CN110418225A - A kind of microphone apparatus - Google Patents

A kind of microphone apparatus Download PDF

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Publication number
CN110418225A
CN110418225A CN201810388306.7A CN201810388306A CN110418225A CN 110418225 A CN110418225 A CN 110418225A CN 201810388306 A CN201810388306 A CN 201810388306A CN 110418225 A CN110418225 A CN 110418225A
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CN
China
Prior art keywords
microphone
vibrating sensor
vibration
signal
vibration signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CN201810388306.7A
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Chinese (zh)
Inventor
张磊
廖风云
齐心
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Shenzhen Voxtech Co Ltd
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Shenzhen Voxtech Co Ltd
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Application filed by Shenzhen Voxtech Co Ltd filed Critical Shenzhen Voxtech Co Ltd
Priority to CN201810388306.7A priority Critical patent/CN110418225A/en
Publication of CN110418225A publication Critical patent/CN110418225A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2430/00—Signal processing covered by H04R, not provided for in its groups

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)

Abstract

This application provides a kind of microphone apparatus, which includes microphone and vibrating sensor, wherein the microphone is for receiving the first signal, first signal includes voice signal and the first vibration signal；The vibrating sensor is for receiving the second vibration signal；And the microphone and the vibrating sensor are configured as first vibration signal and can offset with second vibration signal.

Description

A kind of microphone apparatus
Technical field
This application involves a kind of device and methods for removing earphone noise more particularly to a kind of utilization dual microphone to remove ear The device and method of vibration noise in machine.
Background technique
Due to the open ears of bone conduction earphone, allow wearer that can hear the sound of surrounding, make its on the market increasingly by It welcomes.And as the scene used becomes complicated, the communication effect in communication is required higher and higher.In communication process, The vibration of bone conduction earphone shell can be picked up by microphone, thus echogenicity or other interference in communication process.Some It is integrated in the earphone of Bluetooth chip, can integrate multiple signal processing methods on Bluetooth chip, such as: wind resistance is made an uproar, echo disappears It removes, dual microphone noise reduction etc..But compared to common conductance bluetooth headset, the signal that bone conduction earphone receives is more complicated, leads to It crosses signal processing method and realizes that noise reduction is more difficult, it may appear that lose that word/reverberation is serious, phenomena such as explosion sound occurs, seriously affect Communication effect.In some cases, it to guarantee communication effect, needs that shock-damping structure is arranged in earphone.But due to the earphone scale of construction Limitation, the volume of shock-damping structure is also restrained.
Summary of the invention
According to the one side of the application, a kind of microphone apparatus is provided, the microphone apparatus includes microphone and vibration Dynamic sensor.Wherein, the microphone includes voice signal and the first vibration letter for receiving the first signal, first signal Number；The vibrating sensor is for receiving the second vibration signal；And the microphone and the vibrating sensor are configured as First vibration signal can be offseted with second vibration signal.
In some embodiments, the cavity volume of the vibrating sensor is configured such that the vibrating sensor to The amplitude-frequency response of two vibration signals is identical as amplitude-frequency response of the microphone to the first vibration signal, and/or makes the vibration Dynamic sensor is identical as phase-frequency response of the microphone to the first vibration signal to the phase-frequency response of the second vibration signal.
In some embodiments, the cavity volume of the vibrating sensor is proportional to the cavity volume of the microphone, So that second vibration signal can be offseted with first vibration signal.
In some embodiments, the cavity volume of the cavity volume of the vibrating sensor and microphone ratio is 3:1 To between 6.5:1.
In some embodiments, the microphone apparatus further comprises signal processing unit.The signal processing unit It is configured as offseting first vibration signal with second vibration signal and exports the voice signal.
In some embodiments, the vibrating sensor is that closing microphone or duplex lead to microphone.
In some embodiments, the microphone is ante-chamber aperture or back cavity aperture, and the vibrating sensor is closing wheat Gram wind, the closing microphone are that ante-chamber and back cavity are all closed.
In some embodiments, the microphone is that ante-chamber or back cavity aperture and the vibrating sensor are logical for duplex Microphone, it is ante-chamber and the equal aperture of back cavity that the duplex, which leads to microphone,.
In some embodiments, there are at least one for the microphone ante-chamber aperture is the ante-chamber top or side wall Aperture.
In some embodiments, the microphone and the vibrating sensor have independent connections to the same shell mechanism.
In some embodiments, described device further comprises vibration unit.The vibration unit is located at least partially In the shell, the vibration unit is configured as generating first vibration signal and second vibration signal.Wherein, institute It states microphone and the vibrating sensor is located at position adjacent on the shell or is located on the shell relative to described The symmetrical position of vibration unit.
In some embodiments, the connection type of the microphone or the vibrating sensor and the shell is cantilever company Connect, surrounding edge connection or substrate connection one of.
In some embodiments, the microphone and the vibrating sensor are MEMS microphones.
According to the another aspect of the application, a kind of earphone system is provided, the earphone system includes vibrating speaker, wheat Gram wind apparatus and shell.Wherein the vibrating speaker and the microphone apparatus are located within the shell, the microphone Device includes microphone and vibrating sensor.Wherein for the microphone for receiving the first signal, first signal includes language Sound signal and the first vibration signal；The vibrating sensor is for receiving the second vibration signal, first vibration signal and institute It states the second vibration signal and generation is vibrated by the vibrating speaker；And the microphone and the vibrating sensor are configured as First vibration signal can be offseted with second vibration signal.
Compared with prior art, the beneficial effect performance of the application is as follows:
In such a way that structure design and algorithm combine, the effect for removing vibration noise in earphone is more preferable；
Using special designing vibrating sensor (for example, bone-conduction microphone, closing microphone or duplex lead to microphone), The conductance voice signal in earphone can be effectively shielded, to only pick up vibration and noise signals；
It is designed by structure, so that vibrating sensor is (for example, bone-conduction microphone, closing microphone or duplex lead to Mike Wind) it is consistent to the amplitude-frequency response of vibration and noise signals and/or phase-frequency response with air conduction microphone, reach preferably denoising effect.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to required use in embodiment description Attached drawing be briefly described.It should be evident that the drawings in the following description are only some examples of the present application, for this It, without creative efforts, can also be according to these attached drawings by the application for the those of ordinary skill in field Applied to other similar scenes.Unless explaining obviously or separately from language environment, identical label represents identical knot in figure Structure and operation.
Fig. 1 is a kind of dual microphone Headphone structure schematic diagram according to shown in some embodiments of the present application；
Fig. 2-A to 2-C is that the signal processing method of the removal vibration noise according to shown in some embodiments of the present application shows It is intended to；
Fig. 3 is a kind of structural schematic diagram of earphone outer covering according to shown in some embodiments of the present application；
Fig. 4-A and 4-B is the different positions that the microphone according to shown in some embodiments of the present application is set to earphone outer covering Amplitude-frequency response and phase-frequency response curve when setting；
Fig. 5 is showing for a kind of microphone or vibrating sensor according to shown in some embodiments of the present application and cage connection It is intended to；
Fig. 6-A and 6-B is that microphone or vibrating sensor according to shown in some embodiments of the present application are different from shell Amplitude-frequency response and phase-frequency response curve when link position；
Fig. 7 is the signal of microphone or vibrating sensor according to shown in some embodiments of the present application and cage connection Figure；
Fig. 8-A and 8-B is that microphone or vibrating sensor according to shown in some embodiments of the present application are connected to shell Amplitude-frequency response and phase-frequency response curve when different location；
Fig. 9-A to 9-C is the structural representation of microphone and vibrating sensor according to shown in some embodiments of the present application Figure；
When Figure 10-A and 10-B is the vibrating sensor difference housing depth according to shown in some embodiments of the present application pair The amplitude-frequency response and phase-frequency response curve of vibration and noise signals；
Air conduction microphone when Figure 11-A and 11-B is the ante-chamber volume change according to shown in some embodiments of the present application Amplitude-frequency response and phase-frequency response curve；
Figure 12 is the corresponding amplitude-frequency response of microphone of the difference position of opening according to shown in some embodiments of the present application；
Conductance wheat when Figure 13 is ante-chamber volume change under the surrounding edge connection type according to shown in some embodiments of the present application The amplitude-frequency response of gram wind and totally-enclosed microphone to vibration；
Figure 14 is that the air conduction microphone according to some embodiments of the present application and two kinds of duplexs lead to microphone to air borne sound The amplitude-frequency response of sound signal；
Figure 15 is amplitude-frequency response of the vibrating sensor according to shown in some embodiments of the present application to vibration；
Figure 16 is a kind of structural schematic diagram of dual microphone earphone according to shown in some embodiments of the present application；
Figure 17 is a kind of schematic diagram of dual microphone modular construction embodiment according to shown in some embodiments of the present application；
Figure 18 is a kind of structural schematic diagram of dual microphone earphone according to shown in some embodiments of the present application；
Figure 19 is a kind of structural schematic diagram of dual microphone earphone according to shown in some embodiments of the present application；
Figure 20 is a kind of structural schematic diagram of dual microphone earphone according to shown in some embodiments of the present application；And
Figure 21 is a kind of structural schematic diagram of dual microphone earphone according to shown in some embodiments of the present application.
