CN110484171A - Resin combination, peelable glue-line, IC support plate and IC package processing procedure - Google Patents
Resin combination, peelable glue-line, IC support plate and IC package processing procedure Download PDFInfo
- Publication number
- CN110484171A CN110484171A CN201810459703.9A CN201810459703A CN110484171A CN 110484171 A CN110484171 A CN 110484171A CN 201810459703 A CN201810459703 A CN 201810459703A CN 110484171 A CN110484171 A CN 110484171A
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- Prior art keywords
- line
- temperature
- glue
- resin combination
- peelable glue
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- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 52
- 229920005989 resin Polymers 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000003094 microcapsule Substances 0.000 claims abstract description 34
- 239000008187 granular material Substances 0.000 claims abstract description 33
- 230000018044 dehydration Effects 0.000 claims abstract description 18
- 238000006297 dehydration reaction Methods 0.000 claims abstract description 18
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000010276 construction Methods 0.000 claims description 22
- 238000009434 installation Methods 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 12
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 5
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 4
- 150000004677 hydrates Chemical class 0.000 claims description 3
- 229920006132 styrene block copolymer Polymers 0.000 claims description 2
- 239000002775 capsule Substances 0.000 claims 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 238000012661 block copolymerization Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920002633 Kraton (polymer) Polymers 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000010254 Jasminum officinale Nutrition 0.000 description 1
- 240000005385 Jasminum sambac Species 0.000 description 1
- XMLSXPIVAXONDL-PLNGDYQASA-N Jasmone Chemical group CC\C=C/CC1=C(C)CCC1=O XMLSXPIVAXONDL-PLNGDYQASA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- IVLCENBZDYVJPA-ARJAWSKDSA-N cis-Jasmone Natural products C\C=C/CC1=C(C)CCC1=O IVLCENBZDYVJPA-ARJAWSKDSA-N 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002304 perfume Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XMLSXPIVAXONDL-UHFFFAOYSA-N trans-jasmone Natural products CCC=CCC1=C(C)CCC1=O XMLSXPIVAXONDL-UHFFFAOYSA-N 0.000 description 1
- 239000000341 volatile oil Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
A kind of resin combination, including Styrene-Butadiene-Styrene Block Copolymer, the resin combination further includes several inorganic hydrate and/or microcapsule granule being dispersed in the Styrene-Butadiene-Styrene Block Copolymer, the dehydration temperature that the inorganic hydrate occurs when phenomenon of losing water becomes inorganic matter is greater than 250 degrees Celsius, each microcapsule granule include shell and by the shell coat completely in bury object, in the microcapsule granule in bury object and break through disengaging temperature when the shell largely volatilizees and be greater than 250 degrees Celsius.In addition, the present invention also provides a kind of peelable glue-lines, IC support plate and IC package processing procedure using the resin combination.
Description
Technical field
The present invention relates to a kind of resin combination, using peelable glue-line, IC support plate and the IC envelope of the resin combination
Fill processing procedure.
Background technique
When integrated circuit (IC) is installed on flexible circuit support plate by surface mounting technique, since flexible circuit carries
The more soft mechanical performance of plate, in order to improve the mechanical performance of the flexible circuit support plate during installation, it will usually will be described
Flexible circuit support plate is incorporated on the carrier of a hardness by a peelable glue-line.IC is installed on by surface mounting technique soft
Temperature when on circuit board is about 250 degrees Celsius, however, existing peelable glue-line just will appear in 200 degrees centigrade
The phenomenon for peeling off even embrittlement, can not be good suitable for above-mentioned installation processing procedure.
Summary of the invention
In view of this, it is necessary to provide a kind of resin combinations for promoting peelable temperature.
In addition, there is a need to provide a kind of peelable glue-line using the resin combination.
In addition, there is a need to provide a kind of IC support plate using the resin combination.
In addition, there is a need to provide a kind of IC package processing procedure using the resin combination.
A kind of resin combination, including Styrene-Butadiene-Styrene Block Copolymer, the resin combination also wrap
Several inorganic hydrates and/or microcapsule granule being dispersed in the Styrene-Butadiene-Styrene Block Copolymer are included,
The dehydration temperature that the inorganic hydrate occurs when phenomenon of losing water becomes inorganic matter is greater than 250 degrees Celsius, each microcapsule granule
Including shell and by the shell coat completely in bury object, in the microcapsule granule in bury object to break through the shell a large amount of
Disengaging temperature when volatilization is greater than 250 degrees Celsius.
A kind of peelable glue-line, the peelable glue-line are toasted rear obtained by resin combination as described above.
