CN110511538A - The glue of 0.6mm epoxy resin board - Google Patents
The glue of 0.6mm epoxy resin board Download PDFInfo
- Publication number
- CN110511538A CN110511538A CN201910695483.4A CN201910695483A CN110511538A CN 110511538 A CN110511538 A CN 110511538A CN 201910695483 A CN201910695483 A CN 201910695483A CN 110511538 A CN110511538 A CN 110511538A
- Authority
- CN
- China
- Prior art keywords
- glue
- parts
- epoxy resin
- resin board
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Abstract
This application discloses a kind of glue of 0.6mm epoxy resin board, the parts by weight of the glue each component are allocated as follows: 800-1200 parts of resin；100-140 parts of dicyandiamide；130 parts of organic solvent；240 parts of inorganic fire-retarded additive.The glue of the 0.6mm epoxy resin board is had excellent performance, and meets the production requirement of the whole degree of epoxy resin plate thickness peace.
Description
Technical field
The present invention relates to adhesive and fluid silicone rubber field, more particularly to a kind of glue of 0.6mm epoxy resin board.
Background technique
Existing copper-clad plate is usually to be converted into half in epoxy resin after glass-fiber-fabric is impregnated in binder such as epoxy resin
Solid state heats while semi-solid preparation layer to be formed and dries impregnated cloth solvent to remove, in at least one side of semi-solid preparation layer
Upper lamination copper foil layer simultaneously carries out the obtained copper-clad plate of autoclave moulding to it.And in actual life, various product is all towards lightening
Direction develop, it is more and more thinner, increasingly lighter that this is just necessarily required to copper-clad plate, but existing adhesive is unable to satisfy ultra-thin thickness
The production requirement of degree and flatness.
Summary of the invention
The purpose of the present invention is to provide a kind of glues of 0.6mm epoxy resin board, to overcome deficiency in the prior art.
To achieve the above object, the invention provides the following technical scheme:
The embodiment of the present application discloses a kind of glue of 0.6mm epoxy resin board, the parts by weight of the glue each component
It is allocated as follows: 800-1200 parts of resin；100-140 parts of dicyandiamide；130 parts of organic solvent；240 parts of inorganic fire-retarded additive.
Preferably, in the glue of above-mentioned 0.6mm epoxy resin board, the resin is FR-4 resin.
Preferably, in the glue of above-mentioned 0.6mm epoxy resin board, the organic solvent is dimethylformamide.
Preferably, in the glue of above-mentioned 0.6mm epoxy resin board, the inorganic fire-retarded additive is aluminium hydroxide.
Preferably, in the glue of above-mentioned 0.6mm epoxy resin board, the parts by weight of the glue each component are allocated as follows:
1000 parts of resin；120 parts of dicyandiamide；130 parts of organic solvent；240 parts of inorganic fire-retarded additive.
Preferably, in the glue of above-mentioned 0.6mm epoxy resin board, the glue further includes the face of 0.01-0.02 parts by weight
Material.
Preferably, in the glue of above-mentioned 0.6mm epoxy resin board, the pigment includes green powder.
Compared with the prior art, the advantages of the present invention are as follows: the glue of the 0.6mm epoxy resin board is had excellent performance, and is utilized
Epoxy resin board made from the glue, in the case where meeting flatness requirement, thickness is no more than 0.6mm, frivolous convenient for product
The realization of change.
Specific embodiment
The present invention is described further by the following example: according to following embodiments, the present invention may be better understood.
However, as it will be easily appreciated by one skilled in the art that specific material ratio, process conditions and its result described in embodiment are only used
In illustrating the present invention, without the present invention described in detail in claims should will not be limited.
The glue of 0.6mm epoxy resin board in the specific embodiment of the invention, configuration process are as follows: by the FR- of 1000KG
Blender is added in 4 resins, then stirs evenly the addition of the dimethylformamide of the dicyandiamide of 120KG and 130KG, then will
The aluminium hydroxide of 240KG is added, and stirs 2 hours, is eventually adding the green powder of 16G, obtains glue, the glue that will be prepared after mixing evenly
It is glued in the glue pond of liquid injection gluing machine, the glass fabric that gluing is completed is dried, control gel time in 150 ± 5S
It is interior, obtain the green epoxy resin board of 0.6mm thickness.
In conclusion the glue of the 0.6mm epoxy resin board is had excellent performance, using epoxy resin board made from the glue,
In the case where meeting flatness requirement, thickness is no more than 0.6mm, convenient for the realization that product is lightening.
