CN110416196A - Light-emitting diodes body side surface projection light emitting device and preparation method thereof - Google Patents
Light-emitting diodes body side surface projection light emitting device and preparation method thereof Download PDFInfo
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- CN110416196A CN110416196A CN201910287091.4A CN201910287091A CN110416196A CN 110416196 A CN110416196 A CN 110416196A CN 201910287091 A CN201910287091 A CN 201910287091A CN 110416196 A CN110416196 A CN 110416196A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
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- 229910002027 silica gel Inorganic materials 0.000 claims description 5
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- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 3
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- 239000010980 sapphire Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical group C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims 1
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
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- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of light-emitting diodes body side surface projection light emitting devices and preparation method thereof, including light emitting device；The light emitting device includes light frame, the bubble plate being set in light frame, the bis- glue of AB for generating several bubbles are covered on bubble plate, light frame surrounding is formed at least one LED luminescence chip, the present invention is not by the requirement of environment, basic workshop environment is only needed, does not need additionally to make dust free room production；The present invention is directly produced using the deployed bis- glue of AB, in the process only it should be noted that the control of temperature, that is, can reach beautiful effect.
Description
Technical field
The invention belongs to lamp luminescence engineering device technique fields, and in particular to a kind of light-emitting diodes body side surface projection light emitting device
And preparation method thereof.
Background technique
" carbon reduction " is carried out energetically in recent years by country, and state key training project LED light-emitting diode replaces white heat
Every scheme of lamp source, and because white luminous diode is directive property light source, direct irradiation human eye will generate eyes
Lesion generates the secondary blue light injury of human body, currently, most similar with the present invention is backlight side luminescence technology, it is also to adopt
With physics refraction principle, the refraction principle using panel type transparent material by cutting or net-point printing reaches light refraction
To the technical requirements of the source efficiency of lateral emitting.
Wherein, the material of selection must be very transparent, and side launching position must be extremely brilliant, luminous efficiency
The 65~75% of only original light-emitting diode, but being related to general the selection of material is polymethyl methacrylate or poly- carbon
Acid esters material, it is necessary to which repeatedly processing and cutting cause being not easy for material production, in lamps and lanterns production process, it is necessary to keep
Clean environment production, the design repeatedly laminated cause the phenomenon of production difficulty increase.
In short, above-mentioned material purchase cost is higher, low efficiency, occupancy manpower is more, is unfavorable for the such lamps and lanterns of mass production
A wide range of development.
Against the above technical problems, it therefore needs to make improvements.
Summary of the invention
The present invention is to overcome above-mentioned defect in the prior art, and it is simple, easy to use to provide a kind of structure, saves material
Material, the high light-emitting diodes body side surface projection light emitting device and preparation method thereof of luminous efficiency.
In order to reach the goals above, the technical scheme adopted by the invention is that: light-emitting diodes body side surface projection light emitting device,
Including light emitting device；The light emitting device includes light frame, the bubble plate being set in light frame, is covered on bubble plate
The bis- glue of AB of several bubbles are generated, light frame surrounding is formed at least one LED luminescence chip.
As a preferred solution of the present invention, the bottom of the LED luminescence chip is flushed with the upper surface of the bis- glue of AB.
As a preferred solution of the present invention, at least one described LED luminescence chip has the outer wall with light frame
Or the shape that inner wall matches.
As a preferred solution of the present invention, the light frame upper end is laid with upper cover, the lower end of light frame according to
It is secondary that expelling plate and back-cover are installed.
As a preferred solution of the present invention, the light frame by Pyrex, Bohemian glass, quartz glass, ceramics,
Any combination that any one of AlN, graphene, metal or they are plated on sapphire, glass is made.
As a preferred solution of the present invention, the bis- glue of the AB are transparent flexible glue, which is silica gel, flexi-ring oxygen
One of resin, soft UV glue and flexible plastic or their any combination.
As a preferred solution of the present invention, the A glue in the bis- glue of the AB is epoxy resin, and B glue is that methyl tetrahydro is adjacent
The mixed proportion of phthalate anhydride, A glue and B glue is 3:1 or 2.5:1.
