CN110434158A - A kind of technique that mechanical approach processing waste printed circuit board prepares copper alloy powder - Google Patents
A kind of technique that mechanical approach processing waste printed circuit board prepares copper alloy powder Download PDFInfo
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- CN110434158A CN110434158A CN201910788280.XA CN201910788280A CN110434158A CN 110434158 A CN110434158 A CN 110434158A CN 201910788280 A CN201910788280 A CN 201910788280A CN 110434158 A CN110434158 A CN 110434158A
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- 239000000843 powder Substances 0.000 title claims abstract description 68
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000002699 waste material Substances 0.000 title claims abstract description 41
- 238000013459 approach Methods 0.000 title claims abstract description 27
- 238000012545 processing Methods 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 117
- 239000002184 metal Substances 0.000 claims abstract description 115
- 238000000926 separation method Methods 0.000 claims abstract description 38
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000000498 ball milling Methods 0.000 claims abstract description 33
- 229910052742 iron Inorganic materials 0.000 claims abstract description 20
- 238000007885 magnetic separation Methods 0.000 claims abstract description 12
- 238000012216 screening Methods 0.000 claims abstract description 9
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 34
- 239000012141 concentrate Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000008187 granular material Substances 0.000 claims description 16
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims description 10
- 239000012298 atmosphere Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 238000000713 high-energy ball milling Methods 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 8
- 238000004886 process control Methods 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- KVIPHDKUOLVVQN-UHFFFAOYSA-N ethene;hydrate Chemical group O.C=C KVIPHDKUOLVVQN-UHFFFAOYSA-N 0.000 claims description 6
- 235000012054 meals Nutrition 0.000 claims description 6
- 230000005294 ferromagnetic effect Effects 0.000 claims description 4
- 238000004663 powder metallurgy Methods 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000001238 wet grinding Methods 0.000 claims description 2
- 238000012369 In process control Methods 0.000 claims 1
- 238000010965 in-process control Methods 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 abstract description 21
- 229910052802 copper Inorganic materials 0.000 abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052718 tin Inorganic materials 0.000 abstract description 11
- 239000011135 tin Substances 0.000 abstract description 11
- 239000002783 friction material Substances 0.000 abstract description 10
- 239000011133 lead Substances 0.000 abstract description 10
- 229910052745 lead Inorganic materials 0.000 abstract description 9
- 238000005265 energy consumption Methods 0.000 abstract description 6
- 238000004064 recycling Methods 0.000 abstract description 6
- 230000008929 regeneration Effects 0.000 abstract description 5
- 238000011069 regeneration method Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000012535 impurity Substances 0.000 abstract description 3
- 239000004615 ingredient Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000746 purification Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 21
- 229910052737 gold Inorganic materials 0.000 description 21
- 239000010931 gold Substances 0.000 description 21
- 238000011084 recovery Methods 0.000 description 6
- 238000003723 Smelting Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 230000005291 magnetic effect Effects 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 238000010310 metallurgical process Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000010793 electronic waste Substances 0.000 description 2
- 238000005272 metallurgy Methods 0.000 description 2
- 238000009853 pyrometallurgy Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 238000011953 bioanalysis Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000013070 direct material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 238000009854 hydrometallurgy Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03B—SEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS
- B03B9/00—General arrangement of separating plant, e.g. flow sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/005—Separation by a physical processing technique only, e.g. by mechanical breaking
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Environmental & Geological Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Geology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses the techniques that a kind of mechanical approach processing waste printed circuit board prepares copper alloy powder, its processing step includes: that old circuit board is crushed the processes such as pretreatment, pneumatic separation, iron removal by magnetic separation, mechanical crushing, screening, separation by shaking table, ball milling removal of impurities, ball milling refinement, powder purification process, finally obtains copper alloy powder.The technique has the advantage that the copper alloy powder of acquisition mainly contains Cu, Sn, Pb, Fe, its ingredient and content are in the range of copper base friction material requires, it may be directly applied to prepare copper base friction material, a small amount of tailing that entire technique generates is easily handled the full recycling, it can be achieved that metal；Can be realized in waste printed circuit board compared with the method for valuable metal circular regeneration with other, this technique using mechanical approach without metallurgical technology, it can be achieved that old metal copper it is direct materialized, simple process, production cost is small, and low energy consumption, pollute it is small.
