CN110455158A - A kind of printed circuit board pick-and-place components solder joint height detecting tool - Google Patents
A kind of printed circuit board pick-and-place components solder joint height detecting tool Download PDFInfo
- Publication number
- CN110455158A CN110455158A CN201910881836.XA CN201910881836A CN110455158A CN 110455158 A CN110455158 A CN 110455158A CN 201910881836 A CN201910881836 A CN 201910881836A CN 110455158 A CN110455158 A CN 110455158A
- Authority
- CN
- China
- Prior art keywords
- solder joint
- circuit board
- printed circuit
- plate
- detecting tool
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
- G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
- G01B5/061—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
- G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
- G01B5/066—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness of coating
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
Abstract
The present invention discloses a kind of printed circuit board pick-and-place components solder joint height detecting tool, including fixed plate, the detection plate being installed below fixed plate and the supporting leg for being fixed on fixed board ends and extending downwardly, the lower end surface of two supporting legs is placed in the plate face of printed circuit board and can slide along plate face, detection plate lower face is higher than supporting leg lower end surface, and vertical range between the two is that technique requires height, solder joint height is qualified if detecting tool is along the plate face sliding smoothly of printed circuit board.The quick detection of solder joint height can be completed in batches, improves working efficiency, avoids omitting solder joint, guaranteed all detections, improved Product Safety, avoid human error, improve the reliability of product.
Description
Technical field
The present invention relates to printed circuit board fields, detect work more particularly to a kind of printed circuit board pick-and-place components solder joint height
Dress.
Background technique
In electronic product assembling process, safe insulation problem is one of the emphasis limited with technique, in order to guarantee product
Reliability, it is desirable that metal-back, pin, exposed lead of component etc. should have certain peace with the structural members such as metal shell
Full gap.In certain special applications, since safety clearance restricts, the solder joint height of through-hole mounting part is strictly limited
System, if being more than certain height, it will cause security reliability problem.
Under the requirement of above-mentioned technique, it is desirable that answer strict control component solder joint height during Electronic Assemblies, make it must not
More than defined process, otherwise carry out cutting foot processing in the welding process.Printed circuit board assembly welding and assembling
The height of pin to through-hole mounting part is needed to test after the completion, the currently used method of inspection is using vernier caliper to every
A height of pin measures, more problems existing for this method of inspection, and vernier caliper needs to weld each component pin
Point height measures, and for this solder joint a large amount of for printed circuit board, working efficiency is low；It is welded on printed circuit board assembly
Random distribution is put, is easy to miss a certain solder joint in measurement process, leaves security risk；Belong to contact type measurement in measurement process,
Due to the variability issues of personnel's operation, it is easy to form extra-stress to component's feet solder joint, influences the reliability of solder joint.
Therefore, how to provide efficient, the safe and reliable printed circuit board pick-and-place components solder joint height detecting tool of one kind is this
The current technical issues that need to address of field technical staff.
Summary of the invention
The object of the present invention is to provide a kind of printed circuit board pick-and-place components solder joint height detecting tools, are limited by detection plate
Highly, the quick detection of solder joint height can be completed in batches, improves working efficiency, avoids human error, improve safety.
In order to solve the above technical problems, the present invention provides a kind of printed circuit board pick-and-place components solder joint height detecting tool, packet
Fixed plate, the detection plate being installed below the fixed plate and the supporting leg for being fixed on the fixed board ends and extending downwardly are included,
The lower end surface of two supporting legs is placed in the plate face of printed circuit board and can slide along plate face, and the detection plate lower face is high
In the supporting leg lower end surface, and vertical range between the two is that technique requires height, if detecting tool is along printed circuit board
Smoothly then solder joint height is qualified for plate face sliding.
Preferably, the fixed plate and the detection plate are horizontally disposed, and the supporting leg is vertically arranged, two supporting legs
Lower end surface is in same level, and the both ends of the detection plate are respectively close to the inner sidewall of two supporting legs.
Preferably, the fixed plate and two supporting leg integral types are manufactured.
It preferably, further include the height adjustment device for connecting the fixed plate and the detection plate, the height adjustment dress
It sets and is able to drive the detection plate vertical shift.
Preferably, the detection board ends are provided with retention bead, and the corresponding position of the supporting leg inner sidewall is provided with
Vertical limiting groove, the retention bead are installed in the limiting groove and can slide along the limiting groove.
