CN110480926A - Integrated circuit plastic packaging is molded into injection device - Google Patents
Integrated circuit plastic packaging is molded into injection device Download PDFInfo
- Publication number
- CN110480926A CN110480926A CN201910748725.1A CN201910748725A CN110480926A CN 110480926 A CN110480926 A CN 110480926A CN 201910748725 A CN201910748725 A CN 201910748725A CN 110480926 A CN110480926 A CN 110480926A
- Authority
- CN
- China
- Prior art keywords
- partition panel
- integrated circuit
- molded
- plastic packaging
- injection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/176—Exchanging the injection unit or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of integrated circuit plastic packagings to be molded into injection device, including injection head, expects pipe and fixing seat, the expects pipe first end connects injection head, and the expects pipe second end is mounted in attachment base, attachment base bottom connecting spring, the spring are mounted in fixing seat far from the end of attachment base；The expects pipe includes supervisor and sectional pipe, supervisor's middle-end is equipped with sectional pipe, and supervisor is rotatablely connected with sectional pipe by connector, the first semi-circular partition panel is equipped on the inside of described supervisor one end, the sectional pipe is equipped with the second semi-circular partition panel on the inside of one end of the first partition panel, and the first partition panel and the second partition panel are arranged in parallel by shaft.The present invention cracking can close the injection head to break down, and will not influence the normal operation of other injection heads, and structure is simple, easy to operate.
Description
Technical field
The present invention relates to technical field of integrated circuits more particularly to integrated circuit plastic packaging to be molded into injection device.
Background technique
The encapsulation of integrated circuit refers to the shell of installation semiconductor integrated circuit chip.This shell not only plays peace
It puts, fix, sealing, protecting chip and enhance the effect of electric heating property, but also being to link up the chip interior world and external circuit
Bridge.Contact on chip is wired on the pin of package casing, these pins are further through the conducting wire in printed board
Connection is established with other devices.Therefore, encapsulation plays a crucial role for integrated circuit.Encapsulation can be divided into modeling
Material, ceramics and three kinds of Metal Packaging, wherein Plastic Package has obtained widest application.Existing integrated circuit plastic packaging, which is molded into, to be penetrated
Device is worked at the same time with multiple injection heads and barrel, when wherein some injection head when something goes wrong, needs to stop at once
Work greatly reduces the efficiency of work to replace in this way.
Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
One purpose is that proposition integrated circuit plastic packaging is molded into injection device, and the present invention cracking can close the injection head to break down, again
Will not influence the normal operation of other injection heads, structure is simple, and it is easy to operate, and in actual use, tape tree alicyclic ring
The service life of injection head improves 50,000 moulds time or more than the injection head of general no resin ring, overcomes and uses environmentally protective tree
The problem of rouge injection head as caused by high viscosity, barrel abrasion aggravation, reduced service life.
A kind of integrated circuit plastic packaging according to an embodiment of the present invention is molded into injection device, including injection head, expects pipe and fixing seat,
The expects pipe first end connects injection head, and the expects pipe second end is mounted in attachment base, attachment base bottom connecting spring,
The spring is mounted in fixing seat far from the end of attachment base；
The expects pipe includes supervisor and sectional pipe, and supervisor's middle-end is equipped with sectional pipe, and is responsible for and passes through company with sectional pipe
Interface rotation connection, supervisor one end inside are equipped with the first semi-circular partition panel, and the sectional pipe is close to the first partition panel
One end on the inside of be equipped with the second semi-circular partition panel, and the first partition panel and the second partition panel are arranged in parallel by shaft.
Preferably, the both ends of the shaft is equipped with baffle, and pacifies between baffle and the first partition panel and the second partition panel
Equipped with compression bullet circle.
Preferably, first partition panel and the second partition panel sealing junction are equipped with sealing element.
