CN110446383A - The method of protective film is formed on an at least electronic module - Google Patents
The method of protective film is formed on an at least electronic module Download PDFInfo
- Publication number
- CN110446383A CN110446383A CN201810836095.9A CN201810836095A CN110446383A CN 110446383 A CN110446383 A CN 110446383A CN 201810836095 A CN201810836095 A CN 201810836095A CN 110446383 A CN110446383 A CN 110446383A
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- Prior art keywords
- electronic module
- protection materials
- cavity
- air pressure
- temperature
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
Abstract
The present invention provides a kind of method that protective film is formed on an at least electronic module, and it includes following steps.Protection materials are placed on electronic module, so that protection materials are in contact with each other with electronic module.Electronic module and the protection materials being placed on electronic module are placed in cavity, and make that there is first environment air pressure in cavity.The intracorporal protection materials of heating chamber are to the first temperature, so that the protection materials softening being placed on electronic module.After protection materials softening, make the second environment air pressure for having greater than first environment air pressure in cavity, wherein the intracorporal gas direct weighting protection materials of chamber, so that protection materials guarantor's type is covered on electronic module.Heating guarantor's type is covered in the protection materials on electronic module to second temperature, so that guarantor's type is covered in the solidification of the protection materials on electronic module, to form the protective film that guarantor's type is covered on electronic module.
Description
Technical field
The present invention relates to a kind of on an at least electronic module forms the method for protective film more particularly to one kind passes through high pressure
Method of the mode of gas pressurized to form protective film on an at least electronic module.
Background technique
It is generally used on the mainboard of electronic device often having the different electronic building brick of size dimension.Traditional mode is to pass through
Mode mechanically or manually pastes protective glue in mainboard, to protect the electronic building brick on mainboard and mainboard.But mode above-mentioned
It can often be difficult to closely attach because of protective glue, and cause to stay between protective glue and mainboard or between protective glue and electronic building brick
There is the bubble of remaining.Therefore, it often will lead to aqueous vapor cladding, in turn resulting in electronic building brick service life reduces or have reliability
Problem occurs.
Summary of the invention
The present invention provides a kind of method that protective film is formed on an at least electronic module, by means of the present invention can be with
Keep the performance of electronic module and/or the protective film on guarantor's type covering board good and quality is good.
According to an embodiment of the invention, providing a kind of method for forming protective film on an at least electronic module, packet
Containing following steps.Electronic module and the protection materials being placed on electronic module are placed in cavity, wherein protection materials and electricity
Submodule is in contact with each other.First heating schedule is carried out to the intracorporal protection materials of chamber, so as to be placed in the protected material on electronic module
Material softening, and decompression program is carried out to cavity.After softening protection materials, the second heating is carried out to the intracorporal protection materials of chamber
Program, and boosting program is carried out to cavity, wherein in boosting program, the intracorporal gas direct weighting protection materials of chamber, so that
Protection materials guarantor's type is covered on electronic module.Solidify the protection materials that guarantor's type is covered on electronic module, is covered with forming guarantor's type
The protective film being placed on electronic module.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, electronic module packet
Include circuit board and multiple electronic building bricks.Multiple electronic building bricks are configured on circuit board.By electronic module and it is being placed in electronics
Protection materials in module are placed in the step in cavity, and protection materials are at least in contact with each other with multiple electronic building bricks.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, electronic module
Area is more than or equal to the area of protection materials.It is placed in cavity by electronic module and the protection materials being placed on electronic module
The step of in, the side wall of protection materials not overlay electronic module.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, the first heating journey
Sequence is that protection materials are heated to the first temperature, and the first temperature is more than or equal to the softening point of protection materials, and the first temperature is less than
The solidification point of protection materials.Second heating schedule is protection materials to be heated to second temperature, and second temperature is greater than protected material
The solidification point of material.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, the first temperature is big
In 50 DEG C.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, decompression program is
The intracorporal air pressure of chamber is reduced to first environment air pressure, wherein first environment air pressure is lower than the air pressure outside cavity.Boosting program is to mention
The intracorporal air pressure of chamber is risen to second environment air pressure, wherein second environment air pressure is higher than the air pressure outside cavity.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, the first heating journey
Sequence carries out simultaneously with decompression program.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, the second heating journey
Sequence carries out simultaneously with boosting program.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, cavity and boosting
Unit, pumping cells and heating unit constituent apparatus.Boosting unit and pumping cells are connected to cavity.Heat up unit and cavity
Thermal coupling.