Preferably, every side is respectively provided with there are two the retention bead and two limiting grooves.
Preferably, the height adjustment device is specially screw rod, and tapped through hole, the screw rod are provided in the fixed plate
Middle part is provided with external screw thread, and the screw rod passes through and be threadedly coupled the tapped through hole, and the screw rod lower end connects the detection
The connecting hole of plate, and can be rotated relative to the connecting hole, the screw rod is able to drive the synchronous vertical motion of the detection plate.
Preferably, connecting hole described in flanged joint of the lower end of the screw rod by splicing, the upper end of the screw rod is fixed
Hand is installed and twists handle.
Preferably, graduated scale is provided on the supporting leg.
It preferably, further include vernier caliper.
The present invention provides a kind of printed circuit board pick-and-place components solder joint height detecting tool, including fixed plate, is installed on fixation
Detection plate below plate and the supporting leg for being fixed on fixed board ends and extending downwardly, the lower end surface of two supporting legs is placed in printing electricity
The plate face of road plate can simultaneously be slided along plate face, and detection plate lower face is higher than supporting leg lower end surface, and vertical range between the two is
Technique requires height, and solder joint height is qualified if detecting tool is along the plate face sliding smoothly of printed circuit board.In detection process, choosing
The detecting tool that corresponding technique requires height is selected, the lower end surface of two supporting legs is placed in the plate face of printed circuit board, pushes inspection
It surveys tooling to slide along plate face, when solder joint height is more than that technique requires height, solder joint height is more than detection plate lower face and supporting leg
Vertical range between lower end surface, solder joint can bump against detection plate, and detecting tool movement is obstructed, then it represents that solder joint height superelevation produces
Product are unqualified.When solder joint height, which is no more than technique, requires height, solder joint height is lower than detection plate lower face and supporting leg lower end surface
Between vertical range, solder joint will not bump against detection plate, and detecting tool is mobile smooth, then it represents that solder joint height is normal, and product closes
Lattice.The quick detection of solder joint height can be completed in batches, improves working efficiency, avoids omitting solder joint, guaranteed all detections, improved
Product Safety avoids human error, improves the reliability of product.
Detailed description of the invention
Fig. 1 is a kind of specific embodiment of printed circuit board pick-and-place components solder joint height detecting tool provided by the present invention
Structural schematic diagram；
Fig. 2 is a kind of specific embodiment of printed circuit board pick-and-place components solder joint height detecting tool provided by the present invention
Detecting state schematic diagram；
Fig. 3 is a kind of specific embodiment of printed circuit board pick-and-place components solder joint height detecting tool provided by the present invention
The structural schematic diagram of middle fixed plate and supporting leg；
Fig. 4 is a kind of specific embodiment of printed circuit board pick-and-place components solder joint height detecting tool provided by the present invention
The structural schematic diagram of middle detection plate；
Fig. 5 is a kind of specific embodiment of printed circuit board pick-and-place components solder joint height detecting tool provided by the present invention
The structural schematic diagram of middle detection plate and screw rod.
Specific embodiment
Core of the invention is to provide a kind of printed circuit board pick-and-place components solder joint height detecting tool, is limited by detection plate
Highly, the quick detection of solder joint height can be completed in batches, improves working efficiency, avoids human error, improve safety.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.
Fig. 1 to Fig. 5 is please referred to, Fig. 1 is printed circuit board pick-and-place components solder joint height detecting tool provided by the present invention
A kind of structural schematic diagram of specific embodiment；Fig. 2 is printed circuit board pick-and-place components solder joint height provided by the present invention detection
A kind of detecting state schematic diagram of specific embodiment of tooling；Fig. 3 is printed circuit board pick-and-place components provided by the present invention weldering
The structural schematic diagram of fixed plate and supporting leg in a kind of specific embodiment of point height detecting tool；Fig. 4 is provided by the present invention
Printed circuit board pick-and-place components solder joint height detecting tool a kind of specific embodiment in detection plate structural schematic diagram；Fig. 5
For detection plate in a kind of specific embodiment of printed circuit board pick-and-place components solder joint height detecting tool provided by the present invention and
The structural schematic diagram of screw rod.