Preferably, the injection head includes front end body, and the front end body side surface offers the groove of annular, in the groove
It is socketed with resin ring, in plastic sealed mould process of injection molding, resin is injected head in barrel and is injected into mixing at high temperature under high pressure
Chamber, runner, cast gate, type chamber must have good cooperation and leakproofness in this process between barrel and injection head, can just subtract
Less wear improves service life.One of groove is set on injection head head, using the concept of assisted resin ring, in injection process
In, resin ring connects together with injection head movement always, plays the role of sealing, defective material is prevented to be stuck between barrel and injection head
Gap in, increase running resistance and abrasion.
Preferably, it is socketed with bushing outside the attachment base, the bushing is mounted on pressing plate by briquetting.
Preferably, the air slot for making space locating for spring and extraneous connection is offered in the fixing seat.
Preferably, the connector is around equipped with sealing ring.
Preferably, it is with the resistance to height of import that the sealing element and sealing ring material, which are the resistance to 450 degree of electric insulating sealants of JL-747,
The resistance to 450 DEG C of high temperature adhesives of bi-component of warm organosilicon and import modified firming agent composition.
Beneficial effect in the present invention is: when injection head breaks down, the sectional pipe of manual rotation's expects pipe middle-end, and segmentation
Connector between pipe and supervisor is subjected to displacement rotation, and the first partition panel for being responsible for inside rotates clockwise 180 ° by shaft,
The first partition panel and the second partition panel one round partition panel equal with expects pipe diameter of inner pipe of formation thoroughly separate injection at this time
The charging of head, the present invention cracking can close the injection head to break down, and will not influence the normal operation of other injection heads, tie
Structure is simple, easy to operate, and in actual use, and the service life of the injection head of tape tree alicyclic ring is than general no resin ring
Injection head improve 50,000 moulds time or more, overcome using environmentally protective resin injection head as caused by high viscosity, barrel abrasion
The problem of aggravation, reduced service life.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram that integrated circuit plastic packaging proposed by the present invention is molded into injection device；
Fig. 2 is the structural schematic diagram that integrated circuit plastic packaging proposed by the present invention is molded into expects pipe in injection device；
Fig. 3 is the sectional drawing that integrated circuit plastic packaging proposed by the present invention is molded into expects pipe in injection device；
Fig. 4 is the structure that integrated circuit plastic packaging proposed by the present invention is molded into first baffle and second baffle cooperation in injection device
Schematic diagram；
Fig. 5 is the structural schematic diagram that integrated circuit plastic packaging proposed by the present invention is molded into injection head in injection device.
In figure: 1- injection head, 11- groove, the front end 12- body, 13- resin ring, 2- expects pipe, 21- supervisor, 22- sectional pipe,
The first partition panel of 23-, the second partition panel of 24-, 25- shaft, 26- connector, 27- sealing ring, 28- baffle, 29- compression bullet circle,
210- sealing element, 3- attachment base, 4- pressing plate, 5- spring, 6- air slot, 7- fixing seat, 8- briquetting, 9- bushing.
Specific embodiment
In conjunction with the accompanying drawings, the present invention is further explained in detail.These attached drawings are simplified schematic diagram, only with
Illustration illustrates basic structure of the invention, therefore it only shows the composition relevant to the invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
Referring to Fig.1-5, a kind of integrated circuit plastic packaging is molded into injection device, including injection head 1, expects pipe 2 and fixing seat 7, expects pipe 2
First end connects injection head 1, and 2 second end of expects pipe is mounted in attachment base 3,3 bottom connecting spring 5 of attachment base, and spring 5 is far from even
The end of joint chair 3 is mounted in fixing seat 7；
Expects pipe 2 includes supervisor 21 and sectional pipe 22, and 21 middle-ends of supervisor are equipped with sectional pipe 22, and it is logical with sectional pipe 22 to be responsible for 21
Cross connector 26 rotation connection, supervisor 21 one end on the inside of be equipped with the first semi-circular partition panel 23, sectional pipe 22 close to first every
It is equipped with the second semi-circular partition panel 24 on the inside of one end of disconnected plate 23, and the first partition panel 23 and the second partition panel 24 pass through shaft
25 are arranged in parallel.
