CN110437613A - The preparation method of transparent polyimide film - Google Patents
The preparation method of transparent polyimide film Download PDFInfo
- Publication number
- CN110437613A CN110437613A CN201910681609.2A CN201910681609A CN110437613A CN 110437613 A CN110437613 A CN 110437613A CN 201910681609 A CN201910681609 A CN 201910681609A CN 110437613 A CN110437613 A CN 110437613A
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- CN
- China
- Prior art keywords
- polyimide film
- dianhydride
- transparent polyimide
- preparation
- 20min
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Abstract
The invention discloses the preparation methods of transparent polyimide film, and first diamines is put into reaction kettle, and are dissolved with polar solvent, it is then placed in poly sebacic polyanhydride and allyl succinic anhydride, dianhydride is finally added into reaction kettle, stirs, is prepared into required polyamic acid solution；Then above-mentioned uniformly mixed polyamic acid solution is cast on steel band or glass baseplate after vacuum defoamation, and drawn imidization obtains Kapton by the way of Far-infrared Heating under the protection of dry inert gas.The transparent polyimide film that the preparation method for the transparent polyimide film that the present invention obtains obtains, thickness is in 13um ~ 125um, and the light transmittance at 500nm reaches 90% or more, and 300 DEG C of glass transition temperature or more, yellowness index is less than 1.0.
Description
Technical field
The present invention relates to the preparation methods of a kind of Kapton, especially transparent polyimide film.
Background technique
In recent years, with the rapid development of photovoltaic industry, photoelectric field is to colorless and transparent and have good heat-resisting transparent poly-
The demand of imide membrane is increasing.For example, flexible resin basement membrane will be resistant to during the processing procedure of flexible AMOLED
300 DEG C or more of high temperature, this temperature are much higher than the use temperature of conventional optical film (PET, PEN, polycarbonate etc.), therefore
Transparent polyimide film obtains extensive concern in sphere of learning and engineering field.To improve polyimide resin
The transparency can usually introduce alicyclic structure or fluoro-containing group.The introducing of alicyclic structure frequently can lead to polyimide resin
Thermal stability reduces, so that gained polyimide resin be made to reduce using temperature.
Summary of the invention
One kind is provided and takes into account transparency and high temperature resistant the purpose of the present invention is to solve above-mentioned the deficiencies in the prior art
Transparent polyimide film preparation method.
To achieve the goals above, the preparation method of the transparent polyimide film designed by the present invention, including with
Lower step:
Step 1: preparing polyamic acid solution, first diamines is put into reaction kettle, and is dissolved with polar solvent, is then placed in poly-
Sebacic anhydride and allyl succinic anhydride finally add dianhydride into reaction kettle, and it is molten to be prepared into required polyamic acid for stirring
Liquid；Wherein diamines: poly sebacic polyanhydride: allyl succinic anhydride: the molar ratio of dianhydride is 1:0.2:0.1:1；
Step 2: preparing transparent polyimide film, above-mentioned uniformly mixed polyamic acid solution is passed through into vacuum defoamation
After be cast on steel band or glass baseplate, and under the protection of dry inert gas by the way of Far-infrared Heating, specifically
It is first then successively to be kept in 140-160 DEG C of holding 10-20min at 180-220 DEG C in 100-120 DEG C of holding 10-20min
10-20min, in 220-280 DEG C of holding 10-20min, in 320-380 DEG C of holding 10-20min, in 380-400 DEG C of holding 5-
10min, drawn imidization obtain Kapton.
The dianhydride prepared in polyamic acid solution is pyromellitic acid anhydride (PMDA), hydrogenated pyromellitic anhydride
(HPMDA), 3,3', 4,4'- biphenyltetracarboxylic dianhydride (BPDA), 3,3', 4,4'- benzophenone tetracid dianhydride (BTDA), 4,4'- connection
One of phenylate dianhydride (ODPA), bisphenol A dianhydride (BPADA), 4,4'- (hexafluoro isopropyl alkene) two anhydride phthalic acids (6FPA) are several
Kind；
The diamines is 4,4- diaminodiphenyl ether (4,4-ODA), 3,4 '-diaminodiphenyl ethers (3,4-ODA), p-phenylenediamine
(PPD), bis- (the trifluoromethyl) -4,4'- benzidines (TFMB) of 4,4- diaminodiphenyl-methane (MDA), 2,2'-, 4,4-
Diaminobenzene sulfone (4,4-DDS), 1,4- bis- (4- amino -2- 4-trifluoromethylphenopendant) benzene (6FAPB), (the 4- aminobenzene of 1,3- bis-
One or more of oxygroup) benzene (1,3,4-APB)；
The polar solvent is dimethyl acetamide (DMAC), N-Methyl pyrrolidone (NMP), in dimethylformamide (DMF)
One or more.
