CN110415949A - Connector and electronic device - Google Patents
Connector and electronic device Download PDFInfo
- Publication number
- CN110415949A CN110415949A CN201810405228.7A CN201810405228A CN110415949A CN 110415949 A CN110415949 A CN 110415949A CN 201810405228 A CN201810405228 A CN 201810405228A CN 110415949 A CN110415949 A CN 110415949A
- Authority
- CN
- China
- Prior art keywords
- conductive
- transmission line
- substrate
- hole
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 230000005540 biological transmission Effects 0.000 claims abstract description 62
- 230000004308 accommodation Effects 0.000 claims abstract description 28
- 239000002131 composite material Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004804 winding Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 description 3
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/04—Leading of conductors or axles through casings, e.g. for tap-changing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F2027/297—Terminals; Tapping arrangements for signal inductances with pin-like terminal to be inserted in hole of printed path
Abstract
This application discloses a kind of connector and electronic device, which includes integrated transformer and joint assembly, and integrated transformer includes: substrate, magnetic core, transmission line layer and conduct piece.Multiple annular accommodation grooves are offered on substrate, and substrate is divided into central part and outer part and opens up inside and outside via hole respectively on central part and outer part；Magnetic core is placed in accommodation groove；The transmission line layer of substrate opposite sides includes multiple wire patterns being connected across between inside and outside via hole；Conduct piece in the via hole of inside and outside is sequentially connected with the wire pattern in two transmission line layers, and then forms the wire loop around magnetic core；Central part, outer part, magnetic core, conduct piece and transmission line layer on substrate constitute multiple transformers and/or multiple filters；Joint assembly includes that shell and multiple first be electrically connected with integrated transformer are conductively connected head.By forming the higher wire loop of consistency of winding magnetic core, to improve the consistency of transformer.
Description
Technical field
This application involves technical field of integrated circuits, more particularly to a kind of connector and electronic device.
Background technique
Medium of the connector as signal transmission & control in modern comfort, it has also become indispensable member in modern comfort
Device.In order to more effectively save space, reduce manufacture and assembly cost, the prior art, which is used, is integrated in company for integrated transformer
The inside of device is connect, to improve the degree of integration of connector, reduces volume.Frequently with the coil of hand wound in integrated transformer.
With the needs of the development of network technology and transmission speed upgrading, increasingly to the performance requirement of integrated transformer
The coil consistency of height, existing hand wound is poor, jitter and high production cost, and production efficiency is low.
Summary of the invention
The application is mainly solving the technical problems that provide a kind of connector and electronic device, to solve to connect in the prior art
It connects the integrated transformer in device and uses the technical problem that manual coiling consistency of performance is poor and production efficiency is low.
In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of connector, comprising: collection
At transformer, comprising: at least one layer of substrate offers multiple annular accommodation grooves on each substrate；Each annular is held
It sets slot and is divided into the substrate and the central part set is enclosed by the annular accommodation groove and around the annular accommodation groove setting
Outer part；Multiple inner via holes through the substrate, and each outer part are offered on each central part
On offer through multiple turned on outside holes of the substrate；Multiple magnetic cores are placed in the corresponding annular accommodation groove；
Transmission line layer, the opposite two sides of each substrate are respectively arranged with a transmission line layer；Each transmission line layer is wrapped
Multiple wire patterns of the circumferentially-spaced arrangement along the annular accommodation groove are included, each wire pattern is connected across corresponding one
Between a inner via hole and a turned on outside hole；With multiple conduct pieces, setting in the inner via hole and
The conducting wire figure in two transmission line layers in the turned on outside hole, for being sequentially connected on each substrate
Case, and then form the wire loop that electric current can be transmitted around the magnetic core；Wherein, multiple centers on each substrate
Portion, the corresponding outer part and multiple magnetic cores, multiple conduct pieces, and the institute positioned at the substrate opposite sides
It states transmission line layer and constitutes the multiple transformers and/or multiple filters arranged according to default arranging rule；Joint assembly, including shell
And multiple first be arranged on the shell are conductively connected head, multiple described first are conductively connected head and the integrated transformation
Device electrical connection.
In order to solve the above technical problems, another technical solution that the application uses is: providing a kind of electronic device, the electricity
Sub-device includes motherboard and connector above, and conductive jack is provided on the motherboard, and the connector passes through multiple described
Second is conductively connected head and the conductive jack grafting.
