaining the influence factor pair The coefficient value answered.
The case where for two or more influence factors, is respectively adopted which and obtains the corresponding coefficient of each influence factor Value.
Further, the first presetting method is linear regression method.It, can be by multiple deviation calculated values by linear regression method Curved line relation between influence value is fitted to linear relationship, to finally obtain the corresponding coefficient value of the influence factor, linearly The Return Law is existing statistical procedures method, and those skilled in the art can be by searching for the related existing books such as statistical theory It obtains, which is not described herein again.
In one embodiment, the step of obtaining influence factor corresponding coefficient value include:
Obtain the circuit types of the impedance line of wiring board:
Based on circuit types and obtain coefficient value corresponding with circuit types.
The impedance line of wiring board is divided into two types, i.e., single-ended and difference, and the distribution of impedance line in the circuit board also divides For outer layer and internal layer, accordingly, there exist four kinds of situations, it may be assumed that internal layer is single-ended, internal layer difference, outer layer are single-ended and four kinds of feelings of outer layer difference Condition, four kinds of situations are explained as follows:
Internal layer is single-ended: impedance line carries out single line cabling and the internal layer circuit layer the case where;
Internal layer difference: impedance line carries out two-wire cabling and the internal layer circuit layer the case where;
Outer layer is single-ended: impedance line carries out single line cabling and the outer-layer circuit layer the case where;
Outer layer difference: impedance line carries out two-wire cabling and the outer-layer circuit layer the case where.
The circuit types of different types of impedance line can have an impact disturbance degree of the influence factor to characteristic impedance, because This, also just corresponds to different coefficient values, and needs the circuit types for the impedance line under different situations to distinguish and treat.
In one embodiment, deviation calculated value is deviation percent or/and deviation.
In one embodiment, influence factor includes its in line width, line thicknesses, dielectric thickness and resist thickness At least one of.
It is mainly that line width, line thicknesses, dielectric thickness and welding resistance are thick to the factor that characteristic impedance mainly has an impact Degree, and when different processing flows and route design, the size of different affecting factors can have differences, therefore, can The influence factor being affected is calculated according to practical situation, it is of course also possible to which various factors considers.
In fact, further including dielectric substrate dielectric constant and welding resistance oil to the influence factor that characteristic impedance mainly has an impact Black dielectric constant, however, dielectric substrate dielectric constant has also determined that in the case that dielectric thickness determines, and dielectric substrate is situated between The self character of electric constant inherently substrate influences to be also fixed, therefore, dielectric thickness and dielectric substrate dielectric constant Two factors need to only consider dielectric thickness;Similarly, which is not described herein again for resist thickness and solder mask dielectric constant.
For line width, the width of the route of line width namely line layer hinders characteristic calculating the influence factor It when anti-disturbance degree, needs to consider the circuit types of four kinds of different impedance lines, is respectively as follows: that internal layer is single-ended, internal layer difference, outer layer It is single-ended and four kinds of outer layer difference, the coefficient of correspondence value of every kind of line width being corresponding in corresponding situation.
For line thicknesses, the thickness of copper foil on the thickness namely substrate of line thicknesses namely line layer, with line width It is identical, it needs to consider the circuit types of four kinds of different impedance lines, it is single-ended and outer to be respectively as follows: single-ended internal layer, internal layer difference, outer layer Four kinds of difference of layer, the coefficient of correspondence value of every kind of line thicknesses being corresponding in corresponding situation.
For dielectric thickness, dielectric thickness namely plate thickness, need to consider outer layer is single-ended and outer layer difference in two kinds of situation, every kind It is corresponding with the coefficient of correspondence value of the dielectric thickness in corresponding situation.
For the thickness of resist thickness namely welding resistance green oil layer, since welding resistance exists only in the outer layer of wiring board, The circuit types for only needing to consider two different impedance lines, is respectively as follows: that outer layer is single-ended and two kinds of outer layer difference, and every kind corresponding There is the coefficient of correspondence value of the resist thickness in corresponding situation.