As a preferred solution of the present invention, circuit board is provided in the light frame, LED luminescence chip is mounted on
The circuit board surface, circuit board outside connect live wire.
As a preferred solution of the present invention, the circuit board is PCBA board.
A kind of production method for making light-emitting diodes body side surface projection light emitting device, comprising the following steps:
Step (1) mounts several LED luminescence chips on the board surface according to the needs of design；LED will be pasted with
The circuit board of luminescence chip is put into the side wall of light frame；
Step (2) connects electric wire, electric wire and circuit board electrical connection on the outside of light frame；
Step (3), is delivered to detection station for single LED luminescence chip, carries out energization conducting to each LED luminescence chip
Test, non-defective unit output, defective products exclude；
Step (4), the bis- glue allotments of AB deploy the bis- glue of AB according to the mixed proportion of A glue and B glue for 3:1 or 2.5:1,
By stirring, micro-bubble is generated, colloid is put on bubble plate, until the bis- glue upper ends AB and LED luminescence chip bottom table
Face is concordant, and placement etc. is to be solidified；
Step (5) successively installs upper cover, expelling plate and back-cover.
The beneficial effects of the present invention are:
First, structure of the invention is simple, easy to use, low in cost；
The second, production equipment of the invention is simple, it is not necessary to which large-scale laser cutting equipment is not needed more to consume a large amount of power supplys, be reached
It can be saved the purpose of the energy into production；
Third, the present invention is not by the requirement of environment, it is only necessary to which basic workshop environment does not need additionally to make dust free room
Production；
4th, the present invention is directly produced using the deployed bis- glue of A B, in the process only it should be noted that the control of temperature, i.e., reachable
To beautiful effect；
5th, for traditional light emitting diode behind saturating face light head side, general luminous efficiency is 65-75%, and uses this hair
Bright light-emitting diodes body side surface projection light emitting device, luminous efficiency improve 10~15%.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is luminous device structure schematic diagram of the invention；
Specific embodiment
It elaborates with reference to the accompanying drawing to the embodiment of the present invention.
Embodiment: as shown in Figs. 1-2, light-emitting diodes body side surface projection light emitting device, including light emitting device 2；It is described to shine
Device 2 is including light frame 21, the bubble plate 22 being set in light frame 21, is covered on bubble plate 22 and generates several bubbles
The bis- glue 5 of AB, 21 surrounding of light frame is formed at least one LED luminescence chip 23.
The operation principle of the present invention is that: bubble plate 22, the allotment using the bis- 5 two doses of equal proportions of glue of transparent silica gel AB are uniform
Afterwards, bubble is generated, is separately concentrated on minimum bubble in light frame 21, surrounding is covered with LED luminescence chip 23, when LED is sent out
When optical chip 23 shines, the effect of refraction light source is generated through multiple groups tiny bubble, is generated after LED luminescence chip 23 is reflected
Average light source, reaches the effect of area source.
Light emitting device of the invention, it is necessary to cooperate with LED luminescence chip 23, LED luminescence chip 23 is placed in transparent soft
Bubble silica gel surrounding is reached using the luminous and refraction of LED luminescence chip 23 or other light sources by LED luminescence chip 23
Point light source is converted to the design of area source.
