CN110467920A - A kind of separation of 3D Stacked Die Packaging component chip corrosive agent and separation method - Google Patents
A kind of separation of 3D Stacked Die Packaging component chip corrosive agent and separation method Download PDFInfo
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- CN110467920A CN110467920A CN201910756765.0A CN201910756765A CN110467920A CN 110467920 A CN110467920 A CN 110467920A CN 201910756765 A CN201910756765 A CN 201910756765A CN 110467920 A CN110467920 A CN 110467920A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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Abstract
The present invention discloses a kind of 3D Stacked Die Packaging component chip separation corrosive agent and separation method, and being related to separation method described in multi-chip mounting technical field includes removing the black sealing of chip to obtain the first sample；The chip gold thread for removing first sample obtains the second sample；Second sample is placed in 2~3h of immersion in corrosive agent and obtains third sample；The third sample acetone rinsing；Wherein, the corrosive agent includes the fuming nitric aicd that nitric acid that mass percent is 65%~68% and mass percent are greater than 98%, and the volume ratio of fuming nitric aicd of nitric acid and mass percent greater than 98% that the mass percent is 65%~68% is 1: 1.The method of the present invention operation process is easy to control, and chip form will not be damaged, and 3D can be made to fold chip in chip dies component and be all independently exposed, and defect in chip is made to be easy observation.
Description
Technical field
The present invention relates to multi-chip mounting technical field, specifically a kind of 3D Stacked Die Packaging component chip separation is used
Corrosive agent and separation method.
Background technique
The encapsulation component that chip dies are folded for completely new 3D, if fail in use, it is sometimes desirable to
By destructive physical analysis, when checking the situation of its every layer chip dies, this just needs every layer of chip by component naked
Piece all exposes, and checks the external structure of each chip dies, and convenient for verifying its internal material, whether design and structure are accorded with
The requirement of design document or miscellaneous stipulations properly.
The encapsulation of the folded chip dies of 3D is the important packing forms of one kind of high-performance component, and salient feature is member
The physical analysis of device brings new challenge, how to separate 3D every layer of chip for folding chip dies component, become in order to
3D folds the thorny problem encountered during chip dies encapsulation component failure analysis/physical analysis.
Summary of the invention
(1) the technical issues of solving
The purpose of the present invention is to provide a kind of 3D Stacked Die Packaging component chip separation corrosive agent and separation sides
Method, to solve the problems mentioned in the above background technology.
(2) technical solution
In order to overcome the above technical defects, the present invention provides a kind of 3D Stacked Die Packaging component chip separation corrosion
Agent and separation method.
In a first aspect, the present invention provides a kind of 3D Stacked Die Packaging component chip separation corrosive agent, the corrosion
Agent includes the fuming nitric aicd that the nitric acid that mass percent is 65%~68% and mass percent are greater than 98%, and the quality hundred
The volume ratio than the fuming nitric aicd of nitric acid and mass percent greater than 98% for 65%~68% is divided to be 1: 1.
Preferably, the corrosive agent works under 85~95 degrees celsius.
Second aspect, the present invention also provides a kind of 3D Stacked Die Packaging component chip separation method, the separation sides
Method the following steps are included:
The black sealing of removal chip obtains the first sample；
The chip gold thread for removing first sample obtains the second sample；
Second sample is placed in 2~3h of immersion in corrosive agent and obtains third sample；
The third sample acetone rinsing；
Wherein, the corrosive agent include mass percent be 65%~68% nitric acid and mass percent be greater than 98%
Fuming nitric aicd, and the mass percent be 65%~68% nitric acid and mass percent greater than 98% fuming nitric aicd body
Product is than being 1: 1.
Preferably, the step of black sealing of the removal chip are as follows:
The chip, which is placed in the fuming nitric aicd that temperature is 145~155 degrees Celsius, impregnates 5~8min.
Preferably, the step of removing the chip gold thread of first sample are as follows:
First sample, which is placed in the chloroazotic acid that temperature is 85~95 degrees Celsius, impregnates 7~8min.
Preferably, second sample is placed in 2~3h of immersion in the corrosive agent that temperature is 85~95 degrees Celsius and obtains third
Sample.
Preferably, the third sample acetone rinsing 5s~8s.
Preferably, vacuum pencil is used to draw out after the completion of the third sample acetone rinsing.
