CN110511706A - A kind of heat resistant type phenolic aldehyde/epoxy composite conducting resinl and preparation method thereof - Google Patents
A kind of heat resistant type phenolic aldehyde/epoxy composite conducting resinl and preparation method thereof Download PDFInfo
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- CN110511706A CN110511706A CN201910653140.1A CN201910653140A CN110511706A CN 110511706 A CN110511706 A CN 110511706A CN 201910653140 A CN201910653140 A CN 201910653140A CN 110511706 A CN110511706 A CN 110511706A
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- copper alloy
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C09J161/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention provides a kind of heat resistant type phenolic aldehyde/epoxy resin composite conducting glue and preparation method thereof, and the conducting resinl is made of the raw material of following mass parts ratio: 40-200 parts of epoxy resin, 10-100 parts of phenolic resin；0-20 parts of plasticizer；10-50 parts of diluent；50-90 parts of sheet copper alloy；Spherical copper alloy 10-50 parts；0-10 parts of graphene and 5-10 parts of curing agent；The sheet copper alloy and spherical copper alloy are micron order；The sheet copper alloy, spherical copper alloy and the graphene are conductive filler.The present invention uses phenolic resin blending and modifying epoxy conducting, it is intended to that epoxy conducting is overcome to use the disadvantage that temperature is low, Stability of Resistivity is not high, and using the conductive filler of different-shape, it is intended to maximize favourable factors and minimize unfavourable ones, obtain good electric conductivity, process for making is simple and convenient, and product is heat-resist, and resistance stability is good.
Description
Technical field
The invention patent relates to a kind of conductive material for microelectronics Packaging, especially a kind of heat resistant type conducting resinl and its
Preparation method.
Background technique
Epoxy resin has many excellent performances, and corrosion resistance is good, contraction is low, high-intensitive and high-modulus, cementability
Can be high excellent with processing performance, therefore conducting resinl taking epoxy resin as a matrix material is widely used to Electronic Encapsulating Technology
In.But epoxy resin problems faced is that heat resistance is bad after it solidifies, and long-time service is easy to cause resistivity to rise, resistance
Rate long-time stability are not high.This defect greatly limits it in the application of certain technical fields.Phenolic resin tool
There is good chemical and thermal stability, can maximize favourable factors and minimize unfavourable ones after being mixed with epoxy resin, obtains high comprehensive performance, heat resistant type
Good conducting resinl, but currently on the market without such conducting resinl.
Summary of the invention
The problem of for existing product, the present invention increase conducting resinl matrix flexibility using a kind of flexible additive
Add, so that mechanical performance be made to be improved.This flexible additive can make conductive filler it is more uniform be distributed in epoxy resin
In matrix, to conduct more suitable for electric current, therefore the resistance of conducting resinl can be reduced while improving conducting resinl flexibility
Rate.Its flexibility solves the problems, such as that electronic component cracks during the bonding process.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of heat resistant type phenolic aldehyde/epoxy resin composite conducting glue, is made of the raw material of following mass parts ratio:
40-200 parts of epoxy resin, 10-100 parts of phenolic resin；0-20 parts of plasticizer；10-50 parts of diluent；Sheet of copper
50-90 parts of alloy；Spherical copper alloy 10-50 parts；0-10 parts of graphene and 5-10 parts of curing agent；
The sheet copper alloy and spherical copper alloy are micron order；The sheet copper alloy, spherical copper alloy and described
Graphene is conductive filler.
Preferably, the epoxy resin includes 20-100 parts of E-51 bisphenol A type epoxy resin and E-44 bisphenol type epoxy
20-100 parts of resin；The phenolic resin is F-51 bisphenol F type phenolic resin.
It is furthermore preferred that the epoxide number of the E-51 bisphenol A type epoxy resin is 48-54 equivalent/100g；The E-44 bis-phenol
The epoxide number of A type epoxy resin is 41-47 equivalent/100g；The epoxide number of the F-51 bisphenol F type phenolic resin is worked as 48-51
Amount/100g.
Preferably, the curing agent is one or both of formamide, n,N-Dimethylformamide.
Preferably, the plasticizer is phthalic ester plasticizer.
Preferably, the diluent is dehydrated alcohol.
Preferably, the sheet copper alloy is 100-300 mesh；The spherical copper alloy is 200-800 mesh.The sheet of copper
The ingredient of alloy and spherical copper alloy is equal are as follows: C turns 0.6-1.5wt%, and Ag 0.5-2wt%, Z turn 0.1-0.8wt%, Ce 0.2-
0.6wt%, surplus Cu.
