CN110418227B - Microphone assembly mounting device and novel microphone assembly - Google Patents
Microphone assembly mounting device and novel microphone assembly Download PDFInfo
- Publication number
- CN110418227B CN110418227B CN201910611046.XA CN201910611046A CN110418227B CN 110418227 B CN110418227 B CN 110418227B CN 201910611046 A CN201910611046 A CN 201910611046A CN 110418227 B CN110418227 B CN 110418227B
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- Prior art keywords
- microphone assembly
- opening
- bottom die
- horn
- electrode plate
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- 239000000463 material Substances 0.000 claims description 6
- 239000007779 soft material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013016 damping Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The embodiment of the invention discloses a mounting device of a microphone assembly, which is applied to the technical field of microphones and comprises a bottom die for limiting a back electrode plate in the microphone assembly to a preset distance from an opening of a ring cavity in the microphone assembly, wherein the bottom die is embedded into the opening, the upper surface of the bottom die is higher than the preset distance of the opening, the back electrode plate is embedded into a cavity of the ring cavity, and the lower surface of the back electrode plate is contacted with the upper surface of the bottom die. The embodiment of the invention also discloses a novel microphone assembly, and the mounting device and the novel microphone assembly of the sensor assembly can improve the yield of microphone assembly.
Description
Technical Field
The invention belongs to the technical field of microphones, and particularly relates to a mounting device of a microphone assembly and a novel microphone.
Background
The microphone is an energy conversion device for converting sound signals into electric signals, and in the automatic assembly process of the microphone, a back electrode plate is embedded into a cavity, and the back electrode plate is required to be embedded and pressed to the lower end plane of a plastic cavity.
However, due to the plastic processing characteristics, the two ends of the annular cavity are slightly horn-shaped in practice, the back electrode plate is just positioned at the horn-shaped position after being embedded into the bottom of the plastic cavity, the back electrode plate is in loose fit with the plastic cavity instead of tight fit, and the back electrode plate falls off from the cavity under the vibration action of an automatic production line, so that defective products are formed, and the qualified rate of products is reduced.
Disclosure of Invention
The invention provides a mounting device of a microphone assembly and a novel microphone assembly, and aims to solve the problem that defective products generated by falling of a back electrode plate from a cavity under the action of vibration in the mounting process are high.
An embodiment of the present invention provides a mounting device for a microphone assembly including a backplate and an annular cavity having an opening, the mounting device including: a bottom die limiting the back plate at a preset distance from the opening;
the bottom die is embedded into the opening, and the upper surface of the bottom die is higher than the preset distance of the opening;
The back electrode plate is embedded in the cavity of the annular cavity, and the lower surface of the back electrode plate is contacted with the upper surface of the bottom die.
Further, the opening is a horn-shaped opening;
the bottom die comprises an embedded part, the shape of the embedded part is matched with that of the horn-shaped opening, and the embedded part is fixedly embedded at the horn-shaped opening;
The upper surface of the embedded part is a plane, or the upper surface of the embedded part is two planes, and the two planes are respectively positioned at two inner sides of the horn-shaped opening.
Further, the embedded part is made of soft material and is fixed at the horn-shaped opening in a pressing mode.
Further, the embedded part is made of hard materials and is adhered and fixed at the horn-shaped opening.
Further, the bottom die further comprises a bottom, the bottom comprises two extending parts which extend out of the embedded part, and the upper surfaces of the extending parts are in contact with the bottom surface of the annular cavity.
Further, a first positioning device is arranged on the lower surface of the back electrode plate, a second positioning device is arranged on the upper surface of the bottom die, and the first positioning device and the second positioning device are mutually clamped.
Further, the first positioning device is a convex object, and the second positioning device is a groove; or the first positioning device is a groove, and the second positioning device is a convex object.
Further, the preset distance is 0.05 mm-0.15 mm.
The embodiment of the invention also provides a novel microphone assembly, which comprises: a ring cavity having an opening and a back plate restrained at a preset distance from the opening by a mounting device as described above, the back plate being a back plate larger than two holes;
further, the back electrode plate is a four-hole back electrode plate.