(3) beneficial effect
The present invention provides a kind of 3D Stacked Die Packaging component chip separation corrosive agent and separation methods.With it is existing
Technology is compared, have it is following the utility model has the advantages that
Black sealing is successively removed by chip and chip gold thread is placed on 2~3h of immersion in corrosive agent, using acetone
Rinse, the corrosive agent used for the mass percent that volume ratio is 1: 1 be 65%~68% nitric acid and mass percent be greater than
98% fuming nitric aicd mixed liquor realizes non-top layer chip intracorporal to package cavity and carries out all exposures, avoids machinery and open
It is convenient that physical analysis is carried out to non-top layer chip to the damage of chip during envelope.The method of the present invention operation process is easy to control, and
Chip form will not be damaged, and 3D can be made to fold chip in chip dies component and be all independently exposed, and make to lack in chip
It falls into and is easy observation.
Specific embodiment
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
The elaboration of technology based on the above background, the present invention provide a kind of 3D Stacked Die Packaging component chip separation corruption
Lose agent and separation method.
In a first aspect, the embodiment of the present invention provides a kind of 3D Stacked Die Packaging component chip separation corrosive agent, institute
Stating corrosive agent includes the fuming nitric aicd of nitric acid and mass percent greater than 98% that mass percent is 65%~68%, and described
The volume ratio of fuming nitric aicd of the nitric acid and mass percent that mass percent is 65%~68% greater than 98% is 1: 1.
The corrosive agent that above-described embodiment uses for the mass percent that volume ratio is 1: 1 be 65%~68% nitric acid and matter
The fuming nitric aicd mixed liquor that percentage is greater than 98% is measured, non-top layer chip intracorporal to package cavity is realized and carries out all exposures,
The damage during machinery breaks a seal to chip is avoided, it is convenient that physical analysis is carried out to non-top layer chip.
In one embodiment, the corrosive agent works under 85~95 degrees celsius.In 85~95 degrees celsius
Under corrosive agent promote separation of the corrosive agent to chip.
Second aspect, the embodiment of the present invention also provides a kind of 3D Stacked Die Packaging component chip separation method, described
Separation method the following steps are included:
The black sealing of removal chip obtains the first sample；
The chip gold thread for removing first sample obtains the second sample；
Second sample is placed in 2~3h of immersion in corrosive agent and obtains third sample；
The third sample acetone rinsing；
Wherein, the corrosive agent include mass percent be 65%~68% nitric acid and mass percent be greater than 98%
Fuming nitric aicd, and the mass percent be 65%~68% nitric acid and mass percent greater than 98% fuming nitric aicd body
Product is than being 1: 1.
Above-described embodiment successively removes black sealing by chip and chip gold thread is placed on 2~3h of immersion in corrosive agent,
Using acetone rinsing, the corrosive agent that uses for the mass percent that volume ratio is 1: 1 be 65%~68% nitric acid and quality
Percentage is greater than 98% fuming nitric aicd mixed liquor, realizes non-top layer chip intracorporal to package cavity and carries out all exposures, keeps away
Exempt from damage of the mechanical Kaifeng in the process to chip, it is convenient that physical analysis is carried out to non-top layer chip.The method of the present invention operation
Journey is easy to control, and chip form will not be damaged, and 3D can be made to fold chip in chip dies component and be all independently exposed,
Defect in chip is set to be easy observation.
In one embodiment, it is described removal chip black sealing the step of are as follows:
The chip, which is placed in the fuming nitric aicd that temperature is 145~155 degrees Celsius, impregnates 5~8min.
In one embodiment, the step of removing the chip gold thread of first sample are as follows:
First sample, which is placed in the chloroazotic acid that temperature is 85~95 degrees Celsius, impregnates 7~8min.
In one embodiment, second sample is placed in 2~3h of immersion in the corrosive agent that temperature is 85~95 degrees Celsius and obtains
Third sample.
In one embodiment, the third sample acetone rinsing 5s~8s.
In one embodiment, vacuum pencil is used to draw out after the completion of the third sample acetone rinsing.
It is described in detail below by specific embodiment:
Embodiment 1:
The embodiment of the present invention provides a kind of 3D Stacked Die Packaging component chip separation method, and the separation method includes
Following steps:
Chip is placed in immersion 5min in the fuming nitric aicd that temperature is 145 degrees Celsius and obtains the first sample.
