CN110497257A - A kind of compound high smooth grinding debarring process - Google Patents
A kind of compound high smooth grinding debarring process Download PDFInfo
- Publication number
- CN110497257A CN110497257A CN201910705351.5A CN201910705351A CN110497257A CN 110497257 A CN110497257 A CN 110497257A CN 201910705351 A CN201910705351 A CN 201910705351A CN 110497257 A CN110497257 A CN 110497257A
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- CN
- China
- Prior art keywords
- grinding
- processed
- workpiece
- vibration container
- abrasive
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/06—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving oscillating or vibrating containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
- B24C1/083—Deburring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
- B24C3/325—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for internal surfaces, e.g. of tubes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a kind of compound high smooth grinding debarring process, comprising the following steps: step 1, spiral vibrating grinding;Step 2, jet milled;Step 3, magnetic grinding.The present invention combines three kinds of surface grinding processing methods, by spiral vibrating grinding to the oxide skin on workpiece to be processed surface, burr etc. carries out attrition process, attrition process speed is fast, to plane, shaped face etc. has good surface treatment effect, pass through jet milled again, targetedly the inner hole of workpiece to be processed is processed, solid abrasive is made up during vibro-grinding to the deficiency of inner hole milled processed, machining accuracy is high, deburring effect is good, grinding precision is further increased finally by magnetic grinding, and to dead angle, tiny crevice place grinding deburring effect is good, triplicity, integral grinding is high in machining efficiency, machining accuracy is high.
Description
Technical field
The present invention relates to high-precision metalwork manufacture field, in particular to a kind of compound high smooth grinding debarring process.
Background technique
Machining can hardly prevent the generation of burr;The presence of burr can severely impact product assembly precision and
Service performance.So part is in the fabrication process, it is necessary to except the burr for resetting part;Especially in the manufacture of some crucial spare and accessory parts
In, the precision component for being frequently used in special occasions can not allow the presence of burr.And producing some passes in practice
When key spare and accessory parts remove flash removed, usually using manual method, not only large labor intensity, but also it is extremely difficult to processing request.
At present from simply derust, desanding, descale cleaning technology, develop to using high temperature, electrolysis, ultrasound
The high level debarring process such as wave and vibration.Deburring finally improves process as what part was processed, is highly important.To the greatest extent
Pipe grinding debarring process is greatly improved, but for the treatment effect of the positions such as inner hole of workpiece, dead angle, tiny crack
It is unsatisfactory, a kind of compound debarring process of demand, to improve the product quality of grinding deburring.
Summary of the invention
In order to solve the above technical problems, passing through spiral the present invention provides a kind of compound high smooth grinding debarring process
Vibro-grinding, jet milled and magnetic grinding combine, and solve existing debarring process to inner hole of workpiece, dead angle, tiny
The treatment effect of the positions such as crack is unsatisfactory, the problem of processing quality effect difference.
In order to achieve the above objectives, technical scheme is as follows: a kind of compound high smooth grinding debarring process, including
Following steps:
Step 1, spiral vibrating is ground;It is put into solid abrasive in the vibration container of pot shape structure, then makes vibration container
Interior solid abrasive carries out helical rotation, and workpiece to be processed is gradually put into vibration container, by solid abrasive to be added
Work workpiece is polished directly;
Step 2, jet milled;Workpiece to be processed is taken out from vibration container, and carries out surface clean drying;With to be added
Inner hole on work workpiece replaces the nozzle of conventional jet device, using slurry abrasive material as injection fluid, is sprayed, grinds slurry
When material passes through the inner hole side wall of workpiece to be processed and eats dishes without rice or wine, the inner hole of workpiece to be processed is ground;
Step 3, magnetic grinding;Lapping liquid is added in the grinding groove of Magnetic Force Mill, is put into grinding needle;It will be to be processed
Workpiece is put into grinding groove;Start solenoid power supply, attracts grinding needle to carry out flexible polish-brush to workpiece by excitation;
Ultrasonic wave is propagated in the form of longitudinal wave, is converted into high-frequency mechanical vibration through energy converter, by lapping liquid, grinds needle in high frequency vibrating
Under movement is used, impact extruded workpiece to be processed surface is ground.
As a preferred solution of the present invention, in step 1, resilient support is set below vibration container, is held in vibration
Vibrator is installed outside device, bottom position installs rotary electric machine in vibration container, passes through the common work of vibrator and rotary electric machine
With making solid abrasive in vibration container carry out helical rotation.
As a preferred solution of the present invention, before carrying out spiral vibrating grinding, water first is carried out to workpiece to be processed
Bathe oil removing cleaning.
As a preferred solution of the present invention, spiral vibrating grinding is using silicon carbide abrasive as solid abrasive;It is described
The partial size of silicon carbide abrasive is less than 2.2mm.
As a preferred solution of the present invention, silicon carbide abrasive described in step 1 is before use, be added surface-active
Agent, antirust agent, brightener mixed liquor, be stirred infiltration.
