CN110468414A - A kind of corresponding etching to compensate device - Google Patents
A kind of corresponding etching to compensate device Download PDFInfo
- Publication number
- CN110468414A CN110468414A CN201810440648.9A CN201810440648A CN110468414A CN 110468414 A CN110468414 A CN 110468414A CN 201810440648 A CN201810440648 A CN 201810440648A CN 110468414 A CN110468414 A CN 110468414A
- Authority
- CN
- China
- Prior art keywords
- jet pipe
- nozzle
- compensate
- corresponding etching
- control valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The present invention relates to a kind of corresponding etching to compensate devices, including corresponding etching to compensate apparatus main body, jet pipe, nozzle and control valve, the inside of the corresponding etching to compensate apparatus main body is equipped with jet pipe, and nozzle is provided on jet pipe outer surface, and the upper end of the jet pipe is connected with control valve.The beneficial effects of the present invention are: the corresponding etching to compensate device, this system is mounted with some jet pipes in operative orientation vertical direction, each jet pipe can be with respective control valve control switch, and each jet pipe is mounted with the nozzle of different number, the shape arrangement of nozzle is at a triangle, under normal circumstances according to following arrangement: first jet pipe is mounted with 9 nozzles, second jet pipe is mounted with 8 nozzles, third root jet pipe is mounted with 7 nozzles, so analogize, until to the last a jet pipe installs 1 nozzle, due to can choose opening for each jet pipe, it closes, " brass hill " in plate face can be by removing in layer, more preferably to etch effect.
Description
Technical field
The present invention relates to corresponding etching to compensate technical field, specially a kind of corresponding etching to compensate device.
Background technique
When etching spray is to upper face, the liquid medicine flowing of edges of boards edge will faster among plate, this results in
Upper face forms a kind of " soul is solidifying " state, forms pool effect, to hinder spray and reduce etching reflection speed, causes
One " brass hill " is formed in upper face, better etching quality, these " brass hills " should will remove in order to obtain.
The spraying effect of existing corresponding etching to compensate device is excessively poor, cannot achieve the effect that completely remove " brass hill ", thus shadow
The effect of etching is rung.
Summary of the invention
The purpose of the present invention is to provide a kind of corresponding etching to compensate devices, are mended with solving etching mentioned above in the background art
The spraying effect for repaying device is excessively poor, cannot achieve the effect that completely remove " brass hill ", thus the problem of affecting the effect of etching.
To achieve the above object, the invention provides the following technical scheme: a kind of corresponding etching to compensate device, including corresponding etching to compensate fill
Main body, jet pipe, nozzle and control valve are set, the inside of the corresponding etching to compensate apparatus main body is equipped with jet pipe, and jet pipe outer surface
On be provided with nozzle, the upper end of the jet pipe is connected with control valve.
Preferably, the jet pipe is provided with 14, and jet pipe and nozzle are connectivity structure.
Preferably, it is provided with 9 nozzles on the jet pipe of the leftmost side, 2 nozzles are provided on the 8th jet pipe, and
The quantity of 9th, 10 and 11 jet pipe top nozzle can determine as the case may be.
Preferably, the control valve is pneumatic diaphragm valve, and its material is corrosion resistant engineering plastics.
Preferably, the aperture of the nozzle is 1-2mm, and nozzle vertical direction equidistantly distributed.
Preferably, the nozzle constitutes " V " font structure, and nozzle and jet pipe are detaching structure, jet pipe and corresponding etching to compensate
Apparatus main body is detaching structure.
Preferably, the jet pipe is provided with 10 in distribution, the jet pipe of top up and down, and the jet pipe of lower section is provided with 4.
Preferably, the open and close selection of the jet pipe can be set on the PC that PLC is controlled, and be between jet pipe and PC
It is electrically connected, is incuded by sensor, to control the unlatching of jet pipe.
Compared with prior art, the beneficial effects of the present invention are: the corresponding etching to compensate device, devises a special spray
System, this system are mounted with some jet pipes in operative orientation vertical direction, and each jet pipe can be with respective control valve
Control switch, and each jet pipe is mounted with the nozzle of different number, and the shape arrangement of nozzle is at a triangle, positive reason
According to following arrangement under condition: first jet pipe is mounted with that 9 nozzles, second jet pipe are mounted with 8 nozzles, third root jet pipe peace
7 nozzles have been filled, have so been analogized, until to the last a jet pipe installs 1 nozzle, due to can choose each jet pipe
Open and close, " brass hill " in plate face can be by removing in layer, so that etch effect is more preferably.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of corresponding etching to compensate device of the present invention.