Preferably, the size of the graphene is 5-20 microns.
The present invention also provides a kind of preparation method of above-mentioned heat resistant type phenolic aldehyde/epoxy resin composite conducting glue, including it is following
Step:
S1, each raw material is weighed according to the mass parts ratio；
S2, it the mixture of the epoxy resin and the phenolic resin is placed in a beaker heating stirring is uniformly mixed；
Diluent and plasticizer are sequentially added in S3, Xiang Suoshu beaker, ultrasonic vibration stirs 10-30 minutes, until being formed
Low viscosity mixtures；
The sheet copper alloy, spherical copper alloy and graphene, In are sequentially added in S4, Xiang Suoshu low viscosity mixtures
Under 40-70 DEG C of water-bath, 50-150 revs/min of ultrasonic vibration is stirred 10-30 minutes, until forming uniform conductive filler and tree
Lipoprotein mixture；
S5, the conductive filler and resin compound are cooled down 10-30 minutes in cold water water-bath；
The curing agent is added while stirring in S6, the conductive filler and resin compound after cooling that are formed to S5, directly
To formation pureed semi-solid preparation object；
S7, the pureed semi-solid preparation object is placed in 60-90 DEG C of baking oven, is solidified 1-5 hours.
Compared to the prior art, the invention has the following advantages that
The present invention uses phenolic resin blending and modifying epoxy conducting, it is intended to overcome epoxy conducting low, electric using temperature
The not high disadvantage of resistance rate stability, and using the conductive filler of different-shape, it is intended to it maximizes favourable factors and minimizes unfavourable ones, obtains good electric conductivity,
Process for making is simple and convenient, and product is heat-resist, and resistance stability is good.
This product has excellent heat resistance, and the semi-solid preparation object viscosity of the conducting resinl is lower, is easy to coat, lower
Resistivity.The preparation process of the conducting resinl is simple, and formulation cost is lower, and curing process is relatively easy, and heat resisting temperature is high, for
Industrial applications provide advantage.
Specific embodiment
The following is a clear and complete description of the technical scheme in the embodiments of the invention, it is clear that described embodiment
Only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is general
Logical technical staff every other embodiment obtained without creative efforts, belongs to protection of the present invention
Range.
Combined with specific embodiments below, the present invention will be further described.It should be understood that following embodiment is merely to illustrate this
The person skilled in the art of the range of invention and is not intended to limit the present invention, the field can make according to the content of foregoing invention
Some nonessential modifications and adaptations.
The present embodiment provides a kind of heat resistant type Epoxy Resin/Phenol aldehyde conducting resinls, are made of the raw material of following mass parts ratio:
0-100 parts of E-51 bisphenol A type epoxy resin；0-100 parts of E-44 bisphenol A type epoxy resin；F-51 bisphenol-f type phenol
0-100 parts of urea formaldehyde；0-20 parts of plasticizer；10-50 parts of diluent；50-90 parts of sheet copper alloy；Spherical copper alloy 10-50
Part；0-10 parts of graphene；5-10 parts of curing agent；The copper alloy filler is micron order；The curing agent is formamide, N, N-
One or both of dimethylformamide.
Wherein, the epoxide number of the E-51 bisphenol A type epoxy resin is 48-54 equivalent/100g, the E-44 bisphenol-A type
The epoxide number of epoxy resin is 41-47 equivalent/100g；The epoxide number of the F-51 bisphenol F type phenolic resin be 48-51 equivalent/
100g；The plasticizer is phthalic ester plasticizer；The diluent is dehydrated alcohol；The sheet copper alloy is
100-300 mesh；The spherical copper alloy is 200-800 mesh；The graphene is having a size of 5-20 microns；The copper alloy and
Graphene is all conductive filler；Its ingredient of the copper alloy are as follows: C turns 0.6-1.5wt%, and Ag 0.5-2wt%, Z turn 0.1-
0.8wt%, Ce 0.2-0.6wt%, surplus Cu.