Specific embodiment
As shown in the specification and claims, unless context clearly prompts exceptional situation, " one ", "one", The words such as "an" and/or "the" not refer in particular to odd number, may also comprise plural number.Term " includes " only prompts to include bright with "comprising" Really mark the step of and element, and these steps and element do not constitute one it is exclusive enumerate, method or apparatus may also Include the steps that other or element.Term "based" is " being based at least partially on ".Term " one embodiment " expression " at least one A embodiment "；Term " another embodiment " expression " at least one other embodiment ".The related definition of other terms will be under It is provided in text description.
Flow chart used herein is used to illustrate operation performed by system according to an embodiment of the present application.It should Understand, before or operation below not necessarily accurately carry out in sequence.On the contrary, can be handled according to inverted order or simultaneously Various steps.It is also possible to during other operations are added to these, or remove a certain step from these processes or count step behaviour Make.
Fig. 1 is the structural schematic diagram of the earphone 100 according to shown in some embodiments of the present application.Earphone 100 may include Vibrating speaker 101, elastic construction 102, shell 103, the first connection structure 104, microphone 105,106 He of the second connection structure Vibrating sensor 107.
Vibrating speaker 101 can convert electrical signals to voice signal.The voice signal can pass through air transmitted Or the mode of osteoacusis passes to user.For example, vibrating speaker 101 can direct or through particular medium (for example, one A or multiple panels) head of user is contacted, and the voice signal is passed into listening for user in such a way that skull vibrates Feel nerve.
Shell 101 can be used to support and protect one or more components in earphone 100 (for example, vibrating speaker 101).Elastic construction 102 can connect vibrating speaker 101 and shell 103.In some embodiments, elastic construction 102 can be with Vibrating speaker 101 is fixed in shell 103 in sheet metal form, and is reduced in a manner of vibration damping by vibrating speaker 101 pass to the vibration of shell 103.
Microphone 105 can acquire the voice signal (for example, voice of user) in environment, and the voice signal is converted At electric signal.In some embodiments, microphone 105 is available via airborne sound (also referred to as " conductance Mike Wind ").
Vibrating sensor 107 can with collection machinery vibration signal (for example, by shell 103 vibration generate signal), and The mechanical oscillation signal is converted into electric signal.In some embodiments, vibrating sensor 107 can be sensitive to mechanical oscillation And to the insensitive device of conductance sound (that is, vibrating sensor 107 is more than vibrating sensor for the responding ability of mechanical oscillation 107 for conductance sound responding ability).Mechanical oscillation signal mentioned here refers mainly to the vibration propagated via solid.In In some embodiments, vibrating sensor 107 can be bone-conduction microphone.It in some embodiments, can be by changing conductance The configuration of microphone obtains vibrating sensor 107.This is detailed in about air conduction microphone is changed to obtain the content of vibrating sensor The content of other parts in application, for example, attached drawing 9-B and 9-C and its corresponding description.
Microphone 105 can be connected on shell 103 by the first connection structure 104.Vibrating sensor 107 can pass through Second connection structure 106 is connected on shell 103.First connection structure 104 and/or the second connection structure 106 can pass through phase Microphone 105 and vibrating sensor 107 are connected to the inside of shell 103 by same or different modes.About the first connection knot More contents of structure 104 and/or the second connection structure 106 are detailed in the content of other parts in the application, for example, attached drawing 5 and/or Attached drawing 7, and its corresponding description.
Due to the influence of other assemblies in earphone 100, microphone 105 can generate noise during the work time.As just Illustrate, the process description that microphone 105 generates noise is as follows.Vibrating speaker 101 generates vibration when being passed through electric signal.Vibration Vibration is passed to shell 103 by elastic construction 102 by loudspeaker 101.Since shell 103 and microphone 105 pass through connection knot Structure 104 is connected directly, and the vibration of shell 103 can cause vibration of membrane of shaking in microphone 105, to generate noise (also referred to as " vibration Moving noise " or " mechanical vibration noise ").
Vibration signal acquired in vibrating sensor 107 can be used for eliminating the vibration noise generated in microphone 105.In In some embodiments, the type of microphone 105 and/or vibrating sensor 107, microphone 105 and/or vibrating sensing can choose Device 107 is connected to the position of the inside of shell 103, the connection type of microphone 105 and/or vibrating sensor 107 and shell 103, So that amplitude-frequency response and/or phase-frequency response that microphone 105 is vibrated with 107 Duis of vibrating sensor reach consistent, to reach benefit The vibration signal acquired with vibrating sensor 107 eliminates the effect of the vibration noise generated in microphone 105.
It is only above specific example, the embodiment for being not considered as unique feasible to the description of Headphone structure. It, may be in the feelings without departing substantially from this principle after the basic principle for understanding earphone for one of skill in the art Under condition, various modifications and variations in form and details are carried out to the concrete mode for implementing earphone, but these modifications and variations Still within the scope of above description.For example, may include other more microphones or vibrating sensor in earphone 100, For eliminating the vibration noise of the generation of microphone 105.
Fig. 2-A is a kind of signal processing method that vibration noise is removed according to shown in some embodiments of the present application.In In some embodiments, the signal processing method includes making the received vibration noise of microphone by the way of Digital Signal Processing Signal and the received vibration signal of vibrating sensor offset.In some embodiments, the signal processing method includes using The mode of analog signal directly carries out cancellation operation to the signal using analog circuit.In some embodiments, the signal Processing method can be implemented by a signal processing unit in earphone.
As shown in Fig. 2-A, in signal processing circuit 210, A1It is a vibrating sensor (for example, vibrating sensor 107), B1For a microphone (for example, microphone 105).Vibrating sensor A1It can receive vibration signal, microphone B1It can be with Receive conductance voice signal and vibration and noise signals.Vibrating sensor A1The vibration signal and microphone B received1It receives Vibration and noise signals are probably derived from same vibration source (for example, vibrating speaker 101).Vibrating sensor A1Received vibration signal After a sef-adapting filter C with microphone B1Received vibration and noise signals superposition.Sef-adapting filter C can basis Stack result is adjusted (for example, adjusting the amplitude and/or phase of the vibration signal the received vibration signal of vibrating sensor A Position) so that vibrating sensor A1Received vibration signal and microphone B1Received vibration and noise signals offset, to realize The purpose that noise is eliminated.
In some embodiments, the parameter of sef-adapting filter C is fixed.For example, due to vibrating sensor A1And wheat Gram wind B1It is fixed, vibrating sensor A with factors such as the link position of earphone outer covering and connection types1With microphone B1To vibration Dynamic amplitude-frequency response and/or phase-frequency response can remain unchanged.Therefore, the parameter of sef-adapting filter C can be stored in after determination In one signal processing chip, and it is used directly in signal processing circuit 210.In some embodiments, adaptive-filtering The parameter of device C is variable.During carrying out noise elimination, sef-adapting filter C can be according to vibrating sensor A1With/ Or microphone B1Received signal adjusts its parameter, to achieve the purpose that noise is eliminated.
Fig. 2-B is a kind of signal processing method that vibration noise is removed according to shown in some embodiments of the present application.With Fig. 2-A different places are that the signal processing circuit 220 of Fig. 2-B uses a signal amplitude modulation element D and a signal phase modulation Element E replaces sef-adapting filter C.Vibrating sensor A2Received vibration signal, can be with wheat after amplitude modulation and phase modulation Gram wind B2Received vibration and noise signals offset, to achieve the purpose that noise is eliminated.In some embodiments, the signal Processing method can be implemented by a signal processing unit in earphone.In some embodiments, signal amplitude modulation element D or signal Phase-modulation element E is not all necessary.