In the method for forming protective film on an at least electronic module of embodiment according to the present invention, an at least electronics
Module is multiple electronic modules, and at least two in multiple electronic modules overlap each other in the cavity.
The present invention is to make protection materials in such a way that high pressure gas pressurizes in the process for forming protective film with protection materials
Guarantor's type is covered on electronic module.Therefore, the protective film on electronic module and/or guarantor's type covering board is less easy to damage, and
The performance of electronic module and/or the protective film on guarantor's type covering board is good and quality is good.
Detailed description of the invention
Attached drawing is provided with for further understanding the present invention, and with original for explaining the present invention together is described in detail
Reason, without limiting the scope of the invention to this.Meanwhile shape, size, scale or the ratio of the component in attached drawing may be overstated
Greatly more clearly to emphasize feature.
Fig. 1 is that schematically show according to one embodiment of the present disclosure a kind of applies will an at least electronic die
The schematic diagram of the device of protective film is formed on block.
Fig. 2 be schematically show according to one embodiment of the present disclosure one kind via device in electronic module
The upper method schematic diagram for forming protective film.
Fig. 3 is a kind of shape on an at least electronic module schematically shown according to one embodiment of the present disclosure
At the step flow chart of the method for protective film.
Fig. 4 A to Fig. 4 D be schematically show according to one embodiment of the present disclosure one kind on electronic module
The diagrammatic cross-section for the step of forming the method for protective film.
Description of symbols:
S1, S2, S3, S4: the step of removing the method for electronic building brick；
100: device；
110: cavity；
120: boosting unit；
121: high-pressure air source；
122: pipeline；
123: valve；
130: pumping cells；
131: pump；
132: pipeline；
133: valve；
140: heating unit；
144: adding thermal resistance；
145: electric fan；
150: exhaust unit；
152: pipeline；
153: valve；
160: temperature reducing unit；
162: pipeline；
200: electronic module；
210: circuit board；
210a: side wall；
210b: below；
220: electronic building brick；
300: protection materials；
310: protective film；
400: separation frame；
10,20: gas gap.
Specific embodiment
With detailed reference to exemplary embodiment of the invention, the example of exemplary embodiment is illustrated in attached drawing.Only
It is possible that same components symbol is used to indicate same or similar part in the accompanying drawings and the description.
Fig. 1 is that schematically show according to one embodiment of the present disclosure a kind of applies will an at least electronic die
The schematic diagram of the device of protective film is formed on block.
Firstly, please referring to Fig. 1, illustratively providing one kind can be used in one or more 200 (such as Fig. 4 D of electronic module
It is shown) on form the device 100 of protective film 310 (go out as shown in Figure 4 D).Device 100 include cavity 110, boosting unit 120,
Pumping cells 130 and heating unit 140.
Cavity 110 can have corresponding hatch door (not shown), and hatch door can be opened and make the space and chamber in cavity 110
Space connection outside body 110, hatch door can close and make to constitute closed space in cavity 110.Hatch door is general cavity 110 tool
Some components, therefore in Fig. 1 and not particularly shown.
Boosting unit 120 for example may include high-pressure air source 121, pipeline 122 and valve 123.High-pressure air source 121 for example can be with
Including pressure gas cylinder or booster pump.Pipeline 122 is connected between high-pressure air source 121 and cavity 110.Valve 123 is located at pipeline
On 122.If valve 123 is opened, the gas of high-pressure air source 121 can enter cavity 110 by pipeline 122.Pass through boosting unit 120
The air pressure in cavity 110 can be allow to be greater than the air pressure outside cavity 110.Air pressure outside cavity 110 is usually 1 atmospheric pressure
(1atm)。
Pumping cells 130 for example may include pump 131, pipeline 132 and valve 133.Pipeline 132 is connected to pump 131 and cavity
Between 110.Valve 133 is located on pipeline 132.If valve 133 and pump 131 are opened, the gas in cavity 110 can pass through pipeline 132
And it pumps 131 and is extracted cavity 110.The air pressure in cavity 110 can be allow to be less than outside cavity 110 by pumping cells 130
Air pressure.