The transparent polyimide film that the preparation method for the transparent polyimide film that the present invention obtains obtains,
Thickness is in 13um ~ 125um, and the light transmittance at 500nm reaches 90% or more, and 300 DEG C of glass transition temperature or more, yellowing refers to
Number is less than 1.0.Transparent polyimide film provided by the invention flexible OLED, flexible thin-film solar cell, light guide,
The optical fields such as waveguide and liquid crystal display have a good application prospect.
Specific embodiment
Below with reference to embodiment, the present invention is further described.
Embodiment 1:
The preparation method of transparent polyimide film provided in this embodiment, comprising the following steps:
Step 1: preparing polyamic acid solution, first diamines is put into reaction kettle, and is dissolved with polar solvent, is then placed in poly-
Sebacic anhydride and allyl succinic anhydride finally add dianhydride into reaction kettle, and it is molten to be prepared into required polyamic acid for stirring
Liquid；Wherein diamines: poly sebacic polyanhydride: allyl succinic anhydride: the molar ratio of dianhydride is 1:0.2:0.1:1；The diamines is 3,
4 '-diaminodiphenyl ethers (3,4-ODA), the dianhydride are bisphenol A dianhydride (BPADA).
Step 2: preparing transparent polyimide film, above-mentioned uniformly mixed polyamic acid solution is passed through into vacuum
It is cast to after deaeration on steel band or glass baseplate, and under the protection of dry inert gas by the way of Far-infrared Heating,
Specifically first in 100-120 DEG C of holding 10-20min, then successively protected in 140-160 DEG C of holding 10-20min at 180-220 DEG C
10-20min is held, in 220-280 DEG C of holding 10-20min, in 320-380 DEG C of holding 10-20min, in 380-400 DEG C of holding 5-
10min, drawn imidization obtain Kapton.
The polar solvent is dimethyl acetamide (DMAC), N-Methyl pyrrolidone (NMP), dimethylformamide
One or more of (DMF).
After tested, the transparent polyimide film that the present embodiment obtains, the light transmittance at 500nm reach 90%
More than, 300 DEG C of glass transition temperature or more, yellowness index is less than 1.0.
Embodiment 2:
The preparation method of transparent polyimide film provided in this embodiment, comprising the following steps:
Step 1: preparing polyamic acid solution, first diamines is put into reaction kettle, and is dissolved with polar solvent, is then placed in poly-
Sebacic anhydride and allyl succinic anhydride finally add dianhydride into reaction kettle, and it is molten to be prepared into required polyamic acid for stirring
Liquid；Wherein diamines: poly sebacic polyanhydride: allyl succinic anhydride: the molar ratio of dianhydride is 1:0.2:0.1:1；The diamines is 1,
Bis- (4- amino -2- 4-trifluoromethylphenopendant) benzene (6FAPB) of 4-, the dianhydride are hydrogenated pyromellitic anhydride (HPMDA).
Step 2: preparing transparent polyimide film, above-mentioned uniformly mixed polyamic acid solution is passed through into vacuum
It is cast to after deaeration on steel band or glass baseplate, and under the protection of dry inert gas by the way of Far-infrared Heating,
Specifically first in 100-120 DEG C of holding 10-20min, then successively protected in 140-160 DEG C of holding 10-20min at 180-220 DEG C
10-20min is held, in 220-280 DEG C of holding 10-20min, in 320-380 DEG C of holding 10-20min, in 380-400 DEG C of holding 5-
10min, drawn imidization obtain Kapton.
The polar solvent is dimethyl acetamide (DMAC), N-Methyl pyrrolidone (NMP), dimethylformamide
One or more of (DMF).
After tested, the transparent polyimide film that the present embodiment obtains, the light transmittance at 500nm reach 90%
More than, 300 DEG C of glass transition temperature or more, yellowness index is less than 1.0.
Embodiment 3:
The preparation method of transparent polyimide film provided in this embodiment, comprising the following steps:
Step 1: preparing polyamic acid solution, first diamines is put into reaction kettle, and is dissolved with polar solvent, is then placed in poly-
Sebacic anhydride and allyl succinic anhydride finally add dianhydride into reaction kettle, and it is molten to be prepared into required polyamic acid for stirring
Liquid；Wherein diamines: poly sebacic polyanhydride: allyl succinic anhydride: the molar ratio of dianhydride is 1:0.2:0.1:1；The diamines is 1,
3- bis- (4- amino-benzene oxygen) benzene (1,3,4-APB), the dianhydride are 4,4'- (hexafluoro isopropyl alkene) two anhydride phthalic acids (6FPA).
Step 2: preparing transparent polyimide film, above-mentioned uniformly mixed polyamic acid solution is passed through into vacuum
It is cast to after deaeration on steel band or glass baseplate, and under the protection of dry inert gas by the way of Far-infrared Heating,
Specifically first in 100-120 DEG C of holding 10-20min, then successively protected in 140-160 DEG C of holding 10-20min at 180-220 DEG C
10-20min is held, in 220-280 DEG C of holding 10-20min, in 320-380 DEG C of holding 10-20min, in 380-400 DEG C of holding 5-
10min, drawn imidization obtain Kapton.