Above-described embodiment has the beneficial effect that by opening up annular accommodation groove on substrate, and magnetic core is then embedded to annular
In accommodation groove, and it is respectively formed in the transmission line layer in substrate opposite sides face the more of circumferentially-spaced arrangement along annular accommodation groove
A wire pattern, each wire pattern are connected across between a corresponding inner via hole and a turned on outside hole.Two sides
Multiple wire patterns pass through the conduct piece that is arranged in inner via hole and turned on outside hole and be sequentially connected with, to form winding
The wire loop of magnetic core transmission electric current.To form the higher wire loop of consistency on magnetic core, integrated transformer is improved
Consistency improves production efficiency.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the perspective view of the connector in one embodiment of the application；
Fig. 2 is the decomposition texture schematic diagram of connector in Fig. 1；
Fig. 3 is the overlooking structure diagram of integrated transformer in Fig. 1；
Fig. 4 is the schematic perspective view of substrate in Fig. 3；
Fig. 5 is the schematic cross-sectional view of integrated transformer in Fig. 1；
Fig. 6 is the structural schematic diagram of another embodiment of integrated transformer in Fig. 1；
Fig. 7 is the structural schematic diagram that integrated transformer is provided with bonding layer in Fig. 1；
Fig. 8 is the structural schematic diagram that integrated transformer is provided with composite layer in Fig. 1；
Fig. 9 is the schematic perspective view of integrated transformer in another embodiment of the application；
Figure 10 is the decomposition texture schematic diagram of the connector in another embodiment of the application；
Figure 11 is the schematic perspective view of the connector in Figure 10；
Figure 12 is the structural schematic diagram of electronic device in another embodiment.
Specific embodiment
Below by the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described implementation
Example is merely a part but not all of the embodiments of the present application.Based on the embodiment in the application, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model of the application protection
It encloses.
In one aspect, the application provides a kind of connector 10, as depicted in figs. 1 and 2, in the present embodiment, the connection
Device 10 is generally can include: integrated transformer 100 and the joint assembly 200 being electrically connected with integrated transformer 100.
Fig. 3-5 shows the structure of the integrated transformer 100 in one embodiment of the application.Please continue to refer to Fig. 3-5, integrate
Transformer 100 includes at least one layer of substrate 110, multiple magnetic cores 120, transmission line layer 130 and multiple conduct pieces 140.Specifically such as
Shown in Fig. 3, in the present embodiment, integrated transformer 100 may include a laminar substrate 110, while refering to Fig. 4, open on substrate 110
Equipped with multiple annular accommodation grooves 112, substrate 110 is divided by each annular accommodation groove 112 to be enclosed by annular accommodation groove 112 and sets
The outer part 116 of center portion 114 and corresponding central part 114.
Multiple inner via holes 115 through substrate 110, multiple inner via holes are offered on each central part 114
115 are arranged adjacent to the lateral wall of the central part 114, and being circumferentially arranged along the central part 114.Accordingly, in each outer part
Multiple turned on outside holes 117 through substrate 110 are offered on 116, and multiple turned on outside holes 117 are adjacent to outer part 116
Inner sidewall setting.That is: inner via hole 115 is set in the top ring of central part 114 around the top internal perisporium of the annular accommodation groove 112
It sets, turned on outside hole 117 is arranged in the top ring of outer part 116 around the top peripheral wall of the annular accommodation groove 112.
Each magnetic core 120 is accordingly accommodated in one on substrate 110 annular accommodation groove 112, the section shape of magnetic core 120
The cross sectional shape of shape and annular accommodation groove 112 is substantially the same, in order to which magnetic core 120 can be accommodated in annular accommodation groove 112.Its
In, the cross-sectional shape of the magnetic core 120 can be circular ring shape, side's annular, ellipse etc..Accordingly, the annular accommodation groove 112
Shape can be circular ring shape, side's annular, ellipse etc..
In the present embodiment, toroidal core 120 can successively be folded by several annular flakes and be set, can also be by long narrow gold
Belong to material volume around forming, can also be sintered for several metal mixtures.The generation type of toroidal core 120 can have more
Kind, according to its material difference flexible choice, the application is not construed as limiting.
Magnetic core 120 can be iron core, can also be made of various magnetic metal tea oxides, for example, manganese-zinc ferrite and
Nickel-zinc ferrite etc..Wherein, manganese-zinc ferrite has high magnetic permeability and high magnetic flux density and more low-loss characteristic, nickel-zinc
Ferrite has the characteristics such as high unit area impedance and low magnetic permeability.It is original that magnetic core 120 in the present embodiment, which selects manganese-zinc ferrite,
Material, is formed using high temperature sintering.