Fig. 2-C is a kind of signal processing method that vibration noise is removed according to shown in some embodiments of the present application.No The signal processing circuit being same as in Fig. 2-A and 2-B is designed in Fig. 2-C by reasonable structure, and microphone B can be made3 The vibration and noise signals S2 and vibrating sensor A of acquisition3The vibration signal S1 received directly subtracts each other, to reach noise elimination Purpose.In some embodiments, the signal processing method can be implemented by a signal processing unit in earphone.
It is worth noting that the two paths of signals in Fig. 2-A, 2-B or 2-C is during the treatment, vibrating sensor is connect The signal of receipts and the additive process of microphone received signal can be understood as removing wheat based on vibrating sensor received signal Part relevant to vibration noise in gram wind received signal, to achieve the purpose that eliminate vibration noise.
The description eliminated above to noise is only specific example, the embodiment for being not considered as unique feasible. It, may be in the feelings without departing substantially from this principle after the basic principle for understanding earphone for one of skill in the art Under condition, carry out various modifications and variations in form and details to the concrete mode that noise is eliminated is implemented, but these amendments and Change still within the scope of above description.For example, for those skilled in the art, sef-adapting filter C, signal tune Width element D and signal phase-modulation element E, can be can be used for the element or circuitry instead of Signal Regulation by other, as long as institute It states and can achieve the vibration signal for adjusting vibrating sensor for the element or circuit of substitution, made an uproar with the vibration eliminated in microphone The purpose of acoustical signal.
As it was noted above, vibrating sensor and/or microphone to the amplitude-frequency response of vibration and/or phase-frequency response and its in ear Position on machine shell is related.It is connected to the position of shell by adjusting vibrating sensor and/or microphone, Mike can be made Wind and vibrating sensor are consistent the amplitude-frequency response of vibration and/or phase-frequency response substantially, utilize vibrating sensing to reach The vibration signal of device acquisition offsets the effect for the vibration noise that microphone generates.Fig. 3 is according to some embodiments of the present application institute A kind of structural schematic diagram of the earphone outer covering shown.As shown in figure 3, shell 300 is ring structure, shell 300 can be supported and be protected Vibrating speaker (for example, vibrating speaker 101) in earflap machine.Position 301, position 302, position 303 and position 304 are ear Optional four can place the position of microphone or vibrating sensor in machine shell 300.When microphone is connected with vibrating sensor In shell 300 when different positions, amplitude-frequency response and/or phase-frequency response to vibration also can be different.Wherein, position 301 It is adjacent with position 302.Position 303 and position 301 are located at the adjacent angle position of shell 300.Position 304 is with position 301 apart from farthest And it is located at the diagonal position of shell 300.
Fig. 4-A and 4-B is the different positions that the microphone according to shown in some embodiments of the present application is set to earphone outer covering Amplitude-frequency response when setting.As shown in Fig. 4-A, horizontal axis is vibration frequency, and the longitudinal axis is amplitude-frequency response of the microphone to vibration.Institute It states vibration to be generated by the vibrating speaker in earphone, and microphone is transmitted to by shell, connection structure etc..Wherein, curve P1, P2, P3 and P4 respectively indicate amplitude-frequency when microphone is located at position 301, position 302, position 303 and position 304 in shell 300 Response curve.As shown in Fig. 4-B, horizontal axis is vibration frequency, and the longitudinal axis is phase-frequency response of the microphone to vibration.Wherein, curve P1, P2, P3 and P4 respectively indicate phase-frequency response when microphone is located at position 301, position 302, position 303 and position 304 in shell Curve.
On the basis of position 301, it can be seen that amplitude-frequency response and phase-frequency response when microphone is located at position 302 Amplitude-frequency response and phase-frequency response curve when curve is located at position 301 to microphone is the most similar；Secondly, microphone is located at Amplitude-frequency response and phase when amplitude-frequency response and phase-frequency response curve when position 304 are located at position 301 with microphone Frequency response curve is more similar.In some embodiments, do not considering microphone and vibrating sensor structure and connection type etc. When other factors, microphone and vibrating sensor can be connected to earphone outer covering inside close position (for example, adjacent position Set) or earphone outer covering inside relative to the symmetrical position of vibrating speaker (for example, being located at earphone outer covering when vibrating speaker When center, microphone and vibrating sensor can be located at the diagonal position of earphone outer covering), then it can make microphone It is minimum with the amplitude-frequency response of vibrating sensor and/or the difference of phase-frequency response, to help preferably to eliminate in microphone Vibration noise.
Fig. 5 is the knot of a kind of microphone or vibrating sensor and cage connection according to shown in some embodiments of the present application Structure schematic diagram.For the convenience of description, be described below microphone and shell is connected to example.
As shown in figure 5, the side wall of microphone 503 is connected by connection structure 502 with the side wall of outer shell 501 of earphone, structure At the connection type of cantilever.Connection structure 502 can fix microphone 503 and side wall of outer shell 501 in a manner of silica gel sheath interference, Or microphone 503 and side wall of outer shell 501 are connected in such a way that glue (ebonite or flexible glue) is directly bonded.As shown, connection The central axis of structure 502 and the contact point 504 of side wall of outer shell 501 are defined as dispensing position.The dispensing position 504 is apart from wheat The distance of gram 503 bottom of wind is H1.503 pairs of the microphone amplitude-frequency responses vibrated and/or phase-frequency response can be with dispensing positions Change and changes.
Microphone when Fig. 6-A is the microphone according to shown in some embodiments of the present application and shell difference link position Amplitude-frequency response.Wherein, horizontal axis is vibration frequency, and the longitudinal axis is amplitude-frequency response of the microphone to the vibration of different frequency.It is described Vibration is generated by the vibrating speaker in earphone, and is transmitted to microphone by shell, connection structure etc..As shown, working as a little When the distance H1 of glue positional distance microphone bottom is 0.1mm, the peak value highest of microphone amplitude-frequency response；When H1 is 0.3mm, The peak value when peak value of microphone amplitude-frequency response lower than H1 is 0.1mm, and to high-frequency mobile；When H1 is 0.5mm, microphone width The peak value that frequency response is answered further declines, and further to high-frequency mobile；When H1 be 0.7mm when, microphone amplitude-frequency response peak value into One step declines and further to high-frequency mobile, and peak value almost falls to 0 at this time.It can be seen that microphone rings the amplitude-frequency of vibration It should can change with the variation of dispensing position.In practical applications, it can neatly be selected for dispensing glue according to actual demand Position, it is corresponding to the amplitude-frequency of vibration with the microphone for obtaining the condition that meets.
Microphone when Fig. 6-B is the microphone according to shown in some embodiments of the present application and shell difference link position Phase-frequency response curve.Wherein, horizontal axis is vibration frequency, and the longitudinal axis is phase-frequency response of the microphone to the vibration of different frequency.From figure It can be seen that the increase with dispensing position from microphone distance from bottom in 6-B, the vibration phase of microphone diaphragm also can be corresponding Variation, the position of SPA sudden phase anomalies can be to high-frequency mobile.It can be seen that microphone can be with dispensing position to the phase-frequency response of vibration Variation and change.In practical applications, position for dispensing glue can neatly be selected according to actual demand, to be met The microphone of condition is corresponding to the phase frequency of vibration.
For one of skill in the art, other than the mode that above-mentioned microphone is connect with side wall of outer shell, Microphone can also by other means or other positions and cage connection, for example, the bottom of microphone can on the inside of shell Bottom be connected (also referred to as " substrate connection ").
In addition, microphone can also be attached with shell by surrounding edge form.For example, Fig. 7 is one according to the application The structural schematic diagram that microphone and shell shown in a little embodiments are connected in the form of surrounding edge.As shown in Figure 7, microphone 703 At least two side walls are connect with shell 701 by connection structure 702 respectively, constitute the connection type of surrounding edge form.Connection structure 702 is similar with connection structure 502, and this will not be repeated here.As shown, contact of the central axis of connection structure 702 with shell Point 704 and 705 is dispensing position, and the distance of 703 bottom of dispensing positional distance microphone is H2.703 pairs of microphone vibrations Amplitude-frequency response and/or phase-frequency response can with the H2 of dispensing position change and change.
Fig. 8-A is that difference connects when microphone and shell according to shown in some embodiments of the present application are connected in the form of surrounding edge Connect the amplitude-frequency response of position.Wherein, horizontal axis is vibration frequency, and the longitudinal axis is that microphone rings the amplitude-frequency of the vibration of different frequency It answers.It can be seen that the increase with dispensing position from microphone distance from bottom, the peak of the amplitude-frequency response of microphone from Fig. 8-A Value becomes larger.It can be seen that microphone rings the amplitude-frequency of vibration in the case where microphone and shell are connected in the form of surrounding edge It should can change with the variation of dispensing position.In practical applications, it can neatly be selected for dispensing glue according to actual demand Position, it is corresponding to the amplitude-frequency of vibration with the microphone for obtaining the condition that meets.