Following embodiment is the preparation method of above-mentioned heat resistant type Epoxy Resin/Phenol aldehyde conducting resinl:
Embodiment 1
According to the mass fraction, 80 parts of E-51 bisphenol A type epoxy resins and 20 parts of F-51 bisphenol F type phenolic resin (rings are weighed
Oxygen value is 51 equivalents/100g), it is placed in a beaker；
40 parts of dehydrated alcohol diluents, 20 parts of dioctyl phthalate plasticizer, ultrasound shake are sequentially added into beaker
Low viscosity mixtures are formed after swinging stirring 15 minutes；
75 parts of micron-stage sheet-like copper alloys, 20 parts of micron level spherical are being sequentially added into the low viscosity mixtures of formation
Copper alloy, 0.7 part of graphene；
Under 55 DEG C of water-baths, 110 revs/min are stirred by ultrasonic 30 minutes until forming uniformly mixed conducting resinl filler and setting
Lipoprotein mixture；
By the uniform conductive filler of formation and resin compound at cold water water-bath cooling 20 minutes；
The formyl amine hardener of resin quality 20% is added while stirring into mixture after cooling, until forming pureed
Semi-solid preparation object；
It is finally putting under 80 DEG C of baking ovens, solidifies 3 hours；
It is demoulded after the finished product after solidifying is cooling.
Embodiment 2
According to the mass fraction, 60 parts of E-51 bisphenol A type epoxy resins and 40 parts of F-51 bisphenol F type phenolic resin (rings are weighed
Oxygen value is 51 equivalents/100g), it is placed in a beaker；
40 parts of dehydrated alcohol diluents, 20 parts of dioctyl phthalate plasticizer, ultrasound shake are sequentially added into beaker
It swings stirring and forms low viscosity mixtures after twenty minutes；
75 parts of micron-stage sheet-like copper alloys, 20 parts of micron level spherical are being sequentially added into the low viscosity mixtures of formation
Copper alloy, 0.7 part of graphene；
Under 55 DEG C of water-baths, 110 revs/min are stirred by ultrasonic 20 minutes until forming uniformly mixed conducting resinl filler and setting
Lipoprotein mixture；
By the uniform conductive filler of formation and resin compound at cold water water-bath cooling 30 minutes；
The n,N-Dimethylformamide curing agent of resin quality 25% is added while stirring into mixture after cooling, directly
To formation pureed semi-solid preparation object；
It is finally putting under 80 DEG C of baking ovens, solidifies 2 hours；
It is demoulded after the finished product after solidifying is cooling.
Embodiment 3
According to the mass fraction, 40 parts of E-51 bisphenol A type epoxy resins and 60 parts of F-51 bisphenol F type phenolic resin (rings are weighed
Oxygen value is 0.51 equivalent/g), it is placed in a beaker；
40 parts of dehydrated alcohol diluents, 20 parts of dioctyl phthalate plasticizer, ultrasound shake are sequentially added into beaker
Low viscosity mixtures are formed after swinging stirring 18 minutes；
75 parts of micron-stage sheet-like copper alloys, 20 parts of sheet copper alloy are being sequentially added into the low viscosity mixtures of formation
Micron level spherical copper alloy, 0.7 part of graphene；
Under 60 DEG C of water-baths, 110 revs/min are stirred by ultrasonic 25 minutes until forming uniformly mixed conducting resinl filler and setting
Lipoprotein mixture；
By the uniform conductive filler of formation and resin compound at cold water water-bath cooling 25 minutes；
The curing agent of corresponding amount is added while stirring into mixture after cooling, until forming pureed semi-solid preparation object；
It is finally putting under 90 DEG C of baking ovens, solidifies 1.5 hours；
It is demoulded after the finished product after solidifying is cooling.
Embodiment 4
According to the mass fraction, 80 parts of E-44 bisphenol A type epoxy resins (epoxide number is 0.44 equivalent/g) and 20 parts of F- are weighed
51 bisphenol F type phenolic resins (epoxide number is 51 equivalents/100g), are placed in a beaker；
40 parts of dehydrated alcohol diluents, 20 parts of dioctyl phthalate plasticizer, ultrasound shake are sequentially added into beaker
Low viscosity mixtures are formed after swinging stirring 15 minutes；
75 parts of micron-stage sheet-like copper alloys, 20 parts of sheet copper alloy are being sequentially added into the low viscosity mixtures of formation
Micron level spherical copper alloy, 0.7 part of graphene；
Under 60 DEG C of water-baths, 110 revs/min of ultrasonic agitations 200 minutes until formed uniformly mixed conducting resinl filler with
Resin compound；
By the uniform conductive filler of formation and resin compound at cold water water-bath cooling 30 minutes；
The n,N-Dimethylformamide curing agent of resin quality 20% is added while stirring into mixture after cooling, directly
To formation pureed semi-solid preparation object；
It is finally putting under 75 DEG C of baking ovens, solidifies 3.5 hours；
It is demoulded after the finished product after solidifying is cooling.