Description
Technical field
The present invention relates to Disposal of Electronic Wastes recovery technology fields, and in particular to a kind of mechanical approach processing scrap wire
The technique that road plate prepares copper alloy powder.
Background technique
With the rapid development of electronics and information industry, the performance requirement of electronic product is continuously improved, wiring board is electronics
The core component of product, because the tailing generated in electronic product update and wiring board production, can all have every year
A large amount of waste printed circuit board generates, these electronic wastes also produce the ecological environment of surrounding while tying up social resources
Huge harm.
The constituent of wiring board is complicated, can simply be divided into metal and nonmetallic two parts.Content in different wiring boards
It is different, mostly between the wt.% of 10 wt.% ~ 40.If the content of the wiring board copper in computer reaches 26.6 wt.%, also contain
There are the noble metals such as the valuable metals such as tin, lead, aluminium and micro gold, silver, palladium, there is very high recovery value.Waste printed circuit board removes
Containing a large amount of polymeric material outside metal, is also contained, these materials have very high calorific value, can be by being pyrolyzed to obtain
To fuel oil, asphalt modifier etc. also can be used as.One important topic is had become to the recycling treatment of old circuit board.
There is mechanical approach to pre-process to obtain metal concentrate the main method of the recycling of metal in waste printed circuit board at present,
Again through techniques such as pyrometallurgy, hydrometallurgy or bioanalysis metallurgy, regenerated metal is realized.Its process flow is long, and energy consumption is high, and ring
Border pollution is larger.
Patent CN101642765B discloses a kind for the treatment of process of waste printed circuit board comprising the steps of: by waste printed circuit board
Broken by two-stage, broken partial size is 0.1 ~ 2mm.Lead-foot-line progress ball milling is made into electroplating surfaces with tin layer and interior metal point
It opens, then through magnetic separation separation of ferromagnetic substance.Broken thin material obtains metal richness by high-intensitive centrifugal classification and electrostatic separation
Collective and nonmetallic enrichment body.Nonmetallic enrichment body obtains plastics enrichment body and ceramics enrichment body through pneumatic separating again.
Patent CN102172597B discloses a kind of waste printed circuit board total head recovery method, includes following steps: will give up
Wiring board is crushed to partial size less than 5mm, and the material of acquisition -2mm and the metal charge and nonmetallic material of+2mm are sorted through vibration, then
Using wet magnetic separation separation of ferromagnetic substance and nonmagnetic metal.It is small that previously obtained nonmetallic material and tailings are crushed to granularity
In 1mm, metal powder and non-metal powder are obtained through FLOTATION SEPARATION organic matter and inorganic matter, then through separation by shaking table inorganic matter.
Summary of the invention
It is an object of the present invention to be directed to existing waste printed circuit board metallurgy recovery process long flow path, energy consumption is high, and environmental pollution
Big deficiency provides the mechanical approach recovery process that a kind of short route for avoiding metallurgical process, low energy consumption, pollution is small, real
The regeneration of metal and direct material utilization in existing waste printed circuit board.
The purpose of the present invention is realized at least by one of following technical scheme.