A kind of IC support plate is formed in the line construction on one surface of carrier, the IC support plate including a carrier and one
It further include one by the toasted rear peelable glue-line obtained of resin combination as described above, the peelable glue-line is incorporated into institute
It states between carrier and the line construction.
It is a kind of to apply the IC package processing procedure that peelable glue-line is made after toasted by resin combination as described above, packet
Include following steps:
An IC support plate is provided, the IC support plate is incorporated into the carrier and institute including a carrier, a line construction and one
State the peelable glue-line between line construction；
One integrated circuit is installed on side of the line construction far from the carrier by surface installation technique, institute
Surface installation technique is stated with an installation temperature, the dehydration temperature and/or the disengaging temperature are higher than the installation temperature；
Said integrated circuit is packaged on the IC support plate by an encapsulating structure；
High-temperature baking is carried out to above-mentioned IC support plate, when the peelable glue-line includes inorganic hydrate or microcapsule granule
When, the temperature of the high-temperature baking is greater than or equal to the dehydration temperature or the disengaging temperature, when the peelable glue-line packet
Containing inorganic hydrate and when microcapsule granule, the temperature of the high-temperature baking is greater than or equal to the dehydration temperature and the disengaging
Temperature, so that the inorganic hydrate and microcapsule granule in the peelable glue-line generate bulk gas and overflow outward, thus
So that the peelable glue-line is removed from the line construction, and is not present residue glue on the line construction, and then it is made one
IC package circuit board.
Inorganic hydrate and/or microcapsule granule in resin combination of the invention, so that the resin combination shape
At peelable glue-line peelable temperature promoted so that the peelable glue-line is not shelled when undergoing surface installation technique
Phenomenon is fallen, and residue glue phenomenon is not present in the peelable glue-line after removing.
Detailed description of the invention
Fig. 1 is the schematic cross-section of the IC support plate of embodiment of the present invention.
Fig. 2 is the schematic cross-section that integrated circuit is installed on IC support plate shown in Fig. 1.
Fig. 3 is the schematic cross-section for encapsulating integrated circuit shown in Fig. 2 by encapsulating structure.
Fig. 4 is by the schematic cross-section of IC package circuit board obtained after the removing of peelable glue-line shown in Fig. 3.
Fig. 5 is the DSC figure of the peelable glue-line of the embodiment of the present invention.
Fig. 6 is the DSC figure of the glue-line of comparative example of the present invention.
Fig. 7 is that the DSC of aluminium hydroxide inorganic hydrate schemes.
Main element symbol description
| IC support plate | 1 |
| Carrier | 10 |
| Line construction | 13 |
| Peelable glue-line | 15 |
| Integrated circuit | 2 |
| Encapsulating structure | 3 |
| IC package circuit board | 5 |
Specific embodiment
The resin combination of better embodiment of the present invention can be used as peelable glue-line and be applied in circuit board process,
Such as IC package processing procedure.Contain Styrene-Butadiene-Styrene Block Copolymer (SBS) in the resin combination, and described
Resin combination also include several inorganic hydrates being dispersed in the Styrene-Butadiene-Styrene Block Copolymer and/
Or microcapsule granule.Each microcapsule granule include shell and by the shell coat completely in bury object.Wherein, described inorganic
The dehydration temperature that hydrate occurs when phenomenon of losing water becomes inorganic matter is greater than 250 degrees Celsius, in the microcapsule granule in bury
Object breaks through the disengaging temperature when shell largely volatilizees or vaporizes greater than 250 degrees Celsius.
In the resin combination, the content of the Styrene-Butadiene-Styrene Block Copolymer is 100 parts by weight,
When the resin combination includes the inorganic hydrate, the content of the inorganic hydrate is 1~50 parts by weight, when described
When resin combination includes the microcapsule granule, the content of the microcapsule granule is 5~50 parts by weight.
In present embodiment, the structural formula of the Styrene-Butadiene-Styrene Block Copolymer isWherein, it is 10~70, m and n difference that x, which is 30~90, y,
For the natural number greater than 1.
In present embodiment, the inorganic hydrate be can be selected from but be not limited only in aluminium hydroxide and magnesium hydroxide etc. extremely
Few one kind.In present embodiment, the microcapsule granule is sense face powder, and the interior object that buries is at least one in essence and essential oil
Kind, for example, burying the sense face powder that object is cis-jasmone in described.In other embodiments, the microcapsule granule can be it
His material.
In present embodiment, the average grain diameter of the microcapsule granule is 3 microns~12 microns.