The unit 140 that heats up for example may include adding thermal resistance 144 and electric fan 145.Adding thermal resistance 144 can pass through heat
Object in the mode heating cavity 110 of radiation.Or in the case where there is gas in cavity 110, gas pair can be passed through
The mode of stream, or electric fan 145 in a manner of recycling gas in cavity 110 with the object in heating cavity 110
Part.By heating up, unit 140 can make the temperature in cavity 110 be greater than the temperature outside cavity 110.
In the present embodiment, device 100 not only includes cavity 110, boosting unit 120, pumping cells 130 and heating unit
140, it can also include exhaust unit 150 and/or temperature reducing unit 160.
Exhaust unit 150 may include pipeline 152 and valve 153.Pipeline 152 is connected to space and cavity outside cavity 110
Between space in 110.Valve 153 is located on pipeline 152.Exhaust unit 150 can be higher than cavity in the air pressure in cavity 110
When the situation of the air pressure outside 110, valve of the gas in cavity 110 by unlatching can be directly allow by exhaust unit 150
153 and pipeline 152 be discharged cavity 110.In other examples, if device 100 does not have exhaust unit 150, can also lead to
It crosses pumping cells 130 gas in cavity 110 is discharged.
Temperature reducing unit 160 may include the pipeline 162 equipped with coolant liquid.Coolant liquid is, for example, water, the water including antifreeze
Or refrigerant, however, the present invention is not limited thereto.In the embodiment illustrated in figure 1, the temperature reducing unit 160 of part can be located at cavity
In 110, can be recycled by gaseous exchange or gas by heat radiation or in the case where there is gas in cavity 110
Mode cooling cavities 110 in object.It in other examples, can also be with if device 100 does not have temperature reducing unit 160
It is cooled to room temperature in nature.The temperature in cavity 110 can be allow to be less than outside cavity 110 by temperature reducing unit 160
Temperature.Or when the temperature in cavity 110 is greater than the temperature outside cavity 110, temperature in cavity 110 can be made rapidly
It is down to close to the temperature outside cavity 110.Or by can further allow the temperature in cavity 110 be less than cavity 110
Outer temperature.
Fig. 2 be schematically show according to one embodiment of the present disclosure one kind via device in electronic module
The upper method schematic diagram for forming protective film.Fig. 3 is that the one kind schematically shown according to one embodiment of the present disclosure exists
The step flow chart of the method for protective film is formed on an at least electronic module.Fig. 4 A to Fig. 4 C is to schematically show according to this public affairs
Open a kind of diagrammatic cross-section the step of forming the method for protective film on electronic module of one embodiment of content.Also,
In order to clearly show that, omission shows the members in device 100 (such as: boosting unit 120, pumping cells 130 in Fig. 2
And heating unit 140) or electronic module 200 in members (such as: multiple electronic building bricks 220).
It referring to figure 2., in the present embodiment, can be by electronic module 200 and the protected material being placed on electronic module 200
Material 300 is placed in cavity 110, to pass through device 100 in formation protective film 310 on electronic module 200.As shown in Fig. 2, cavity
It can place separation frame 400 in 110, and can be by multiple electronic modules 200 as in cavity 110, and multiple electronic modules 200
In at least two can be by separation frame 400 in overlapping each other in cavity 110 and in vertical direction (that is, in gravity direction
On) do not contact.
Fig. 1 be please also refer to Fig. 3 and Fig. 4 A.Firstly, in step sl, by electronic module 200 and being placed in electronic die
Protection materials 300 on block 200 are placed in cavity 110, and wherein protection materials 300 are in contact with each other with electronic module 200.
In the present embodiment, electronic module 200 includes circuit board 210 and multiple electronic building bricks 220.Electronic building brick 220
It is configured on circuit board 210.Size or function between multiple electronic building bricks 220 can be the same or different from each other, in the present invention
In and it is without restriction.Electronic building brick 220 can be electrically connected with circuit board 210.For example, electronic module 200 may include
Mainboard, and multiple electronic building bricks 220 may include the driving component (such as: chip) being configured on circuit board 210 and/or passive group
Part is (such as: inductively or capacitively).
In the present embodiment, protection materials 300 are covered on the upper surface of electronic module 200 (herein by gravity naturally
" above " refer under the particular state of gravity).Certainly, electricity is covered on by gravity naturally in protection materials 300
After the upper surface of submodule 200, between protection materials 300 and electronic module 200 only by Fan Dewali or electrostatic force each other
It attaches.Therefore, if necessary, it may not be necessary to which applying big peeling force can take protection materials 300 from electronic module 200
Under.