As shown in Figure 3 and Figure 5, in the present embodiment, a transmission line layer is respectively arranged in the opposite two sides of substrate 110
130 each transmission line layers 130 include multiple wire patterns 136 along the circumferentially-spaced arrangement of annular accommodation groove 112, and every
Each wire pattern 136 in a transmission line layer 130 is connected across a corresponding inner via hole 115 and a turned on outside
Between hole 117.
Further, a conduct piece is provided in each inner via hole 115 and each turned on outside hole 117
140, and the both ends of conduct piece 140 are attached with the wire pattern 136 in each transmission line layer 130 respectively.Conduct piece 140 is suitable
Wire pattern 136 in two transmission line layers 130 of secondary connection, it is possible thereby to form the wire loop for transmitting electric current around magnetic core 120.
Wherein, conduct piece 140 can be metal column, or conductive metal layer.When conduct piece 140 is to be arranged in inside
When metal column in via hole 115 and turned on outside hole 117, the diameter of the metal column is less than or equal to the inside conducting where it
The diameter in hole 115 or turned on outside hole 117.When conduct piece 140 is conductive metal layer, which can be for example, by
The modes such as plating, coating are formed on the inner wall in inner via hole 115 and turned on outside hole 117.It is used to form conduct piece 140
Material may include being not limited to copper, aluminium, iron, nickel, gold, silver, platinum family, chromium, magnesium, tungsten, molybdenum, lead, tin, indium, zinc or its alloy etc..
Please continue to refer to shown in Fig. 3-5, a central part 114 on substrate 110,116, magnetic cores of corresponding outer part
120 and multiple conduct pieces 140 and the wire pattern 136 being located in two transmission line layers 130 corresponding with each magnetic core 120 can
To form a transformer or filter.Wherein, the difference of transformer and filter is to wind the wire loop of magnetic core 120
Winding method is different, and transformer includes an input line and a coupling line, and filter includes an input line and output line.
Annular accommodation groove 112 on one substrate 110 can be completely used for forming transformer, can also be completely used for forming filter
Wave device, can be used to form transformer with a part, and a part is used to form filter, is not construed as limiting herein.Therefore, Mei Yiji
Multiple central parts 114, corresponding outer part 116 and multiple magnetic cores 120, multiple conduct pieces 140 on plate 110, and being located at should
The transmission line layer 130 of 110 opposite sides of substrate may make up multiple transformers and/or multiple filtering according to the arrangement of default arranging rule
Device.
In one embodiment, an integrated transformer 100 can only include a laminar substrate 110, on the substrate 110 simultaneously
It is formed with multiple transformers and multiple filters.I.e. multiple transformers and multiple filters share the same substrate 110.At this point,
Transformer and filter in integrated transformer 100 are located on the same floor.
In another embodiment, an integrated transformer 100 also may include multilager base plate 110, and on each laminar substrate 110
It is formed simultaneously with multiple transformers and multiple filters.
In another embodiment, integrated transformer 100 can also include at least one first substrate and at least one the
Two substrates.Wherein, the annular accommodation groove 112 on first substrate is completely used for forming transformer, the annular accommodating in the second substrate
Slot 112 is completely used for shaping filter.At this point, the transformer and filter in integrated transformer 100 are located at different layers, and
An electromagnetic assembly can be formed between at least one transformer and at least one filter between adjacent layer.For example, the first base
An at least transformer on plate and at least filter in the second substrate can form an electromagnetic assembly, in each electromagnetic assembly
All transformers and filter electrical connection, be not electrically connected between each group electromagnetic assembly.
As shown in fig. 6, in the present embodiment, integrated transformer 100 includes a laminar substrate 110, and on a laminar substrate 110
It is respectively formed with multiple transformers 152 and multiple filters 154, i.e. transformer 152 and filter 154 shares same substrate 110.
And a transformer 152 and an electrical connection of filter 154 on substrate 110, to form one group of electromagnetic assembly 150.This reality
It applies in example, refering to Fig. 6, four groups of electromagnetic assemblies 150, the transformer 152 in every group of electromagnetic assembly 150 is formed on substrate 110
It is electrically connected with filter 154, and mutually without electrical connection between each group electromagnetic assembly 150.