25 both ends of shaft are equipped with baffle 28, and are respectively mounted between baffle 28 and the first partition panel 23 and the second partition panel 24
There is compression bullet circle 29, the first partition panel 23 and the second partition panel 24 sealing junction are equipped with sealing element 210, before injection head 1 includes
Body 12 is held, body 12 side in front end offers the groove 11 of annular, is socketed with resin ring 13, plastic packaging module injection molding mistake in groove 11
Cheng Zhong, resin are injected first 1 in barrel and are injected into mixing chamber, runner, cast gate, type chamber at high temperature under high pressure, in this process,
Must there are good cooperation and leakproofness between barrel and injection head 1, just can be reduced abrasion, improve service life.In injection head 1
Head be arranged one of groove 11, using the concept of assisted resin ring 13, in injection process, resin ring 13 always with injection head 1
Connect together movement, plays the role of sealing, and defective material is prevented to be stuck in the gap between barrel and injection head 1, increases operation resistance
Power and abrasion, attachment base 3 are socketed with bushing 9 outside, and bushing 9 is mounted on pressing plate 4 by briquetting 8, and offering in fixing seat 7 makes bullet
The air slot 6 in space locating for spring 5 and extraneous connection, connector 26 is around sealing ring 27 is equipped with, and sealing ring 27 is to the first partition panel
23 and second the junction of partition panel 24 be sealed, compression bullet circle 29 can compress the first partition panel 23 and the second partition panel 24
The gap that junction is likely to occur, sealing element 210 and 27 material of sealing ring be the resistance to 450 degree of electric insulating sealants of JL-747 be with into
The resistance to 450 DEG C of high temperature adhesives of bi-component of mouth high-temperature resistant silicone and import modified firming agent composition.
Working principle: when work, when injection head 1 breaks down, the sectional pipe 22 of 2 middle-end of manual rotation's expects pipe, segmentation
Connector 26 between pipe 22 and supervisor 21 is subjected to displacement rotation, and the first partition panel 23 of 21 inside of supervisor passes through 25 up time of shaft
Needle rotates 180 °, at this time the first partition panel 23 and the second partition panel 24 formed a circle equal with 2 diameter of inner pipe of expects pipe every
Disconnected plate thoroughly separates the charging of injection head 1, and the present invention cracking can close the injection head 1 to break down, and will not influence other
The normal operation of injection head 1, structure is simple, easy to operate, and in actual use, the injection head 1 of tape tree alicyclic ring 13
Service life improves 50,000 moulds time or more than the injection head 1 of general no resin ring 13, overcome the environmentally protective resin of use due to
The problem of injection head 1 caused by high viscosity, barrel abrasion aggravation, reduced service life.
The standardized element that the present invention uses can commercially, and shaped piece is according to specification and attached drawing note
Load can carry out customized, and the specific connection type of each part is all made of in the prior art mature bolt, rivet, welding etc.
Conventional means, mechanical, part and equipment are all made of in the prior art, conventional model, in addition circuit connection uses the prior art
Middle conventional connection type, this will not be detailed here, and the content being not described in detail in this specification belongs to this field professional technique
The prior art well known to personnel.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of integrated circuit plastic packaging is molded into injection device, it is characterised in that: including injection head, expects pipe and fixing seat, the expects pipe
First end connects injection head, and the expects pipe second end is mounted in attachment base, attachment base bottom connecting spring, the spring
End far from attachment base is mounted in fixing seat；
The expects pipe includes supervisor and sectional pipe, and supervisor's middle-end is equipped with sectional pipe, and is responsible for and passes through connector with sectional pipe
Rotation connection, equipped with the first semi-circular partition panel on the inside of described supervisor one end, the sectional pipe close to the first partition panel one
End inside is equipped with the second semi-circular partition panel, and the first partition panel and the second partition panel are arranged in parallel by shaft.
