CN110459492B - Semiconductor refrigeration piece banding device - Google Patents
Semiconductor refrigeration piece banding device Download PDFInfo
- Publication number
- CN110459492B CN110459492B CN201910751505.4A CN201910751505A CN110459492B CN 110459492 B CN110459492 B CN 110459492B CN 201910751505 A CN201910751505 A CN 201910751505A CN 110459492 B CN110459492 B CN 110459492B
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- China
- Prior art keywords
- cylinder
- semiconductor refrigeration
- banding device
- chain
- frame
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000005057 refrigeration Methods 0.000 title claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims abstract description 21
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 229910052573 porcelain Inorganic materials 0.000 description 6
- 230000007547 defect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Packages (AREA)
Abstract
The invention relates to the technical field of semiconductor refrigeration piece production equipment, in particular to a semiconductor refrigeration piece edge sealing device, which comprises a frame, a rotating shaft, a support leg, a gear, a chuck and a working position, wherein the rotating shaft is arranged on the support leg; three racks are arranged on the side surface of the rack at intervals in the front-back direction, the racks and the running gear have the opportunity of meshing, and the length of each rack is 1/4 of the circumference of the gear; a lifting cylinder is arranged below the chain at the rear end of the frame and is a first cylinder, and a glue groove is formed in the first cylinder; three lifting cylinders, namely a second cylinder, a third cylinder and a fourth cylinder, are arranged below the rack and behind the rack, and glue tanks are respectively arranged on the second cylinder, the third cylinder and the fourth cylinder. Has the advantages of labor force reduction, production efficiency improvement and simple and convenient operation.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration piece production equipment, in particular to a semiconductor refrigeration piece edge sealing device.
Background
The semiconductor refrigerating member comprises a porcelain plate and crystal grains welded on the porcelain plate, the semiconductor refrigerating member is of a square structure and is provided with four edges, the porcelain plate of the semiconductor refrigerating member can be damaged, such as the porcelain plate is damaged due to collision and the like, and an effective way for reducing the damage of the porcelain plate is to coat adhesive edge sealing around the porcelain plate.
In the prior art, the technical scheme adopted for sealing the periphery of the semiconductor refrigerating piece is as follows: the worker holds the semiconductor refrigerating piece by hand and dips the edge of the refrigerating piece with glue, the glue is contained in the glue tank, and the semiconductor refrigerating piece is provided with four edges, so that the edge of the semiconductor refrigerating piece is sealed for four times, and the defects of troublesome operation and labor waste are overcome.
Disclosure of Invention
The invention aims at solving the defects and provides the semiconductor refrigeration piece edge sealing device which reduces labor force, improves production efficiency and is simple and convenient to operate.
The technical scheme of the invention is realized in such a way that the semiconductor refrigeration piece edge sealing device is characterized in that: the machine comprises a machine frame, wherein the machine frame is provided with a rear end for installing a refrigerating element and a front end for unloading the refrigerating element after sealing, a transmission roller driven by a motor is arranged at the rear end and the front end of the machine frame and is respectively a rear transmission roller and a front transmission roller, a chain wheel is arranged on the transmission roller, a chain is wound on the chain wheel to form a circulating structure, a connecting piece is connected onto the chain, an inverted U-shaped structure with a downward opening is arranged below the connecting piece, the inverted U-shaped structure is provided with two supporting legs, a rotating shaft is arranged on the supporting legs, a gear is arranged outside the supporting legs, chucks are arranged at the inner sides of the supporting legs, and a station for clamping the refrigerating element is arranged between the two chucks;
three racks are arranged on the side surface of the rack at intervals in the front-back direction, the racks and the running gear have the opportunity of meshing, and the length of each rack is 1/4 of the circumference of the gear;
A lifting cylinder is arranged below the chain at the rear end of the frame and is a first cylinder, and a glue groove is formed in the first cylinder;
Three lifting cylinders, namely a second cylinder, a third cylinder and a fourth cylinder, are arranged below the rack and behind the rack, and glue tanks are respectively arranged on the second cylinder, the third cylinder and the fourth cylinder.