In the present embodiment, since electronic building brick 220 is arranged on circuit board 210.Therefore, by protection materials 300
After being placed on electronic module 200, protection materials 300 are at least in contact with each other with the electronic building brick 220 of part.In addition, in this implementation
In example, protection materials 300 are not only in contact with each other with the electronic building brick 220 of part, can also connect each other with the circuit board 210 of part
Touching, it is in the present invention and without restriction.
Under overlooking state, the area of electronic module 200 is more than or equal to the area of protection materials 300.That is, will
After protection materials 300 are placed on electronic module 200, protection materials 300 can not covering board 210 side wall 210a or below
210b。
In the present embodiment, the material of protection materials 300 is thermosetting polymer, in the present invention and without restriction.
Thermosetting polymer for example may include bulk moulding material (Bulk Molding Compound, abbreviation BMC), O-phthalic
Diallyl phthalate (Diallyl Phthalate, abbreviation DAP) resin, urea-formaldehyde (Urea Formaldehyde, abbreviation UF)
Resin or phenolic resin etc., it is in the present invention and without restriction.
In the present embodiment, it can be after first first protection materials 300 are placed on electronic module 200 outside cavity 110,
Electronic module 200 and the protection materials being placed on electronic module 200 300 are placed in together in cavity 110 again, but the present invention is not
It is limited to this.In other embodiments, it is also possible to first electronic module 200 be placed in cavity 110 and then by protection materials
300 are placed on the correspondence electronic module 200 having been placed in cavity 110.
Furthermore it is possible to by the cavity of one or more 200 embedded devices 100 of electronic module of covering protection material 300
After in 110, it can make to constitute closed space in cavity 110.In at this point, the air pressure in cavity 110 is approximately equal to cavity
Ambient pressure outside 110, however, the present invention is not limited thereto.For example, if device 100 has the flushing gas for being connected to cavity 110
(purge gas) pipeline, then after constituting closed space in cavity 110, the pressure in cavity 110 may be slightly larger than cavity
Ambient pressure outside 110.
In the present embodiment, due to protection materials 300 be directly batch be overlying on electronic module 200, and protection materials 300 in
It is at room temperature mold layer flexible.Therefore, there may be some gas gaps 10 between protection materials 300 and electronic module 200.
Fig. 1 be please also refer to Fig. 3 and Fig. 4 B.In step s 2, first is carried out to the protection materials 300 in cavity 110
Heating schedule so that the protection materials 300 being placed on electronic module 200 soften, and carries out decompression program to cavity 110.
In the present embodiment, the first heating schedule can be carried out by the heating unit 140 of device 100.First heating journey
Sequence is that will criticize the protection materials 300 being overlying on electronic module 200 to be heated to the first temperature.First temperature is more than or equal to protection materials
300 softening point, and the first temperature is less than the solidification point of protection materials 300.Therefore, the protection being overlying on electronic module 200 is criticized
Therefore material 300 can soften, but not be cured.
In the present embodiment, the timing for carrying out the first heating schedule at least will be weighed partially with the timing for carrying out decompression program
It is folded.In some embodiments, it while carrying out the first heating schedule, can be dropped by the pumping cells 130 of device 100
Press program.Being depressured program is by the air pressure drop in cavity 110 down to first environment air pressure, and wherein first environment air pressure is lower than cavity
Air pressure outside 110.Due to only being attached each other by Fan Dewali or electrostatic force between protection materials 300 and electronic module 200,
Therefore, decompression program can be such that the gas in the gas gap 20 between protection materials 300 and electronic module 200 is discharged gradually.
Also, since batch protection materials 300 being overlying on electronic module 200 can soften because being heated.In this way, protection materials
300 can more be attached on electronic module 200.
In general, the first temperature can according to protection materials 300 softening point and be adjusted.In some embodiments
In, the first temperature is not only greater than the softening point for being equal to protection materials 300 and is greater than 50 DEG C.In this way, which if cavity 110 is interior, electric
There is subtle droplet, droplet can also lead under first environment air pressure on submodule 200 and/or in protection materials 300
It crosses the first temperature greater than 50 DEG C and forms vapor, and then cavity 110 can be discharged by the pumping cells 130 of device 100.
