CN110426309A - A method of measurement anti-solder ink solid content - Google Patents
A method of measurement anti-solder ink solid content Download PDFInfo
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- CN110426309A CN110426309A CN201910618494.2A CN201910618494A CN110426309A CN 110426309 A CN110426309 A CN 110426309A CN 201910618494 A CN201910618494 A CN 201910618494A CN 110426309 A CN110426309 A CN 110426309A
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- copper plate
- naked copper
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- solid content
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N5/00—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid
- G01N5/04—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by removing a component, e.g. by evaporation, and weighing the remainder
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A method of measurement anti-solder ink solid content, comprising the following steps: toasted 1 hour at a temperature of naked copper plate is placed on 140-160 DEG C；It is weighed after cooling using electronic balance, obtains W1；Anti-solder ink is required to mix according to the proportion, is stirred evenly using blender；One layer of anti-solder ink is stamped on naked copper plate using silk screen；The naked copper plate of printed ink is weighed using electronic balance, obtains W2；The naked copper plate of printed ink is put into oven, 140-160 DEG C at a temperature of toast 1 hour；It is weighed after cooling using electronic balance, obtains W3；Continue naked copper plate after cooling to be put into oven, 140-160 DEG C at a temperature of toast 30 minutes, take out weighing again after cooling, obtain W4；It repeats previous step and obtains W5, relatively more continuous weighing data three times is consistent；The solid content P of wax tailings is then calculated according to formula.Detection can be completed using the existing equipment of production scene in the present invention, easy to operate, measurement result is accurate, can quickly detect the solid content of anti-solder ink.
Description
Technical field
The present invention relates to wiring board manufacture field, in particular to a kind of method for measuring anti-solder ink solid content.
Background technique
In assist side manufacturing process, anti-welding process be it is essential, purposes is as follows:
1) it prevents because of moisture between conductor line, the different degrees of short circuit that chemicals etc. is led to；
2) it prevents during production and assembling element because of open circuit caused by operating；
3) tin sticky of conductor part position is prevented；
4) make printed board route and various temperature and humidity, acid-base environment insulation, to guarantee the good electrical of printed wiring board
Function.
Most important raw material are anti-solder inks in anti-welding production process, therefore anti-solder ink quality has PCB quality
Conclusive influence, it can be seen that, the supplied materials quality restriction of anti-solder ink just seems most important.
Anti-solder ink solid content is an important performance indexes of ink, and the height of solid content determines anti-solder ink not
The purposes of same domain, if rabbet ink must have high solid content, and surface ink does not need high solid content then, therefore for anti-
For solder paste ink Incoming Quality Control, the solid content of anti-solder ink must be monitored, and avoid occurring supplied materials problem due to anti-solder ink
Lead to the quality problem of PCB batch, however the equipment price of the detection of the existing solid content for anti-solder ink is expensive and operates
It is complicated.
Summary of the invention
The technical problem to be solved by the present invention is to overcome drawbacks described above of the existing technology, provide a kind of simple, fast
The method of measurement anti-solder ink solid content that is prompt, not needing increase relevant device.
The technical solution adopted by the present invention to solve the technical problems is, a method of measurement anti-solder ink solid content,
The following steps are included:
(a) naked copper plate is put into oven, is toasted 1 hour at a temperature of 140-160 DEG C；
(b) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W1；
(c) anti-solder ink is required to mix according to the proportion, is stirred evenly using blender；
(d) one layer of anti-solder ink is stamped on the naked copper plate for weighing up weight using silk screen；
(e) the naked copper plate of printed ink is weighed using electronic balance, obtains weight W2；
(f) the naked copper plate of printed ink is put into oven, is toasted 1 hour at a temperature of 140-160 DEG C；
(g) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W3,
(h) continue naked copper plate after cooling to be put into oven, 140-160 DEG C at a temperature of toast 30 minutes, after cooling
It is multiple to take out weighing, obtain weight W4；
(i) it repeats step (h) and obtains weight W5, comparing W3, W4, W5, whether data are consistent three times；
(j) naked copper plate is not up to constant weight and then continues repeatedly step (i) to obtain weight Wn, until reaching constant weight, i.e. Wn-2=
Wn-1=Wn(n≥5)；
(k) the solid content P of wax tailings is calculated according to formula (1)；
In formula (1):
The numerical value of P is percentage, and W1 is the quality of naked copper plate after being dried, unit g；W2 is to be imprinted on naked copper before drying
The gross mass of anti-solder ink and naked copper plate on plate, unit g；W3, W4, W5...Wn are that drying is imprinted on naked copper plate after the completion
Anti-solder ink and naked copper plate gross mass, unit g.