One kind peelable glue-line as made from above-mentioned resin combination, the peelable glue-line is by toasting the resin group
Object is closed to be made.In present embodiment, the resin combination 110 degrees Celsius at a temperature of baking 15 minutes after be made it is described can
Remove glue-line.The peelable glue-line is semi-cured state.
When the resin combination is containing only inorganic hydrate or microcapsule granule, the peelable glue-line is less than institute in temperature
When stating dehydration temperature or the disengaging temperature, Styrene-Butadiene-Styrene Block Copolymer in the peelable glue-line it
Between further occurrence cross-linking reaction so that the peelable glue-line viscosity reduce but it is not brittle.The peelable glue-line is in temperature
When degree is greater than or equal to the dehydration temperature or the disengaging temperature, the inorganic hydrate or the microcapsule granule are generated greatly
Amount gas simultaneously overflows outward, so that the peelable glue-line is removed from object in connection easily, and is not present
Residue glue phenomenon.
When the resin combination includes simultaneously inorganic hydrate and microcapsule granule, the peelable glue-line is small in temperature
S-B-S block when the dehydration temperature and/or the disengaging temperature, in the peelable glue-line
Further occurrence cross-linking reaction between copolymer so that the peelable glue-line viscosity reduce but it is not brittle.It is described peelable
Glue-line is when temperature is greater than or equal to the dehydration temperature and the disengaging temperature, the inorganic hydrate dehydration and water vapor,
Or the interior object that buries in the microcapsule granule volatilizees or vaporizes, and then generates bulk gas and overflow outward, so that described
Peelable glue-line is removed from object in connection easily, and residue glue phenomenon is not present.
Referring to Fig. 1, a kind of IC support plate 1 comprising a carrier 10, a line construction 13 and one are incorporated into the carrier
Peelable glue-line 15 between 10 and the line construction 13.
The present invention also provides a kind of IC package processing procedures comprising following steps:
Step S 1, referring to Fig. 1, providing an IC support plate 1, the IC support plate 1 includes a carrier 10, a line construction 13
And one be incorporated into above-mentioned peelable glue-line 15 between the carrier 10 and the line construction 13.
Step S2 a, referring to Fig. 2, integrated circuit 2 (i.e. IC) is installed on the line by surface installation technique (SMT)
On side of the line structure 13 far from the carrier 10.Wherein, the installation temperature of the surface installation technique is about 250 degrees Celsius,
The dehydration temperature and/or the disengaging temperature are above the installation temperature.At this point, the benzene second in the peelable glue-line 15
Reaction is crosslinked between alkene-butadiene-styrene block copolymer so that the peelable glue-line viscosity reduce but it is not crisp
Change.
Step S3, referring to Fig. 3, said integrated circuit 2 is packaged on the IC support plate 1 by encapsulating structure 3.
Specifically, directly forming envelope in the side that the IC support plate 1 is equipped with the integrated circuit 2 by molding mode
Assembling structure 3, to encapsulate the integrated circuit 2.
Step S4, referring to Fig. 4, the IC support plate 1 for being packaged with integrated circuit 2 for above-mentioned carries out high-temperature baking, when it is described can
When removing glue-line 15 containing only inorganic hydrate or microcapsule granule, the temperature of the high-temperature baking is greater than or equal to the dehydration temperature
Degree or the disengaging temperature, so that inorganic hydrate in peelable glue-line 15 or microcapsule granule generate bulk gas and outside
It overflows, so that the peelable glue-line 15 is removed from the line construction 13 easily, and the line construction 13 is not
There are residue glues, and then an IC package circuit board 5 is made.When the peelable glue-line 15 includes inorganic hydrate and microcapsules simultaneously
When particle, the temperature of the high-temperature baking is greater than or equal to the dehydration temperature and the disengaging temperature, so that peelable glue-line
Inorganic hydrate and microcapsule granule in 15 generate bulk gas and overflow outward, so that the peelable glue-line 15 is light
It changes places and is removed from the line construction 13, and residue glue is not present in the line construction 13, and then an IC package circuit board is made
5。
It is appreciated that may also include other making technologies after step S4.
The present invention is specifically described below by Examples and Comparative Examples.
Embodiment
The Styrene-Butadiene-Styrene Block Copolymer for the model D1101 that 100g Kraton Polymers is produced
And the sense face powder of the jasmine perfume of the model SS-PD 41104-1 of 20g New Prismatic Enterprise Co., Ltd. production is placed in toluene,
It is uniformly mixed and the Styrene-Butadiene-Styrene Block Copolymer is made to be dissolved in the toluene and configure completion tree
Oil/fat composition.