First sample is placed in immersion 8min in the chloroazotic acid that temperature is 85 degrees Celsius and obtains the second sample；
Second sample is placed in immersion 2h in the corrosive agent that temperature is 85 degrees Celsius and obtains third sample；
The third sample acetone rinsing 8s, is drawn out using vacuum pencil.
Wherein, the corrosive agent includes the smoke nitre of nitric acid and mass percent greater than 98% that mass percent is 65%
Acid, and the volume ratio of fuming nitric aicd of nitric acid and mass percent greater than 98% that the mass percent is 65% is 1: 1.
Embodiment 2:
Second aspect, the embodiment of the present invention also provides a kind of 3D Stacked Die Packaging component chip separation method, described
Separation method the following steps are included:
Chip is placed in immersion 8min in the fuming nitric aicd that temperature is 155 degrees Celsius and obtains the first sample.
First sample is placed in immersion 7min in the chloroazotic acid that temperature is 95 degrees Celsius and obtains the second sample；
Second sample is placed in immersion 3h in the corrosive agent that temperature is 95 degrees Celsius and obtains third sample；
The third sample acetone rinsing 5s, is drawn out using vacuum pencil.
Wherein, the corrosive agent includes the smoke nitre of nitric acid and mass percent greater than 98% that mass percent is 68%
Acid, and the volume ratio of fuming nitric aicd of nitric acid and mass percent greater than 98% that the mass percent is 68% is 1: 1.
Embodiment 3:
Second aspect, the embodiment of the present invention also provides a kind of 3D Stacked Die Packaging component chip separation method, described
Separation method the following steps are included:
Chip is placed in immersion 6min in the fuming nitric aicd that temperature is 150 degrees Celsius and obtains the first sample.
First sample is placed in immersion 7.5min in the chloroazotic acid that temperature is 85 degrees Celsius and obtains the second sample；
Second sample is placed in immersion 2.5h in the corrosive agent that temperature is 90 degrees Celsius and obtains third sample；
The third sample acetone rinsing 7s, is drawn out using vacuum pencil.
Wherein, the corrosive agent includes the smoke nitre of nitric acid and mass percent greater than 98% that mass percent is 67%
Acid, and the volume ratio of fuming nitric aicd of nitric acid and mass percent greater than 98% that the mass percent is 67% is 1: 1.
Embodiment 4:
The embodiment of the present invention provides a kind of 3D Stacked Die Packaging component chip separation method, and the separation method includes
Following steps:
Chip is placed in immersion 7min in the fuming nitric aicd that temperature is 148 degrees Celsius and obtains the first sample.
First sample is placed in immersion 7.3min in the chloroazotic acid that temperature is 90 degrees Celsius and obtains the second sample；
Second sample is placed in immersion 2.8h in the corrosive agent that temperature is 87 degrees Celsius and obtains third sample；
The third sample acetone rinsing 6s, is drawn out using vacuum pencil.
Wherein, the corrosive agent includes the smoke nitre of nitric acid and mass percent greater than 98% that mass percent is 66%
Acid, and the volume ratio of fuming nitric aicd of nitric acid and mass percent greater than 98% that the mass percent is 66% is 1: 1.
Embodiment 5:
The embodiment of the present invention provides a kind of 3D Stacked Die Packaging component chip separation method, and the separation method includes
Following steps:
Chip is placed in immersion 7.5min in the fuming nitric aicd that temperature is 152 degrees Celsius and obtains the first sample.
First sample is placed in immersion 7.3min in the chloroazotic acid that temperature is 88 degrees Celsius and obtains the second sample；
Second sample is placed in immersion 2.3h in the corrosive agent that temperature is 92 degrees Celsius and obtains third sample；
The third sample acetone rinsing 6.8s, is drawn out using vacuum pencil.
Wherein, the corrosive agent includes the smoke nitre of nitric acid and mass percent greater than 98% that mass percent is 65%
Acid, and the volume ratio of fuming nitric aicd of nitric acid and mass percent greater than 98% that the mass percent is 65% is 1: 1.
Embodiment 6:
The embodiment of the present invention provides a kind of 3D Stacked Die Packaging component chip separation method, and the separation method includes
Following steps:
Chip is placed in immersion 6.8min in the fuming nitric aicd that temperature is 154 degrees Celsius and obtains the first sample.