In one embodiment, the corresponding deviation calculated value of line width uses deviation percent.
In one embodiment, the corresponding deviation calculated value of line thicknesses uses deviation;
In one embodiment, the corresponding deviation calculated value of dielectric thickness uses deviation percent;
In one embodiment, the corresponding deviation calculated value of resist thickness uses deviation percent.
It should be noted that deviation here refers to the deviation between real data and the target data of setting;And it is inclined Poor percentage refers to the deviation between real data and the target data of setting, the percentage of the deviation and target data, ability Field technique personnel can need to select deviation percent or deviation according to actual calculating, to calculate to final characteristic impedance Disturbance degree data, which is not described herein again.
In one embodiment, the disturbance degree calculation method of the influence factor provided by the present application to characteristic impedance is especially suitable It should be in following situations:
The line width range of line width is 3.0mil-15mil;
The thickness range of line thicknesses is 0.5mil-2.0mil;
The thickness range of dielectric thickness is 3.0mil-10mil;
It is 0.5mil-3.0mil in the Thickness Method of resist thickness.
The present embodiment also provides a kind of wiring board, using the influence to characteristic impedance as described in any one above-mentioned embodiment The disturbance degree calculation method of factor calculate the disturbance degree of the influence factor of characteristic impedance.
The wiring board is calculated by the disturbance degree of the influence factor to characteristic impedance, so as to right in production Each influence factor is adjusted and manages, and the processing quality for the wiring board for obtaining processing is more preferable.
Referring to figure 2. with table 1, the specific implementation for calculating coefficient value of the line width in outer layer difference is provided Example.
The influence value of line width when 1. impedance line type of table is outer layer difference
The table 1, it is the actual value of 30 groups of line widths in the case of outer layer differential-type and corresponding for giving impedance line Line width difference percentage, and corresponding line width difference is given to the influence value of characteristic impedance;The data of the table 1 according to Fig. 2 Manufactured curve graph, and the linear line figure obtained after being fitted by linear regression method.As shown in Figure 2, in this case, can get Coefficient value of the line width in outer layer difference is -0.4454, which is specially following steps, and it is outer for setting the situation Layer difference situation:
Obtain 30 groups of data of target line width and actual track width and acquisition of line width;
Obtain the corresponding deviation calculated value of 30 groups of line widths (the present embodiment is difference percentage);
30 groups of line widths are obtained to the influence value of characteristic impedance;
Deviation calculated value and influence value are handled according to linear regression method and obtain making influence value and deviation calculated value Between coefficient value in a linear relationship.
Reach characteristic impedance tolerance (as generally ± 10% or ± 5%), then can by the Tolerance assignment to pair In each influence factor answered, with by the influence degree for controlling each influence factor, the tolerance for carrying out the final characteristic impedance of control is wanted It asks, and is realized eventually by the technological standards of control each process (such as acid etching, alkali etching, pressing, plating, welding resistance).
For the characteristic impedance of internal layer impedance line, include two kinds of situations: internal layer is not necessarily to electro-coppering;Internal layer needs electro-coppering, Contain metalized blind vias.
In the case of the first, in the case that internal layer is not necessarily to electro-coppering, line thicknesses (namely copper thick) it is very poor smaller, because This, the line width etched is more uniform, and table 2 is a specific example:
2 internal layer of table is not necessarily to the case where electro-coppering
Upper table 2, by taking internal layer single-ended type situation as an example, obtaining copper thickness tolerance according to practical production experience is ± 3 μm, by Yi =ki*XiCalculating copper thickness is ± 3% to the disturbance degree of impedance;Line width tolerance+8% is obtained by practical production experience, according to Yi =ki*XiLine width is calculated to disturbance degree ± 4% of impedance;Other factors are obtained impedance influences degree by practical experience, other because Element, which refers to, can not use Yi=ki*XiThe impedance influences degree of calculating is obtained according to practical production experience data, can be set as ± 3%, finally copper thickness is brought into Z=[∑ to impedance influences degree to impedance influences degree and other factors to impedance influences degree, line width (Yi 2)]0.5It is ± 5.8% that equation, which calculates impedance tolerance (theory),.