At least one LED luminescence chip 23 of the invention has the shape to match with the outer wall or inner wall of light frame 21
Shape is whether fitted on the inner wall or outer wall of light frame 21, and the hair of LED luminescence chip 23 can be set as needed
The direction of smooth surface then can according to need the installation that it is arbitrarily arranged for example, if LED luminescence chip 23 is 360 ° luminous
Orientation；For example, if LED luminescence chip 23 is 180 ° luminous, then its light-emitting surface (exit facet of light) can be arranged to
Inwardly or outwardly, entire light frame 21 is all the heat-radiating substrate of LED luminescence chip 23, i.e. thermal resistance to wall towards light frame 21
Small, heat dissipation area is big, good heat dissipation, can install more LED luminescence chips 23,
When LED luminescence chip 23 shines, the light that at least partly LED luminescence chip 23 issues, which can be passed through sequentially, is covered with production
The bis- glue 5 of AB of raw several bubbles, generate the effect of refraction light source, will generate average light after the refraction of 23 light source of LED luminescence chip
Source, reaches the effect of area source, and the light transmittance of the light of sending can be greater than 90%, meanwhile, 23 bottom of LED luminescence chip and AB
The distance of double glue 5 is not more than 23 oneself height of LED luminescence chip, this be for the light shape that is issued of collocation LED luminescence chip 23 and
Design, to increase the whole light extraction efficiency and light-emitting angle of LED luminescence chip 23, wherein the bottom of LED luminescence chip 23 and AB
The upper surface of double glue 5 flushes.
21 upper end of light frame of the invention is laid with upper cover 1, and the lower end of light frame 21 is sequentially installed with 3 He of expelling plate
Back-cover 4, upper cover 1 of the invention, which is regardless of, is limited to any shape, and purpose is contour structures and covers luminous light source, of the invention
Expelling plate 3, which is regardless of, is limited to any shape, and purpose is contour structures and covers luminous light source, and back-cover 4 of the invention is regardless of limit
In any shape, purpose is contour structures and covers luminous light source.
Light frame 21 is by being plated with AlN, graphite on Pyrex, Bohemian glass, quartz glass, ceramics, sapphire, glass
Any one of alkene, metal or their any combination are made.
The bis- glue 5 of AB are transparent flexible glue, which is one of silica gel, soft epoxy resin, soft UV glue and flexible plastic
Or their any combination.Term " flexible glue " herein is relative to having quite or for the glue of certain degree of hardness in this field
, that is, need to be subject to the usual explanation in this field；A glue in the bis- glue 5 of AB is epoxy resin, and B glue is methyl tetrahydro neighbour's benzene
The mixed proportion of dicarboxylic acid anhydride, A glue and B glue is 3:1 or 2.5:1.
Circuit board 6 is provided in light frame 21, LED luminescence chip 23 is mounted on 6 surface of circuit board, circuit board 6
Outside connects live wire 7, and circuit board 6 is PCBA board.
A kind of production method for making light-emitting diodes body side surface projection light emitting device, comprising the following steps:
Step (1) mounts several LED luminescence chips on the board surface according to the needs of design；LED will be pasted with
The circuit board of luminescence chip is put into the side wall of light frame；
Step (2) connects electric wire, electric wire and circuit board electrical connection on the outside of light frame；
Step (3), is delivered to detection station for single LED luminescence chip, carries out energization conducting to each LED luminescence chip
Test, non-defective unit output, defective products exclude；
Step (4), the bis- glue 5 of AB are deployed, and the bis- glue of AB are adjusted according to the mixed proportion of A glue and B glue for 3:1 or 2.5:1
Match, by stirring, generate micro-bubble, colloid is put on bubble plate, until the bis- glue upper ends AB and LED luminescence chip bottom
Flush, placement etc. are to be solidified；
Step (5) successively installs upper cover 1, expelling plate 3 and back-cover 4.
This case invention can generate gas by stirring via the transparent or semitransparent curable glue of other different types
Bubble, same plastic device bubble plate processing and production after solidification.
The present invention can generate bubble by stirring via the transparent or semitransparent curable glue of other different types,
By double-deck or Multi-stacking compaction, same plastic device bubble plate processing and production after solidification.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention；Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. light-emitting diodes body side surface projection light emitting device, it is characterised in that: including light emitting device (2)；Light emitting device (2) packet
Include light frame (21), the bubble plate (22) being set on light frame (21), bubble plate (22) if on be covered with generate dry gas
The bis- glue of the AB of bubble (5), light frame (21) surrounding are formed at least one LED luminescence chip (23).
2. light-emitting diodes body side surface projection light emitting device according to claim 1, it is characterised in that: the LED shines core
The bottom of piece (23) is flushed with the upper surface of the bis- glue of AB (5).