The present invention provides the techniques that a kind of mechanical approach processing waste printed circuit board prepares copper alloy powder, including following step
It is rapid:
(1) initial physical sorting will be carried out after the broken pretreatment of waste printed circuit board, obtains ferrous metal enrichment body；
(2) it after further crushing the obtained ferrous metal enrichment body of step (1), sieves to obtain greater than 200 purposes with sieve
Coarse granular material；
(3) the obtained coarse granular material for being greater than 200 mesh of step (2) is used into separation by shaking table, removes nonmetallic, raising metal
It is enriched with the content of metal in body, obtains metal concentrate；
(4) the obtained metal concentrate of step (3) is subjected to ball-milling treatment, will wherein remaining nonmetallic levigate rear screening gone
It removes, further purifies metals and be enriched with body, obtain copper alloy corase meal；
(5) the obtained copper alloy corase meal of step (4) is subjected to high-energy ball milling, obtains fine grain copper alloy powder；
(6) the obtained fine grain copper alloy powder of step (5) is subjected to atmosphere reduction, obtains can be directly used for powder metallurgy
Copper alloy powder.
Preferably, in step (1), using crusher by wiring board break process to 5 mm hereinafter, the physical separation
For pneumatic separation.
Preferably, in step (2), the obtained ferrous metal enrichment body of step (1) is crushed to using beater grinder
0.5 mm or less.
Preferably, ball milling described in step (4) uses planetary ball mill, and ball milling is carried out in a manner of wet-milling.
Preferably, ball milling solvent is water or hexamethylene, the volume and metal enrichment weight of water or hexamethylene in step (4)
Ratio be 0.2 ~ 2 ml/g.
Preferably, rotational speed of ball-mill is 300 ~ 500 r/min in step (4), and Ball-milling Time is 2 ~ 10 h, ball material mass ratio control
System is in 15:1 ~ 100:1.
Preferably, high-energy ball milling described in step (5) uses planetary high-energy ball mill, and rotational speed of ball-mill is 300 ~ 500 r/
Min, Ball-milling Time are 6 ~ 20 h, and ball-material mass ratio is 15:1 ~ 100:1.
Preferably, process control agent is water or hexamethylene, the volume and copper alloy corase meal of process control agent in step (5)
Mass ratio be 0.2 ~ 2 ml/g.
Preferably, fine grain copper alloy powder is restored in hydrogen atmosphere in step (6).
Preferably, when the mass fraction of iron content is greater than 5 wt.% in the obtained ferrous metal enrichment body of step (1), In
Body will be enriched with to ferrous metal before step (2) processing by, which carrying out, carries out magnetic separation separation, respectively obtains non-ferrous metal enrichment body and ferromagnetic
Property metal concentrate, then non-ferrous metal enrichment body is carried out after further crushing, sieves to obtain that be greater than 200 purposes thick with sieve
Granule materials.
Compared to the prior art, the present invention has the following technical effects and advantage:
Waste printed circuit board recovery processing technique proposed by the present invention mainly uses mechanical approach, avoids metallurgical technology, therefore have
Have the characteristics that process is short, low energy consumption, pollution is small, the copper alloy powder that can be obtained mainly contains Cu, Sn, Pb, Fe, ingredient and contains
Amount may be directly applied to prepare copper base friction material, realize metal in waste printed circuit board in the range of copper base friction material requires
Regeneration.The a small amount of tailing generated in this technique can enter metallurgical process and further recycle, and realize the full recycling of metal.
Detailed description of the invention
Fig. 1 is that the mechanical approach that embodiment provides handles the process flow chart that waste printed circuit board prepares copper alloy powder.
Specific embodiment
To facilitate the understanding of the present invention, the present invention is made below in conjunction with Figure of description and preferred embodiment more complete
Face meticulously describes.It should be appreciated that described herein, specific examples are only used to explain the present invention, is not used to limit this
Invention.In addition, as long as technical characteristic involved in each embodiment of invention described below is not constituted each other
Conflict can be combined with each other.