Fig. 1 be please also refer to Fig. 3 and Fig. 4 C.In step s3, after the softening of protection materials 300, in cavity 110
Protection materials 300 carry out the second heating schedule, and boosting program is carried out to cavity 110, wherein in boosting program, cavity
Gas direct weighting protection materials 300 in 110, so that 300 guarantor's type of protection materials is covered on electronic module 200.
In the present embodiment, the second heating schedule can be carried out by the heating unit 140 of device 100.Second heating journey
Sequence is that will criticize the protection materials 300 being overlying on electronic module 200 to be heated to second temperature.Second temperature is greater than protection materials 300
Solidification point.Therefore, therefore criticizing the protection materials 300 being overlying on electronic module 200 can be cured.
In the present embodiment, the timing for carrying out the second heating schedule at least will be weighed partially with the timing for carrying out boosting program
It is folded.In some embodiments, it while carrying out the second heating schedule, can be risen by the boosting unit 120 of device 100
Press program.Boosting program is that the air pressure in cavity 110 is promoted to second environment air pressure, and wherein second environment air pressure is higher than cavity
Air pressure outside 110.Since batch protection materials 300 being overlying on electronic module 200 have been heated and soften, and protection materials 300
Almost without gas between electronic module 200.Therefore, boosting program can pass through the gas direct weighting in cavity 110
It criticizes and is overlying on the protection materials 300 on electronic module 200 and being softened, and make to criticize and be overlying on electronic module 200 and be softened
300 guarantor's type of protection materials (conformally) be covered on electronic module 200.Certainly, natural state (even if
In the outer space) under be that suitable difficulty reaches complete gasless state, therefore, even if between protection materials 300 and electronic module 200
The fine gas gap perceived can not be observed or be difficult to naked eyes, also belongs to aforementioned " protection materials 300 and electronic module
Almost without gas between 200 " equivalency range.
In some embodiments, by the boosting unit 120 of device 100, second environment air pressure can be made to be more than or equal to 0.8
Million pas (megapascal, abbreviation MPa), however, the present invention is not limited thereto.
Compared in a manner of mould pressurizing or other similar mechanical pressurization, since the present invention is pressurizeed by high pressure gas
Mode be covered in 300 guarantor's type of protection materials on electronic module 200, therefore, even if electronic module 200 include multiple sizes not
The same electronic building brick 220, the electronic building brick 220 on 300 guarantor's type covering board 210 of protection materials after can still making softening.
In addition, also due to the present invention is therefore, will not to damage electronic module 200 or guarantor's type in such a way that high pressure gas pressurizes
Protection materials 300 on covering board 210.
Fig. 1 be please also refer to Fig. 3 and Fig. 4 D.In step s 4, solidify the protection that guarantor's type is covered on electronic module 200
Material 300, to form the protective film 310 that guarantor's type is covered on electronic module 200.
In the present embodiment, since the second heating schedule is that will criticize the protection materials 300 being overlying on electronic module 200 to heat
To more than the second temperature of the solidification point of protection materials 300.Therefore, the protection materials 300 on guarantor's type covering board 210 can be with
It is solidified to form the protective film 310 that guarantor's type is covered on electronic module 200.
Through the above steps after the step of S1 to step S4, can substantially complete the present embodiment in an at least electronic die
The method of protective film 310 is formed on block 200.
Certainly, in order to which the circuit board 210 that will have had 310 guarantor's type of protective film to cover thereon takes out.Dress can passed through
It sets 100 temperature reducing unit 160 to cool down, or is cooled down by natural cooling, and by the exhaust unit 150 of device 100 by cavity
Air pressure in 110 is down to be substantially the same with the air pressure outside cavity 110 after, then will there is 310 guarantor's type of protective film to be covered in it
On circuit board 210 take out.
Due to formed protective film 310 protection materials 300 can not covering board 210 side wall 210a or below
210b.Therefore, the protective film 310 of insulation can protect the electronic building brick 220 on circuit board 210, and unprotected film 310 covers
Part (such as: the side wall 210a or following 210b of circuit board 210) can be still electrically connected with other electronic building bricks 220.