The specific value for obtaining impedance tolerance (theory), be conducive to PCB manufactory judge each process process capability whether The tolerance (such as generally ± 10% or ± 5%) for meeting impedance, if the impedance tolerance (theory) calculated, which has exceeded, requires number Value, then show that existing process capability is unable to satisfy the resistance requirements, need to take measures to improve the system of one of them or several processes Cheng Nengli, such as line width deviation can be reduced using the control for receiving tight line width tolerance, to reduce line width to impedance influences degree, from And obtain smaller impedance tolerance;Conversely, if calculate impedance tolerance within claimed range, can be by existing process capability It is managed.
Under second situation, internal layer needs electro-coppering, since plating thickeies copper, to make copper that is, containing in the case where metalized blind vias Thick uniformity is deteriorated, and copper thickness tolerance is larger, thus line width tolerance is also larger, and table 3 is a specific example:
3 internal layer of table needs electro-coppering, i.e., containing in the case where metalized blind vias
Upper table 3, in case where internal layer single-ended type, internal layer needs electro-coppering, and compared with internal layer is without electro-coppering, copper is thick Very poor larger, line width is very poor also to be increased with it, and obtaining copper thickness tolerance according to practical production experience in this case is ± 8 μm, by Yi=ki*XiCalculating copper thickness is ± 8% to the disturbance degree of impedance;Line width tolerance, which is ± 10%, to be obtained by practical production experience, According to Yi=ki*XiIt is ± 5% to the disturbance degree of impedance that equation calculation, which goes out line width,;Other factors are to impedance influences degree by actually passing through Acquisition is tested, other factors, which refer to, can not use Yi=ki*XiThe impedance influences degree of calculating is obtained according to practical production experience data, can To be set as ± 3%;Finally by copper thickness to impedance influences degree, line width to impedance influences degree and other factors to impedance influences degree band Enter Z=[∑ (Yi 2)]0.5It is ± 9.9% that equation, which calculates impedance tolerance (theory),.
The specific value for obtaining impedance tolerance (theory), be conducive to PCB manufactory judge each process process capability whether The tolerance (such as generally ± 10% or ± 5%) for meeting impedance, if the impedance tolerance (theory) calculated, which has exceeded, requires number Value, shows that existing process capability is unable to satisfy the resistance requirements, need to take measures to improve the system of one of them or several processes Cheng Nengli, such as can take the control for receiving tight line width tolerance reduces line width deviation, to reduce line width to impedance influences degree, from And obtain smaller impedance tolerance;Conversely, if calculating impedance tolerance within claimed range, it can be by existing process capability pipe Control.
For the characteristic impedance of external layer impedance line, there are two types of situations: primary plating;Repeatedly plating.
The case where to primary plating, since plating number is few, copper is thick uniformly preferable, and copper thickness tolerance and line width tolerance are smaller. The influence factor of outer layer impedance tolerance includes dielectric thickness tolerance, resist thickness tolerance and other factors, and table 4 is one specific Example:
The case where outer layer impedance of table 4, primary plating
Upper table 4, in case where outer layer single-ended type, obtaining copper thickness tolerance according to practical production experience is ± 10 μm, By Yi=ki*XiCalculating copper thickness is ± 2% to the disturbance degree of impedance;Line width tolerance is obtained for ± 10% by practical production experience, According to Yi=ki*XiCalculating line width is ± 5% to the disturbance degree of impedance;The thick tolerance that is situated between is obtained for ± 10% by practical production experience , according to Yi=ki*XiCalculating the thick disturbance degree to impedance that is situated between is ± 6%;Resist thickness tolerance is ± 30% by actual production Experience obtains, according to Yi=ki*XiCalculating resist thickness is ± 1% to the disturbance degree of impedance;Other factors are to impedance influences degree It is obtained by practical experience, other factors, which refer to, can not use Yi=ki*XiThe impedance influences degree of calculating, according to practical production experience number According to acquisition, ± 2% may be set to;It is finally that copper thickness is thick to impedance influences to impedance influences degree, Jie to impedance influences degree, line width Degree, resist thickness tolerance bring Z=[∑ (Y into impedance influences degree to impedance influences degree and other factorsi 2)]0.5Equation calculates resistance Anti- tolerance (theory) is ± 8.4%.