2. integrated circuit plastic packaging according to claim 1 is molded into injection device, it is characterised in that: the both ends of the shaft is equipped with
Baffle, and compression bullet circle is mounted between baffle and the first partition panel and the second partition panel.
3. integrated circuit plastic packaging according to claim 2 is molded into injection device, it is characterised in that: first partition panel and
Two partition panels seal junction and are equipped with sealing element.
4. integrated circuit plastic packaging according to claim 1 is molded into injection device, it is characterised in that: the injection head includes front end
Body, the front end body side surface offer the groove of annular, are socketed with resin ring in the groove.
5. integrated circuit plastic packaging according to claim 1 is molded into injection device, it is characterised in that: be socketed with outside the attachment base
Bushing, the bushing are mounted on pressing plate by briquetting.
6. integrated circuit plastic packaging according to claim 1 is molded into injection device, it is characterised in that: offered in the fixing seat
Make the air slot in space locating for spring and extraneous connection.
7. integrated circuit plastic packaging according to claim 1 is molded into injection device, it is characterised in that: the connector surround and is equipped with
Sealing ring.
8. integrated circuit plastic packaging according to claim 1 is molded into injection device, it is characterised in that: the sealing element and sealing ring
Material is organosilicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910748725.1A CN110480926B (en) | 2019-08-14 | 2019-08-14 | Injection device for integrated circuit plastic package mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910748725.1A CN110480926B (en) | 2019-08-14 | 2019-08-14 | Injection device for integrated circuit plastic package mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110480926A true CN110480926A (en) | 2019-11-22 |
| CN110480926B CN110480926B (en) | 2020-05-01 |
Family
ID=68549911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910748725.1A Active CN110480926B (en) | 2019-08-14 | 2019-08-14 | Injection device for integrated circuit plastic package mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110480926B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113619023A (en) * | 2021-08-09 | 2021-11-09 | 天津大学 | Injection equipment for plastic packaging film of integrated circuit |
Citations (6)
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| CN207172590U (en) * | 2017-08-19 | 2018-04-03 | 深圳市君鸿宇科技有限公司 | A kind of material-changing device of injection machine |
| WO2018183810A1 (en) * | 2017-03-31 | 2018-10-04 | Synventive Molding Solutions, Inc. | Rotary valve |
| CN109276934A (en) * | 2018-10-30 | 2019-01-29 | 金川集团股份有限公司 | A kind of high concentration slurry pump intake anti-clogging liquid distributing device |
| CN208885993U (en) * | 2018-09-18 | 2019-05-21 | 江苏海纬集团有限公司 | A kind of adjustable shut-off valve |
-
2019
- 2019-08-14 CN CN201910748725.1A patent/CN110480926B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103252872A (en) * | 2013-04-13 | 2013-08-21 | 金孝禹 | Full-automatic multi-runner injection molding machine head |
| CN106813499A (en) * | 2015-11-27 | 2017-06-09 | 湖南鼎玖能源环境科技有限公司 | Swing type rotary furnace and its active clapboard component |
| WO2018183810A1 (en) * | 2017-03-31 | 2018-10-04 | Synventive Molding Solutions, Inc. | Rotary valve |
| CN207172590U (en) * | 2017-08-19 | 2018-04-03 | 深圳市君鸿宇科技有限公司 | A kind of material-changing device of injection machine |
| CN208885993U (en) * | 2018-09-18 | 2019-05-21 | 江苏海纬集团有限公司 | A kind of adjustable shut-off valve |
| CN109276934A (en) * | 2018-10-30 | 2019-01-29 | 金川集团股份有限公司 | A kind of high concentration slurry pump intake anti-clogging liquid distributing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113619023A (en) * | 2021-08-09 | 2021-11-09 | 天津大学 | Injection equipment for plastic packaging film of integrated circuit |
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| Publication number | Publication date |
|---|---|
| CN110480926B (en) | 2020-05-01 |
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