As a preferred solution of the present invention, in step 1, the solid abrasive in vibration container accounts for vibration container volume
60% or more, workpiece to be processed shared volume in vibration container is less than the half of volume shared by solid abrasive.
As a preferred solution of the present invention, in step 2, by high-pressure pump as power source, continue slurry abrasive material
By the inner hole of workpiece to be processed, jet milled is realized.
As a preferred solution of the present invention, the volume ratio of the lapping liquid and grinding needle is (9-10): 1.
As a preferred solution of the present invention, the slurry abrasive material in step 2 is the grinding fluid that nano silicon oxide is added.
Through the above technical solutions, the beneficial effect of technical solution of the present invention is: the present invention handles three kinds of surface grindings
Method combines, and carries out attrition process to oxide skin, the burr on workpiece to be processed surface etc. by spiral vibrating grinding, grinding adds
Work speed is fast, has good surface treatment effect to plane, shaped face etc., then by jet milled, targetedly to be added
The inner hole of work workpiece is processed, and makes up solid abrasive during vibro-grinding to the deficiency of inner hole milled processed, processing essence
Degree is high, and deburring effect is good, further increases grinding precision finally by magnetic grinding, and grind to dead angle, tiny crevice place
It is good to grind off burr effect, triplicity, integral grinding is high in machining efficiency, and machining accuracy is high, deburring high treating effect, workpiece table
Face is smoothly bright, good product quality.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
Embodiment 1
It is processed for aluminium alloy communication products
Specifically, compound high smooth grinding debarring process, comprising the following steps:
Step 1, spiral vibrating is ground;It is put into solid abrasive in the vibration container of pot shape structure, then makes vibration container
Interior solid abrasive carries out helical rotation, and workpiece to be processed is gradually put into vibration container, by solid abrasive to be added
Work workpiece is polished directly;After workpiece to be processed is all put into, spiral vibrating grinds 10min.
Step 2, jet milled;Workpiece to be processed is taken out from vibration container, and carries out surface clean drying;With to be added
Inner hole on work workpiece replaces the nozzle of conventional jet device, using slurry abrasive material as injection fluid, is sprayed, grinds slurry
When material passes through the inner hole side wall of workpiece to be processed and eats dishes without rice or wine, the inner hole of workpiece to be processed is ground;Specific workpiece to be processed
Actual demand, adjust jet pressure and slurry abrasive material type.Single hole jet milled process time is 1-3min.
Step 3, magnetic grinding;Lapping liquid is added in the grinding groove of Magnetic Force Mill, is put into grinding needle;It will be to be processed
Workpiece is put into grinding groove;Start solenoid power supply, attracts grinding needle to carry out flexible polish-brush to workpiece by excitation;
Ultrasonic wave is propagated in the form of longitudinal wave, is converted into high-frequency mechanical vibration through energy converter, by lapping liquid, grinds needle in high frequency vibrating
Under movement is used, impact extruded workpiece to be processed surface is ground.The magnetic grinding time controls in 10-45min.
Embodiment 2
For 5G filter machining cylinder block
The invention discloses a kind of compound high smooth grinding debarring process, comprising the following steps:
Step 1, spiral vibrating is ground;Water-bath oil removing cleaning first is carried out to workpiece to be processed.Later in the vibration of pot shape structure
It is put into solid abrasive in visibly moved device, so that the solid abrasive in vibration container is carried out helical rotation, specifically, in vibration container
Lower section setting resilient support, installs vibrator outside vibration container, and bottom position installs rotary electric machine in vibration container, passes through
The collective effect of vibrator and rotary electric machine makes the solid abrasive in vibration container carry out helical rotation.Then by work to be processed
Part is gradually put into vibration container, is polished directly by solid abrasive to workpiece to be processed.Spiral vibrating grinding uses carbon
SiClx abrasive material is as solid abrasive;The partial size of the silicon carbide abrasive is less than 2.2mm.And it can be used in silicon carbide abrasive
Before, the mixed liquor of surfactant, antirust agent, brightener is added, is stirred infiltration.It is worth noting that, spiral vibrating is ground
During mill, the solid abrasive in vibration container accounts for 60% or more of vibration container volume, and workpiece to be processed is in vibration container
Shared volume is less than the half of volume shared by solid abrasive.
Step 2, jet milled;Workpiece to be processed is taken out from vibration container, and carries out surface clean drying;With to be added
Inner hole on work workpiece replaces the nozzle of conventional jet device, using slurry abrasive material as injection fluid, is sprayed, grinds slurry
When material passes through the inner hole side wall of workpiece to be processed and eats dishes without rice or wine, the inner hole of workpiece to be processed is ground.Specifically, passing through high pressure
Pump is used as power source, and slurry abrasive material is made to continuously pass through the inner hole of workpiece to be processed, realizes jet milled.Preferably, slurry abrasive material
For the grinding fluid that nano silicon oxide is added.