The resin combination is coated on one surface of a copper foil, and is toasted 15 minutes under 110 degrees Celsius, so that institute
It states resin combination and forms a peelable glue-line for being bonded in the copper foil surface.
Comparative example 1
The Styrene-Butadiene-Styrene Block Copolymer for the model D1101 that 100g Kraton Polymers is produced
It is placed in toluene, is uniformly mixed and the Styrene-Butadiene-Styrene Block Copolymer is made to be dissolved in the toluene i.e.
Resin combination is completed in configuration.
The resin combination is coated on one surface of a copper foil, and is toasted 15 minutes under 110 degrees Celsius, so that institute
It states resin combination and forms a glue-line for being bonded in the copper foil surface.
Comparative example 2
The resin material of the model ETERAC 7735P of Changxing Chemical Industry Co Ltd's production is coated on one
One surface of copper foil simultaneously forms a glue-line.
Copper-stripping intensity survey is carried out respectively to the glue-line of the peelable glue-line of above-described embodiment and comparative example 1-2 at normal temperature
Examination is then toasted after the peelable glue-line of 5 minutes above-described embodiments and the glue-line of comparative example 1-2 at 230 degrees Celsius again to implementation
The peelable glue-line of example and the glue-line of comparative example 1-2 carry out copper-stripping strength test respectively, finally toast 30 points at 270 degrees Celsius
Again to the peelable glue-line of embodiment and comparative example 1-2 after the peelable glue-line of clock above-described embodiment and the glue-line of comparative example 1-2
Glue-line carry out copper-stripping strength test respectively.Testing result please refers to the detection data of table 1, Fig. 5, Fig. 6 and Fig. 7.
Coherent detection data of the table 1 about the peelable glue-line of embodiment and the glue-line of comparative example
Fig. 5 is the DSC figure of the peelable glue-line of embodiment, wherein Fig. 6 is the DSC figure of the glue-line of comparative example 1, wherein should
Just there is very strong absorption peak at 310 degrees Celsius in glue-line, it is known that the temperature that the glue-line viscosity disappears is higher, i.e., subsequent removing when
Temperature need it is higher.Fig. 7 is that the DSC of aluminium hydroxide inorganic hydrate schemes, and aluminium hydroxide strong put just occurs at 266 degrees Celsius
Thermal response.
The peelable glue-line that the embodiment of the present invention is formed it can be seen from table 1 and Fig. 5-7 is toasted at 230 and 270 degrees Celsius
Also there is certain copper-stripping intensity afterwards, and copper-stripping intensity is less than what comparative example 1 was formed without the resin combination of sense face powder
The copper-stripping intensity of glue-line so that in subsequent lift-off processing the embodiment of the present invention formed peelable glue-line be easier to removal and not
Easily stay residue glue.Compared to the glue-line of comparative example 2, the peelable glue-line that the embodiment of the present invention is formed is when undergoing surface installation technique
Peeling phenomenon does not occur.
Inorganic hydrate and/or microcapsule granule in resin combination of the invention, so that the resin combination shape
At peelable glue-line peelable temperature promoted so that the peelable glue-line is not shelled when undergoing surface installation technique
Phenomenon is fallen, and residue glue phenomenon is not present in the peelable glue-line after removing.
Claims (12)
1. a kind of resin combination, including Styrene-Butadiene-Styrene Block Copolymer, which is characterized in that the resin group
Closing object further includes several inorganic hydrates being dispersed in the Styrene-Butadiene-Styrene Block Copolymer and/or micro- glue
Capsule particle, the dehydration temperature that the inorganic hydrate occurs when phenomenon of losing water becomes inorganic matter are greater than 250 degrees Celsius, each micro- glue
Capsule particle include shell and by the shell coat completely in bury object, in the microcapsule granule in bury object and break through the shell
Disengaging temperature when body largely volatilizees is greater than 250 degrees Celsius.
2. resin combination as described in claim 1, which is characterized in that in the resin combination, the styrene-fourth two
Alkene-styrene block copolymer content is 100 parts by weight, when the resin combination includes the inorganic hydrate, institute
The content for stating inorganic hydrate is 1~50 parts by weight, when the resin combination includes the microcapsule granule, micro- glue
The content of capsule particle is 5~50 parts by weight.
3. resin combination as described in claim 1, which is characterized in that the s-B-S block copolymerization
The structural formula of object isWherein, x be 30~90, y be 10~
70, m and n is respectively the natural number for being greater than 1.