Further, a drying chamber is arranged at the rear of the frame, the drying chamber is provided with an inlet and an outlet, and the chain passes through the inlet and the outlet.
Further, a sponge layer is arranged in the glue solution tank.
Further, a small air cylinder is arranged transversely between the inner side of the supporting leg and the chuck.
Further, a lifting large cylinder is arranged below the chain at the rear end of the frame and is a fifth cylinder, the fifth cylinder is arranged behind the first cylinder, and a tray is further arranged on the fifth cylinder.
Further, the device also comprises a control box, wherein the control box is arranged on the frame and is connected with the motor, the first cylinder, the second cylinder, the third cylinder, the fourth cylinder, the small cylinder and the fifth cylinder.
The beneficial effects of the invention are as follows: the semiconductor refrigeration piece edge sealing device has the advantages of labor reduction, production efficiency improvement and simplicity and convenience in operation.
Drawings
FIG. 1 is a schematic side view of the present invention.
Fig. 2 is a sectional view taken along the direction a-a in fig. 1.
Fig. 3 is an enlarged view at B in fig. 1.
Fig. 4 is an enlarged view at C in fig. 2.
Wherein: 1. the device comprises a frame 2, a refrigerating element 3, a rear end 4, a front end 5, a rear transfer roller 6, a front transfer roller 7, a chain wheel 8, a chain 9, a connecting element 10, a rotating shaft 11, a gear 12, a chuck 13, a rack 14, a first cylinder 15, a glue solution tank 16, a second cylinder 17, a third cylinder 18, a fourth cylinder 19, a drying chamber 20, a small cylinder 21, a large cylinder 22, a tray 23, a control box 24 and springs.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown, a semiconductor refrigeration piece edge banding device is characterized by: the machine comprises a machine frame 1, wherein the machine frame is provided with a rear end 3 for installing a refrigerating element 2 and a front end 4 for unloading the refrigerating element after sealing, a transmission roller driven by a motor is arranged at the rear end and the front end of the machine frame and is respectively a rear transmission roller 5 and a front transmission roller 6, a chain wheel 7 is arranged on the transmission roller, a chain 8 is wound on the chain wheel to form a circulating structure, a connecting piece 9 is connected to the chain, an inverted U-shaped structure with a downward opening is arranged below the connecting piece, the inverted U-shaped structure is provided with two supporting legs 9a, a rotating shaft 10 is arranged on the supporting legs, a gear 11 is arranged outside the supporting legs, a chuck 12 is arranged at the inner side of the supporting legs, and a station for clamping the refrigerating element is arranged between the two chucks;
Three racks 13 are arranged on the side surface of the rack at intervals in the front-back direction, the racks and the running gears have the opportunity of meshing, and the length of each rack is 1/4 of the circumference of each gear;
A lifting cylinder is arranged below the chain at the rear end of the frame and is a first cylinder 14, and a glue groove 15 is formed in the first cylinder;
Three lifting cylinders, namely a second cylinder 16, a third cylinder 17 and a fourth cylinder 18, are arranged below the rack and behind the rack, and a glue groove 15 is respectively arranged on the second cylinder, the third cylinder and the fourth cylinder.