Please continue to refer to Fig. 7, in one embodiment of the application, with the side of transmission line layer 130 on integrated transformer 100
It is additionally provided with the bonding layer 160 for fixing and being electrically connected electronic component 300.Specifically, there is transmission directly on substrate 110
Bonding layer 160 is set on the side of line layer 130, and electronic component 300 is connected directly on bonding layer 160.Wherein, " directly
Connection " is referred to herein as electronic component 300 is not connected on bonding layer 160 by other intermediate mediums.In fact, the electronics
Element 300 includes leading-out terminal, and the leading-out terminal is directly connected to the bonding layer 160.
For example, in the embodiment shown in fig. 7, the side of the substrate 110 of integrated transformer 100 has the biography of same layer setting
Defeated line layer 130 and bonding layer 160, wherein electronic component 300 is directly connected on the bonding layer 160.Bonding layer 160 and one
The setting of 130 same layer of transmission line layer, the not overlapping and electrical connection of side.That is, base is arranged in bonding layer 160 and transmission line layer 130 simultaneously
The different zones on the same surface of plate 110, and bonding layer 160 can be for example, by conductive connecting and the transmission line being arranged with its same layer
Layer 130 is electrically connected.In other embodiments, which can also be electrically connected with the transmission line layer 130 of 110 other side of substrate
It connects.For example, can be carried on the back by the way that conductive through hole (not shown) is arranged on bonding layer 160 by conductive through hole and substrate 110
Electrical connection is realized to the transmission line layer 130 of 160 side of bonding layer, it is not limited here.
As shown in figure 8, in another embodiment, integrated transformer 100 further includes composite layer 170.Wherein, composite layer 170
The side back to substrate 110 of the one layer transmission line layer 130 farthest apart from substrate 110 is set.The composite layer 170 is for being arranged
Electronic component 300 so that electronic component 300 with and the neighbouring at least transmission line layer 130 of the composite layer 170 be electrically connected.
In this embodiment, composite layer 170 includes articulamentum 172 and conductive layer 174.Wherein, which is located at and leads
Between electric layer 174 and corresponding transmission line layer 130, for conductive layer 174 to be fixed to the transmission line layer of integrated transformer 100
On 130, and conductive layer 174 and transmission line layer 130 are separated into anti-short circuit.
Further, in other implementations, connector 10 can also include integrated transformer 100 and integrated change
The joint assembly 200 and be arranged on integrated transformer 100 and be electrically connected with integrated transformer 100 that depressor 100 is electrically connected
Electronic component 300.The specific setting structure of integrated transformer 100 please refers to above, and this will not be repeated here.
Electronic component 300 is arranged on integrated transformer 100, in particular to electronic component 300 is arranged in integrated transformer
On 100 bonding layer as shown in FIG. 6 160 or on composite layer 170 as shown in Figure 7.
In one embodiment, the conductive layer 174 of the composite layer 170 is pad layer, and electronic component 300 is sticked or welds
On conductive layer 174.
The quantity that the electronic component 300 on bonding layer 160 or conductive layer 174 is arranged in is one or more, electronic component
300 can include but is not limited to capacitor, resistance and inductance etc..The composition tool in addition, multiple electronic components 300 can also be connected to each other
There are the circuit of certain function, such as filter circuit etc..When the connection of multiple electronic components 300 forms filter circuit, can filter out
By the interference signal in treated the signal of integrated transformer 100, to improve the performance of integrated transformer 100.
In the present embodiment, the connection terminal for connecting with joint assembly 200 is additionally provided on integrated transformer 100.
In one embodiment, as shown in Figures 2 and 3, which can be multiple first conductive through hole 180a.First is conductive
Through-hole 180a axially penetrates through integrated transformer 100 along inner via hole 115, and is electrically connected with an at least transmission line layer 130, and
And conductive material is formed on its inner wall.The gold in conductive material and inner via hole 115 in first conductive through hole 180a
The generation type for belonging to layer is identical, and two conductive materials are identical can also be different, and is not especially limited herein.
In another embodiment, as shown in figure 9, the connection terminal can be conductive for multiple first with preset length
Pin 180b.The one side vertical with transmission line layer 130 of integrated transformer 100 is arranged in multiple first conductive pin 180b
On, multiple first conductive pin 180b are intervally installed, and every one first conductive pin 180b with an at least transmission line layer
130 electrical connections.
Wherein, the preset length of first conductive pin 180b can be greater than integrated transformer 100 along inner via hole 115
1/5th and the height axial along inner via hole 115 less than or equal to integrated transformer 100 of axial height.That is, the
The length of one conductive pin 180b can be greater than 1/5th of 100 height of integrated transformer.