Step 3, magnetic grinding;Lapping liquid is added in the grinding groove of Magnetic Force Mill, is put into grinding needle;It will be to be processed
Workpiece is put into grinding groove;Start solenoid power supply, attracts grinding needle to carry out flexible polish-brush to workpiece by excitation;
Ultrasonic wave is propagated in the form of longitudinal wave, is converted into high-frequency mechanical vibration through energy converter, by lapping liquid, grinds needle in high frequency vibrating
Under movement is used, impact extruded workpiece to be processed surface is ground.The volume ratio of the lapping liquid and grinding needle is (9-
10):1。
By above-mentioned specific embodiment, the beneficial effects of the present invention are: the present invention is by three kinds of surface grinding processing method phases
In conjunction with by spiral vibrating grinding to the progress attrition process such as oxide skin, the burr on workpiece to be processed surface, attrition process speed
Fastly, there is good surface treatment effect to plane, shaped face etc., then by jet milled, targetedly to workpiece to be processed
Inner hole processed, make up solid abrasive during vibro-grinding to the deficiency of inner hole milled processed, machining accuracy is high, goes
Burr effect is good, further increases grinding precision finally by magnetic grinding, and grind deburring to dead angle, tiny crevice place
Effect is good, and triplicity, integral grinding is high in machining efficiency, and machining accuracy is high, deburring high treating effect, the smooth light of workpiece surface
It is bright, good product quality.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (9)
1. a kind of compound high smooth grinding debarring process, which comprises the following steps:
Step 1, spiral vibrating is ground;It is put into solid abrasive in the vibration container of pot shape structure, then makes in vibration container
Solid abrasive carries out helical rotation, and workpiece to be processed is gradually put into vibration container, by solid abrasive to work to be processed
Part is polished directly;
Step 2, jet milled;Workpiece to be processed is taken out from vibration container, and carries out surface clean drying;With work to be processed
Inner hole on part replaces the nozzle of conventional jet device, using slurry abrasive material as injection fluid, is sprayed, passes through slurry abrasive material
When crossing the inner hole side wall of workpiece to be processed and eating dishes without rice or wine, the inner hole of workpiece to be processed is ground;
Step 3, magnetic grinding;Lapping liquid is added in the grinding groove of Magnetic Force Mill, is put into grinding needle;By workpiece to be processed
It is put into grinding groove;Start solenoid power supply, attracts grinding needle to carry out flexible polish-brush to workpiece by excitation;Ultrasound
Wave is propagated in the form of longitudinal wave, is converted into high-frequency mechanical vibration through energy converter, by lapping liquid, is ground needle and is acted in high frequency vibrating
Under, impact extruded workpiece to be processed surface is ground.
2. compound high smooth grinding debarring process according to claim 1, which is characterized in that in step 1, hold in vibration
Setting resilient support, installs vibrator outside vibration container below device, and bottom position installs rotary electric machine in vibration container, leads to
The collective effect for crossing vibrator and rotary electric machine makes the solid abrasive in vibration container carry out helical rotation.
3. compound high smooth grinding debarring process according to claim 2, which is characterized in that ground carrying out spiral vibrating
Before mill, water-bath oil removing cleaning first is carried out to workpiece to be processed.
4. compound high smooth grinding debarring process according to claim 3, which is characterized in that spiral vibrating grinding uses
Silicon carbide abrasive is as solid abrasive;The partial size of the silicon carbide abrasive is less than 2.2mm.
5. compound high smooth grinding debarring process according to claim 3, which is characterized in that be carbonized described in step 1
Silicon abrasive material before use, be added surfactant, antirust agent, brightener mixed liquor, be stirred infiltration.
6. compound high smooth grinding debarring process according to claim 3, which is characterized in that in step 1, vibration container
Interior solid abrasive accounts for 60% or more of vibration container volume, and workpiece to be processed shared volume in vibration container is ground less than solid
Expect the half of shared volume.
7. compound high smooth grinding debarring process according to claim 3, which is characterized in that in step 2, pass through high pressure
Pump is used as power source, and slurry abrasive material is made to continuously pass through the inner hole of workpiece to be processed, realizes jet milled.
8. compound high smooth grinding debarring process according to claim 3, which is characterized in that the lapping liquid and grinding
The volume ratio of needle is (9-10): 1.
9. compound high smooth grinding debarring process according to claim 3, which is characterized in that the slurry mill in step 2
Material is the grinding fluid that nano silicon oxide is added.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114043322A (en) * | 2021-12-08 | 2022-02-15 | 绍兴自远磨具有限公司 | High-precision magnetorheological grinding and polishing process for special-shaped workpiece |
CN114310500A (en) * | 2021-12-30 | 2022-04-12 | 江苏时代华宜电子科技有限公司 | Novel processing method of high-precision molybdenum alloy wafer |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114043322A (en) * | 2021-12-08 | 2022-02-15 | 绍兴自远磨具有限公司 | High-precision magnetorheological grinding and polishing process for special-shaped workpiece |
CN114310500A (en) * | 2021-12-30 | 2022-04-12 | 江苏时代华宜电子科技有限公司 | Novel processing method of high-precision molybdenum alloy wafer |
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Application publication date: 20191126 |