According to the embodiment of the invention, the bottom die is arranged, and the back electrode plate is arranged at a position which is away from the outlet of the annular cavity by a preset distance, so that the back electrode plate cannot fall off from the annular cavity due to vibration in assembly, the yield of assembly is improved, and the yield in the assembly process can reach 99.8%.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention.
FIG. 1 is a schematic cross-sectional view of a mounting device for a microphone assembly and a novel microphone assembly provided in an embodiment of the invention;
Fig. 2 is a schematic exploded view in cross section of a mounting device for a microphone assembly and a novel microphone assembly provided in an embodiment of the invention;
fig. 3 is a schematic structural view of a mounting device for a novel microphone assembly according to an embodiment of the present invention;
Fig. 4 is another structural schematic diagram of a novel microphone assembly mounting apparatus provided by an embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention will be clearly described in conjunction with the accompanying drawings, and it is apparent that the described embodiments are only some embodiments but not all embodiments of the present invention. All other embodiments, based on the embodiments of the invention, which a person skilled in the art would obtain without making any inventive effort, are within the scope of the invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a mounting device of a microphone assembly and a novel microphone assembly according to an embodiment of the present invention. The novel microphone assembly is part of a microphone, which may be specifically a microphone. The novel microphone assembly, along with other components, may be assembled into a microphone.
Referring to fig. 2, fig. 2 is an exploded view of the mounting device of the microphone assembly and the novel microphone assembly of fig. 1.
The novel microphone assembly includes a backplate 20 and a ring cavity 30. The ring cavity 30 has an opening 40.
The mounting means of the microphone assembly comprises a bottom mold 10 which limits the back plate 20 to a predetermined distance from the opening 40.
Wherein, the bottom die 10 is embedded into the opening 40, and the upper surface of the bottom die 10 is higher than the preset distance h of the opening 40. Specifically, the preset distance h may be 0.05mm to 0.15mm (millimeters), and preferably, the preset distance is 0.1mm.
The back plate 20 is embedded in the cavity of the annular cavity 30, and the lower surface of the back plate 20 is in contact with the upper surface of the bottom die 10.
The back plate 20 is embedded in the cavity by the embedding die 50 from top to bottom onto the upper plane of the bottom die 10, and due to the existence of the bottom die 10, the back plate 20 is fixed at the lower end of the annular cavity 30, and the distance from the opening 40 is 0.05 mm-0.15 mm, and at this time, the back plate 20 and the annular cavity 30 are in a close fit state. Vibration is generated in the assembly process, and the back electrode plate 20 cannot fall off from the opening 40 of the annular cavity 30, so that defective products are avoided.
Further, the back plate 20 is a back plate larger than two holes, such as a four hole back plate. The number of holes is large, so that damping generated during pressing can be reduced, the pressing accuracy is easier to control, and the back plate 20 is easier to press to a position with a distance of 0.05 mm-0.15 mm from the opening 40 at the lower end of the ring cavity 30.
The material of the ring cavity 30 may be a plastic material.
The opening 40 may be a straight nozzle or an opening having an inclined angle, such as a horn-shaped opening.
Further, referring to fig. 3, fig. 3 is a schematic structural view of the mounting device bottom die 10 in fig. 1 and 2. The bottom die 10 includes an insert portion 11 and a bottom portion 12. The shape of the insertion portion 11 is matched with the shape of the opening 40, and the insertion portion 11 may be inserted into the opening 40. The openings 40 in fig. 1 and 2 are horn-shaped openings, and may be other shapes, such as straight-tube openings. The shape of the embedded part 11 is matched with that of the horn-shaped opening 40, and the embedded part 11 is fixedly embedded at the horn-shaped opening 40. The bottom 12 comprises two extensions 13 extending outwardly from the insert 11, the upper surface of the extensions 13 being in contact with the bottom surface of the ring cavity 30.