The polar solvent is dimethyl acetamide (DMAC), N-Methyl pyrrolidone (NMP), dimethylformamide
One or more of (DMF).
After tested, the transparent polyimide film that the present embodiment obtains, the light transmittance at 500nm reach 90%
More than, 300 DEG C of glass transition temperature or more, yellowness index is less than 1.0.
Claims (4)
1. a kind of preparation method of transparent polyimide film, it is characterised in that: the following steps are included:
Step 1: preparing polyamic acid solution, first diamines is put into reaction kettle, and is dissolved with polar solvent, is then placed in poly-
Sebacic anhydride and allyl succinic anhydride finally add dianhydride into reaction kettle, and it is molten to be prepared into required polyamic acid for stirring
Liquid；Wherein diamines: poly sebacic polyanhydride: allyl succinic anhydride: the molar ratio of dianhydride is 1:0.2:0.1:1；
Step 2: preparing transparent polyimide film, above-mentioned uniformly mixed polyamic acid solution is passed through into vacuum defoamation
After be cast on steel band or glass baseplate, and under the protection of dry inert gas by the way of Far-infrared Heating, specifically
It is first then successively to be kept in 140-160 DEG C of holding 10-20min at 180-220 DEG C in 100-120 DEG C of holding 10-20min
10-20min, in 220-280 DEG C of holding 10-20min, in 320-380 DEG C of holding 10-20min, in 380-400 DEG C of holding 5-
10min, drawn imidization obtain Kapton.
2. the preparation method of transparent polyimide film according to claim 1, it is characterised in that: the preparation is poly-
Dianhydride in amide acid solution is pyromellitic acid anhydride (PMDA), hydrogenated pyromellitic anhydride (HPMDA), 3,3', 4,4'-
Biphenyltetracarboxylic dianhydride (BPDA), 3,3', it is 4,4'- benzophenone tetracid dianhydride (BTDA), 4,4'- biphenyl ether dianhydride (ODPA), double
One or more of phenol A dianhydride (BPADA), 4,4'- (hexafluoro isopropyl alkene) two anhydride phthalic acids (6FPA).
3. the preparation method of transparent polyimide film according to claim 1, it is characterised in that: the diamines is
4,4- diaminodiphenyl ether (4,4-ODA), 3,4 '-diaminodiphenyl ethers (3,4-ODA), p-phenylenediamine (PPD), 4,4- diamino
Bis- (the trifluoromethyl) -4,4'- benzidines (TFMB) of diphenyl methane (MDA), 2,2'-, 4,4- diaminobenzene sulfone (4,4-
DDS), bis- (4- amino -2- 4-trifluoromethylphenopendant) benzene (6FAPB) of 1,4-, 1,3- bis- (4- amino-benzene oxygen) benzene (1,3,4-
One or more of APB).
4. the preparation method of transparent polyimide film according to claim 1, it is characterised in that: the polarity is molten
Agent is one or more of dimethyl acetamide (DMAC), N-Methyl pyrrolidone (NMP), dimethylformamide (DMF).
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Cited By (4)
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| CN111662473A (en) * | 2020-07-24 | 2020-09-15 | 浙江道明光电科技有限公司 | Preparation method of low-yellow-index colorless transparent polyimide film |
| JP2021113303A (en) * | 2020-05-11 | 2021-08-05 | 晉一化工股▲ふん▼有限公司Chin Yee Chemical Industries Co., Ltd. | Thermosetting polyimide resin and method for producing the same, composition, prepolymer, film, adhesive, and use thereof |
| CN114591626A (en) * | 2022-03-16 | 2022-06-07 | 东南大学 | Transparent polyimide resisting coupling of electron irradiation and stress field and preparation method thereof |
| CN114702705A (en) * | 2022-02-22 | 2022-07-05 | 哈尔滨工业大学 | High-temperature-resistant colorless transparent polyimide film for lead-free soldering reflow in electronic industry and preparation method thereof |
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| JP2021113303A (en) * | 2020-05-11 | 2021-08-05 | 晉一化工股▲ふん▼有限公司Chin Yee Chemical Industries Co., Ltd. | Thermosetting polyimide resin and method for producing the same, composition, prepolymer, film, adhesive, and use thereof |
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| CN114702705B (en) * | 2022-02-22 | 2022-11-04 | 哈尔滨工业大学 | High-temperature-resistant colorless transparent polyimide film for lead-free soldering reflow in electronic industry and preparation method thereof |
| WO2023160563A1 (en) * | 2022-02-22 | 2023-08-31 | 哈尔滨工业大学 | High-temperature-resistant colorless transparent polyimide film for lead-free welding reflow in electronic industry, and preparation method therefor |
| CN114591626A (en) * | 2022-03-16 | 2022-06-07 | 东南大学 | Transparent polyimide resisting coupling of electron irradiation and stress field and preparation method thereof |
| CN114591626B (en) * | 2022-03-16 | 2023-12-12 | 东南大学 | Transparent polyimide resistant to electron irradiation and stress field coupling and preparation method thereof |
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