The specific value for obtaining impedance tolerance (theory), be conducive to PCB manufactory judge each process process capability whether The tolerance (such as generally ± 10% or ± 5%) for meeting impedance, if the impedance tolerance (theory) calculated, which has exceeded, requires number Value, shows that existing process capability is unable to satisfy the resistance requirements, need to take measures to improve the system of one of them or several processes Cheng Nengli, such as line width deviation can be reduced using the control for receiving tight line width tolerance, to reduce line width to impedance influences degree, from And obtain smaller impedance tolerance;Conversely, if calculating impedance tolerance within claimed range, it can be by existing process capability pipe Control.
The case where for being repeatedly electroplated (the case where being electroplated twice or more than twice), copper thickness uniformity is poor, copper thickness tolerance Greatly, line width tolerance also becomes larger therewith, and table 5 is an example:
The outer layer impedance of table 5, repeatedly the case where plating
Upper table 5, in case where outer layer single-ended type, outer layer is repeatedly electroplated, compared with outer layer is once electroplated, copper thickness pole Difference is larger, and line width is very poor also to be increased with it, and obtaining copper thickness tolerance according to practical production experience under the conditions of this is ± 15 μm, by Yi =ki*XiEquation calculation copper thickness is ± 3% to the disturbance degree of impedance;Line width tolerance is obtained for ± 15% by practical production experience, According to Yi=ki*XiCalculating line width is ± 7.5% to the disturbance degree of impedance;The thick tolerance that is situated between is ± 10% by practical production experience It obtains, according to Yi=ki*XiCalculating the thick disturbance degree to impedance that is situated between is ± 6%;Resist thickness tolerance is ± 30% by actually giving birth to Industry tests acquisition, according to Yi=ki*XiCalculating resist thickness is ± 1% to the disturbance degree of impedance;Other factors are to impedance influences Degree is obtained by practical experience, and other factors, which refer to, can not use Yi=ki*XiThe impedance influences degree of calculating, according to practical production experience Data obtain, and can be set as ± 2%;It is finally that copper thickness is thick to impedance shadow to impedance influences degree, Jie to impedance influences degree, line width Loudness, resist thickness tolerance bring Z=[∑ (Y into impedance influences degree to impedance influences degree and other factorsi 2)]0.5Equation calculates Impedance tolerance (theory) is ± 10.3%.
The specific value for obtaining impedance tolerance (theory), be conducive to PCB manufactory judge each process process capability whether The tolerance (such as generally ± 10% or ± 5%) for meeting impedance, if the impedance tolerance (theory) calculated, which has exceeded, requires number Value, shows that existing process capability is unable to satisfy the resistance requirements, need to take measures to improve the system of one of them or several processes Cheng Nengli, such as can take the control for receiving tight line width tolerance reduces line width deviation, to reduce line width to impedance influences degree, from And obtain smaller impedance tolerance;Conversely, if calculating impedance tolerance within claimed range, it can be by existing process capability pipe Control.