Here, it should also be noted that, in order to avoid having obscured the present invention because of unnecessary details, in embodiment only
Illustrate only with closely related structure and/or processing step according to the solution of the present invention, and be omitted with relationship of the present invention not
Big other details.
Finally, it is to be noted that, the terms "include", "comprise" or its any other variant be intended to it is non-exclusive
Property include so that include a series of elements process, method, article or equipment not only include those elements, but also
Further include other elements that are not explicitly listed, or further include for this process, method, article or equipment it is intrinsic
Element.
Claims (7)
1. a kind of glue of 0.6mm epoxy resin board, it is characterised in that: the parts by weight of the glue each component are allocated as follows:
800-1200 parts of resin；100-140 parts of dicyandiamide；130 parts of organic solvent；240 parts of inorganic fire-retarded additive.
2. the glue of 0.6mm epoxy resin board according to claim 1, it is characterised in that: the resin is FR-4 resin.
3. the glue of 0.6mm epoxy resin board according to claim 1, it is characterised in that: the organic solvent is diformazan
Base formamide.
4. the glue of 0.6mm epoxy resin board according to claim 1, it is characterised in that: the inorganic fire-retarded additive
For aluminium hydroxide.
5. the glue of 0.6mm epoxy resin board according to claim 1, it is characterised in that: the weight of the glue each component
Amount part is allocated as follows: 1000 parts of resin；120 parts of dicyandiamide；130 parts of organic solvent；240 parts of inorganic fire-retarded additive.
6. the glue of 0.6mm epoxy resin board according to claim 1, it is characterised in that: the glue further includes 0.01-
The pigment of 0.02 parts by weight.
7. the glue of 0.6mm epoxy resin board according to claim 6, it is characterised in that: the pigment includes green powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910695483.4A CN110511538A (en) | 2019-07-30 | 2019-07-30 | The glue of 0.6mm epoxy resin board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910695483.4A CN110511538A (en) | 2019-07-30 | 2019-07-30 | The glue of 0.6mm epoxy resin board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110511538A true CN110511538A (en) | 2019-11-29 |
Family
ID=68624301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910695483.4A Pending CN110511538A (en) | 2019-07-30 | 2019-07-30 | The glue of 0.6mm epoxy resin board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110511538A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101735558A (en) * | 2008-11-07 | 2010-06-16 | 福建新世纪电子材料有限公司 | Glue solution for copper-clad plate |
| CN201587156U (en) * | 2009-10-22 | 2010-09-22 | 杭州联生绝缘材料有限公司 | Epoxy resin laminated board |
| CN102190865A (en) * | 2010-03-16 | 2011-09-21 | 金安国纪科技股份有限公司 | Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof |
| CN103540103A (en) * | 2013-09-22 | 2014-01-29 | 重庆德凯覆铜板有限公司 | Epoxy resin composition and method for preparing adhesive by using same |
| CN104999740A (en) * | 2015-07-24 | 2015-10-28 | 山东金宝电子股份有限公司 | Preparation method for high-CTI halogen-free type CEM-3 copper-clad plate |
| CN113121955A (en) * | 2019-12-30 | 2021-07-16 | 浙江华正新材料股份有限公司 | Ultrathin halogen-free flame-retardant glass fiber plate with low roughness and preparation method thereof |
-
2019
- 2019-07-30 CN CN201910695483.4A patent/CN110511538A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101735558A (en) * | 2008-11-07 | 2010-06-16 | 福建新世纪电子材料有限公司 | Glue solution for copper-clad plate |
| CN201587156U (en) * | 2009-10-22 | 2010-09-22 | 杭州联生绝缘材料有限公司 | Epoxy resin laminated board |
| CN102190865A (en) * | 2010-03-16 | 2011-09-21 | 金安国纪科技股份有限公司 | Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof |
| CN103540103A (en) * | 2013-09-22 | 2014-01-29 | 重庆德凯覆铜板有限公司 | Epoxy resin composition and method for preparing adhesive by using same |
| CN104999740A (en) * | 2015-07-24 | 2015-10-28 | 山东金宝电子股份有限公司 | Preparation method for high-CTI halogen-free type CEM-3 copper-clad plate |
| CN113121955A (en) * | 2019-12-30 | 2021-07-16 | 浙江华正新材料股份有限公司 | Ultrathin halogen-free flame-retardant glass fiber plate with low roughness and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191129 |