The upper surface of the insertion portion 11 in the above-described figures is a plane. The upper surface of the insertion portion 11 may also be two flat surfaces, i.e., the insertion portion 11 is divided into two parts, which are respectively located at both inner sides of the horn-shaped opening 40, as shown in fig. 4. Compared with the embedded part of one plane, the embedded part of two planes has simpler structure and saves more materials.
Further, the embedded part 11 may be soft material and is fixed at the horn-shaped opening 40 in a pressing manner;
the embedded part 11 may be made of hard material, and may be adhered and fixed to the horn-shaped opening 40, and the adhesion may be removable adhesion, so that the embedded part 11 is easily peeled off.
Further, a first positioning device is arranged on the lower surface of the back plate 20, a second positioning device is arranged on the upper surface of the bottom die 10, and the first positioning device and the second positioning device are mutually clamped and used for assisting in contacting the back plate 20 with the bottom die 10 in place and improving the success rate of contacting the back plate 20 with the bottom die 10. The first positioning means may be provided at the center of the lower surface of the back plate 20 or may be provided at a non-center position. The second positioning device is matched with the first positioning device in position.
Specifically, the first positioning device is a convex object, and the second positioning device is a groove; or the first positioning device is a groove, and the second positioning device is a convex object. The convex object and the groove are mutually clamped.
The insert mold 50 is driven by a high precision insert press driven by a servo linear motor to push the back plate 20 downward. The bottom die 10 is a high-precision bottom die, and the high-precision bottom die adopts a laser processing technology. In this embodiment, the embedding precision and the bottom die precision of the back plate 20 are controlled within a tolerance range of 0.05mm, so that the high yield of microphone assembly is realized, and the quality and efficiency of the assembled microphone are improved.
Further, the back plate 20 is embedded and pressed to a position with a preset distance h from the opening 40, after the bottom die 10 is removed, the novel microphone assembly (namely the annular cavity 30 and the back plate 20 embedded in the annular cavity 30) is conveyed to the next assembly procedure through an automatic line vibration conveyor belt, the vibration conveyor belt vibrates, the back plate 20 can vibrate to the opening 40 but cannot fall out of the opening 40, the integral assembly of the microphone is completed at the next assembly procedure, and particularly, a copper ring, a diaphragm and PCB (Printed Circuit Board) plates are placed in the back plate 20 and the annular cavity 30 which are embedded into a whole, and the shell is packaged, so that the assembly is completed.
In the embodiment of the invention, the bottom die is arranged, and the back electrode plate is arranged at a position which is at a preset distance from the outlet of the annular cavity, so that the back electrode plate cannot fall off from the annular cavity due to vibration in assembly, the yield of assembly is improved, and the yield in the assembly process can reach 99.8%.
The embodiment of the invention also provides a novel microphone assembly, which comprises a ring cavity with an opening and a back electrode plate which is limited at a preset distance from the opening of the ring cavity through the installation device, wherein the back electrode plate is a back electrode plate with more than two holes, and in particular, the back electrode plate is a four-hole back electrode plate.
The novel microphone assembly in the embodiment adopts the back electrode plate with more than two holes, so that damping generated during pressing in can be reduced, the pressing-in precision is easier to control, and the back electrode plate is easier to push and press to the position of the lower end of the annular cavity, which is away from the preset distance of the opening. When the back plate is assembled, the bottom die is arranged, and the back plate is arranged at a position which is away from the outlet of the annular cavity by a preset distance, so that the back plate cannot fall off from the annular cavity due to vibration in assembly, the yield of assembly is improved, and the yield in the assembly process can reach 99.8%. And the novel microphone assembly has the advantages of simple and reliable process structure, good stability, improved frequency response, sensitivity and uniformity of acoustic indexes, simple manufacturing process and low cost, and is suitable for mass production.
The foregoing description of the mounting device for a microphone assembly and the novel microphone assembly provided by the present invention will be presented to those skilled in the art in view of the foregoing description of the embodiments of the present invention, and the scope of the embodiments and applications of the present invention should not be interpreted as limiting the invention.