As shown in Fig. 1, a kind of mechanical approach processing waste printed circuit board prepares the technique of copper alloy powder, including following step
It is rapid: broken pretreatment, pneumatic separation, magnetic separation, mechanical crushing, separation by shaking table, ball milling removal of impurities, the ball milling refinement, powder of waste printed circuit board
The processes such as end purifying, the copper alloy powder finally obtained may be directly applied to prepare copper base friction material, realize in waste printed circuit board
The regeneration cycle of metal resource.This technique mainly uses mechanical approach to realize the regeneration cycle of old metal, avoids metallurgical work
Skill greatly reduces energy consumption and pollution.And a small amount of tailing generated in technique can enter metallurgical process and further recycle, it can be real
The full recycling that cash belongs to.
Embodiment 1
Present embodiments provide the technique that a kind of mechanical approach processing waste printed circuit board prepares copper alloy powder, including following step
It is rapid:
(1) 100 kg waste printed circuit boards are crushed to 5 mm hereinafter, and using pneumatic separation method realize metal and it is nonmetallic just
Step separation obtains ferrous metal enrichment body, and wherein iron content is 16.9 wt.%；
(2) the obtained ferrous metal enrichment body of step (1) is subjected to magnetic separation separation, respectively obtains non-ferrous metal enrichment body and iron
Magnetic metal is enriched with body；
(3) step (2) obtained non-ferrous metal enrichment body is further crushed to by 0.5 mm using hammer mill hereinafter, with
Sieve sieves to obtain the coarse granular material greater than 200 mesh；
(4) the obtained coarse granular material for being greater than 200 mesh of step (3) is used into waterpower separation by shaking table, the most of non-gold of removal
Belong to, improves the content of metal in metal concentrate, obtain metal concentrate；
(5) the obtained metal concentrate of step (4) is subjected to ball-milling treatment, rotational speed of ball-mill is controlled in 400 r/min, ball milling
Between control in 4h, ball material mass ratio is 20:1, and the volume and metal enrichment body mass ratio of water are 1mL/g, will wherein remaining non-gold
Screening removal, further purifies metals and is enriched with body after belonging to levigate；
(6) the obtained metal concentrate of step (5) is subjected to high-energy ball milling, using water as process control agent, the volume and gold of water
The mass ratio for belonging to enrichment body is 1 ml/g, and rotational speed of ball-mill is 400 r/min, and ball material mass ratio 20:1, Ball-milling Time is 10 h.
To fine grain copper alloy powder, particle diameter distribution is between 7 ~ 45 μm；
(7) the obtained fine grain copper alloy powder of step (6) is subjected to hydrogen atmosphere reduction, obtains can be directly used for powder smelting
The copper alloy powder of gold, Cu 91.71 wt.%, Sn 3.42 wt.%, Pb 2.74 wt.%, Fe 1.46 in copper alloy powder
Wt.%, C 0.16 wt.%, Zn 0.25 wt.% of 0.26 wt.%, O, this alloy powder can be used for preparing copper base friction material.
Embodiment 2
Present embodiments provide the technique that a kind of mechanical approach processing waste printed circuit board prepares copper alloy powder, including following step
It is rapid:
(1) 100 kg waste printed circuit boards are crushed to 5 mm hereinafter, and using pneumatic separation method realize metal and it is nonmetallic just
Step separation obtains ferrous metal enrichment body, and wherein iron content is 16.9 wt.%；
(2) the obtained ferrous metal enrichment body of step (1) is subjected to magnetic separation separation, respectively obtains non-ferrous metal enrichment body and iron
Magnetic metal is enriched with body；
(3) step (2) obtained non-ferrous metal enrichment body is further crushed to by 0.5 mm using hammer mill hereinafter, with
Sieve sieves to obtain the coarse granular material greater than 200 mesh；
(4) the obtained coarse granular material for being greater than 200 mesh of step (3) is used into waterpower separation by shaking table, the most of non-gold of removal
Belong to, improves the content of metal in metal concentrate, obtain metal concentrate；
(5) the obtained metal concentrate of step (4) is subjected to ball-milling treatment, rotational speed of ball-mill is controlled in 400 r/min, ball milling
Between control in 3h, ball material mass ratio is 20:1, and the volume and metal enrichment body mass ratio of water are 1ml/g, will wherein remaining non-gold
Screening removal, further purifies metals and is enriched with body after belonging to levigate；
(6) the obtained metal concentrate of step (5) is subjected to high-energy ball milling.Using water as process control agent, the volume and gold of water
The mass ratio for belonging to enrichment body is 0.5 ml/g, and rotational speed of ball-mill is 400 r/min, and ball material mass ratio 20:1, Ball-milling Time is 10 h,
Fine grain copper alloy powder is obtained, particle diameter distribution is between 7 ~ 45 μm；
(7) the obtained fine grain copper alloy powder of step (6) is subjected to hydrogen atmosphere reduction, obtains can be directly used for powder smelting
The copper alloy powder of gold, Cu 90.69 wt.%, Sn 4.12 wt.%, Pb 3.30 wt.%, Fe 1.15 in copper alloy powder
Wt.%, C 0.23 wt.%, Zn 0.25 wt.% of 0.26 wt.%, O, this alloy powder can be used for preparing copper base friction material.
