CN110455569B - Sampling device and method - Google Patents
Sampling device and method Download PDFInfo
- Publication number
- CN110455569B CN110455569B CN201910811479.XA CN201910811479A CN110455569B CN 110455569 B CN110455569 B CN 110455569B CN 201910811479 A CN201910811479 A CN 201910811479A CN 110455569 B CN110455569 B CN 110455569B
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- CN
- China
- Prior art keywords
- clamping
- rotating
- clamping part
- sample
- sampling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910811479.XA CN110455569B (en) | 2019-08-30 | 2019-08-30 | Sampling device and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910811479.XA CN110455569B (en) | 2019-08-30 | 2019-08-30 | Sampling device and method |
Publications (2)
Publication Number | Publication Date |
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CN110455569A CN110455569A (en) | 2019-11-15 |
CN110455569B true CN110455569B (en) | 2023-01-06 |
Family
ID=68489951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910811479.XA Active CN110455569B (en) | 2019-08-30 | 2019-08-30 | Sampling device and method |
Country Status (1)
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CN (1) | CN110455569B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205374922U (en) * | 2015-11-10 | 2016-07-06 | 上海与德通讯技术有限公司 | Angle of visibility testing arrangement |
CN207497644U (en) * | 2017-09-29 | 2018-06-15 | 泉州弘盛琉璃有限公司 | A kind of rotating device of coloured glaze batch machining |
CN208044921U (en) * | 2018-09-10 | 2018-11-02 | 高彤彤 | A kind of College English interactive teaching device |
CN208880280U (en) * | 2018-10-23 | 2019-05-21 | 苏州迈特科技有限公司 | A kind of CNC milling machine automatic blanking device |
CN208992193U (en) * | 2018-11-07 | 2019-06-18 | 广州哲野超硬材料磨削技术有限公司 | A kind of multi-angle adjustable numerical control machine tool clamp |
CN209027894U (en) * | 2018-11-13 | 2019-06-25 | 段世举 | A kind of clinical laboratory's blood evenly mixing device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2961338B2 (en) * | 1992-04-08 | 1999-10-12 | コマツ電子金属株式会社 | Apparatus and method for manufacturing semiconductor thin film |
-
2019
- 2019-08-30 CN CN201910811479.XA patent/CN110455569B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205374922U (en) * | 2015-11-10 | 2016-07-06 | 上海与德通讯技术有限公司 | Angle of visibility testing arrangement |
CN207497644U (en) * | 2017-09-29 | 2018-06-15 | 泉州弘盛琉璃有限公司 | A kind of rotating device of coloured glaze batch machining |
CN208044921U (en) * | 2018-09-10 | 2018-11-02 | 高彤彤 | A kind of College English interactive teaching device |
CN208880280U (en) * | 2018-10-23 | 2019-05-21 | 苏州迈特科技有限公司 | A kind of CNC milling machine automatic blanking device |
CN208992193U (en) * | 2018-11-07 | 2019-06-18 | 广州哲野超硬材料磨削技术有限公司 | A kind of multi-angle adjustable numerical control machine tool clamp |
CN209027894U (en) * | 2018-11-13 | 2019-06-25 | 段世举 | A kind of clinical laboratory's blood evenly mixing device |
Also Published As
Publication number | Publication date |
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CN110455569A (en) | 2019-11-15 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211021 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |