CN101457013A - Light scattering type epoxy resin composition and preparation method thereof - Google Patents
Light scattering type epoxy resin composition and preparation method thereof Download PDFInfo
- Publication number
- CN101457013A CN101457013A CNA200910042492XA CN200910042492A CN101457013A CN 101457013 A CN101457013 A CN 101457013A CN A200910042492X A CNA200910042492X A CN A200910042492XA CN 200910042492 A CN200910042492 A CN 200910042492A CN 101457013 A CN101457013 A CN 101457013A
- Authority
- CN
- China
- Prior art keywords
- agent
- light scattering
- epoxy resin
- type epoxy
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
A light scattering typed episode resin combination and the preparation method thereof. The light scattering typed episode resin combination comprises an A solution and a B solution, wherein the A solution comprise 95 to 98 part by weight of episode resin, 1.0 to 3.5 part by weight of light scattering diluents and 0.5 to 1.5 part by weight of silicon-oil-based adhering accelerator; the B solution comprises 95 to 98 part by weight of firming agent, 1.0 to 4.5 part by weight of curing accelerator and 0.5 to 1.5 part by weight of antioxidant. The invention also comprises the preparation method for the light scattering typed episode resin combination. The light scattering typed episode resin combination of the invention has good intersolubility and homogeneity and the storage time can reach 12 months. The light scattering diluents in the condensates are graded distributed; therefore the episode resin combination is provided with excellent light scattering functions.
Description
Technical field
The present invention relates to a kind of light scattering type epoxy resin composition and preparation method thereof, especially relate to light scattering type epoxy resin composition of a kind of optoelectronic semiconductor component (photosemiconductor) sealing usefulness and preparation method thereof.
Background technology
Composition epoxy resin is widely used in for example sealing of LED, digital display module, dot matrix display module of optoelectronic semiconductor component.This composition epoxy resin that is used for sealing optoelectronic semiconductor elements, in the sealing of dot matrix display module and some LED, digital display module element seal, except comprising Resins, epoxy, solidifying agent, curing catalyst usually, also need when joining glue, add a certain proportion of light diffusing agent, make the optoelectronic semiconductor component after the sealing have scattering of light or diffusive property.
The suspension mixture of existing light diffusing agent for making by mechanically mixing by insoluble inorganic salt or organic solid (particle diameter is generally 5～10 microns) and Resins, epoxy, join by a certain percentage when joining glue in the composition epoxy resin, there are many defectives in it:
(1) generally is scattered in the Resins, epoxy by mediating or grinding by inorganic salt (or organic compound) solia particle, because it is not dissolved in the Resins, epoxy, so still be suspended in the composition epoxy resin with solid particulate form, in the hot setting process after the optoelectronic semiconductor component sealing, composition epoxy resin viscosity reduces greatly, the colloid damping action reduces, wherein the solid particulate gravitate of Xuan Fuing can produce sedimentation in various degree, thereby cause the light granule proliferation in the cured body to form the radial Gradient distribution, the scattering of light of the optoelectronic semiconductor component after the encapsulation is a greater impact;
(2) in composition epoxy resin, be easy to generate sedimentation, can not join in the composition epoxy resin in advance, but promptly join i.e. usefulness, join in the composition epoxy resin during promptly usually as the third set of dispense glue, give and use operation to make troubles;
(3) be subjected to composition epoxy resin to have certain working hour to limit, need frequently to join glue (join the glue frequency and be generally 30～60 minutes once) in the production.The ratio of light diffusing agent in composition epoxy resin less (being generally 1～4%), join in the glue in each time, can't guarantee the light diffusing agent proportioning strict conformance in the composition epoxy resin of different batches preparation and mix, make light diffusing agent proportioning and distribution in the composition epoxy resin difference occur, the scattering of light homogeneity and the quality of the optoelectronic semiconductor component after causing encapsulating are affected.