Embodiment 5
According to the mass fraction, 60 parts of E-44 bisphenol A type epoxy resins (epoxide number is 0.44 equivalent/g) and 40 parts of F- are weighed
51 bisphenol F type phenolic resins (epoxide number is 51 equivalents/100g), are placed in a beaker；
40 parts of dehydrated alcohol diluents, 20 parts of dioctyl phthalate plasticizer, ultrasound shake are sequentially added into beaker
Low viscosity mixtures are formed after swinging stirring 15 minutes；
75 parts of micron-stage sheet-like copper alloys, 20 parts of micron level spherical are being sequentially added into the low viscosity mixtures of formation
Copper alloy, 0.7 part of graphene；
Under 50 DEG C of water-baths, 110 revs/min are stirred by ultrasonic 35 minutes until forming uniformly mixed conducting resinl filler and setting
Lipoprotein mixture；
By the uniform conductive filler of formation and resin compound at cold water water-bath cooling 15 minutes；
The formyl amine hardener of resin quality 25% is added while stirring into mixture after cooling, until forming pureed
Semi-solid preparation object；
It is finally putting under 85 DEG C of baking ovens, solidifies 2.5 hours；
It is demoulded after the finished product after solidifying is cooling.
Embodiment 6
According to the mass fraction, 40 parts of E-44 bisphenol A type epoxy resins (epoxide number is 44 equivalents/100g) and 60 parts are weighed
F-51 bisphenol F type phenolic resin (epoxide number is 51 equivalents/100g), is placed in a beaker；
40 parts of dehydrated alcohol diluents, 20 parts of dioctyl phthalate plasticizer, ultrasound shake are sequentially added into beaker
It swings stirring and forms low viscosity mixtures after ten minutes；
75 parts of micron-stage sheet-like copper alloys, 20 parts of micron level spherical are being sequentially added into the low viscosity mixtures of formation
Copper alloy, 0.7 part of graphene；
Under 65 DEG C of water-baths, 110 revs/min are stirred by ultrasonic 15 minutes until forming uniformly mixed conducting resinl filler and setting
Lipoprotein mixture；
By the uniform conductive filler of formation and resin compound at cold water water-bath cooling 30 minutes；
The formamide and N,N-dimethylformamide of resin quality 25% is added while stirring into mixture after cooling
Mixture curing agent, until forming pureed semi-solid preparation object；
It is finally putting under 70 DEG C of baking ovens, solidifies 4 hours；
It is demoulded after the finished product after solidifying is cooling.
Table 1 is embodiment 1-6 sample morphology observation structure:
| Project | Sample morphology |
| Embodiment 1 | Rigidity |
| Embodiment 2 | Toughness, bending are fine |
| Embodiment 3 | Very tough, doubling does not fracture |
| Embodiment 4 | It is tougher, it is bent |
| Embodiment 5 | Toughness, bending are fine |
| Embodiment 6 | Flexibility can pull out crackle |
As known from Table 1, synthesis conducting resinl traditional performance is good.
Table 2 is embodiment 1-6 resistivity measurement result (unit: Ω cm):
As known from Table 2, after addition F-51 is phenolic resin modified, the resistance of conducting resinl is substantially reduced, and resistance stability increases.
Table 3 is embodiment 1-6 heat resistance test result
As known from Table 3, be added F-51 it is phenolic resin modified after, the heat resisting temperature of conducting resinl generally improves 50 DEG C or so, resistance to
It is hot good.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to preferred embodiment to this hair
It is bright to be described in detail, it will be appreciated by those skilled in the art that technical solution of the present invention can be modified or be waited
With replacement, without departing from the objective and range of the technical program, should all cover in scope of the presently claimed invention.
Claims (10)
1. a kind of heat resistant type phenolic aldehyde/epoxy resin composite conducting glue, it is characterised in that: its by following mass parts ratio raw material system
At:
40-200 parts of epoxy resin, 10-100 parts of phenolic resin；0-20 parts of plasticizer；10-50 parts of diluent；Sheet copper alloy
50-90 parts；Spherical copper alloy 10-50 parts；0-10 parts of graphene and 5-10 parts of curing agent；
The sheet copper alloy and spherical copper alloy are micron order；The sheet copper alloy, spherical copper alloy and the graphite
Alkene is conductive filler.
2. conducting resinl according to claim 1, it is characterised in that: the epoxy resin includes E-51 bisphenol type epoxy tree
20-100 parts of rouge and 20-100 parts of E-44 bisphenol A type epoxy resin；The phenolic resin is F-51 bisphenol F type phenolic resin.