Claims (9)
1. A mounting apparatus for a microphone assembly, the microphone assembly including a backplate and a ring cavity having an opening, the mounting apparatus comprising: a bottom die limiting the back plate at a preset distance from the opening; the annular cavity is made of plastic;
the bottom die is embedded into the opening, and the upper surface of the bottom die is higher than the preset distance of the opening;
The back electrode plate is embedded in the cavity of the annular cavity, and the lower surface of the back electrode plate is contacted with the upper surface of the bottom die; the opening is a horn-shaped opening; the bottom die comprises an embedded part, the shape of the embedded part is matched with that of the horn-shaped opening, and the embedded part is fixedly embedded at the horn-shaped opening; the bottom die further comprises a bottom, the bottom comprises two extending parts which extend out of the embedded part, and the upper surfaces of the extending parts are in contact with the bottom surface of the annular cavity.
2. The mounting apparatus for a microphone assembly of claim 1 wherein,
The upper surface of the embedded part is a plane, or the upper surface of the embedded part is two planes, and the two planes are respectively positioned at two inner sides of the horn-shaped opening.
3. The mounting device for a microphone assembly according to claim 2, wherein the insert portion is made of soft material, and the insert portion is press-fixed to the horn-shaped opening.
4. A mounting arrangement for a microphone assembly as defined in claim 3, wherein the insert is of a rigid material and is adhesively secured to the horn opening.
5. The mounting device for a microphone assembly according to claim 1, wherein a first positioning device is provided on a lower surface of the back plate, a second positioning device is provided on an upper surface of the bottom die, and the first positioning device and the second positioning device are engaged with each other.
6. The mounting arrangement for a microphone assembly of claim 5 wherein the first positioning arrangement is a projection and the second positioning arrangement is a recess;
or the first positioning device is a groove, and the second positioning device is a convex object.
7. The mounting device for a microphone assembly of claim 6 wherein the predetermined distance is 0.05mm to 0.15mm.
8. A novel microphone assembly comprising an annular cavity having an opening and a backplate limited at a predetermined distance from the opening by a mounting device as claimed in any one of claims 1 to 7;
the back electrode plate is a back electrode plate with more than two holes.
9. The novel microphone assembly of claim 8 wherein the backplate is a four-hole backplate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910611046.XA CN110418227B (en) | 2019-07-08 | 2019-07-08 | Microphone assembly mounting device and novel microphone assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910611046.XA CN110418227B (en) | 2019-07-08 | 2019-07-08 | Microphone assembly mounting device and novel microphone assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110418227A CN110418227A (en) | 2019-11-05 |
| CN110418227B true CN110418227B (en) | 2024-06-25 |
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ID=68360641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910611046.XA Active CN110418227B (en) | 2019-07-08 | 2019-07-08 | Microphone assembly mounting device and novel microphone assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110418227B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210381236U (en) * | 2019-07-08 | 2020-04-21 | 东莞市乐友电声科技有限公司 | Mounting device for microphone assembly and novel microphone assembly |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145997A (en) * | 1991-11-20 | 1993-06-11 | Ono Sokki Co Ltd | Condenser microphone |
| CN1794884A (en) * | 2005-12-14 | 2006-06-28 | 潍坊歌尔电子有限公司 | Miniature electret capacitor microphone |
| KR20090113210A (en) * | 2008-04-25 | 2009-10-29 | 호시덴 가부시기가이샤 | Electret condenser microphone |
| CN201616904U (en) * | 2010-01-27 | 2010-10-27 | 潍坊新港电子有限公司 | Electret microphone |
| CN202103844U (en) * | 2011-06-14 | 2012-01-04 | 昌邑佳声电子有限公司 | Electret condenser microphone |
| CN205051874U (en) * | 2015-11-03 | 2016-02-24 | 北京卓锐微技术有限公司 | MEMS (Micro -electromechanical system) microphone |
-
2019
- 2019-07-08 CN CN201910611046.XA patent/CN110418227B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210381236U (en) * | 2019-07-08 | 2020-04-21 | 东莞市乐友电声科技有限公司 | Mounting device for microphone assembly and novel microphone assembly |
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| Publication number | Publication date |
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| CN110418227A (en) | 2019-11-05 |
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