Preferably, the size of the naked copper plate is 10CM × 10CM.
Preferably, the mixing time that anti-solder ink mixes in the step (c) is not less than 15 minutes.
Preferably, diluent or organic solvent are not added when anti-solder ink stirs in the step (c).
Preferably, the precision of the electronic balance is 0.001g.
Preferably, the baking temperature of the step (a), step (f) and step (h) is 150 DEG C.
Compared with prior art, the beneficial effects of the present invention are:
1, detection can be completed using the existing equipment of production scene in the present invention, is not required to increase relevant device, can save life
Produce cost；
2, operation of the present invention is simple, measurement result is accurate, can quickly detect the solid content of anti-solder ink, effectively monitor
The supplied materials quality of anti-solder ink.
Detailed description of the invention
Attached drawing be for provide it is of the invention further understand, and part of specification is constituted, with following specific reality
It applies mode to be used to explain the present invention together, but should not be construed as limiting the invention.
Fig. 1 is the flow diagram of a wherein embodiment of the invention.
Specific embodiment
Below in conjunction with drawings and examples, the present invention will be further described.
Embodiment 1
Referring to Fig. 1, the present embodiment the following steps are included:
(a) naked copper plate is put into oven, is toasted 1 hour at a temperature of 140 DEG C；
(b) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W1；
(c) anti-solder ink is required to mix according to the proportion, is stirred evenly using blender；
(d) one layer of anti-solder ink is stamped on the naked copper plate for weighing up weight using silk screen；
(e) the naked copper plate of printed ink is weighed using electronic balance, obtains weight W2；
(f) the naked copper plate of printed ink is put into oven, is toasted 1 hour at a temperature of 140 DEG C；
(g) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W3,
(h) continue naked copper plate after cooling to be put into oven, 140 DEG C at a temperature of toast 30 minutes, taken again after cooling
It weighs out, obtains weight W4；
(i) it repeats step (h) and obtains weight W5, comparing W3, W4, W5, whether data are consistent three times；
(j) naked copper plate is not up to constant weight and then continues repeatedly step (i) to obtain weight Wn, until reaching constant weight, i.e. Wn-2=
Wn-1=Wn(n≥5)；
(k) the solid content P of wax tailings is calculated according to formula (1)；
In formula (1):
The numerical value of P is percentage, and W1 is the quality of naked copper plate after being dried, unit g；W2 is to be imprinted on naked copper before drying
The gross mass of anti-solder ink and naked copper plate on plate, unit g；W3, W4, W5...Wn are that drying is imprinted on naked copper plate after the completion
Anti-solder ink and naked copper plate gross mass, unit g.
Naked copper plate is the microetch piece for detecting microetch amount, having a size of 10CM × 10CM.
The mixing time that anti-solder ink mixes in step (c) is not less than 15 minutes.
Diluent or organic solvent are not added when anti-solder ink stirs in step (c).
The precision of electronic balance is 0.001g.