3. conducting resinl according to claim 2, it is characterised in that: the epoxide number of the E-51 bisphenol A type epoxy resin is
48-54 equivalent/100g；The epoxide number of the E-44 bisphenol A type epoxy resin is 41-47 equivalent/100g；The F-51 Bisphenol F
The epoxide number of type phenolic resin is 48-51 equivalent/100g.
4. conducting resinl according to any one of claims 1 to 3, it is characterised in that: the curing agent is formamide, N, N- diformazan
One or both of base formamide.
5. conducting resinl according to any one of claims 1 to 3, it is characterised in that: the plasticizer is phthalate
Plasticizer.
6. conducting resinl according to any one of claims 1 to 3, it is characterised in that: the diluent is dehydrated alcohol.
7. conducting resinl according to any one of claims 1 to 3, it is characterised in that: the sheet copper alloy is 100-300 mesh；
The spherical copper alloy is 200-800 mesh.
8. conducting resinl according to claim 7, it is characterised in that: the ingredient of the sheet copper alloy and spherical copper alloy is equal
Are as follows: C turns 0.6-1.5wt%, and Ag 0.5-2wt%, Z turn 0.1-0.8wt%, Ce 0.2-0.6wt%, surplus Cu.
9. conducting resinl according to any one of claims 1 to 3, it is characterised in that: the size of the graphene is 5-20 microns.
10. a kind of preparation method of conducting resinl as described in any one of claim 1 to 9, which comprises the following steps:
S1, each raw material is weighed according to the mass parts ratio；
S2, it the mixture of the epoxy resin and the phenolic resin is placed in a beaker heating stirring is uniformly mixed；
Diluent and plasticizer are sequentially added in S3, Xiang Suoshu beaker, ultrasonic vibration stirs 10-30 minutes, until being formed low viscous
Spend mixture；
The sheet copper alloy, spherical copper alloy and graphene are sequentially added in S4, Xiang Suoshu low viscosity mixtures, in 40-70
Under DEG C water-bath, 50-150 revs/min of ultrasonic vibration is stirred 10-30 minute, until the uniform conductive filler of formation is mixed with resin
Object；
S5, the conductive filler and resin compound are cooled down 10-30 minutes in cold water water-bath；
The curing agent is added while stirring in S6, the conductive filler and resin compound after cooling that are formed to S5, until shape
At pureed semi-solid preparation object；
S7, the pureed semi-solid preparation object is placed in 60-90 DEG C of baking oven, is solidified 1-5 hours.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910653140.1A CN110511706A (en) | 2019-07-19 | 2019-07-19 | A kind of heat resistant type phenolic aldehyde/epoxy composite conducting resinl and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910653140.1A CN110511706A (en) | 2019-07-19 | 2019-07-19 | A kind of heat resistant type phenolic aldehyde/epoxy composite conducting resinl and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111004598A (en) * | 2019-12-05 | 2020-04-14 | 常州烯奇新材料有限公司 | Conductive silver adhesive applied to electronic resonator and preparation method |
| CN112375270A (en) * | 2020-11-11 | 2021-02-19 | 珠海京工检测技术有限公司 | Conductive rubber for electronic packaging and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559880A (en) * | 2013-10-18 | 2015-04-29 | 利德英可电子科技（苏州）有限公司 | Low-cost nanosilver conductive adhesive for crystal oscillator encapsulation, and preparation method of low-cost nanosilver conductive adhesive |
| CN109337625A (en) * | 2018-09-28 | 2019-02-15 | 北京理工大学珠海学院 | A kind of low-temperature setting copper alloy conducting resinl and preparation method thereof |
-
2019
- 2019-07-19 CN CN201910653140.1A patent/CN110511706A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559880A (en) * | 2013-10-18 | 2015-04-29 | 利德英可电子科技（苏州）有限公司 | Low-cost nanosilver conductive adhesive for crystal oscillator encapsulation, and preparation method of low-cost nanosilver conductive adhesive |
| CN109337625A (en) * | 2018-09-28 | 2019-02-15 | 北京理工大学珠海学院 | A kind of low-temperature setting copper alloy conducting resinl and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111004598A (en) * | 2019-12-05 | 2020-04-14 | 常州烯奇新材料有限公司 | Conductive silver adhesive applied to electronic resonator and preparation method |
| CN112375270A (en) * | 2020-11-11 | 2021-02-19 | 珠海京工检测技术有限公司 | Conductive rubber for electronic packaging and preparation method thereof |
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Application publication date: 20191129 |