CN110489308A - A kind of method of control CPU heating under low temperature - Google Patents
A kind of method of control CPU heating under low temperature Download PDFInfo
- Publication number
- CN110489308A CN110489308A CN201910876721.1A CN201910876721A CN110489308A CN 110489308 A CN110489308 A CN 110489308A CN 201910876721 A CN201910876721 A CN 201910876721A CN 110489308 A CN110489308 A CN 110489308A
- Authority
- CN
- China
- Prior art keywords
- cpu
- heating
- temperature
- low temperature
- pilot controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000008569 process Effects 0.000 claims description 8
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3024—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a central processing unit [CPU]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/148—Silicon, e.g. silicon carbide, magnesium silicide, heating transistors or diodes
Abstract
The present invention provides a kind of method for controlling CPU heating under low temperature, include the following steps that S1. system power supply starts；S2. judge whether master cpu has been started up by pilot controller；S3. judge whether temperature is higher than safety value by temperature detecting unit；S4. it disconnects the power supply of master cpu and is opened simultaneously by heating unit and heated；S5. heating time-out is judged whether by pilot controller.The method that CPU heating is controlled under a kind of low temperature of the present invention can quickly solve the problem of that safety-security area main control chip low temperature can not start in actual life, and solution is more quick, effectively.
Description
Technical field
The invention belongs to electrical equipments, more particularly, to a kind of method for controlling CPU heating under low temperature.Background technique
The universal low-temperature characteristics of the main control chip of safety-security area is poor at present, it is understood that there may be the problem of low temperature can not start, it is existing
Some solutions generally have following several:
1, do not consider Low Temperature Problems, no special measure.
2, it detects to directly heat to suitable temperature after temperature is low and power again.
Wherein scheme 1 can not solve the problems, such as completely, when encountering the very low environment of temperature, it is likely that equipment can not just start
；Scheme 2 can solve problem, but will cause and start slow problem under low temperature.
Summary of the invention
In view of this, the present invention is directed to overcome above-mentioned defect existing in the prior art, propose to control CPU under a kind of low temperature
The method of heating.
In order to achieve the above objectives, the technical scheme of the present invention is realized as follows:
The method of control CPU heating, includes the following steps: under a kind of low temperature
S1. system power supply starts；
S2. judge whether master cpu has been started up by pilot controller；
S3. judge whether temperature is higher than safety value by temperature detecting unit；
S4. it disconnects the power supply of master cpu and is opened simultaneously by heating unit and heated；
S5. heating time-out is judged whether by pilot controller.
Further, the result that the step S2 judges whether master cpu starts includes:
A1.CPU has been started up, and process terminates, system start completion；
A2.CPU is inactive, enters step S3.
Further, the judging result for whether being higher than safety value to temperature in the step S3 includes:
B1. temperature is higher than safety value, and pilot controller can continue waiting for system starting without operation；
B2. temperature is lower than safety value, then enters step S4.
Further, to heating, whether Chao Shi judging result includes: in the step S5
C1. it has not timed out, return step S3；
C2. overtime, return step S1.
Further, the pilot controller is controlled according to the different conditions of temperature and CPU changes power supply and heating
State.
Further, heating unit, temperature detecting unit are connected to pilot controller, and pilot controller is connected to master control
CPU。
Compared with the existing technology, present invention has the advantage that
Can quickly solve the problem of that safety-security area main control chip low temperature can not start in actual life, and solve compared with
To be quick, effectively.
Detailed description of the invention
The attached drawing for constituting a part of the invention is used to provide further understanding of the present invention, schematic reality of the invention
It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is system block diagram schematic diagram described in the embodiment of the present invention.
Fig. 2 is circuit theory schematic diagram described in the embodiment of the present invention.
Fig. 3 is flow diagram of the bed of the present invention described in example.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
Limitation of the invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can
To explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise indicated, " multiple "
It is meant that two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood by concrete condition
Concrete meaning in the present invention.
The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in Fig. 1, the present invention includes with lower component: 1, heating unit；2, master cpu；3, temperature detecting module；4,
Power supply；5, pilot controller.Wherein heating unit, temperature detecting module, power supply three parts are connected to pilot controller, auxiliary control
Device processed is connected to master cpu, and power supply is connected to master cpu.Heating unit is responsible for master cpu heating, and temperature detecting module is negative
Duty detects current temperature value, and power supply is responsible for master cpu power supply, and pilot controller is responsible for according to temperature and master cpu
Different conditions control changes the state of power supply and heating.
As shown in Fig. 2, concrete implementation circuit mainly includes such as lower component: 1, the triode of control heating；2, it controls
The triode of power supply enabled state；3, power supply；4, pilot controller；5, temperature detection resistance；6, adding thermal resistance.Wherein, it controls
The triode of heating, the triode for controlling power supply enabled state, temperature detection resistance are connected to pilot controller
Pilot controller can obtain Current Temperatures by reading the voltage of temperature detection resistance；Pilot controller can lead to
Cross the heating of the base voltage control adding thermal resistance of the triode of setting control heating；Pilot controller can be controlled by setting
The enabled state of the base voltage control power supply of the triode of power supply enabled state, and then control the output of power supply.
Power supply is default starting state, works as system power supply under the not controlled state of triode of control power supply enabled state
Afterwards, power supply can directly power for master cpu.