Summary of the invention
The objective of the invention is to overcome the above-mentioned defective that prior art exists, a kind of sealing optoelectronic semiconductor elements light scattering type epoxy resin composition and preparation method thereof is provided, this light scattering type epoxy resin composition is easy to use, and good with the optoelectronic semiconductor component light scattering property of this composition epoxy resin sealing.
The present invention's light scattering type epoxy resin composition is made up of A agent and B agent, and the A agent includes Resins, epoxy 95～98 weight parts, light scattering agent 1.0～3.5 weight parts and silicone oil base adhesive accelerant 0.5～1.5 weight part; The B agent includes solidifying agent 90～97 weight parts, curing catalyst 1.0～3.5 weight parts and antioxidant 0.5～8.0 weight part.
Resins, epoxy in the described A agent can be one or two or more kinds that is selected from bisphenol A epoxide resin, bisphenol F epoxy resin, bisphenol-s epoxy resin, phenolic resin varnish (as novolak Resins, epoxy and ortho-cresol novolac epoxy resin), alicyclic type epoxy resin, nitrogenous type Resins, epoxy, hydrogenated bisphenol A epoxy resin, tetraglycidel ether epoxy resin and the triglycidyl isocyanurate; Wherein preferred bisphenol A epoxide resin, bisphenol F epoxy resin, novolak Resins, epoxy, hydrogenated bisphenol A epoxy resin or alicyclic type epoxy resin, more preferably bisphenol A epoxide resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, alicyclic type epoxy resin, described preferred epoxy has the good transparency and yellowing resistance.
Though preferred Resins, epoxy at room temperature is liquid, but preferably use the Resins, epoxy of average epoxy equivalent (weight) as 110-300, if use average epoxy equivalent (weight) to be lower than 110 Resins, epoxy, the composition that contains this Resins, epoxy can influence quality greatly because of fragility when being used for sealing optoelectronic semiconductor elements.If use average epoxy equivalent (weight) to surpass 300 Resins, epoxy, the composition that contains this Resins, epoxy can influence quality because of second-order transition temperature (Tg) reduces when being used for sealing optoelectronic semiconductor elements.
Described light scattering agent can be that senior fatty carbene carboxylic acid, aliphatic hydrocarbon dicarboxylic acid and the compound with primary hydroxyl functional group carry out the senior ester cpds that the condensation esterification forms; Described senior fatty carbene carboxylic acid can be the linear ethylenic unsaturation alkylene dicarboxylate of 10-40 carbon atom, for example cis Octadec-9-enoic Acid; The saturated dicarboxylic acid of the 4-20 carbon atom that described aliphatic hydrocarbon dicarboxylic acid can be a carboxy blocking, for example hexanodioic acid; The compound of described primary hydroxyl functional group can be the compound of 2-4 primary hydroxyl functional group, for example tetramethylolmethane; The acid esters value of this senior ester cpds can be 0-30, preferably is lower than 15.The hydroxyl value of this senior ester cpds can be 10-25, preferably is lower than 15.
Described adhesive accelerant is the coupling agent of silicane, for example γ-Qiu Jibingjisanjiayangjiguiwan, γ-sulfydryl propyl-triethoxysilicane, γ-(2, the 3-propylene oxide) propyl trimethoxy silicane, γ-(2, the 3-propylene oxide) dimethyl methyl TMOS, γ-An Bingjisanjiayangjiguiwan, γ-aminopropyl methyldiethoxysilane or γ-aminopropyl dimethyl methyl TMOS etc., the coupling agent of these silicane can be used in combination separately or with two or more form.
The solidifying agent of described B agent can be an alkylation dicarboxylic anhydride solidifying agent, for example, be selected from a kind of in hexahydrophthalic anhydride, methyl carbic anhydride, Tetra Hydro Phthalic Anhydride, methylhexahydrophthalic anhydride, the methyl tetrahydrophthalic anhydride or with two or more.Wherein preferred colourless or faint yellow acid anhydrides, as methylhexahydrophthalic anhydride or methyl tetrahydrophthalic anhydride, these alkylation dicarboxylic anhydrides can be used in combination separately or with two or more form.
Curing catalyst there are not special requirement and restriction, for example, can be to be selected from 1,8-diazabicyclo (5,4,0)-and undecylene-7, triethylenediamine, three-2,4,6-dimethylaminomethyl phenol, 2-ethyl-4-Methylimidazole, N-Methylimidazole, four-normal-butyl phosphine, four-normal-butyl phosphine-0, a kind of in 0-diethyl phosphorothioate, triphenylphosphine, tetraphenyl phosphine, tetraphenyl borate salts, tetraethylammonium bromide, the Tetrabutyl amonium bromide or with two or more.Wherein preferred 1,8-diazabicyclo (5,4,0)-undecylene-7, tetraethylammonium bromide or Tetrabutyl amonium bromide.
Antioxidant is not had special requirement and restriction yet, for example, can be to be selected from 2,6 di tert butyl 4 methyl phenol, 2,6 di t butyl phenol, dihydroxyphenyl propane, 9, a kind of in 10-dioxy-9-oxa--10-phospho hetero phenanthrene-10-oxide compound; Wherein preferred 2,6 di tert butyl 4 methyl phenol, 9,10-dioxy-9-oxa--10-phospho hetero phenanthrene-10-oxide compound.
In addition, when needed, normally used known properties-correcting agent, fire retardant, defoamer, parting agent, tinting material, pigment and other multiple additives can add being mixed into A agent or B agent in known ratio.
Its preparation method may further comprise the steps: (1) under agitation joins Resins, epoxy, light scattering agent, silicone oil base adhesive accelerant in the reactor successively, stirs under 75～85 ℃, is cooled to room temperature, makes the A agent; (2) solidifying agent, curing catalyst, antioxidant are mixed, mix evenly in 60～70 ℃, be cooled to room temperature, make the B agent.
With A agent and B agent separate storage.During use, described A agent is mixed by weight A:B=1:1 with the B agent, promptly can be used for sealing optoelectronic semiconductor elements.
The present invention's sealing optoelectronic semiconductor elements can be used for all kinds of optical semiconductor element encapsulations with light scattering type epoxy resin composition, for example LED, dot matrix display module, digital display module etc., and its application does not have particular restriction.
The present invention's light scattering type epoxy resin composition, its excellent effect is: be 12 months (1) storage period: because selected light diffusing agent and Resins, epoxy have good mutual solubility, store and also can not produce sedimentation in 12 months; (2) easy to use, only need during use A agent and B agent by waiting parts by weight to mix, packaged optoelectronic semiconductor component can obtain the light scattering effect of being satisfied with; (3) light scattering agent is evenly distributed in the cured article, no concentration gradient, and the light scattering property of packaged optoelectronic semiconductor component and quality are significantly improved and improve.
Embodiment
The invention will be further described below in conjunction with embodiment.
Embodiment 1
A agent prescription: bisphenol A epoxide resin (oxirane value 0.48～0.54ep/100g) 97.0 gram, light scattering agent is (by the condensation and making under catalyst-free of hexanodioic acid, tetramethylolmethane, cis Octadec-9-enoic Acid, acid number 13, hydroxyl value 13) 2.0 grams, γ-sulfydryl propyl-triethoxysilicane 1.0 grams, transparent violet B0.0001 gram, silane defoamer 0.003 gram;
B agent prescription: methylhexahydrophthalic anhydride 97.0 grams, Tetrabutyl amonium bromide 1.0 grams, 2,6 di tert butyl 4 methyl phenol 1.0 grams.
Preparation: (1) 80 ℃ and stir under, in bisphenol A epoxide resin, add light scattering agent, γ-sulfydryl propyl-triethoxysilicane, transparent violet B, silane defoamer, stir, remove bubble under the decompression, be cooled to room temperature, obtain the A agent; (2) 65 ℃ and stir under, in methylhexahydrophthalic anhydride, add Tetrabutyl amonium bromide, 2,6 di tert butyl 4 methyl phenol, stir, remove bubble under the decompression, be cooled to room temperature, obtain the B agent.
With A agent and B agent separate storage, room temperature storage 12 months, the contained light diffusing agent of A agent is not seen sedimentation.Mix by weight A:B=1:1 before using, stir, be used for sealing optoelectronic semiconductor elements.Optoelectronic semiconductor component with the encapsulation of present embodiment product has satisfied light scattering property.
Embodiment 2
A agent prescription: hydrogenated bisphenol A epoxy resin (oxirane value 0.39～0.43ep/100g) 97.0 gram, light scattering agent is (by the condensation and making under catalyst of hexanodioic acid, tetramethylolmethane, cis Octadec-9-enoic Acid, acid number 13, hydroxyl value 13) 2.0 grams, γ-(2, the 3-propylene oxide) dimethyl methyl TMOS 1.0 grams, transparent violet B0.0001 gram, silane defoamer 0.003 gram;
B agent prescription: methylhexahydrophthalic anhydride 91.0 grams, tetraethylammonium bromide 1.0 grams, 9,10-dioxy-9-oxa--10-phospho hetero phenanthrene-10-oxide compound 8.0 grams.
Preparation: (1) 78 ℃ and stir under, in hydrogenated bisphenol A epoxy resin, add light scattering agent, γ-sulfydryl propyl-triethoxysilicane, transparent violet B, silane defoamer, stir, remove bubble under the decompression, be cooled to room temperature, obtain the A agent; (2) 70 ℃ and stir under, in methylhexahydrophthalic anhydride, add tetraethylammonium bromide, 9,10-dioxy-9-oxa--10-phospho hetero phenanthrene-10-oxide compound stirs, and removes bubble under the decompression, is cooled to room temperature, obtains the B agent.
With A agent and B agent separate storage, room temperature storage 12 months, the contained light diffusing agent of A agent is not seen sedimentation.Mix by weight A:B=1:1 before using, stir, be used for sealing optoelectronic semiconductor elements.With the optoelectronic semiconductor component light scattering property of present embodiment product encapsulation and embodiment 1 prepared light scattering type epoxy resin composition encapsulate identical.
Embodiment 3
A agent prescription: bisphenol A epoxide resin (oxirane value 0.48～0.54ep/100g) 57.6 gram, hydrogenated bisphenol A epoxy resin (oxirane value 0.39～0.43ep/100g) 38.4 gram, light scattering agent (with embodiment 1) 3.0 grams and γ-(2, the 3-propylene oxide) propyl trimethoxy silicane 1.0 grams;
B agent prescription: solidifying agent methylhexahydrophthalic anhydride 96 grams, curing catalyst Tetrabutyl amonium bromide 2.0 grams and antioxidant 2,6 di tert butyl 4 methyl phenol 2.0 grams.
Preparation: (1) 85 ℃ and stir under, in bisphenol A epoxide resin Resins, epoxy, Hydrogenated Bisphenol A mixture, add light scattering agent, γ-(2, the 3-propylene oxide) propyl trimethoxy silicane, stir, remove bubble under the decompression, be cooled to room temperature, obtain the A agent; (2) 65 ℃ and stir under, in methylhexahydrophthalic anhydride, add tetraethylammonium bromide, 9,10-dioxy-9-oxa--10-phospho hetero phenanthrene-10-oxide compound stirs, and removes bubble under the decompression, is cooled to room temperature, obtains the B agent.
With A agent and B agent separate storage, room temperature storage 12 months, the contained light diffusing agent of A agent is not seen sedimentation.Mix by weight A:B=1:1 before using, stir, be used for sealing optoelectronic semiconductor elements.With the optoelectronic semiconductor component light scattering property of present embodiment product encapsulation and embodiment 1 prepared light scattering type epoxy resin composition encapsulate identical.
Embodiment 4
A agent prescription: bisphenol A epoxide resin (oxirane value 0.48～0.54ep/100g) 97.0 gram, light scattering agent (with embodiment 1) 2.0 grams, γ-sulfydryl propyl-triethoxysilicane 1.0 grams, transparent violet B0.0001 gram, silane defoamer 0.003 gram;
B agent prescription: methylhexahydrophthalic anhydride 67.9 grams, Tetra Hydro Phthalic Anhydride 29.1 grams, 1,8-diazabicyclo (5,4,0)-undecylene-72.0 gram and antioxidant 2,6 di t butyl phenol 1.0 grams.
Preparation: (1) 85 ℃ and stir under, in bisphenol A epoxide resin, add light scattering agent, γ-(2, the 3-propylene oxide) dimethyl methyl TMOS, stir, remove bubble under the decompression, be cooled to room temperature, obtain the A agent; (2) 62 ℃ and stir under, in methylhexahydrophthalic anhydride and Tetra Hydro Phthalic Anhydride mixture, add 1,8-diazabicyclo (5,4,0)-and undecylene-7,2,6 di t butyl phenol, stir, remove bubble under the decompression, be cooled to room temperature, obtain the B agent.
With A agent and B agent separate storage, room temperature storage 12 months, the contained light diffusing agent of A agent is not seen sedimentation.Use preceding by weight A: B=1: 1 mixes, and stirs, and is used for sealing optoelectronic semiconductor elements.With the optoelectronic semiconductor component light scattering property of present embodiment product encapsulation and embodiment 1 prepared light scattering type epoxy resin composition encapsulate identical.
Claims (9)
1, a kind of light scattering type epoxy resin composition is characterized in that, is made up of A agent and B agent, and the A agent includes Resins, epoxy 95～98 weight parts, light scattering agent 1.0～3.5 weight parts and silicone oil base adhesive accelerant 0.5～1.5 weight part; The B agent includes solidifying agent 95～98 weight parts, curing catalyst 1.0～3.5 weight parts and antioxidant 0.5～1.5 weight part.
2, light scattering type epoxy resin composition as claimed in claim 1, it is characterized in that described Resins, epoxy is one or two or more kinds that is selected from bisphenol A epoxide resin, bisphenol F epoxy resin, bisphenol-s epoxy resin, phenolic resin varnish, alicyclic type epoxy resin, nitrogenous type Resins, epoxy, hydrogenated bisphenol A epoxy resin, tetraglycidel ether epoxy resin and the triglycidyl isocyanurate.
3. light scattering type epoxy resin composition as claimed in claim 1 or 2, it is characterized in that described light scattering agent is that senior fatty carbene carboxylic acid, aliphatic hydrocarbon dicarboxylic acid and the compound with primary hydroxyl functional group carry out the senior ester cpds that the condensation esterification forms; Described senior fatty carbene carboxylic acid is the linear ethylenic unsaturation alkylene dicarboxylate of 10～40 carbon atoms, and the aliphatic hydrocarbon dicarboxylic acid is the saturated dicarboxylic acid of 4～20 carbon atoms of carboxy blocking, and the compound of primary hydroxyl functional group is the compound of 2～4 primary hydroxyl functional groups; The acid esters value of this senior ester cpds is 0～30, and hydroxyl value is 10～25.
4, light scattering type epoxy resin composition as claimed in claim 3 is characterized in that, described senior fatty carbene carboxylic acid is cis-Octadec-9-enoic Acid; Described aliphatic hydrocarbon dicarboxylic acid is a hexanodioic acid; The compound of described primary hydroxyl functional group is a tetramethylolmethane.
5, light scattering type epoxy resin composition as claimed in claim 1 or 2 is characterized in that, described adhesive accelerant is the coupling agent of silicane.
6, light scattering type epoxy resin composition as claimed in claim 5, it is characterized in that, the coupling agent of described silicane is to be selected from γ-Qiu Jibingjisanjiayangjiguiwan, γ-sulfydryl propyl-triethoxysilicane, γ-(2, the 3-propylene oxide) one or two or more kinds in propyl trimethoxy silicane, γ-(2, the 3-propylene oxide) dimethyl methyl TMOS, γ-An Bingjisanjiayangjiguiwan, γ-aminopropyl methyldiethoxysilane or the γ-aminopropyl dimethyl methyl TMOS.
7, light scattering type epoxy resin composition as claimed in claim 1 or 2 is characterized in that, described solidifying agent is an alkylation dicarboxylic anhydride solidifying agent.
8, light scattering type epoxy resin composition as claimed in claim 1 or 2, it is characterized in that described alkylation dicarboxylic anhydride solidifying agent is selected from a kind of in hexahydrophthalic anhydride, methyl carbic anhydride, Tetra Hydro Phthalic Anhydride, methylhexahydrophthalic anhydride, the methyl tetrahydrophthalic anhydride or with two or more.
9, a kind of preparation method as one of claim 1-8 described light scattering type epoxy resin composition, it is characterized in that, may further comprise the steps: (1) mixes Resins, epoxy, light scattering agent and silicone oil base adhesive accelerant in 75～85 ℃, be cooled to room temperature, make the A agent; (2) solidifying agent, curing catalyst and antioxidant are mixed, mix in 60～70 ℃, be cooled to room temperature, make the B agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910042492XA CN101457013B (en) | 2009-01-14 | 2009-01-14 | Light scattering type epoxy resin composition and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910042492XA CN101457013B (en) | 2009-01-14 | 2009-01-14 | Light scattering type epoxy resin composition and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101457013A true CN101457013A (en) | 2009-06-17 |
| CN101457013B CN101457013B (en) | 2011-06-15 |
Family
ID=40768147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910042492XA Expired - Fee Related CN101457013B (en) | 2009-01-14 | 2009-01-14 | Light scattering type epoxy resin composition and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101457013B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102775736A (en) * | 2012-08-16 | 2012-11-14 | 上纬（上海）精细化工有限公司 | LED (Light-Emitting Diode) package material and composite used in same |
| CN104203933A (en) * | 2012-03-30 | 2014-12-10 | 三菱化学株式会社 | Method for manufacturing epoxy compound, and catalyst composition for epoxylating reaction |
| CN104497486A (en) * | 2014-12-16 | 2015-04-08 | 浙江华正新材料股份有限公司 | Anti-yellowing modified halogen-free white resin composition, laminated board and preparation method of composition |
| CN104672785A (en) * | 2014-06-30 | 2015-06-03 | 广东丹邦科技有限公司 | Epoxy molding compound and preparation method thereof |
| CN104804688A (en) * | 2015-04-21 | 2015-07-29 | 汕头市骏码凯撒有限公司 | Outdoor LED packing matt epoxy resin package adhesive and preparation method thereof |
| CN110416196A (en) * | 2019-04-11 | 2019-11-05 | 浙江宙辉电器有限公司 | Light-emitting diodes body side surface projection light emitting device and preparation method thereof |
-
2009
- 2009-01-14 CN CN200910042492XA patent/CN101457013B/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9650353B2 (en) | 2012-03-30 | 2017-05-16 | Mitsubishi Chemical Corporation | Method for producing epoxy compound and catalyst composition for epoxidation reaction |
| CN104203933A (en) * | 2012-03-30 | 2014-12-10 | 三菱化学株式会社 | Method for manufacturing epoxy compound, and catalyst composition for epoxylating reaction |
| US10730846B2 (en) | 2012-03-30 | 2020-08-04 | Mitsubishi Chemical Corporation | Method of producing epoxy compound and catalyst composition for epoxidation reaction |
| TWI660950B (en) * | 2012-03-30 | 2019-06-01 | 日商三菱化學股份有限公司 | Method of producing epoxy compound and epoxidation reaction reagent composition |
| CN104203933B (en) * | 2012-03-30 | 2016-11-16 | 三菱化学株式会社 | The manufacture method of epoxide and epoxidation reaction carbon monoxide-olefin polymeric |
| CN107082870A (en) * | 2012-03-30 | 2017-08-22 | 三菱化学株式会社 | Epoxy composite |
| CN102775736A (en) * | 2012-08-16 | 2012-11-14 | 上纬（上海）精细化工有限公司 | LED (Light-Emitting Diode) package material and composite used in same |
| CN104672785B (en) * | 2014-06-30 | 2019-04-09 | 广东丹邦科技有限公司 | A kind of epoxy-plastic packaging material and preparation method thereof |
| CN104672785A (en) * | 2014-06-30 | 2015-06-03 | 广东丹邦科技有限公司 | Epoxy molding compound and preparation method thereof |
| CN104497486A (en) * | 2014-12-16 | 2015-04-08 | 浙江华正新材料股份有限公司 | Anti-yellowing modified halogen-free white resin composition, laminated board and preparation method of composition |
| CN104804688B (en) * | 2015-04-21 | 2017-03-08 | 汕头市骏码凯撒有限公司 | A kind of outdoor LED encapsulation dumb light type epoxy encapsulation glue and preparation method thereof |
| CN104804688A (en) * | 2015-04-21 | 2015-07-29 | 汕头市骏码凯撒有限公司 | Outdoor LED packing matt epoxy resin package adhesive and preparation method thereof |
| CN110416196A (en) * | 2019-04-11 | 2019-11-05 | 浙江宙辉电器有限公司 | Light-emitting diodes body side surface projection light emitting device and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101457013B (en) | 2011-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101457013B (en) | Light scattering type epoxy resin composition and preparation method thereof | |
| TWI483962B (en) | Composition for transfer molding, substrate for mounting optical semiconductor device and method for fabricating the same, and optical semiconductor device | |
| CN100509987C (en) | Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same | |
| TWI522414B (en) | Curable resin composition and cured article thereof | |
| CN103492482B (en) | Light reflection hardening resin composition and optical semiconductor device | |
| CN102276958B (en) | Epoxy resin composition for optical use, optical component using the same, and optical semiconductor device obtained using the same | |
| CN102782000B (en) | Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition | |
| SG187259A1 (en) | Functional particle, functional particle group, filler, resin composition for electronic component, electronic component and semiconductor device | |
| KR20110041497A (en) | Optical semiconductor sealing resin composition and optical semiconductor device using same | |
| CN101072807A (en) | Thermosetting epoxy resin composition and use thereof | |
| CN103168074A (en) | Curable epoxy resin composition | |
| KR20120095879A (en) | Curable resin composition for optical semiconductor encapsulation, and cured product of same | |
| CN102985458A (en) | Method for producing cured product and cured product | |
| KR20140009102A (en) | Curing agent composition for epoxy resin, curable resin composition, and cured product thereof | |
| TW200415197A (en) | Epoxy resin composition for optical semiconductor package | |
| CN1186387C (en) | Method for preparing epoxy resin composition for sealing optoelectronic semiconductor elements | |
| CN114316869A (en) | Two-component thermosetting epoxy resin composition and application thereof, two-component thermosetting epoxy resin and preparation method and application thereof | |
| JP2017103470A (en) | Board for mounting optical semiconductor element and manufacturing method therefor, and optical semiconductor device | |
| JP6910112B2 (en) | Resin composition for optical semiconductor, its manufacturing method, and optical semiconductor device | |
| TW201527380A (en) | Heat-curable resin composition for optical semiconductor device, lead frame for optical semiconductor device and obtained using same, and optical semiconductor device | |
| JP5523816B2 (en) | Modified resin composition, method for producing the same, and curable resin composition containing the same | |
| JP5401907B2 (en) | Method for manufacturing thermosetting resin composition, substrate for mounting optical semiconductor element, method for manufacturing the same, and optical semiconductor device | |
| JP2011052102A (en) | Epoxy resin curing agent, method for producing the same and epoxy resin composition | |
| TW201330333A (en) | Resin composition for sealing optical semiconductor and optical semiconductor device using the same | |
| JP2014040534A (en) | High-purity alicyclic diepoxy compound, curable epoxy resin composition, cured product, transparent encapsulation material, and light emitting element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110615 Termination date: 20180114 |