In the present embodiment, the length of the first conductive pin 180b is equal to integrated transformer 100 along 115 axis of inner via hole
To height, i.e., multiple the first conductive pin 180b being spaced each other are set on entire side.Specifically, with transmission line layer
Circular groove 182 compatible with every one first conductive pin 180b is opened up on 130 vertical sides, by the first conductive pin
180b is arranged in circular groove 182.
In the present embodiment, multiple circular grooves 182 can be first opened up on the side vertical with transmission line layer 130,
Then the first conductive pin 180b is formed for example, by the mode for coating or being electroplated in circular groove 182.Certainly, at it
In his embodiment, the first conductive pin 180b can also be welded in for example, by the mode of welding in circular groove 182
In circular groove 182.The application is not specifically limited the generation type of first conductive pin 180b.
The connection terminal of existing integrated transformer 100 is arranged in transmission line layer 130 more, due in transmission line layer 130
Multiple wire patterns 136 and other electronic components 300 are usually provided with, thus the region for connection terminal to be arranged is smaller, holds
Connection terminal is easily caused to connect with joint assembly 200 unstable.
The application is formed in hole and is led by punching on the surface parallel with transmission line layer 130 of integrated transformer 100
Electric material is to form the first conductive through hole 180a being electrically connected with an at least transmission line layer 130；Or it hangs down with transmission line layer 130
The the first conductive pin 180b of preset length being electrically connected with an at least transmission line layer 130 is set on straight side wall, so that with connecing
The area for the connection terminal that head assembly 200 connects increases, so that the connection of connection terminal and joint assembly 200 is more firm.
Continue as shown in Fig. 2, in the present embodiment, joint assembly 200 generally may include shell 210 and be arranged in shell
Multiple first on body 210 are conductively connected head 220, and joint assembly 200 is conductively connected head 220 and integrated transformation by multiple first
Device 100 realizes electrical connection.
As shown in Fig. 2, in one embodiment, multiple first, which are conductively connected head 220, is arranged side by side, and every 1 first leads
It is conductive that electrical connector 220 may each comprise sequentially connected first conductive connection part 222, the second conductive connection part 224 and third
Interconnecting piece 226.Wherein, there is an angle between the first conductive connection part 222 and the second conductive connection part 224, and angle is less than
90°；Second conductive connection part 224 is vertical with third conductive connection part 226, i.e., the second conductive connection part 224 connects with third conduction
Angle between socket part 226 is equal to 90 °.
Accordingly, multiple the second conductive connection parts that head 220 is conductively connected with every one first are provided on shell 210
224 compatible mounting grooves 212, and in the position of corresponding third conductive connection part 226 to be also provided with one perforative fixed for shell 210
Position hole 214.Second conductive connection part 224 is accommodated in mounting groove 212, and third conductive connection part 226 is worn from location hole 214
Out, and on integrated transformer 100 the first conductive through hole 180a or the first conductive pin 180b connect, be achieved in first
It is conductively connected being electrically connected between head 220 and integrated transformer 100.
Specifically, in one embodiment, as shown in Fig. 2, when the connection terminal on integrated transformer 100 is first conductive logical
When the 180a of hole, third conductive connection part 226 is inserted into the first conductive through hole 180a, passes through the conduction in the first conductive through hole 180a
Material is contacted with third conductive connection part 226, to realize being electrically connected for joint assembly 200 and integrated transformer 100.
In another embodiment, in conjunction with Fig. 2 and Fig. 9, when the connection terminal on integrated transformer 100 is arranged on side wall
The first conductive pin 180b when, third conductive connection part 226 is welded with the first conductive pin 180b, or uses conducting resinl
(not shown) is bonded third conductive connection part 226 and the first conductive pin 180b, to realize joint assembly 200 and integrate
The electrical connection of transformer 100.
Figure 10 shows another embodiment of the first conductive connection head of the application.As shown in Figure 10, in another reality
It applies in mode, multiple first, which are conductively connected head 220, is arranged side by side, and every one first conductive connection head 220, which may each comprise, to be connected to each other
The first conductive connection part 222a and the second conductive connection part 224a.First conductive connection part 222a and the second conductive connection part
There is an angle between 224a, and angle is less than 90 °.
Accordingly, multiple the second conductive connection parts that head 220 is conductively connected with every one first are provided on shell 210
224 compatible mounting grooves 212.The part second conductive connection part 224a is accommodated in mounting groove 212, and second is conductively connected
Portion 224a is further pierced by the mounting groove 212 far from one end of the first conductive connection part 222a and is electrically connected to integrated transformer
100, it thus can realize that first is conductively connected between head 220 and integrated transformer 100 by the second conductive connection part 224a
Electrical connection.