Fig. 8-B is that difference connects when microphone and shell according to shown in some embodiments of the present application are connected in the form of surrounding edge Connect the phase-frequency response curve of position.Wherein, horizontal axis is vibration frequency, and the longitudinal axis is phase frequency response of the microphone to the vibration of different frequency It answers.It can be seen that the increase with dispensing position from microphone distance from bottom, the vibration vibration of membrane phase of microphone from Fig. 8-B Position can also change, and the position of SPA sudden phase anomalies can be to high-frequency mobile.It can be seen that being connected in the form of surrounding edge in microphone and shell In the case where connecing, microphone can change the phase-frequency response of vibration with the variation of dispensing position.It in practical applications, can be with According to actual demand, position for dispensing glue is neatly selected, it is corresponding to the phase frequency of vibration with the microphone for obtaining the condition that meets.
In some embodiments, in order to make vibrating sensor and microphone to amplitude-frequency response/phase frequency response of vibration as far as possible Be consistent, can by vibrating sensor and microphone with identical connection type (for example, cantilever connects, substrate connection, surrounding edge One of form connection) it connects inside the shell, and vibrating sensor and the respective dispensing position of microphone keep identical or most Amount is close.
As it was noted above, vibrating sensor and/or microphone are to the amplitude-frequency response of vibration and/or phase-frequency response and microphone And/or the type of vibrating sensor is related.By selecting the type of suitable microphone and/vibrating sensor, wheat can be made Gram wind and vibrating sensor are consistent the amplitude-frequency response of vibration and/or phase-frequency response substantially, are passed to reach using vibration The vibration signal that sensor obtains eliminates the effect for the vibration noise that microphone generates.
Fig. 9-A is a kind of structural schematic diagram of air conduction microphone 910 according to shown in some embodiments of the present application.One In a little embodiments, air conduction microphone 910 can be MEMS (Micro-electromechanical System) microphone.MEMS Microphone has the characteristics that small size, low-power consumption, high stability and good consistency amplitude-frequency and phase-frequency response.Such as Fig. 9-A Shown, the air conduction microphone 910 includes aperture 911, shell 912, integrated circuit (ASIC) 913, printed circuit board (PCB) 914, ante-chamber 915, vibrating diaphragm 916 and back cavity 917.The side that aperture 911 is located at shell 912 (is upper side in Fig. 9-A, i.e., Top).Integrated circuit 913 is mounted on PCB914.Ante-chamber 915 and back cavity 917 are formed by the isolation of vibrating diaphragm 916.As shown, Ante-chamber 915 includes the space of 916 top of vibrating diaphragm, is formed by vibrating diaphragm 916 and shell 912.Back cavity 917 includes 916 lower section of vibrating diaphragm Space is formed by vibrating diaphragm 916 and PCB914.In some embodiments, when air conduction microphone 910 is placed in earphone, in environment Conductance sound (for example, voice of user) ante-chamber 915 can be entered by aperture 911 and cause the vibration of vibrating diaphragm 916.Together When, the vibration signal that vibrating speaker generates can cause the outer of air conduction microphone 910 via shell, the connection structure etc. of earphone The vibration of shell 912, and then the vibration of vibrating diaphragm 916 is driven, to generate vibration and noise signals.
In some embodiments, air conduction microphone 910 may alternatively be 917 aperture of back cavity, and ante-chamber 915 and outside are empty The exhausted mode of air bound.
Fig. 9-B is a kind of structural schematic diagram of vibrating sensor 920 according to shown in some embodiments of the present application.Such as figure Shown, vibrating sensor 920 includes shell 922, integrated circuit (ASIC) 923, printed circuit board (PCB) 924, ante-chamber 925, vibration Film 926 and back cavity 927.In some embodiments, vibrating sensor 920 can pass through opening the air conduction microphone in Fig. 9-A The closing of hole 911 obtains (in this application, vibrating sensor 920 alternatively referred to as closes microphone 920).In some embodiments, When closing microphone 920 is placed in earphone, the conductance sound (for example, voice of user) in environment cannot be introduced into closing Mike The inside of wind 920 and the vibration for causing vibrating diaphragm 926.Vibrating speaker generate vibration via earphone shell, connection structure etc. Cause the vibration for closing the shell 922 of microphone 920, and then drive the vibration of vibrating diaphragm 926, generates vibration signal.
Fig. 9-C is the structural schematic diagram of the another kind vibrating sensor 930 according to shown in some embodiments of the present application.Such as Shown in figure, vibrating sensor 930 include aperture 931, shell 932, integrated circuit (ASIC) 933, printed circuit board (PCB) 934, Ante-chamber 935, vibrating diaphragm 936, back cavity 937 and aperture 938.In some embodiments, vibrating sensor 930 can be by Fig. 9-A In air conduction microphone 937 bear of back cavity so that back cavity 937 be connected with the external world and obtain (in this application, vibrate Sensor 930 is alternatively referred to as duplex and leads to microphone 930).In some embodiments, lead to microphone 930 when duplex to be placed in earphone When, the conductance sound (for example, voice of user) in environment enters duplex by aperture 931 and aperture 938 respectively and leads to microphone In 930, so that the received conductance voice signal in 936 two sides of vibrating diaphragm is cancelled out each other.Therefore conductance voice signal can not cause vibrating diaphragm 936 apparent vibrations.The vibration that vibrating speaker generates causes duplex to lead to microphone via shell, the connection structure etc. of earphone The vibration of 930 shell 932, and then the vibration of vibrating diaphragm 936 is driven, generate vibration signal.
It is only above specific example to the description of air conduction microphone and vibrating sensor, is not considered as uniquely may be used Capable embodiment.It, may be not after the basic principle for understanding microphone for one of skill in the art In the case where this principle, various modifications and variations are carried out to the specific structure of microphone and/or vibrating sensor, still These modifications and variations are still within the scope of above description.For example, for those skilled in the art, air conduction microphone 910 or vibrating sensor 930 in aperture 911 or 931 can be only fitted to the left or right side of shell 912 or shell 932, only need The microphone aperture can achieve the purpose for making ante-chamber 915 or 935 be connected with the external world.Further, aperture Quantity is not limited only to one, and air conduction microphone 910 or vibrating sensor 930 may include opening for multiple similar apertures 911 or 931 Hole.
In some embodiments, what the vibrating diaphragm 926 or 936 that the closing microphone 920 or duplex lead to microphone 930 generated Vibration signal can be used for offsetting the vibration and noise signals that the vibrating diaphragm 916 of air conduction microphone 910 generates.In some embodiments, In order to obtain the effect of preferably removal vibration noise, also to make to close microphone 920 as far as possible or duplex leads to microphone 930 It is identical to the amplitude-frequency response of the mechanical oscillation of earphone outer covering or phase-frequency response as air conduction microphone 910.
Just for illustrative purposes, below with the air conduction microphone being previously mentioned in Fig. 9-A, Fig. 9-B and Fig. 9-C and vibration For loudspeaker.It can be by changing air conduction microphone or vibrating sensor (for example, closing microphone 920 or duplex lead to Mike Wind 930) ante-chamber volume, back cavity volume and/or cavity volume so that the width of air conduction microphone and vibrating sensor to vibration Frequency response is answered and/or phase-frequency response reaches consistent or almost the same, to achieve the effect that remove vibration noise.Chamber mentioned here Body volume is the sum of microphone or ante-chamber volume and the back cavity volume of closing microphone.In some embodiments, work as vibrating sensing When amplitude-frequency response that device and air conduction microphone vibrate earphone outer covering and/or consistent phase-frequency response, the cavity body of vibrating sensor Product can be considered as " equivalent volume " of 910 cavity volume of air conduction microphone.In some embodiments, choosing cavity volume is gas The closing microphone for leading microphone cavity volume equivalent volume facilitates the vibration and noise signals for eliminating air conduction microphone.