The specific embodiment of the invention provides a kind of printed circuit board pick-and-place components solder joint height detecting tool, including fixed plate
1, detection plate 2 and two supporting legs 3, detection plate 2 are installed on 1 lower section of fixed plate, and two supporting legs 3 are individually fixed in the two of fixed plate 1
It holds and extends downwardly, i.e., detecting tool is in " all " fonts.The lower end surface of two supporting legs 3 is placed in the plate face of printed circuit board 7 simultaneously
It can be slided along plate face, and 2 lower face of detection plate is higher than 3 lower end surface of supporting leg, i.e. 3 lower end surface of supporting leg is located at printed circuit board 7
When in plate face, the lower face of detection plate 2 is separated with the plate face of printed circuit board 7.2 lower face of detection plate and 3 lower end surface of supporting leg it
Between vertical range be technique require height, if detecting tool along printed circuit board 7 plate face sliding smoothly if solder joint 8 highly close
Lattice.
Specifically, in order to guarantee the accuracy detected, fixed plate 1 and detection plate 2 are horizontally disposed, and the two is parallel to each other, branch
Leg 3 is vertically arranged, and the lower end surface of two supporting legs 3 is in same level, and the both ends of detection plate 2 are respectively close to two supporting legs 3
Inner sidewall makes three planes of fixed plate 1, detection plate 2 and supporting leg lower end surface be in the state being parallel to each other, guarantees detection plate 2
Vertical range between lower face and 3 lower end surface of supporting leg is equal everywhere, improves detection stability, can also be as needed, and adjustment is each
The angle of component.Wherein, fixed plate 1 and two 3 integral types of supporting leg are manufactured, and can also be fabricated separately, and bolt or weldering are being passed through
It the modes such as connects to be attached.
In detection process, selects corresponding technique to require the detecting tool of height, the lower end surface of two supporting legs 3 is placed on printing
In the plate face of circuit board 7, detecting tool is pushed to slide along plate face, when 8 height of solder joint is more than that technique requires height, solder joint 8 is high
Degree is more than the vertical range between 3 lower end surface of 2 lower face of detection plate and supporting leg, and solder joint 8 can bump against detection plate 2, and detecting tool is moved
It is dynamic to be obstructed, then it represents that 8 height superelevation of solder joint, product are unqualified.When 8 height of solder joint, which is no more than technique, requires height, solder joint 8 is high
Degree will not bump against detection plate 2, detecting tool lower than the vertical range between 3 lower end surface of 2 lower face of detection plate and supporting leg, solder joint 8
It is mobile smooth, then it represents that 8 height of solder joint is normal, and product is qualified.The quick detection of 8 height of solder joint can be completed in batches, improve work
Make efficiency, avoid omitting solder joint 8, guarantees all detections, improve Product Safety, avoid human error, improve the reliable of product
Property.According to the process requirement set in advance, it is ready for a series of detecting tool of different vertical distances, detects different model
When printed circuit board, specific detecting tool is directly selected.
On the basis of the printed circuit board pick-and-place components solder joint height detecting tool that above-mentioned each specific embodiment provides, also
Height adjustment device including being connected and fixed plate 1 and detection plate 2, height adjustment device are able to drive 2 vertical shift of detection plate.For
Adaptation different technique requirement for height, can be adjusted by height adjustment device 2 lower face of detection plate and 3 lower end surface of supporting leg it
Between vertical range, to adapt to the printed circuit board 7 that different sizes require.
In order to guarantee the stabilization of 2 vertical shift process of detection plate, retention bead can be provided at 2 both ends of detection plate
21, the corresponding position of 3 inner sidewall of supporting leg is provided with vertical limiting groove 31, and retention bead 21 is installed in limiting groove 31 simultaneously
It can be slided along limiting groove 31.Specifically, every side is respectively provided with there are two retention bead 21 and two limiting grooves 31.Detection plate
During 2 vertical shifts, retention bead 21 is slided in limiting groove 31, plays the role of guiding and limit, needs to make to examine
3 clearance fit of drafting board 2 and supporting leg guarantees smoothly sliding, also can adjust the quantity and arrangement of each component, of the invention
Within protection scope.