When the device is used, firstly, the stacked refrigerating pieces can be placed between two chucks, the chucks clamp the stacked refrigerating pieces, one side of the refrigerating pieces is arranged downwards horizontally, for example, the side a is operated, a motor is driven to operate, the chain is driven to operate, when the refrigerating pieces are operated on a first cylinder, the first cylinder is started to rise, one side (side a) of the refrigerating pieces is contacted with glue solution in a glue solution tank, glue sealing can be carried out on one side of the refrigerating pieces, one side of the refrigerating pieces is required to be contacted with the glue solution level, the glue solution level cannot be immersed too deeply, after the glue sealing is finished, the cylinder is lowered, the chain drives the refrigerating pieces to operate forwards, at the moment, the rack acts on a gear, and as the length of the rack is 1/4 of the circumference of the gear, the other side of the refrigerating pieces is rotated by 90 degrees, when the refrigerating pieces are operated on a second cylinder, the second cylinder is started, one side (side a) of the refrigerating pieces is contacted with glue solution in the glue solution tank, the second side b) of the refrigerating pieces is started to seal the glue tank, the edge of the refrigerating pieces, the edge sealing can be carried out on the second side of the refrigerating pieces, the edge sealing can be finished, and the edge sealing can be carried out on the second side sealing edge sealing of the refrigerating pieces, and the edge sealing can be finished.
The device adopts mechanized equipment, and can finish edge sealing of the refrigerating piece only by starting the air cylinder and the motor, thereby achieving the purpose of saving labor force.
Further, a drying chamber 19 is provided at the rear of the frame, said drying chamber having an inlet and an outlet through which the chain passes.
The edge-sealed glue solution can be dried or dried, a heating pipe, an electric fan and other drying devices can be arranged in the drying chamber, and the drying chamber can be a drying chamber in the prior art.
Preferably, a drying chamber is arranged on the frame behind each glue groove, and 4 drying chambers are arranged in total, so that glue can be dried immediately after each edge sealing is finished, and the effect is better.
Further, a sponge layer is arranged in the glue solution tank.
In this way, the situation that the refrigerating element is immersed into the glue solution too much can be avoided.
Further, the bottom of the glue solution tank is also provided with a rubber layer.
By the arrangement, damage caused by friction between the side edge of the refrigerating piece and the bottom of the glue solution tank can be reduced.
Further, a small air cylinder 20 is transversely arranged between the inner side of the supporting leg and the chuck.
The device can clamp the refrigerating piece placed in the station, and is firm in connection.
Further, a lifting large cylinder 21 is arranged below the rear end chain of the frame and is a fifth cylinder, the fifth cylinder is arranged behind the first cylinder, and a tray 22 is further arranged on the fifth cylinder.
This facilitates the placement of stacked refrigeration components at the station where the refrigeration components are held. When the semiconductor refrigerator is used, the stacked refrigeration pieces are placed on the tray, and when the chuck runs to the side face of the stacked refrigeration pieces, the small cylinder is started, so that the semiconductor refrigeration pieces can be held for edge sealing, and convenience is brought to installation of the refrigeration pieces.
Further, the device also comprises a control box 23, wherein the control box is arranged on the frame and is connected with the motor, the first cylinder, the second cylinder, the third cylinder, the fourth cylinder, the small cylinder and the fifth cylinder.
This facilitates control.
Further, a spring 24 is arranged between the glue solution tank and the air cylinder.
Thus, soft contact between the refrigerating element and the bottom of the glue groove can be realized, and damage to the refrigerating element is reduced.
The above embodiments are merely examples of the present invention, but the present invention is not limited thereto, and any changes or modifications made by those skilled in the art are included in the scope of the present invention.
Claims (10)
1. A semiconductor refrigeration piece banding device is characterized in that: the machine comprises a machine frame, wherein the machine frame is provided with a rear end for installing a refrigerating element and a front end for unloading the refrigerating element after sealing, a transmission roller driven by a motor is arranged at the rear end and the front end of the machine frame and is respectively a rear transmission roller and a front transmission roller, a chain wheel is arranged on the transmission roller, a chain is wound on the chain wheel to form a circulating structure, a connecting piece is connected onto the chain, an inverted U-shaped structure with a downward opening is arranged below the connecting piece, the inverted U-shaped structure is provided with two supporting legs, a rotating shaft is arranged on the supporting legs, a gear is arranged outside the supporting legs, chucks are arranged at the inner sides of the supporting legs, and a station for clamping the refrigerating element is arranged between the two chucks;
three racks are arranged on the side surface of the rack at intervals in the front-back direction, the racks and the running gear have the opportunity of meshing, and the length of each rack is 1/4 of the circumference of the gear;
A lifting cylinder is arranged below the chain at the rear end of the frame and is a first cylinder, and a glue groove is formed in the first cylinder;
Three lifting cylinders, namely a second cylinder, a third cylinder and a fourth cylinder, are arranged below the rack and behind the rack, and glue tanks are respectively arranged on the second cylinder, the third cylinder and the fourth cylinder.