Figure 10-A is that the vibrating sensor of the difference cavity volume according to shown in some embodiments of the present application believes vibration Number amplitude-frequency response.In some embodiments, amplitude-frequency response of the vibrating sensor of the different cavity volumes to vibration Curve can be obtained by finite element method or actual measurement.As an example, the vibrating sensor is closing microphone, And the bottom of the vibrating sensor is mounted on the inside of earphone outer covering.As shown in Figure 10-A, horizontal axis is vibration frequency, and the longitudinal axis is envelope Close the amplitude-frequency response of vibration of the microphone to different frequency.The vibration is generated by the vibrating speaker in earphone, and by outer Shell, connection structure are transmitted to the vibration signal of air conduction microphone or vibrating sensor.Wherein solid line is air conduction microphone to vibration Amplitude-frequency response.Dotted line be respectively close microphone and air conduction microphone cavity volume ratio be 1:1,3:1,6.5:1 and Microphone is closed to the amplitude-frequency response of vibration when 9.3:1.When cavity volume ratio is 1:1, the amplitude-frequency of microphone is closed Response curve is integrally lower than the amplitude-frequency response of air conduction microphone；When cavity volume ratio is 3:1, the amplitude-frequency of microphone is closed Response curve increases but the whole amplitude-frequency response for being still slightly below air conduction microphone；When cavity volume ratio is 6.5:1, closing The amplitude-frequency response of microphone is integrally slightly above the amplitude-frequency response of air conduction microphone；When cavity volume ratio is 9.3:1, The amplitude-frequency response of closing microphone is integrally higher than the amplitude-frequency response of air conduction microphone.As can be seen that working as cavity volume When than between 3:1 to 6.5:1, the amplitude-frequency response for closing microphone and air conduction microphone is almost the same.Thus, it is possible to recognize For air conduction microphone cavity volume equivalent volume the cavity volume of microphone (close) ratio between 3:1 to 6.5:1.One In a little embodiments, when vibrating sensor (for example, closing microphone 920) and air conduction microphone (for example, air conduction microphone 910) connect Receive the vibration signal from the same vibration source, and the chamber of the cavity volume of the vibrating sensor and the air conduction microphone When body volume ratio is between 3:1 to 6.5:1, it is received that the vibrating sensor can aid in the elimination air conduction microphone institute Vibration signal.
Similarly, Figure 10-B is the closing microphone pair of the difference cavity volume according to shown in some embodiments of the present application The phase-frequency response schematic diagram of vibration.As shown in figure 10-b, horizontal axis is vibration frequency, and the longitudinal axis is closing microphone to different frequency The phase-frequency response of vibration.Wherein, solid line is phase-frequency response curve of the air conduction microphone to vibration to 10-B, and dotted line is respectively to close wheat Phase frequency response of the closing microphone to vibration when gram wind and air conduction microphone cavity volume are than for 1:1,3:1,6.5:1 and 9.3:1 Answer curve.In some embodiments, when closing microphone (for example, closing microphone 920) and air conduction microphone are (for example, conductance Microphone 910) receive from the same vibration source vibration signal, and it is described closing microphone cavity volume and conductance wheat When the cavity volume ratio of gram wind is greater than 3:1, the closing microphone can aid in eliminate the air conduction microphone it is received Vibration signal.
It is only above specific example to the description of the equivalent volume of air conduction microphone cavity volume, is not considered as The embodiment of unique feasible.For one of skill in the art, in the basic principle for understanding air conduction microphone Afterwards, various amendments may be carried out to the specific structure of microphone and/or vibrating sensor without departing substantially from this principle And change, but these modifications and variations are still within the scope of above description.For example, air conduction microphone or/vibration can be passed through The modification of the structure of dynamic sensor changes the equivalent volume of air conduction microphone cavity volume, need to only select the envelope of appropriate cavities volume Microphone is closed, achievees the purpose that eliminate vibration noise.
As it was noted above, the equivalent volume of cavity volume also can be different when air conduction microphone has different structures. In some embodiments, the factor for influencing the air conduction microphone cavity body equivalent volume includes the ante-chamber of the air conduction microphone Volume, back cavity volume, position of opening and/or sound source route of transmission etc..Alternatively, in some embodiments, gas can be used The equivalent volume of microphone ante-chamber volume is led to characterize the ante-chamber volume of vibrating sensor.Microphone ante-chamber volume mentioned here Equivalent volume can be described as, when vibrating sensor is identical with the back cavity volume of air conduction microphone, and vibrating sensor is gentle When leading the amplitude-frequency response and/or consistent phase-frequency response that microphone vibrates earphone outer covering, the ante-chamber volume of the vibrating sensor For " equivalent volume " of air conduction microphone ante-chamber volume.In some embodiments, back cavity volume and air conduction microphone back cavity are chosen Volume is equal, and ante-chamber volume is the closing microphone of air conduction microphone ante-chamber volume equivalent volume, helps to eliminate conductance The vibration and noise signals of microphone.
When air conduction microphone has different structures, the equivalent volume of ante-chamber volume also can be different.In some implementations Example in, influence the air conduction microphone ante-chamber volume equivalent volume factor include the ante-chamber volume of the air conduction microphone, after Cavity volume, position of opening and/or sound source route of transmission etc..
Air conduction microphone is to vibration when Figure 11-A is the ante-chamber volume change according to shown in some embodiments of the present application Amplitude-frequency response schematic diagram.In some embodiments, the air conduction microphone of the different ante-chamber volumes is bent to the amplitude-frequency response of vibration Line can be obtained by finite element method or actual measurement.As shown in Figure 11-A, horizontal axis is vibration frequency, and the longitudinal axis is conductance Amplitude-frequency response of the microphone to the vibration of different frequency.V0For the ante-chamber volume of air conduction microphone.Wherein, solid line is ante-chamber volume For V0When air conduction microphone amplitude-frequency response, dotted line is that ante-chamber volume is 2V0、3V0、4V0、5V0、6V0When air conduction microphone Amplitude-frequency response.It can be seen from the figure that with the increase of air conduction microphone ante-chamber volume, the vibrating diaphragm of air conduction microphone Amplitude becomes larger, and vibrating diaphragm is easier to vibrate.
For the air conduction microphone with different ante-chamber volumes, can be determined each according to corresponding amplitude-frequency response The equivalent volume of air conduction microphone ante-chamber volume.In some embodiments, the equivalent volume of the ante-chamber volume can be according to class It is determined like the method for Figure 10-A.For example, being 2V for ante-chamber volume according to amplitude-frequency response corresponding in Figure 11-A0Gas Microphone is led, using the method for Figure 10-A, determines that the equivalent volume of its ante-chamber volume is 6.7V0.That is, working as vibrating sensing The back cavity volume of device and the back cavity volume of air conduction microphone are equal, and before the ante-chamber volume and air conduction microphone of vibrating sensor Cavity volume is respectively 6.7V0And 2V0When, vibrating sensor rings the amplitude-frequency response and air conduction microphone of vibration to the amplitude-frequency of vibration It answers identical.As shown in table 1, with the increase of ante-chamber volume, the equivalent volume of air conduction microphone ante-chamber volume is also increased with it.
Ante-chamber volume 1V0 2V0 3V0 4V0 5V0
Equivalent volume 4V0 6.7V0 8V0 9.3V0 12V0
Equivalent volume under the different ante-chamber volumes of table 1.