In figure: 1, corresponding etching to compensate apparatus main body, 2, jet pipe, 3, nozzle, 4, control valve.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, the present invention provides a kind of technical solution: a kind of corresponding etching to compensate device, including corresponding etching to compensate device master
Body 1, jet pipe 2, nozzle 3 and control valve 4, the inside of corresponding etching to compensate apparatus main body 1 are equipped with jet pipe 2, and on 2 outer surface of jet pipe
It is provided with nozzle 3, jet pipe 2 is provided with 14, and jet pipe 2 and nozzle 3 are connectivity structure, are provided with 9 on the jet pipe 2 of the leftmost side
Nozzle 3 is provided with 2 nozzles 3 on the 8th jet pipe 2, and the quantity of the 9th, 10 and 11 2 top nozzle 3 of jet pipe can be according to specific
Situation is determined, and the aperture of nozzle 3 is 1-2mm, and nozzle 3 vertical direction equidistantly distributed, nozzle 3 constitute " V " font structure, and
Nozzle 3 and jet pipe 2 are detaching structure, and jet pipe 2 and corresponding etching to compensate apparatus main body 1 are detaching structure, and jet pipe 2 is in distribution up and down, on
The jet pipe 2 of side is provided with 10, and the jet pipe 2 of lower section is provided with 4, and the open and close selection of jet pipe 2 can be on the PC that PLC is controlled
It is set, to be electrically connected between jet pipe 2 and PC, is incuded by sensor, to control the unlatching of jet pipe, be can choose
The open and close of each jet pipe 2, " brass hill " in plate face can be by removing in layer, so that etch effect is more preferably, jet pipe
2 upper end is connected with control valve 4, and control valve 4 is pneumatic diaphragm valve, and its material is corrosion resistant engineering plastics.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection scope of invention.
Claims (8)
1. a kind of corresponding etching to compensate device, including corresponding etching to compensate apparatus main body (1), jet pipe (2), nozzle (3) and control valve (4),
It is characterized by: the inside of the corresponding etching to compensate apparatus main body (1) is equipped with jet pipe (2), and it is provided on jet pipe (2) outer surface
The upper end of nozzle (3), the jet pipe (2) is connected with control valve (4).
2. a kind of corresponding etching to compensate device according to claim 1, it is characterised in that: the jet pipe (2) is provided with 14, and
Jet pipe (2) and nozzle (3) are connectivity structure.
3. a kind of corresponding etching to compensate device according to claim 1, it is characterised in that: set on the jet pipe (2) of the leftmost side
9 nozzles (3) are equipped with, 2 nozzles (3), and the 9th, 10 and 11 jet pipe (2) top nozzle are provided on the 8th jet pipe (2)
(3) quantity can determine as the case may be.
4. a kind of corresponding etching to compensate device according to claim 1, it is characterised in that: the control valve (4) be pneumatically every
Film valve, and its material is corrosion resistant engineering plastics.
5. a kind of corresponding etching to compensate device according to claim 1, it is characterised in that: the aperture of the nozzle (3) is 1-
2mm, and nozzle (3) vertical direction equidistantly distributed.
6. a kind of corresponding etching to compensate device according to claim 1, it is characterised in that: the nozzle (3) constitutes " V " font knot
Structure, and nozzle (3) and jet pipe (2) they are detaching structure, jet pipe (2) and corresponding etching to compensate apparatus main body (1) they are detaching structure.
7. a kind of corresponding etching to compensate device according to claim 1, it is characterised in that: the jet pipe (2) is distributed in upper and lower, on
The jet pipe (2) of side is provided with 10, and the jet pipe (2) of lower section is provided with 4.
8. a kind of corresponding etching to compensate device according to claim 1, it is characterised in that: the open and close selection of the jet pipe (2) can
To be set on the PC that PLC is controlled, to be electrically connected between jet pipe (2) and PC, incuded by sensor, to control
The unlatching of jet pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810440648.9A CN110468414A (en) | 2018-05-10 | 2018-05-10 | A kind of corresponding etching to compensate device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810440648.9A CN110468414A (en) | 2018-05-10 | 2018-05-10 | A kind of corresponding etching to compensate device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110468414A true CN110468414A (en) | 2019-11-19 |
Family
ID=68503670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810440648.9A Pending CN110468414A (en) | 2018-05-10 | 2018-05-10 | A kind of corresponding etching to compensate device |
Country Status (1)
Country | Link |
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CN (1) | CN110468414A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201501928U (en) * | 2009-08-21 | 2010-06-09 | 东莞美维电路有限公司 | Etching nozzle assembly with three spraying stages |
CN202430287U (en) * | 2011-12-30 | 2012-09-12 | 特新电路材料(东莞)有限公司 | Compensation spray device |
-
2018
- 2018-05-10 CN CN201810440648.9A patent/CN110468414A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201501928U (en) * | 2009-08-21 | 2010-06-09 | 东莞美维电路有限公司 | Etching nozzle assembly with three spraying stages |
CN202430287U (en) * | 2011-12-30 | 2012-09-12 | 特新电路材料(东莞)有限公司 | Compensation spray device |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191119 |
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RJ01 | Rejection of invention patent application after publication |