4. resin combination as described in claim 1, which is characterized in that the inorganic hydrate is selected from aluminium hydroxide and hydrogen-oxygen
Change at least one of magnesium.
5. resin combination as described in claim 1, which is characterized in that the microcapsule granule is sense face powder.
6. resin combination as described in claim 1, which is characterized in that the average grain diameter of the microcapsule granule is 3 microns
~12 microns.
7. a kind of peelable glue-line, which is characterized in that the peelable glue-line is described in any item by such as claim 1~6
It is made after resin combination is toasted.
8. peelable glue-line as claimed in claim 7, which is characterized in that the temperature of the baking is 110 degrees Celsius, the baking
The roasting time is 15 minutes.
9. a kind of IC support plate is formed in the line construction on one surface of carrier including a carrier and one, which is characterized in that institute
Stating IC support plate further includes one toasted rear obtained peelable by the described in any item resin combinations of such as claim 1~6
Glue-line, the peelable glue-line are incorporated between the carrier and the line construction.
10. IC support plate as claimed in claim 9, which is characterized in that the temperature of the baking is 110 degrees Celsius, the baking
Time be 15 minutes.
11. it is a kind of application by the described in any item resin combinations of such as claim 1~6 it is toasted after peelable glue-line is made
IC package processing procedure comprising following steps:
An IC support plate is provided, the IC support plate is incorporated into the carrier and the line including a carrier, a line construction and one
Peelable glue-line between line structure；
One integrated circuit is installed on side of the line construction far from the carrier by surface installation technique, the table
Face package technique has an installation temperature, and the dehydration temperature and/or the disengaging temperature are higher than the installation temperature；
Said integrated circuit is packaged on the IC support plate by an encapsulating structure；
High-temperature baking is carried out to above-mentioned IC support plate, when the peelable glue-line includes inorganic hydrate or microcapsule granule, institute
The temperature for stating high-temperature baking is greater than or equal to the dehydration temperature or the disengaging temperature, when the peelable glue-line includes inorganic
When hydrate and microcapsule granule, the temperature of the high-temperature baking is greater than or equal to the dehydration temperature and the disengaging temperature,
So that the inorganic hydrate and microcapsule granule in the peelable glue-line generate bulk gas and overflow outward, so that institute
It states peelable glue-line to remove from the line construction, and residue glue is not present in the line construction, and then IC package electricity is made
Road plate.
12. IC package processing procedure as claimed in claim 11, which is characterized in that be made peelable after the resin combination is toasted
Baking temperature from glue-line is 110 degrees Celsius, and the time is 15 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810459703.9A CN110484171B (en) | 2018-05-15 | 2018-05-15 | Resin composition, strippable adhesive layer, IC carrier and IC packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810459703.9A CN110484171B (en) | 2018-05-15 | 2018-05-15 | Resin composition, strippable adhesive layer, IC carrier and IC packaging process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110484171A true CN110484171A (en) | 2019-11-22 |
| CN110484171B CN110484171B (en) | 2022-02-22 |
Family
ID=68545258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810459703.9A Active CN110484171B (en) | 2018-05-15 | 2018-05-15 | Resin composition, strippable adhesive layer, IC carrier and IC packaging process |
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| Country | Link |
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| CN (1) | CN110484171B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2250513A (en) * | 1990-11-27 | 1992-06-10 | Nitto Denko Corp | Film- or sheet-form adhesive material |
| JP2003020458A (en) * | 2001-07-09 | 2003-01-24 | Sliontec Corp | Adhesive tape substrate and adhesive tape using the same |
| TW201800466A (en) * | 2016-06-24 | 2018-01-01 | 鵬鼎科技股份有限公司 | Resin composition, film and circuit board using the same |
| CN109554145A (en) * | 2017-09-25 | 2019-04-02 | 臻鼎科技股份有限公司 | High temperature resistant peelable glue and preparation method thereof |
-
2018
- 2018-05-15 CN CN201810459703.9A patent/CN110484171B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2250513A (en) * | 1990-11-27 | 1992-06-10 | Nitto Denko Corp | Film- or sheet-form adhesive material |
| JP2003020458A (en) * | 2001-07-09 | 2003-01-24 | Sliontec Corp | Adhesive tape substrate and adhesive tape using the same |
| TW201800466A (en) * | 2016-06-24 | 2018-01-01 | 鵬鼎科技股份有限公司 | Resin composition, film and circuit board using the same |
| CN109554145A (en) * | 2017-09-25 | 2019-04-02 | 臻鼎科技股份有限公司 | High temperature resistant peelable glue and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN110484171B (en) | 2022-02-22 |
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