Similarly, air conduction microphone pair when Figure 11-B is the back cavity volume change according to shown in some embodiments of the present application The amplitude-frequency response schematic diagram of vibration.In some embodiments, amplitude-frequency of the air conduction microphone of the different back cavity volumes to vibration Response curve can be obtained by finite element method or actual measurement.As shown in Figure 11-B, horizontal axis is vibration frequency, the longitudinal axis It is air conduction microphone to the amplitude-frequency response of the vibration of different frequency.V1For the back cavity volume of air conduction microphone.Wherein, after solid line is Cavity volume is 0.5V1When air conduction microphone amplitude-frequency response, dotted line be respectively back cavity volume be 1V1、1.5V1、2V1、 2.5V1、3V1When air conduction microphone amplitude-frequency response.It can be seen from the figure that with the increasing of air conduction microphone back cavity volume Greatly, the amplitude of the vibrating diaphragm of air conduction microphone becomes larger, and vibrating diaphragm is easier to vibrate.For the air conduction microphone with different back cavity volumes, The equivalent volume of each air conduction microphone ante-chamber volume can be determined according to corresponding amplitude-frequency response.In some embodiments In, the equivalent volume of the ante-chamber volume can be determined according to the method for similar Figure 10-A.For example, according to shown in Figure 11-B Solid line is 0.5V for back cavity volume1Air conduction microphone the equivalent appearance of its ante-chamber volume is determined using the method for Figure 10-A Product is 3.5V0.That is, when the back cavity volume of air conduction microphone and vibrating sensor is 0.5V1, and vibrating sensor Ante-chamber volume and the front cavity of air conduction microphone product are respectively 3.5V0And 1V0When, vibrating sensor to the amplitude-frequency response of vibration with Air conduction microphone is identical to the amplitude-frequency response of vibration.In another example when the back cavity volume of air conduction microphone and vibrating sensor is 3.0V1, and the ante-chamber volume of vibrating sensor and the front cavity of air conduction microphone product are respectively 7V0And 1V0When, vibrating sensor It is identical as amplitude-frequency response of the air conduction microphone to vibration to the amplitude-frequency response of vibration.When the ante-chamber volume of air conduction microphone is kept 1V0Constant, back cavity volume is from 0.5V1Increase to 3.0V1When, the equivalent volume of air conduction microphone ante-chamber volume is from 3.5V0Increase to 7V0。
In some embodiments, the position of opening on air conduction microphone shell also will affect air conduction microphone ante-chamber volume Equivalent volume.Figure 12 is that the corresponding vibrating diaphragm amplitude-frequency response of the difference position of opening according to shown in some embodiments of the present application is bent Line.In some embodiments, the amplitude-frequency response of vibration can be led to when the air conduction microphone has different position of opening It crosses finite element method or actual measurement obtains.As shown, horizontal axis is vibration frequency, the longitudinal axis is the gas of different position of opening Microphone is led to the amplitude-frequency response of vibration.As shown in figure 12, solid line is that aperture is located at the air conduction microphone of cover top portion to vibration Amplitude-frequency response, dotted line is that aperture is located at amplitude-frequency response of the air conduction microphone to vibration of side wall of outer shell.It can see Out, the amplitude-frequency response of air conduction microphone when aperture is located at top is integrally higher than the width of air conduction microphone when aperture is located at side wall Frequency response is answered.In some embodiments, it can be directed to the air conduction microphone of different position of opening, it is bent according to corresponding amplitude-frequency response Line determines the equivalent volume of its corresponding ante-chamber volume respectively.The equivalent volume of the ante-chamber volume determines that method can be figure Method in 10-A.
In some embodiments, the equivalent volume that aperture is located at the air conduction microphone ante-chamber volume of cover top portion is greater than aperture Positioned at the equivalent volume of the air conduction microphone ante-chamber volume of side wall.For example, the ante-chamber volume of the air conduction microphone of top drilling is 1V0, the equivalent volume of ante-chamber volume is 4V0, the equivalent volume of the air conduction microphone ante-chamber volume of the side-wall hole of identical size About 1.5V0.The air conduction microphone of the identical size Expressing side-wall hole ante-chamber volume and rear chamber integral not with top The ante-chamber volume and back cavity volume of the air conduction microphone of aperture are equal.
In some embodiments, the approach that vibration source is propagated is different, and the equivalent volume of air conduction microphone ante-chamber volume can not yet Together.In some embodiments, vibration source route of transmission and microphone are related with the connection type of earphone outer covering, different microphones with The connection type of earphone outer covering can generate different amplitude-frequency responses.For example, when microphone is connected inside the shell using surrounding edge form, It is different to the amplitude-frequency response of vibration when from using side wall connection type.
Different from Figure 10 with shell in such a way that bottom is connect, Figure 13 is according to some embodiments of the present application Surrounding edge connection type under ante-chamber volume change when air conduction microphone and totally-enclosed microphone to the amplitude-frequency response of vibration.Value Must illustrate, discuss air conduction microphone ante-chamber volume or cavity volume equivalent volume when, the air conduction microphone and The connection side of vibrating sensor with corresponding equivalent volume (equivalent volume of ante-chamber volume or the equivalent volume of cavity volume) Formula is identical.For example, air conduction microphone and vibrating sensor are all made of surrounding edge connection type in Fig. 7, Fig. 8 and Figure 13.For another example Air conduction microphone and vibrating sensor can use substrate connection type, surrounding edge connection type in other embodiments in the application Or other connection types.In some embodiments, when the air conduction microphone is connected with totally-enclosed microphone surrounding edge form pair The amplitude-frequency response of vibration can be obtained by finite element method or actual measurement.As shown in figure 13, solid line is ante-chamber Volume is V0And the and shell amplitude-frequency response of air conduction microphone to vibration when being connected in the form of surrounding edge.Dotted line, which respectively indicates, to be enclosed The front cavity product of side connection is respectively 1V0、2V0、4V0、6V0, totally-enclosed microphone is to the amplitude-frequency response of vibration.Currently Cavity volume is 1V0Air conduction microphone using surrounding edge form connect when, amplitude-frequency response be integrally lower than surrounding edge form connection Ante-chamber volume is 1V0Totally-enclosed microphone amplitude-frequency response.Ante-chamber volume is 2V0Totally-enclosed microphone use surrounding edge When form connects, the ante-chamber volume that amplitude-frequency response is integrally lower than the connection of surrounding edge form is 1V0Air conduction microphone amplitude-frequency Response curve.Current cavity volume is 4V0And 6V0Totally-enclosed microphone using surrounding edge form connect when, amplitude-frequency response continue It reduces, the ante-chamber volume lower than the connection of surrounding edge form is 1V0Air conduction microphone amplitude-frequency response.It can from figure Out, the ante-chamber volume of microphone is closed in 1V0-2V0Between when, surrounding edge connection closing microphone amplitude-frequency response and side The amplitude-frequency response of the air conduction microphone of wall connection is closest.It can be concluded that if air conduction microphone and closing microphone all It is connected using surrounding edge form, the equivalent volume of air conduction microphone ante-chamber volume is in 1V0-2V0Between.
Figure 14 is that the air conduction microphone according to shown in some embodiments of the present application and two kinds of duplexs lead to microphone to conductance The amplitude-frequency response of voice signal.Specifically, solid line corresponds to the amplitude-frequency response of air conduction microphone, and dotted line respectively corresponds out The duplex that hole is located at the logical microphone of duplex of cover top portion and aperture is located at side wall leads to the amplitude-frequency response of microphone.In such as figure Shown in dotted line, when the frequency of conductance voice signal is less than 5kHz, duplex leads to microphone to conductance voice signal without response.Work as gas Lead voice signal frequency be more than 10kHz after, since the wavelength of conductance voice signal moves closer to the spy that duplex leads to microphone Length is levied, meanwhile, frequency is close to or up to the characteristic frequency of diaphragm structure, so that vibrating diaphragm generates resonance, can have larger Amplitude, at this time duplex lead to microphone to conductance voice signal generate response.Duplex mentioned here leads to microphone properties length It can be duplex and lead to the size of microphone in one dimension.For example, leading to microphone when duplex is that cuboid or approximation are rectangular When body, the characteristic length can be length, width or the height that duplex leads to microphone.For another example when duplex leads to microphone For cylindrical body perhaps approximate cylindrical body when the characteristic length can be the diameter or height that duplex leads to microphone.Some In embodiment, the wavelength of the conductance voice signal leads to the characteristic length of microphone close to duplex, it can be understood as the conductance The wavelength of voice signal and the duplex lead to the characteristic length of microphone in the same magnitude (for example, being all mm magnitude).In In some embodiments, for the frequency range of speech communication in 500Hz-3400Hz range, duplex leads to microphone in the range to air borne sound Sound is insensitive, can be used for measuring vibration and noise signals, and compared to closing microphone, duplex leads to microphone in low-frequency range to conductance The isolation better effect of voice signal, thus microphone conduct can be led to using the duplex of cover top portion aperture or side-wall hole Vibrating sensor is to help to eliminate the vibration and noise signals in air conduction microphone.
Figure 15 is amplitude-frequency response of the vibrating sensor according to shown in some embodiments of the present application to vibration.It is described Vibrating sensor includes that closing microphone and duplex lead to microphone.Specifically, Figure 15 is two kinds of closing microphones and two kinds of duplexs Amplitude-frequency response of the logical microphone to vibration.Wherein, heavy line indicates that the ante-chamber volume of top drilling is 1V0Duplex lead to wheat Gram wind indicates that the ante-chamber volume of side-wall hole is 1V to the amplitude-frequency response of vibration, fine line0Duplex lead to microphone to vibration Dynamic amplitude-frequency response.It is 9V that two dotted lines, which respectively indicate ante-chamber volume,0And 3V0Closing microphone the amplitude-frequency of vibration is rung Answer curve.It can be seen from the figure that the ante-chamber volume of side-wall hole is 1V0Duplex to lead to microphone and ante-chamber volume be 9V0Envelope Microphone approximation " equivalent " is closed, the ante-chamber volume of top drilling is 1V0Duplex to lead to microphone and ante-chamber volume be 3V0Closing Microphone approximation " equivalent ".Therefore, it is possible to which leading to microphone using the duplex of small volume carrys out the biggish totally-enclosed wheat of substituted volume Gram wind.In some embodiments, mutually the duplex of " equivalent " or approximate " equivalent " leads to microphone and closes microphone and can replace Change use.