2. The semiconductor refrigeration unit edge banding device according to claim 1, wherein: the rear of the frame is also provided with a drying chamber which is provided with an inlet and an outlet, and the chain passes through the inlet and the outlet.
3. A semiconductor refrigeration unit edge banding device according to claim 1 or 2, wherein: the glue solution tank is also internally provided with a sponge layer.
4. A semiconductor refrigeration unit edge banding device according to claim 1 or 2, wherein: the bottom of the glue solution tank is also provided with a rubber layer.
5. A semiconductor refrigeration unit edge banding device according to claim 1 or 2, wherein: a small air cylinder is arranged transversely between the inner side of the supporting leg and the chuck.
6. A semiconductor refrigeration unit edge banding device according to claim 3, wherein: a small air cylinder is arranged transversely between the inner side of the supporting leg and the chuck.
7. The semiconductor refrigeration unit edge banding device according to claim 5, wherein: the lifting large cylinder is arranged below the chain at the rear end of the frame and is a fifth cylinder, the fifth cylinder is arranged behind the first cylinder, and a tray is further arranged on the fifth cylinder.
8. The semiconductor refrigeration unit edge banding device according to claim 4, wherein: the lifting large cylinder is arranged below the chain at the rear end of the frame and is a fifth cylinder, the fifth cylinder is arranged behind the first cylinder, and a tray is further arranged on the fifth cylinder.
9. The semiconductor refrigeration unit edge banding device according to claim 7, wherein: the device also comprises a control box, wherein the control box is arranged on the frame and is connected with the motor, the first cylinder, the second cylinder, the third cylinder, the fourth cylinder, the small cylinder and the fifth cylinder.
10. The semiconductor refrigeration unit edge banding device according to claim 6, wherein: a spring is arranged between the glue solution tank and the air cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910751505.4A CN110459492B (en) | 2019-08-15 | 2019-08-15 | Semiconductor refrigeration piece banding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910751505.4A CN110459492B (en) | 2019-08-15 | 2019-08-15 | Semiconductor refrigeration piece banding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110459492A CN110459492A (en) | 2019-11-15 |
| CN110459492B true CN110459492B (en) | 2024-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910751505.4A Active CN110459492B (en) | 2019-08-15 | 2019-08-15 | Semiconductor refrigeration piece banding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110459492B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210092042U (en) * | 2019-08-15 | 2020-02-18 | 许昌市森洋电子材料有限公司 | Edge sealing device for semiconductor refrigeration piece |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW513791B (en) * | 2001-09-26 | 2002-12-11 | Orient Semiconductor Elect Ltd | Modularized 3D stacked IC package |
| CN204182518U (en) * | 2014-10-10 | 2015-03-04 | 东莞市华立实业股份有限公司 | A kind of back of the body coating device of edge sealing sheet material |
| CN208696590U (en) * | 2018-09-06 | 2019-04-05 | 泉州市依科达半导体致冷科技有限公司 | A kind of semiconductor refrigeration member semi-automatic arc welder |
| CN109979865B (en) * | 2019-04-29 | 2024-02-23 | 苏州鑫本智能科技有限公司 | Foam adhesive tape pre-pinching positioning type photovoltaic module edge sealing mechanism |
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2019
- 2019-08-15 CN CN201910751505.4A patent/CN110459492B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210092042U (en) * | 2019-08-15 | 2020-02-18 | 许昌市森洋电子材料有限公司 | Edge sealing device for semiconductor refrigeration piece |
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| CN110459492A (en) | 2019-11-15 |
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