It is to make to protect in such a way that high pressure gas pressurizes since the present invention is in the process for forming protective film with protection materials
Material guarantor's type is covered on electronic module.Therefore, the protective film less rapid wear on electronic module and/or guarantor's type covering board
It is bad, and the performance of electronic module and/or the protective film on guarantor's type covering board is good and quality is good.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of method for forming protective film on an at least electronic module characterized by comprising
An at least electronic module and the protection materials being placed on an at least electronic module are placed in cavity, wherein
The protection materials are in contact with each other with an at least electronic module；
The protection materials intracorporal to the chamber carry out the first heating schedule, so as to be placed on an at least electronic module
The protection materials softening, and decompression program is carried out to the cavity；
After softening the protection materials, the protection materials intracorporal to the chamber carry out the second heating schedule, and to institute
It states cavity and carries out boosting program, wherein in the boosting program, protection materials described in the intracorporal gas direct weighting of chamber,
So that the protection materials guarantor type is covered on an at least electronic module；And
Solidify the protection materials that guarantor's type is covered on an at least electronic module, with formed guarantor's type be covered in it is described at least
The protective film on one electronic module.
2. the method according to claim 1, wherein described at least each of electronic module includes:
Circuit board；And
Multiple electronic building bricks are configured on the circuit board, and by an at least electronic module and be placed in it is described at least
Protection materials on one electronic module are placed in the step in cavity, the protection materials at least with the multiple electronic building brick that
This contact.
3. the method according to claim 1, wherein the area of an at least electronic module is more than or equal to described
The area of protection materials, and by an at least electronic module and the protection materials being placed on an at least electronic module
It is placed in the step in cavity, the protection materials do not cover the side wall of an at least electronic module.
4. the method according to claim 1, wherein wherein:
First heating schedule is that the protection materials are heated to the first temperature, and first temperature is more than or equal to the guarantor
The softening point of protective material, and first temperature is less than the solidification point of the protection materials；And
Second heating schedule is the protection materials to be heated to second temperature, and the second temperature is greater than the protection
The solidification point of material.
5. according to the method described in claim 4, it is characterized in that, first temperature is greater than 50 DEG C.
6. the method according to claim 1, wherein wherein:
The decompression program is to reduce the intracorporal air pressure of chamber to first environment air pressure, wherein the first environment air pressure is lower than
Air pressure outside the cavity；And
The boosting program is to promote the intracorporal air pressure of chamber to second environment air pressure, wherein the second environment air pressure is higher than
Air pressure outside the cavity.
7. the method according to claim 1, wherein first heating schedule and the decompression program simultaneously into
Row.
8. the method according to claim 1, wherein second heating schedule and the boosting program simultaneously into
Row.
9. the method according to claim 1, wherein the cavity and boosting unit, pumping cells and heating
Unit constituent apparatus, in which:
The boosting unit and the pumping cells are connected to the cavity；And
The heating unit and the cavity thermal coupling.
10. the method according to claim 1, wherein an at least electronic module be multiple electronic modules, and
At least two in the multiple electronic module overlap each other in the cavity.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/393,968 US11419221B2 (en) | 2018-05-02 | 2019-04-25 | Method of forming protective film on at least one electronic module |
| DE102019110818.7A DE102019110818B4 (en) | 2018-05-02 | 2019-04-26 | PROCESS FOR MAKING A PROTECTIVE FILM ON AT LEAST ONE ELECTRONIC MODULE BACKGROUND |
| TW108115299A TWI689237B (en) | 2018-05-02 | 2019-05-02 | Method of forming a protective film on at least one electronic module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862665537P | 2018-05-02 | 2018-05-02 | |
| US62/665,537 | 2018-05-02 |
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| CN110446383A true CN110446383A (en) | 2019-11-12 |
| CN110446383B CN110446383B (en) | 2021-03-05 |
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| CN201810836095.9A Active CN110446383B (en) | 2018-05-02 | 2018-07-26 | Method for forming protective film on at least one electronic module |
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| TW (1) | TWI689237B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113715318A (en) * | 2020-05-26 | 2021-11-30 | 毅力科技有限公司 | Vacuum film pressing system and vacuum film pressing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI820917B (en) * | 2022-09-19 | 2023-11-01 | 毅力科技有限公司 | Method for forming a protective film on an electronic module |
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| CN113715318A (en) * | 2020-05-26 | 2021-11-30 | 毅力科技有限公司 | Vacuum film pressing system and vacuum film pressing method |
Also Published As
| Publication number | Publication date |
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| TWI689237B (en) | 2020-03-21 |
| CN110446383B (en) | 2021-03-05 |
| TW201948011A (en) | 2019-12-16 |
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