Embodiment 1
As shown in figure 16, earphone 1600 includes air conduction microphone 1601, bone-conduction microphone 1602 and shell 1603.Its In, the side of the sound hole 1604 of air conduction microphone 1601 and the air communication outside earphone 1600, air conduction microphone 1601 connects It connects on the side in shell 1603.Bone-conduction microphone 1602 is bonded on a side in shell 1603.Conductance Mike Wind 1601 can obtain conductance voice signal by sound hole 1604, and be obtained by the connection structure of side and shell 1603 First vibration signal (that is, vibration and noise signals).Available second vibration signal of bone-conduction microphone 1602 is (that is, shell The mechanical oscillation signal of 1603 transmitting).First vibration signal and the second vibration signal are all generated by the vibration of shell 1603. Particularly, since bone-conduction microphone 1602 and air conduction microphone 1601 constructively have larger difference, two microphone width Frequency response and phase-frequency response difference, can carry out the elimination of vibration and noise signals using signal processing method shown in Fig. 2-A.
Embodiment 2
As shown in figure 17, dual microphone component 1700 includes air conduction microphone 1701, closing microphone 1702 and shell 1703.Wherein, air conduction microphone 1701 and closing microphone 1702 are integrated component, the outer wall of two microphones respectively with shell 1703 inside is mutually bonded.The sound hole 1704 of air conduction microphone 1701 is connected with the air outside dual microphone component 1700 Logical, the sound hole 1702 of closing microphone 1702 is located at the bottom of air conduction microphone 1701 and keeps isolation (etc. with outside air Imitate the closing microphone in Fig. 9-B).Particularly, the closing microphone 1702 can be used complete with air conduction microphone 1701 Exactly the same air conduction microphone, and the envelope closing microphone 1702 and not being connected with outside air is realized by the design in structure Close form.This integral member structure makes air conduction microphone 1701 and closing microphone 1702 relative to vibration source (for example, Fig. 1 In vibrating speaker 101) Vibration propagation path having the same so that air conduction microphone 1701 and closing microphone 1702 receive identical vibration signal.Air conduction microphone 1701 can obtain conductance voice signal by sound hole 1704, with And the first vibration signal (that is, vibration and noise signals) are obtained by shell 1703.Closing microphone 1702 only obtains the second vibration Signal (that is, mechanical oscillation signal that shell 1703 transmits).First vibration signal and the second vibration signal are all by shell 1603 vibration generates.Particularly, ante-chamber volume, back cavity volume, and/or the cavity volume for closing microphone 1702 can be corresponding Ground is set as the equivalent volume of 1701 corresponding volume of air conduction microphone (ante-chamber volume, back cavity volume, and/or cavity volume), from And make air conduction microphone 1701 and closing microphone 1702 that there is identical or approximately uniform frequency response.Dual microphone group Part 1700 has the advantages that the scale of construction is small, and can individually be debugged, simple production process.In some embodiments, wheat Gram wind component 1700 can eliminate the vibration noise of the received all communication frequency bands of air conduction microphone 1701.
Figure 18 is the Headphone structure comprising the dual microphone component in Figure 17.As shown in figure 18, earphone 1800 includes Dual microphone component 1700, shell 1801 and connection structure 1802.The shell 1703 of the component of diamylose gram component 1700 is by enclosing Side form is connected with earphone outer covering 1801.The connection type can make two microphones in diamylose gram component 1700 relative to outer Link position on shell 1801 keeps symmetrical, so that the Vibration propagation path for being further ensured that vibration source to two microphones communicates. In some embodiments, the Headphone structure in Figure 18 can be eliminated well due to vibration noise propagation path, two microphones Influence of the reasons such as type difference to removal vibration noise effect.
Embodiment 3
Figure 19 is the schematic diagram of a dual microphone Headphone structure.As shown in figure 19, earphone 1900 includes vibrating speaker 1901, shell 1902, elastic element 1903, air conduction microphone 1904, bone-conduction microphone 1905 and aperture 1906.Wherein, it shakes Dynamic loudspeaker 1901 is fixed on shell 1902 by elastic element 1903.Air conduction microphone 1904 and bone-conduction microphone 1905 It is connected to the different position in 1902 inside of shell.Air conduction microphone 1904 is communicated by aperture 1906 with outside air, with Receive conductance voice signal.When 1901 vibration sounding of vibrating speaker, shell 1902 is driven to vibrate, shell 1902 transmits vibration To air conduction microphone 1904 and bone-conduction microphone 1905.It in some embodiments, can be using such as the signal processing in Fig. 2-B Method, the vibration signal obtained using bone-conduction microphone 1905, the vibration and noise signals that air conduction microphone 1904 is received It eliminates.In some embodiments, bone-conduction microphone 1905 can be used for eliminating the received all communications of air conduction microphone 1904 The vibration noise of frequency range.
Embodiment 4
Figure 20 is the Headphone structure schematic diagram that a dual microphone eliminates vibration noise.As shown in figure 20, earphone 2000 wraps Include vibrating speaker 2001, shell 2002, elastic element 2003, air conduction microphone 2004, vibrating sensor 2005 and aperture 2006.Vibrating sensor 2005 can be closing microphone, duplex according to shown in embodiments some in the application and lead to microphone Or bone-conduction microphone, it is also possible to other sensor devices with vibration signals collecting function.Vibrating speaker 2001 is logical Elastic element 2003 is crossed to be fixed on shell 2002.Air conduction microphone 2004 and vibrating sensor 2005 are by selecting or debugging Two microphones with identical amplitude-frequency response and/or phase-frequency response afterwards.The top and side of air conduction microphone 2004 connect respectively It connects in 2006 inside of shell, the side of vibrating sensor 2005 is connected to the inside of shell 2006.Air conduction microphone 2004 passes through Aperture 2006 is communicated with outside air.When 2001 vibration sounding of vibrating speaker, shell 2002 is driven to vibrate, the vibration of shell 2002 It is dynamic to pass to air conduction microphone 2004 and vibrating sensor 2005.Due to air conduction microphone 2004 and vibrating sensor 2005 with The position that shell 2006 connects is very close (for example, two microphones can be located at position 301 and position in Fig. 3 302), so the vibration for passing to the two microphones by shell 2006 is identical.In some embodiments, air conduction microphone 2004 The signal received with vibrating sensor 2005 can use the signal processing method as shown in Fig. 2-C, by air conduction microphone 2004 vibration and noise signals received are eliminated.In some embodiments, vibrating sensor 2005 can be used for eliminating conductance wheat The vibration noise of gram received all communication frequency bands of wind 2004.
Embodiment 5
Figure 21 is a kind of dual microphone Headphone structure schematic diagram.Dual microphone earphone 2100 is the another of earphone 2000 in Figure 20 A kind of deformation.Wherein, earphone 2100 includes vibrating speaker 2101, shell 2102, elastic element 2103, air conduction microphone 2104, vibrating sensor 2105 and aperture 2106.Vibrating sensor 2105 can be closing microphone, duplex leads to microphone or bone Conduction microphone.Air conduction microphone 2104 and vibrating sensor 2105 are connected to the interior of shell 2102 by surrounding edge form respectively Side, and it is symmetrical (for example, two microphones can be located at 301 He of position in Fig. 3 relative to vibrating speaker 2101 Position 304).Air conduction microphone 2104 and vibrating sensor 2105 can be has identical amplitude-frequency response after selecting or debugging And/or two microphones of phase-frequency response.In some embodiments, air conduction microphone 2104 and vibrating sensor 2105 receive Signal the vibration and noise signals that air conduction microphone 2104 receives can be disappeared using signal processing method shown in Fig. 2-C It removes.In some embodiments, vibrating sensor 2105 can be used for eliminating the received all communication frequency bands of air conduction microphone 2104 Vibration noise.
Basic conception is described above, it is clear that those skilled in the art, foregoing invention discloses only As an example, and not constituting the restriction to the application.Although do not clearly state herein, those skilled in the art may The application is carry out various modifications, improve and is corrected.Such modification, improvement and amendment are proposed in this application, so such Modification improves, corrects the spirit and scope for still falling within the application example embodiment.