In the printed circuit board pick-and-place components solder joint height detecting tool that the specific embodiment of the invention provides, height adjustment
Device can use various structures, such as link mechanism or expansion link mechanism, and thread mechanism can also be used, and wherein height adjustment fills
It is set to screw rod 4, tapped through hole 32 is provided in fixed plate 1, is provided with external screw thread in the middle part of screw rod 4, screw rod 4 passes through spiral shell when installation
Line through-hole 32 makes external screw thread and tapped through hole 32 be cooperatively connected, and the corresponding position of detection plate 2 is provided with connecting hole 22, under screw rod 4
End is connected to connecting hole 22, and can rotate relative to connecting hole 22, and screw rod 4 is able to drive the synchronous vertical motion of detection plate 2.Rotation
When turning screw rod 4, screw rod 4 is rotated around its vertical axis, and screw rod 4 is rotated relative to tapped through hole 32 and connecting hole 22 at this time, detection
Plate 2 will not rotate, under the action of screw thread, the lower movement vertically of screw rod 4, while will drive detection plate 2 and moving up and down,
Realize the adjustment of vertical range.
To guarantee connection effect, the lower end of screw rod 4 is connected to connecting hole 22 by the flange 5 of splicing, can be normally opposite
Rotation, and screw rod 4 will not be separated with detection plate 2, can synchronize vertical shift, can also be connected by structures such as Limit Bearings, In
The upper end of screw rod 4 is fixedly installed with hand and twists handle 6, is convenient for rotary screw 4.
In the printed circuit board pick-and-place components solder joint height detecting tool that the specific embodiment of the invention provides, on supporting leg 3
It is provided with graduated scale, or is equipped with individual vernier caliper.Graduated scale can be set to the leading flank of supporting leg 3, detection plate 2
Altitude location can be carried out in moving process, reach the height of needs.In detection process, technique requirement for height as needed,
Rotate hand and twist handle 6, and then adjust the height of detection plate 2, by vernier caliper or graduated scale measure 2 lower face of detection plate with
Vertical range between 3 lower end surface of supporting leg, and by adjusting repeatedly, guarantee that vertical range is equal to technique requirement for height, is then
Detecting tool can be pushed to slide along the plate face of printed circuit board 7 according to the above method, realize the batch detection of 8 height of solder joint.
Printed circuit board pick-and-place components solder joint height detecting tool provided by the present invention is described in detail above.This
Apply that a specific example illustrates the principle and implementation of the invention in text, the explanation of above example is only intended to
It facilitates the understanding of the method and its core concept of the invention.It should be pointed out that for those skilled in the art, In
Without departing from the principles of the invention, can be with several improvements and modifications are made to the present invention, these improvement and modification are also fallen
Enter in the protection scope of the claims in the present invention.
Claims (10)
1. a kind of printed circuit board pick-and-place components solder joint height detecting tool, which is characterized in that including fixed plate (1), be installed on institute
The supporting leg (3) for stating the detection plate (2) below fixed plate (1) and being fixed on the fixed plate (1) both ends and extending downwardly, two institutes
The lower end surface for stating supporting leg (3) is placed in the plate face of printed circuit board (7) and can slide along plate face, detection plate (2) lower plate
Face is higher than the supporting leg (3) lower end surface, and vertical range between the two is that technique requires height, if detecting tool is along printing electricity
Smoothly then solder joint (8) height is qualified for the plate face sliding of road plate (7).
2. printed circuit board pick-and-place components solder joint height detecting tool according to claim 1, which is characterized in that the fixation
Plate (1) and the detection plate (2) are horizontally disposed, and the supporting leg (3) is vertically arranged, and the lower end surface of two supporting legs (3) is in
Same level, the both ends of the detection plate (2) are respectively close to the inner sidewall of two supporting legs (3).
3. printed circuit board pick-and-place components solder joint height detecting tool according to claim 1, which is characterized in that the fixation
Plate (1) and two supporting leg (3) integral types are manufactured.
4. existing according to claim 1 to printed circuit board pick-and-place components solder joint height detecting tool, feature described in 3 any one
In further including the height adjustment device for connecting the fixed plate (1) and the detection plate (2), the height adjustment device can
Drive the detection plate (2) vertical shift.
5. printed circuit board pick-and-place components solder joint height detecting tool according to claim 4, which is characterized in that the detection
Plate (2) both ends are provided with retention bead (21), and the corresponding position of supporting leg (3) inner sidewall is provided with vertical limiting groove
(31), the retention bead (21) is installed in the limiting groove (31) and can slide along the limiting groove (31).