Embodiment 2
Referring to Fig. 1, the present embodiment the following steps are included:
(a) naked copper plate is put into oven, is toasted 1 hour at a temperature of 160 DEG C；
(b) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W1；
(c) anti-solder ink is required to mix according to the proportion, is stirred evenly using blender；
(d) one layer of anti-solder ink is stamped on the naked copper plate for weighing up weight using silk screen；
(e) the naked copper plate of printed ink is weighed using electronic balance, obtains weight W2；
(f) the naked copper plate of printed ink is put into oven, is toasted 1 hour at a temperature of 160 DEG C；
(g) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W3,
(h) continue naked copper plate after cooling to be put into oven, 160 DEG C at a temperature of toast 30 minutes, taken again after cooling
It weighs out, obtains weight W4；
(i) it repeats step (h) and obtains weight W5, comparing W3, W4, W5, whether data are consistent three times；
(j) naked copper plate is not up to constant weight and then continues repeatedly step (i) to obtain weight Wn, until reaching constant weight, i.e. Wn-2=
Wn-1=Wn(n≥5)；
(k) the solid content P of wax tailings is calculated according to formula (1)；
In formula (1):
The numerical value of P is percentage, and W1 is the quality of naked copper plate after being dried, unit g；W2 is to be imprinted on naked copper before drying
The gross mass of anti-solder ink and naked copper plate on plate, unit g；W3, W4, W5...Wn are that drying is imprinted on naked copper plate after the completion
Anti-solder ink and naked copper plate gross mass, unit g.
Naked copper plate is the microetch piece for detecting microetch amount, having a size of 10CM × 10CM.
The mixing time that anti-solder ink mixes in step (c) is not less than 15 minutes.
Diluent or organic solvent are not added when anti-solder ink stirs in step (c).
The precision of electronic balance is 0.001g.
Embodiment 3
Referring to Fig. 1, the present embodiment the following steps are included:
(a) naked copper plate is put into oven, is toasted 1 hour at a temperature of 150 DEG C；
(b) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W1；
(c) anti-solder ink is required to mix according to the proportion, is stirred evenly using blender；
(d) one layer of anti-solder ink is stamped on the naked copper plate for weighing up weight using silk screen；
(e) the naked copper plate of printed ink is weighed using electronic balance, obtains weight W2；
(f) the naked copper plate of printed ink is put into oven, is toasted 1 hour at a temperature of 150 DEG C；
(g) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W3,
(h) continue naked copper plate after cooling to be put into oven, 150 DEG C at a temperature of toast 30 minutes, taken again after cooling
It weighs out, obtains weight W4；
(i) it repeats step (h) and obtains weight W5, comparing W3, W4, W5, whether data are consistent three times；
(j) naked copper plate is not up to constant weight and then continues repeatedly step (i) to obtain weight Wn, until reaching constant weight, i.e. Wn-2=
Wn-1=Wn(n≥5)；
(k) the solid content P of wax tailings is calculated according to formula (1)；
In formula (1):
The numerical value of P is percentage, and W1 is the quality of naked copper plate after being dried, unit g；W2 is to be imprinted on naked copper before drying
The gross mass of anti-solder ink and naked copper plate on plate, unit g；W3, W4, W5...Wn are that drying is imprinted on naked copper plate after the completion
Anti-solder ink and naked copper plate gross mass, unit g.
Naked copper plate is the microetch piece for detecting microetch amount, having a size of 10CM × 10CM.
The mixing time that anti-solder ink mixes in step (c) is not less than 15 minutes.
Diluent or organic solvent are not added when anti-solder ink stirs in step (c).
The precision of electronic balance is 0.001g.