Embodiment 3
Present embodiments provide the technique that a kind of mechanical approach processing waste printed circuit board prepares copper alloy powder, including following step
It is rapid:
(1) 100 kg waste printed circuit boards are crushed to 5 mm hereinafter, and using pneumatic separation method realize metal and it is nonmetallic just
Step separation obtains ferrous metal enrichment body, and wherein iron content is 16.9 wt.%；
(2) the obtained ferrous metal enrichment body of step (1) is subjected to magnetic separation separation, respectively obtains non-ferrous metal enrichment body and iron
Magnetic metal is enriched with body；
(3) step (2) obtained non-ferrous metal enrichment body is further crushed to by 0.5 mm using hammer mill hereinafter, with
Sieve sieves to obtain the coarse granular material greater than 200 mesh；
(4) the obtained coarse granular material for being greater than 200 mesh of step (3) is used into waterpower separation by shaking table, the most of non-gold of removal
Belong to, improves the content of metal in metal concentrate, obtain metal concentrate；
(5) the obtained metal concentrate of step (4) is subjected to ball-milling treatment, rotational speed of ball-mill is controlled in 400 r/min, ball milling
Between control in 2h, ball material mass ratio is 20:1, and the volume and metal enrichment body mass ratio of water are 1ml/g, will wherein remaining non-gold
Screening removal, further purifies metals and is enriched with body after belonging to levigate；
(6) the obtained metal concentrate of step (5) is subjected to high-energy ball milling, using hexamethylene as process control agent, hexamethylene
The mass ratio of volume and metal concentrate is 0.2 ml/g, and rotational speed of ball-mill is 400 r/min, ball material mass ratio 20:1, when ball milling
Between be 8 h.Fine grain copper alloy powder is obtained, particle diameter distribution is between 7 ~ 45 μm；
(7) the obtained fine grain copper alloy powder of step (6) is subjected to hydrogen atmosphere reduction, obtains can be directly used for powder smelting
The copper alloy powder of gold, Cu 89.39 wt.%, Sn 4.88 wt.%, Pb 3.91 wt.%, Fe 1.04 in copper alloy powder
Wt.%, C 0.27 wt.%, Zn 0.25 wt.% of 0.26 wt.%, O, this alloy powder can be used for preparing copper base friction material.