6. printed circuit board pick-and-place components solder joint height detecting tool according to claim 5, which is characterized in that every side is all provided with
The retention bead (21) and two limiting grooves (31) there are two setting.
7. printed circuit board pick-and-place components solder joint height detecting tool according to claim 4, which is characterized in that the height
Regulating device is specially screw rod (4), is provided with tapped through hole (32) on the fixed plate (1), is provided in the middle part of the screw rod (4)
External screw thread, the screw rod (4) pass through and are threadedly coupled the tapped through hole (32), and screw rod (4) lower end connects the detection
The connecting hole (22) of plate (2), and can be rotated relative to the connecting hole (22), the screw rod (4) is able to drive the detection
Plate (2) synchronizes vertical motion.
8. printed circuit board pick-and-place components solder joint height detecting tool according to claim 7, which is characterized in that the screw rod
(4) lower end connects the connecting hole (22) by the flange (5) of splicing, and the upper end of the screw rod (4) is fixedly installed with hand and twists
Handle (6).
9. printed circuit board pick-and-place components solder joint height detecting tool according to claim 4, which is characterized in that the supporting leg
(3) graduated scale is provided on.
10. printed circuit board pick-and-place components solder joint height detecting tool according to claim 4, which is characterized in that further include
Vernier caliper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910881836.XA CN110455158A (en) | 2019-09-18 | 2019-09-18 | A kind of printed circuit board pick-and-place components solder joint height detecting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910881836.XA CN110455158A (en) | 2019-09-18 | 2019-09-18 | A kind of printed circuit board pick-and-place components solder joint height detecting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110455158A true CN110455158A (en) | 2019-11-15 |
Family
ID=68492310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910881836.XA Pending CN110455158A (en) | 2019-09-18 | 2019-09-18 | A kind of printed circuit board pick-and-place components solder joint height detecting tool |
Country Status (1)
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| CN (1) | CN110455158A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4745684A (en) * | 1986-12-17 | 1988-05-24 | Hughes Aircraft Company | Solder thickness measurement method and apparatus |
| WO2008145112A1 (en) * | 2007-05-31 | 2008-12-04 | Solarwatt Ag | Layer thickness measuring instrument, and method for measuring a layer thickness in tinned metal strips used as electrical connectors |
| CN202216635U (en) * | 2011-08-19 | 2012-05-09 | 东莞市维海电子有限公司 | Floating height detection device for SMT circuit board |
| CN105674848A (en) * | 2016-04-19 | 2016-06-15 | 京东方科技集团股份有限公司 | Thickness detector |
| CN208282730U (en) * | 2018-03-14 | 2018-12-25 | 绍兴和为贵轴承有限公司 | A kind of Production of bearing height detecting device |
| CN109373859A (en) * | 2018-11-19 | 2019-02-22 | 深圳市亿禾得科技有限公司 | A kind of PCBA board detection device |
| CN209355825U (en) * | 2018-12-25 | 2019-09-06 | 湖州华龙智能科技有限公司 | A kind of pcb board height of pin on back surface detection device |
-
2019
- 2019-09-18 CN CN201910881836.XA patent/CN110455158A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4745684A (en) * | 1986-12-17 | 1988-05-24 | Hughes Aircraft Company | Solder thickness measurement method and apparatus |
| WO2008145112A1 (en) * | 2007-05-31 | 2008-12-04 | Solarwatt Ag | Layer thickness measuring instrument, and method for measuring a layer thickness in tinned metal strips used as electrical connectors |
| CN202216635U (en) * | 2011-08-19 | 2012-05-09 | 东莞市维海电子有限公司 | Floating height detection device for SMT circuit board |
| CN105674848A (en) * | 2016-04-19 | 2016-06-15 | 京东方科技集团股份有限公司 | Thickness detector |
| CN208282730U (en) * | 2018-03-14 | 2018-12-25 | 绍兴和为贵轴承有限公司 | A kind of Production of bearing height detecting device |
| CN109373859A (en) * | 2018-11-19 | 2019-02-22 | 深圳市亿禾得科技有限公司 | A kind of PCBA board detection device |
| CN209355825U (en) * | 2018-12-25 | 2019-09-06 | 湖州华龙智能科技有限公司 | A kind of pcb board height of pin on back surface detection device |
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Application publication date: 20191115 |