The above examples are only used to illustrate the technical scheme of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (6)
1. a kind of method for measuring anti-solder ink solid content, which comprises the following steps:
(a) naked copper plate is put into oven, is toasted 1 hour at a temperature of 140-160 DEG C；
(b) it after the completion of toasting after naked copper plate is cooling, is weighed using electronic balance, obtains weight W1；
(c) anti-solder ink is required to mix according to the proportion, is stirred evenly using blender；
(d) silk screen is used, one layer of anti-solder ink is stamped on the naked copper plate for weighing up weight；
(e) the naked copper plate of printed ink is weighed using electronic balance, obtains weight W2；
(f) the naked copper plate of printed ink is put into oven, is toasted 1 hour at a temperature of 140-160 DEG C；
(g) it is weighed after naked copper plate is cooling using electronic balance after the completion of toasting, obtains weight W3,
(h) continue naked copper plate after cooling to be put into oven, 140-160 DEG C at a temperature of toast 30 minutes, taken again after cooling
It weighs out, obtains weight W4；
(i) it repeats step (h) and obtains weight W5, comparing W3, W4, W5, whether data are consistent three times；
(j) naked copper plate is not up to constant weight and then continues repeatedly step (i) to obtain weight Wn, until reaching constant weight, i.e. Wn-2=Wn-1=Wn
(n≥5)；
(k) the solid content P of wax tailings is calculated according to formula (1)；
In formula (1):
The numerical value of P is percentage, and W1 is the quality of naked copper plate after being dried, unit g；W2 is to be imprinted on naked copper plate before drying
Anti-solder ink and naked copper plate gross mass, unit g；W3, W4, W5...Wn are that dry be imprinted on naked copper plate after the completion is prevented
The gross mass of solder paste ink and naked copper plate, unit g.
2. the method for measurement anti-solder ink solid content according to claim 1, it is characterised in that: the size of the naked copper plate
For 10CM × 10CM.
3. the method for measurement anti-solder ink solid content according to claim 1, it is characterised in that: in the step (c), prevent
The mixing time of solder paste ink mixing is not less than 15 minutes.
4. the method for measurement anti-solder ink solid content according to claim 3, it is characterised in that: in the step (c), prevent
Solder paste ink does not add diluent or organic solvent when stirring.
5. the method for measurement anti-solder ink solid content according to claim 1, it is characterised in that: the essence of the electronic balance
Degree is 0.0001g.
6. the method for measurement anti-solder ink solid content according to claim 1, it is characterised in that: the step (a), step
(f) and the baking temperature of step (h) is 150 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910618494.2A CN110426309A (en) | 2019-07-10 | 2019-07-10 | A method of measurement anti-solder ink solid content |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910618494.2A CN110426309A (en) | 2019-07-10 | 2019-07-10 | A method of measurement anti-solder ink solid content |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910618494.2A Pending CN110426309A (en) | 2019-07-10 | 2019-07-10 | A method of measurement anti-solder ink solid content |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4753889A (en) * | 1982-11-29 | 1988-06-28 | Cem Corporation | Analytical method for determining volatiles, solids and solvent extractables |
| CN102162782A (en) * | 2010-12-29 | 2011-08-24 | 天津东洋油墨有限公司 | Method for measuring lamina decrement difference value of content of paste-like ink volatile organic compound |
| CN102883546A (en) * | 2012-09-19 | 2013-01-16 | 胜宏科技（惠州）股份有限公司 | Thick copper plate solder resistance process |
| CN105136604A (en) * | 2015-09-09 | 2015-12-09 | 安徽江淮汽车股份有限公司 | Detection method for oil removal rate of degreasant |
-
2019
- 2019-07-10 CN CN201910618494.2A patent/CN110426309A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4753889A (en) * | 1982-11-29 | 1988-06-28 | Cem Corporation | Analytical method for determining volatiles, solids and solvent extractables |
| CN102162782A (en) * | 2010-12-29 | 2011-08-24 | 天津东洋油墨有限公司 | Method for measuring lamina decrement difference value of content of paste-like ink volatile organic compound |
| CN102883546A (en) * | 2012-09-19 | 2013-01-16 | 胜宏科技（惠州）股份有限公司 | Thick copper plate solder resistance process |
| CN105136604A (en) * | 2015-09-09 | 2015-12-09 | 安徽江淮汽车股份有限公司 | Detection method for oil removal rate of degreasant |
Non-Patent Citations (1)
| Title |
|---|
| 颜进华: "《造纸化学品》", 31 August 2015, 华南理工大学出版社 * |
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Application publication date: 20191108 |