Embodiment 4
Present embodiments provide the technique that a kind of mechanical approach processing waste printed circuit board prepares copper alloy powder, including following step
It is rapid:
(1) 100 kg waste printed circuit boards are crushed to 5 mm hereinafter, and using pneumatic separation method realize metal and it is nonmetallic just
Step separation obtains ferrous metal enrichment body, and wherein iron content is 16.9 wt.%；
(2) the obtained ferrous metal enrichment body of step (1) is subjected to magnetic separation separation, respectively obtains non-ferrous metal enrichment body and iron
Magnetic metal is enriched with body；
(3) step (2) obtained non-ferrous metal enrichment body is further crushed to by 0.5 mm using hammer mill hereinafter, with
Sieve sieves to obtain the coarse granular material greater than 200 mesh；
(4) the obtained coarse granular material for being greater than 200 mesh of step (3) is used into waterpower separation by shaking table, the most of non-gold of removal
Belong to, improves the content of metal in metal concentrate, obtain metal concentrate；
(5) the obtained metal concentrate of step (4) is subjected to ball-milling treatment, rotational speed of ball-mill is controlled in 300 r/min, ball milling
Between control in 4h, ball material mass ratio is 20:1, and the volume and metal enrichment body mass ratio of water are 1ml/g, will wherein remaining non-gold
Screening removal, further purifies metals and is enriched with body after belonging to levigate；
(6) the obtained metal concentrate of step (5) is subjected to high-energy ball milling, using water as process control agent, the volume and gold of water
The mass ratio for belonging to enrichment body is 1 ml/g, and rotational speed of ball-mill is 500 r/min, and ball material mass ratio 20:1, Ball-milling Time is 6 h.
To fine grain copper alloy powder, particle diameter distribution is between 7 ~ 45 μm；
(7) the obtained fine grain copper alloy powder of step (6) is subjected to hydrogen atmosphere reduction, obtains can be directly used for powder smelting
The copper alloy powder of gold, Cu 88.74 wt.%, Sn 5.18 wt.%, Pb 4.14 wt.%, Fe 1.21 in copper alloy powder
Wt.%, C 0.22 wt.%, Zn 0.25 wt.% of 0.26 wt.%, O, this alloy powder can be used for preparing copper base friction material.
Embodiment 5
Present embodiments provide the technique that a kind of mechanical approach processing waste printed circuit board prepares copper alloy powder, including following step
It is rapid:
(1) 100 kg waste printed circuit boards are crushed to 5 mm hereinafter, and using pneumatic separation method realize metal and it is nonmetallic just
Step separation obtains ferrous metal enrichment body, and wherein iron content is 16.9 wt.%；
(2) the obtained ferrous metal enrichment body of step (1) is subjected to magnetic separation separation, respectively obtains non-ferrous metal enrichment body and iron
Magnetic metal is enriched with body；
(3) step (2) obtained non-ferrous metal enrichment body is further crushed to by 0.5 mm using hammer mill hereinafter, with
Sieve sieves to obtain the coarse granular material greater than 200 mesh；
(4) the obtained coarse granular material for being greater than 200 mesh of step (3) is used into waterpower separation by shaking table, the most of non-gold of removal
Belong to, improves the content of metal in metal concentrate, obtain metal concentrate；
(5) the obtained metal concentrate of step (4) is subjected to ball-milling treatment, rotational speed of ball-mill is controlled in 500 r/min, ball milling
Between control in 4h, ball material mass ratio is 20:1, and the volume and metal enrichment body mass ratio of water are 1ml/g, will wherein remaining non-gold
Screening removal, further purifies metals and is enriched with body after belonging to levigate；
(6) the obtained metal concentrate of step (5) is subjected to high-energy ball milling, using hexamethylene as process control agent, hexamethylene
The mass ratio of volume and metal concentrate is 0.5 ml/g, and rotational speed of ball-mill is 400 r/min, ball material mass ratio 20:1, when ball milling
Between be 14 h.Fine grain copper alloy powder is obtained, particle diameter distribution is between 7 ~ 45 μm；
(7) the obtained fine grain copper alloy powder of step (6) is subjected to hydrogen atmosphere reduction, obtains can be directly used for powder smelting
The copper alloy powder of gold, Cu 91.85 wt.%, Sn 3.12 wt.%, Pb 2.51 wt.%, Fe 1.89 in copper alloy powder
Wt.%, C 0.12 wt.%, Zn 0.25 wt.% of 0.26 wt.%, O, this alloy powder can be used for preparing copper base friction material.