In addition, except clearly stating in non-claimed, the sequence of herein described processing element and sequence, digital alphabet Using or other titles use, be not intended to limit the sequence of the application process and method.Although by each in above-mentioned disclosure Kind of example discuss it is some it is now recognized that useful inventive embodiments, but it is to be understood that, such details only plays explanation Purpose, appended claims are not limited in the embodiment disclosed, on the contrary, claim is intended to cover and all meets the application The amendment and equivalent combinations of embodiment spirit and scope.For example, although system component described above can be set by hardware It is standby to realize, but can also be only achieved by the solution of software, such as pacify on existing server or mobile device Fill described system.
Similarly, it is noted that in order to simplify herein disclosed statement, to help real to one or more invention Apply the understanding of example, above in the description of the embodiment of the present application, sometimes by various features merger to one embodiment, attached drawing or In descriptions thereof.But this disclosure method is not meant to mention in aspect ratio claim required for the application object And feature it is more.In fact, the feature of embodiment will be less than whole features of the single embodiment of above-mentioned disclosure.
Finally, it will be understood that embodiment described herein is only to illustrate the principle of the embodiment of the present application.Other Deformation may also belong to scope of the present application.Therefore, as an example, not a limit, the alternative configuration of the embodiment of the present application is visual It is consistent with teachings of the present application.Correspondingly, embodiments herein is not limited only to the implementation that the application is clearly introduced and described Example.

Claims (26)

1. a kind of microphone apparatus, the microphone apparatus includes microphone and vibrating sensor, which is characterized in that
For the microphone for receiving the first signal, first signal includes voice signal and the first vibration signal；
The vibrating sensor is for receiving the second vibration signal；And
The microphone and the vibrating sensor are configured as first vibration signal can be with the second vibration signal phase It offsets.
2. the apparatus according to claim 1, which is characterized in that the cavity volume of the vibrating sensor is configured such that The vibrating sensor is to the amplitude-frequency response of the second vibration signal with the microphone to the amplitude-frequency response phase of the first vibration signal Together, and/or make the vibrating sensor to the phase-frequency response of the second vibration signal and the microphone to the first vibration signal Phase-frequency response it is identical.
3. the apparatus according to claim 1, which is characterized in that the cavity volume of the vibrating sensor and the microphone Cavity volume it is proportional so that second vibration signal can be offseted with first vibration signal.
4. device according to claim 3, which is characterized in that the cavity volume of the vibrating sensor and the microphone Cavity volume ratio be 3:1 between 6.5:1.
5. the apparatus according to claim 1, which is characterized in that described device further includes signal processing unit, the signal Processing unit is configured as offseting first vibration signal with second vibration signal and exports the voice signal.
6. the apparatus according to claim 1, which is characterized in that the vibrating sensor is that closing microphone or duplex are logical Microphone.
7. device according to claim 6, which is characterized in that
The microphone be ante-chamber aperture or back cavity aperture, and
The vibrating sensor is closing microphone, and the closing microphone is that ante-chamber and back cavity are all closed.
8. device according to claim 6, which is characterized in that
The microphone is configured as ante-chamber aperture or back cavity aperture, and
The vibrating sensor is that duplex leads to microphone, and it is ante-chamber and the equal aperture of back cavity that the duplex, which leads to microphone,.
9. device according to claim 7 or 8, which is characterized in that the ante-chamber aperture of the microphone is the ante-chamber There are at least one apertures for top or side wall.
10. the apparatus according to claim 1, which is characterized in that the microphone and vibrating sensor independent connection In the same shell mechanism.
11. device according to claim 10, which is characterized in that described device further comprises vibration unit, at least one The part vibration unit is located in the shell, and the vibration unit is configured as generating first vibration signal and described Second vibration signal, wherein the microphone and the vibrating sensor are located at adjacent position on the shell or are located at Relative to the symmetrical position of the vibration unit on the shell.
12. device according to claim 10, which is characterized in that the microphone or the vibrating sensor and described outer The connection type of shell is one of cantilever connection, surrounding edge connection or substrate connection.
13. the apparatus according to claim 1, which is characterized in that the microphone and the vibrating sensor are miniature Mechatronic Systems microphone.
14. an earphone system, the earphone system includes vibrating speaker, microphone apparatus and shell, which is characterized in that
The vibrating speaker and the microphone apparatus are located within the shell,
The microphone apparatus includes microphone and vibrating sensor, which is characterized in that
For the microphone for receiving the first signal, first signal includes voice signal and the first vibration signal；
The vibrating sensor is for receiving the second vibration signal, and first vibration signal and second vibration signal are by institute Vibrating speaker vibration is stated to generate；And
The microphone and the vibrating sensor are configured as first vibration signal can be with the second vibration signal phase It offsets.
15. earphone system according to claim 14, which is characterized in that the cavity volume of the vibrating sensor is configured To make amplitude-frequency of the vibrating sensor to the amplitude-frequency response of the second vibration signal with the microphone to the first vibration signal It responds identical, and/or the vibrating sensor is shaken to the phase-frequency response of the second vibration signal and the microphone to first The phase-frequency response of dynamic signal is identical.
16. earphone system according to claim 14, which is characterized in that the cavity volume of the vibrating sensor with it is described The volume of microphone is proportional, so that second vibration signal can be offseted with first vibration signal.
17. earphone system according to claim 16, which is characterized in that the cavity volume of the vibrating sensor and described The cavity volume ratio of microphone is 3:1 between 6.5:1.
18. earphone system according to claim 14, which is characterized in that it further comprise signal processing unit, the letter Number processing unit is configured as offseting first vibration signal with second vibration signal and exports the voice letter Number.
19. earphone system according to claim 14, which is characterized in that the vibrating sensor is closing microphone or double Connection microphone.
20. earphone system according to claim 19, which is characterized in that
The microphone be ante-chamber aperture or back cavity aperture, and
The vibrating sensor is closing microphone, and the closing microphone is that ante-chamber and back cavity are all closed.
21. earphone system according to claim 19, which is characterized in that
The microphone is configured as ante-chamber aperture or back cavity aperture, and
The vibrating sensor is that duplex leads to microphone, and it is ante-chamber and the equal aperture of back cavity that the duplex, which leads to microphone,.
22. the earphone system according to claim 20 or 21, which is characterized in that the ante-chamber aperture of the microphone is described There are at least one apertures for the top of ante-chamber or side wall.
23. earphone system according to claim 14, which is characterized in that the microphone and the vibrating sensor are independent It is connected to the shell.
24. earphone system according to claim 23, which is characterized in that the microphone and the vibrating sensor are located at On the shell adjacent position or be located at the shell on relative to the symmetrical position of the vibrating speaker.
25. earphone system according to claim 23, which is characterized in that the microphone or the vibrating sensor and outer The connection type of shell is that cantilever connection, surrounding edge connection one of are connected with substrate.
26. earphone system according to claim 14, which is characterized in that the microphone and the vibrating sensor are MEMS microphone.
CN201810388306.7A 2018-04-26 2018-04-26 A kind of microphone apparatus Pending CN110418225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810388306.7A CN110418225A (en) 2018-04-26 2018-04-26 A kind of microphone apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810388306.7A CN110418225A (en) 2018-04-26 2018-04-26 A kind of microphone apparatus

Publications (1)

Publication Number Publication Date
CN110418225A true CN110418225A (en) 2019-11-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810388306.7A Pending CN110418225A (en) 2018-04-26 2018-04-26 A kind of microphone apparatus

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Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112153517A (en) * 2020-10-20 2020-12-29 朱利 Multi-medium conduction double-microphone earphone
CN114598978A (en) * 2020-12-04 2022-06-07 中兴通讯股份有限公司 Anti-vibration radio device, terminal, signal processing method and signal processing module
WO2024108332A1 (en) * 2022-11-21 2024-05-30 深圳市韶音科技有限公司 Acoustic output apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112153517A (en) * 2020-10-20 2020-12-29 朱利 Multi-medium conduction double-microphone earphone
CN114598978A (en) * 2020-12-04 2022-06-07 中兴通讯股份有限公司 Anti-vibration radio device, terminal, signal processing method and signal processing module
WO2022116644A1 (en) * 2020-12-04 2022-06-09 中兴通讯股份有限公司 Anti-vibration sound reception device, terminal, signal processing method, and signal processing module
WO2024108332A1 (en) * 2022-11-21 2024-05-30 深圳市韶音科技有限公司 Acoustic output apparatus

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