First sample is placed in immersion 7.2min in the chloroazotic acid that temperature is 86 degrees Celsius and obtains the second sample；
Second sample is placed in immersion 2.6h in the corrosive agent that temperature is 93 degrees Celsius and obtains third sample；
The third sample acetone rinsing 6.5s, is drawn out using vacuum pencil.
Wherein, the corrosive agent includes the smoke nitre of nitric acid and mass percent greater than 98% that mass percent is 65%
Acid, and the volume ratio of fuming nitric aicd of nitric acid and mass percent greater than 98% that the mass percent is 65% is 1: 1.
Claims (8)
1. a kind of 3D Stacked Die Packaging component chip separation corrosive agent, which is characterized in that the corrosive agent includes quality
Nitric acid and mass percent that percentage is 65%~68% are greater than 98% fuming nitric aicd, and the mass percent is 65%
The volume ratio of fuming nitric aicd of~68% nitric acid and mass percent greater than 98% is 1: 1.
2. 3D Stacked Die Packaging component chip separation corrosive agent according to claim 1, which is characterized in that described
Corrosive agent works under 85~95 degrees celsius.
3. a kind of 3D Stacked Die Packaging component chip separation method, which is characterized in that the separation method includes following step
It is rapid:
The black sealing of removal chip obtains the first sample；
The chip gold thread for removing first sample obtains the second sample；
Second sample is placed in 2~3h of immersion in corrosive agent and obtains third sample；
The third sample acetone rinsing；
Wherein, the corrosive agent includes the smoke of nitric acid and mass percent greater than 98% that mass percent is 65%~68%
Nitric acid, and the mass percent be 65%~68% nitric acid and mass percent greater than 98% fuming nitric aicd volume ratio
It is 1: 1.
4. 3D Stacked Die Packaging component chip separation method according to claim 3, which is characterized in that described to go to decore
The step of black sealing of piece are as follows:
The chip, which is placed in the fuming nitric aicd that temperature is 145~155 degrees Celsius, impregnates 5~8min.
5. 3D Stacked Die Packaging component chip separation method according to claim 3, which is characterized in that removal described the
The step of chip gold thread of one sample are as follows:
First sample, which is placed in the chloroazotic acid that temperature is 85~95 degrees Celsius, impregnates 7~8min.
6. 3D Stacked Die Packaging component chip separation method according to claim 3, which is characterized in that second examination
Sample is placed in 2~3h of immersion in the corrosive agent that temperature is 85~95 degrees Celsius and obtains third sample.
7. 3D Stacked Die Packaging component chip separation method according to claim 3, which is characterized in that the third examination
Sample acetone rinsing 5s~8s.
8. 3D Stacked Die Packaging component chip separation method according to claim 3, which is characterized in that the third examination
Vacuum pencil is used to draw out after the completion of sample acetone rinsing.
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| CN201910756765.0A CN110467920A (en) | 2019-08-16 | 2019-08-16 | A kind of separation of 3D Stacked Die Packaging component chip corrosive agent and separation method |
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| CN201910756765.0A CN110467920A (en) | 2019-08-16 | 2019-08-16 | A kind of separation of 3D Stacked Die Packaging component chip corrosive agent and separation method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114927408A (en) * | 2022-05-19 | 2022-08-19 | 深圳市东方聚成科技有限公司 | Nondestructive chip separation and packaging test recycling method for electronic device |
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| CN102044405A (en) * | 2009-10-13 | 2011-05-04 | 中芯国际集成电路制造(上海)有限公司 | Chip separation method in multi-chip pack |
| CN103824756A (en) * | 2012-11-16 | 2014-05-28 | 中芯国际集成电路制造(上海)有限公司 | Method for removing package structure |
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2019
- 2019-08-16 CN CN201910756765.0A patent/CN110467920A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004043898A1 (en) * | 2002-11-14 | 2004-05-27 | Dipharma S.P.A. | A process for the mononitration of alkanediols |
| CN102044405A (en) * | 2009-10-13 | 2011-05-04 | 中芯国际集成电路制造(上海)有限公司 | Chip separation method in multi-chip pack |
| CN103824756A (en) * | 2012-11-16 | 2014-05-28 | 中芯国际集成电路制造(上海)有限公司 | Method for removing package structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114927408A (en) * | 2022-05-19 | 2022-08-19 | 深圳市东方聚成科技有限公司 | Nondestructive chip separation and packaging test recycling method for electronic device |
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Application publication date: 20191119 |