In embodiment 1 to 5, to the 200 mesh tailing below obtained after material crushing and screening and in ball milling impurity removal process
Middle to sieve obtained 200 mesh tailing below, main component and content therein are similar, all rich in valuable gold such as Cu, Sn, Pb
Belong to, can be recycled by way of pyrometallurgy, realizes metal resource circulation.For the ferromagnetism object obtained by magnetic separation process
Matter is enriched with body (mainly containing Fe), can be used as steelmaking feed.For the tailing that separation by shaking table generates, wherein main metallic element is
Cu, there are also a small amount of Sn, Pb, remaining major part be it is nonmetallic, can be by hydrometallurgical mode by the valuable gold in tailing
Belong to recycling, realizes metal resource circulation.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent replacements and improvementsmade within the spirit and principles of the invention, etc. should all include
Within protection scope of the present invention.
Claims (10)
1. a kind of technique that mechanical approach processing waste printed circuit board prepares copper alloy powder, which comprises the following steps:
(1) initial physical sorting will be carried out after the broken pretreatment of waste printed circuit board, obtains ferrous metal enrichment body；
(2) it after further crushing the obtained ferrous metal enrichment body of step (1), sieves to obtain greater than 200 purposes with sieve
Coarse granular material；
(3) the obtained coarse granular material for being greater than 200 mesh of step (2) is used into separation by shaking table, removes nonmetallic, raising metal
It is enriched with the content of metal in body, obtains metal concentrate；
(4) the obtained metal concentrate of step (3) is subjected to ball-milling treatment, will wherein remaining nonmetallic levigate rear screening gone
It removes, further purifies metals and be enriched with body, obtain copper alloy corase meal；
(5) the obtained copper alloy corase meal of step (4) is subjected to high-energy ball milling, obtains fine grain copper alloy powder；
(6) the obtained fine grain copper alloy powder of step (5) is subjected to atmosphere reduction, obtains can be directly used for powder metallurgy
Copper alloy powder.
2. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In using crusher by wiring board break process to 5 mm hereinafter, the physical separation is pneumatic separation in step (1).
3. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In step (1) obtained ferrous metal enrichment body is crushed to 0.5 mm or less using beater grinder in step (2).
4. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In ball milling described in step (4) uses planetary ball mill, and ball milling is carried out in a manner of wet-milling.
5. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In ball milling solvent is water or hexamethylene in step (4), and the ratio of the volume and metal enrichment weight of water or hexamethylene is 0.2 ~ 2
ml/g。
6. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In, in step (4) rotational speed of ball-mill be 300 ~ 500 r/min, Ball-milling Time be 2 ~ 10 h, ball material mass ratio control 15:1 ~
100:1。
7. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In high-energy ball milling described in step (5) uses planetary high-energy ball mill, and rotational speed of ball-mill is 300 ~ 500 r/min, Ball-milling Time
For 6 ~ 20 h, ball-material mass ratio is 15:1 ~ 100:1.
8. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In process control agent is water or hexamethylene in step (5), and the volume of process control agent and the mass ratio of copper alloy corase meal are
0.2~2 ml/g。
9. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In fine grain copper alloy powder is restored in hydrogen atmosphere in step (6).
10. mechanical approach processing waste printed circuit board according to claim 1 prepares the technique of copper alloy powder, feature exists
In the mass fraction of iron content is greater than 5 wt.% in the obtained ferrous metal enrichment body of step (1), is carrying out at step (2)
Body is enriched with to ferrous metal before reason and carry out magnetic separation separation, respectively obtain non-ferrous metal enrichment body and ferromagnetic metal enrichment body,
Then non-ferrous metal enrichment body is carried out after further crushing, is sieved to obtain the coarse granular material greater than 200 mesh with sieve.
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| CN113005296A (en) * | 2021-03-05 | 2021-06-22 | 苏州鑫达资源再生利用有限公司 | Method for recovering copper in copper-clad circuit board |
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