3. light-emitting diodes body side surface projection light emitting device according to claim 1, it is characterised in that: it is described at least one
LED luminescence chip (23) has the shape to match with the outer wall or inner wall of light frame (21).
4. light-emitting diodes body side surface projection light emitting device according to claim 3, it is characterised in that: the light frame
(21) upper end is laid with upper cover (1), and the lower end of light frame (21) is sequentially installed with expelling plate (3) and back-cover (4).
5. light-emitting diodes body side surface projection light emitting device according to claim 4, it is characterised in that: the light frame
(21) by being plated with AlN, graphene, appointing in metal on Pyrex, Bohemian glass, quartz glass, ceramics, sapphire, glass
A kind of or their any combination is made.
6. light-emitting diodes body side surface projection light emitting device according to claim 2, it is characterised in that: the bis- glue of AB (5)
For transparent flexible glue, which is one of silica gel, soft epoxy resin, soft UV glue and flexible plastic or their any group
It closes.
7. light-emitting diodes body side surface projection light emitting device according to claim 6, it is characterised in that: the bis- glue of AB (5)
In A glue be epoxy resin, B glue is methyl tetrahydrophthalic anhydride, and the mixed proportion of A glue and B glue is 3:1 or 2.5:1.
8. light-emitting diodes body side surface projection light emitting device according to claim 5, it is characterised in that: the light frame
(21) it is provided on circuit board (6), LED luminescence chip (23) is mounted on the circuit board (6) surface, connects on the outside of circuit board (6)
It is connected to electric wire (7).
9. light-emitting diodes body side surface projection light emitting device according to claim 8, it is characterised in that: the circuit board (6)
For PCBA board.
10. a kind of for making the production of light-emitting diodes body side surface projection light emitting device described in any one of claim 1-9
Method, which comprises the following steps:
Step (1) mounts several LED luminescence chips on the board surface according to the needs of design；LED will be pasted with
The circuit board of luminescence chip is put into the side wall of light frame；
Step (2) connects electric wire, electric wire and circuit board electrical connection on the outside of light frame；
Step (3), is delivered to detection station for single LED luminescence chip, carries out energization conducting to each LED luminescence chip
Test, non-defective unit output, defective products exclude；
Step (4), the bis- glue of AB (5) allotment adjust the bis- glue of AB according to the mixed proportion of A glue and B glue for 3:1 or 2.5:1
Match, by stirring, generate micro-bubble, colloid is put on bubble plate, until the bis- glue upper ends AB and LED luminescence chip bottom table
Face is concordant, and placement etc. is to be solidified；
Step (5) successively installs upper cover (1), expelling plate (3) and back-cover (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910287091.4A CN110416196A (en) | 2019-04-11 | 2019-04-11 | Light-emitting diodes body side surface projection light emitting device and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910287091.4A CN110416196A (en) | 2019-04-11 | 2019-04-11 | Light-emitting diodes body side surface projection light emitting device and preparation method thereof |
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| Publication Number | Publication Date |
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| CN110416196A true CN110416196A (en) | 2019-11-05 |
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| CN201910287091.4A Pending CN110416196A (en) | 2019-04-11 | 2019-04-11 | Light-emitting diodes body side surface projection light emitting device and preparation method thereof |
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| US20150349218A1 (en) * | 2014-05-30 | 2015-12-03 | Cree, Inc. | Submount based light emitter components and methods |
| CN206449507U (en) * | 2017-01-25 | 2017-08-29 | 江门市瑞麒照明有限公司 | A kind of sheen LED panel lamp |
| CN109471212A (en) * | 2018-12-24 | 2019-03-15 | 宁波激智科技股份有限公司 | A kind of high brightness optical diffusion |
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2019
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| CN104110591A (en) * | 2013-04-22 | 2014-10-22 | 展晶科技(深圳)有限公司 | Light emitting diode lamp |
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| CN206449507U (en) * | 2017-01-25 | 2017-08-29 | 江门市瑞麒照明有限公司 | A kind of sheen LED panel lamp |
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Application publication date: 20191105 |