As shown in Fig. 3, whole control logic is as follows:
After system electrification, such as process 1, system power supply starting, power supply is master cpu power supply, enters process 2, auxiliary later
Whether controller detection master cpu has been turned on, if had been started up, process terminates, system start completion；If inactive, into
Enter process 3, pilot controller can detect Current Temperatures, if temperature be higher than safety value, pilot controller can without operation, after
Continuous waiting system starting；If temperature is lower than safety value, entering process 4, pilot controller will disconnect the power supply of master cpu, and
Heating to be opened simultaneously, enters process 5 later, pilot controller determines whether heating time-out, such as has not timed out, then return to process 3,
It whether in safe range to continue to test temperature, after temperature reaches safe range, returns to process 1, attempt again to be system
Power supply and activation system；If heating has timed, out, then it is returned directly to process 1, attempts activation system.
Only presently preferred embodiments of the present invention is not intended to limit the invention, all in the spirit and principles in the present invention
Within, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (5)
1. controlling the method for CPU heating under a kind of low temperature, characterized by the following steps:
S1. system power supply starts；
S2. judge whether master cpu has been started up by pilot controller；
S3. judge whether temperature is higher than safety value by temperature detecting unit；
S4. it disconnects the power supply of master cpu and is opened simultaneously by heating unit and heated；
S5. heating time-out is judged whether by pilot controller.
2. controlling the method for CPU heating under a kind of low temperature according to claim 1, it is characterised in that: the step S2 sentences
The result whether disconnected master cpu starts includes:
A1.CPU has been started up, and process terminates, system start completion；
A2.CPU is inactive, enters step S3.
3. controlling the method for CPU heating under a kind of low temperature according to claim 1, it is characterised in that: in the step S3
The judging result for whether being higher than safety value to temperature includes:
B1. temperature is higher than safety value, and pilot controller can continue waiting for system starting without operation；
B2. temperature is lower than safety value, then enters step S4.
4. controlling the method for CPU heating under a kind of low temperature according to claim 1, it is characterised in that: in the step S5
To heating, whether Chao Shi judging result includes:
C1. it has not timed out, return step S3；
C2. overtime, return step S1.
5. controlling the method for CPU heating under a kind of low temperature according to claim 1, it is characterised in that: the heating unit,
Temperature detecting unit is connected to pilot controller, and pilot controller is connected to master cpu, pilot controller according to temperature and
The different conditions control of CPU changes the state of power supply and heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910876721.1A CN110489308A (en) | 2019-09-17 | 2019-09-17 | A kind of method of control CPU heating under low temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910876721.1A CN110489308A (en) | 2019-09-17 | 2019-09-17 | A kind of method of control CPU heating under low temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110489308A true CN110489308A (en) | 2019-11-22 |
Family
ID=68558432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910876721.1A Pending CN110489308A (en) | 2019-09-17 | 2019-09-17 | A kind of method of control CPU heating under low temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110489308A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182222A (en) * | 2020-01-13 | 2020-05-19 | 天地伟业技术有限公司 | Method for heating spherical camera by cold start |
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| CN101154179A (en) * | 2006-09-29 | 2008-04-02 | 联想(北京)有限公司 | Low-temperature reinforcing system and method for computer |
| JP2011249203A (en) * | 2010-05-28 | 2011-12-08 | Sanyo Electric Co Ltd | Electromagnetic cooker |
| CN103440022A (en) * | 2013-08-21 | 2013-12-11 | 陈炳青 | Computer system and mini-host and display device thereof |
| CN103729000A (en) * | 2013-12-27 | 2014-04-16 | 深圳英飞拓科技股份有限公司 | Intelligent temperature control system based on outdoor electronic equipment |
| CN206292692U (en) * | 2016-12-09 | 2017-06-30 | 合肥陆通智能科技有限公司 | A kind of industrial computer suitable for being used under low temperature environment |
| CN108809283A (en) * | 2017-05-02 | 2018-11-13 | 佛山市顺德区美的电热电器制造有限公司 | The Drive Protecting Circuit of electromagnetic heating system and its IGBT |
| CN108919851A (en) * | 2018-06-29 | 2018-11-30 | 深圳市沃特沃德股份有限公司 | Temperature control method, system and the device of integrated circuit |
-
2019
- 2019-09-17 CN CN201910876721.1A patent/CN110489308A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101154179A (en) * | 2006-09-29 | 2008-04-02 | 联想(北京)有限公司 | Low-temperature reinforcing system and method for computer |
| JP2011249203A (en) * | 2010-05-28 | 2011-12-08 | Sanyo Electric Co Ltd | Electromagnetic cooker |
| CN103440022A (en) * | 2013-08-21 | 2013-12-11 | 陈炳青 | Computer system and mini-host and display device thereof |
| CN103729000A (en) * | 2013-12-27 | 2014-04-16 | 深圳英飞拓科技股份有限公司 | Intelligent temperature control system based on outdoor electronic equipment |
| CN206292692U (en) * | 2016-12-09 | 2017-06-30 | 合肥陆通智能科技有限公司 | A kind of industrial computer suitable for being used under low temperature environment |
| CN108809283A (en) * | 2017-05-02 | 2018-11-13 | 佛山市顺德区美的电热电器制造有限公司 | The Drive Protecting Circuit of electromagnetic heating system and its IGBT |
| CN108919851A (en) * | 2018-06-29 | 2018-11-30 | 深圳市沃特沃德股份有限公司 | Temperature control method, system and the device of integrated circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182222A (en) * | 2020-01-13 | 2020-05-19 | 天地伟业技术有限公司 | Method for heating spherical camera by cold start |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191122 |