According to table 2- table 5, it can determine that each process is to meet customer requirement based on the disturbance degree to characteristic impedance Impedance tolerance and need to manage line width, copper thick (i.e. line thicknesses), dielectric thickness, resist thickness tolerance standard, be convenient for Each process index is managed in assist side manufacturing process.It also more can intuitively reflect existing process processing procedure energy simultaneously Whether power can satisfy the characteristic impedance tolerance of client.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (10)

1. the disturbance degree calculation method of the influence factor of a kind of pair of characteristic impedance, which is characterized in that influence to characteristic impedance because Element at least one, disturbance degree calculation method to the influence factor of characteristic impedance the following steps are included:
Obtain the corresponding coefficient value of the influence factor;
Obtain the corresponding deviation calculated value of the influence factor;
The corresponding influence factor is calculated to characteristic according to the first equation and based on the coefficient value and the deviation calculated value The influence value of impedance;
All influence factors are calculated to characteristic impedance according to second equation and based on calculated each influence value Disturbance degree;
First equation are as follows:
Yi=ki*Xi
The second equation are as follows:
Z=[∑ (Yi 2)]0.5
Wherein, i is the number of influence factor and takes positive integer, kiFor the corresponding coefficient value of i-th of influence factor, XiIt is i-th The corresponding deviation calculated value of influence factor, YiIt is i-th of influence factor to the influence value of characteristic impedance, Z is all influence factors To the disturbance degree of characteristic impedance.
2. the disturbance degree calculation method of the influence factor according to claim 1 to characteristic impedance, which is characterized in that described Coefficient value is transferred from presetting database based on the first preset requirement and is obtained.
3. the disturbance degree calculation method of the influence factor according to claim 2 to characteristic impedance, which is characterized in that described Influence factor corresponding coefficient value in the presetting database is determined by following steps:
It obtains the deviation calculated value of the influence factor and obtains deviation calculated value described in multiple groups;
The influence factor is obtained the influence value of characteristic impedance and obtains influence value described in multiple groups;
The deviation calculated value and the influence value are handled according to the first presetting method and obtain making the influence value and The coefficient value in a linear relationship between the deviation calculated value.
4. the disturbance degree calculation method of the influence factor according to claim 3 to characteristic impedance, which is characterized in that described First presetting method is linear regression method.
5. the disturbance degree calculation method of the influence factor according to claim 1 to characteristic impedance, which is characterized in that obtain The step of influence factor corresponding coefficient value includes:
Obtain the circuit types of the impedance line of wiring board:
Based on the circuit types and obtain the coefficient value corresponding with the circuit types.
6. the disturbance degree calculation method of the influence factor according to claim 1-5 to characteristic impedance, feature It is, the deviation calculated value is deviation percent or/and deviation.
7. the disturbance degree calculation method of the influence factor according to claim 6 to characteristic impedance, which is characterized in that described Influence factor includes wherein at least one in line width, line thicknesses, dielectric thickness and resist thickness.
8. the disturbance degree calculation method of the influence factor according to claim 7 to characteristic impedance, which is characterized in that described The corresponding deviation calculated value of line width uses deviation percent;
The corresponding deviation calculated value of the line thicknesses uses deviation;
The corresponding deviation calculated value of the dielectric thickness uses deviation percent;
The corresponding deviation calculated value of the resist thickness uses deviation percent.
9. the disturbance degree calculation method of the influence factor according to claim 7 to characteristic impedance, which is characterized in that described The line width range of line width is 3.0mil-15mil;
The thickness range of the line thicknesses is 0.5mil-2.0mil;
The thickness range of the dielectric thickness is 3.0mil-10mil;
It is 0.5mil-3.0mil in the Thickness Method of the resist thickness.
10. a kind of wiring board, which is characterized in that using as described in any item pairs of characteristic impedances of claim 1-9 influence because The disturbance degree calculation method of element calculate the disturbance degree of the influence factor of characteristic impedance.
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CN111598383A (en) * 2020-04-03 2020-08-28 广州兴森快捷电路科技有限公司 Prediction method, system and storage medium of yield influence degree of PCB order
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CN113392613A (en) * 2020-03-13 2021-09-14 浙江宇视科技有限公司 Circuit board wiring method, system and device
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