Please continue to refer to Figure 10, in the present embodiment, set on a side surface of the integrated transformer 100 close to shell 210
Multiple first pads 190 are equipped with, and multiple first pads 190 are positioned close to the side of joint assembly 200.Every one second is conductive
Interconnecting piece 224a is carried out welding with corresponding first pad 190 or is glued using conducting resinl after being pierced by mounting groove 212
It connects, to realize being electrically connected between the second conductive connection part 224a and integrated transformer 100.
In above-mentioned two embodiment, all first are conductively connected where the second conductive connection part 224 or 224a of head 220
Plane is parallel to each other with the plane where the transmission line layer 130 of integrated transformer 100.Certainly, in other embodiments, Suo You
One be conductively connected the second conductive connection part 224 of head 220,224a where plane can also be with the transmission of integrated transformer 100
Plane where line layer 130 is mutually perpendicular to.
In the above-mentioned two embodiment of the application, by the way that multiple first conductive connection heads 220 are fixed on shell 210, and
It is further connect with integrated transformer 100, the position of multiple first conductive connections heads 220 can be made relatively fixed, thus increased
The connection reliability of strong joint assembly 200 and integrated transformer 100.
Refering to Fig. 2 and Figure 10, in the present embodiment, integrated transformer 100 is additionally provided with far from the side of joint assembly 200
Multiple second conductive through holes 184, the second conductive through hole 184 axially penetrate through integrated transformation along inner via hole (not shown)
Device 100, and every one second conductive through hole 184 is electrically connected with an at least transmission line layer.The structure and formation of second conductive through hole 184
Mode and the structure of the first conductive through hole 180a are identical as generation type, please refer to the setting of the first conductive through hole 180a, herein
It repeats no more.
In the present embodiment, continuing with Fig. 2 and Figure 10, connector 10 further comprises multiple spaced second leading
Electrical connector 230, for connector 10 to be electrically connected with external circuit.Wherein, the second conductive connection head 230 can be conduction
Needle.
In one embodiment, which is only arranged on integrated transformer 100.Specifically, one end of conductive pin can
Be plugged in the second conductive through hole 184 and be electrically connected with second conductive through hole 184, the extension of the other end of conductive pin be pierced by this
Two conductive through holes 184, for being electrically connected with external circuit.Wherein, conductive pin can be welded with the second conductive through hole 184, or
Person is connected to the inner wall of second conductive through hole 184, to realize being electrically connected for conductive pin and the second conductive through hole 184.
In one embodiment, external circuit is located at side of the integrated transformer 100 far from shell 210.At this point, conductive
The other end of needle extends along the direction far from the shell 210 is pierced by the second conductive through hole 184, and is then electrically connected with external circuit
It connects.
In another embodiment, shell 210 is between external circuit and integrated transformer 100.At this point, such as Fig. 1-2
Shown, the length of shell 210 is smaller than the length of integrated transformer 100, so that open up on the integrated transformer 100 second leads
Through-hole 184 is exposed without to be blocked by shell 210.Therefore, second conductive through hole 184 is pierced by the other end extension of conductive pin
When, conductive pin is without going past shell 210.
Certainly, in another embodiment, which may be disposed on the shell 210 of joint assembly 200.Specific such as Figure 10
With shown in Figure 11, in the present embodiment, the length of the shell 210 can be equal to or greater than integrated transformer 100 length.In addition,
It can be set multiple fixation holes 216 on shell 210, each fixation hole 216 and every one second conductive through hole 184 are coaxial corresponding to be set
It sets.One end of conductive pin is pierced by from the side of shell 210 by fixation hole 216, for being connect with external circuit, and conductive pin
The other end is inserted into the second conductive through hole 184 and is electrically connected with the second conductive through hole 184.Wherein, which can be with second
Conductive through hole 184 welds, or is connected to the inner wall of second conductive through hole 184, to realize that conductive pin and the second conduction are logical
The electrical connection in hole 184.The advantages of this arrangement are as follows the fixation hole 216 on shell 210 can play the work of positioning to conductive pin
With so that the connection between the second conductive through hole 184 connecting with conductive pin and external circuit is more stable.
On the other hand, Figure 12 is please referred to, the application also provides a kind of electronic device 20, which includes motherboard 12
With connector 10.Wherein, the structure of connector 10 is as it was noted above, details are not described herein again.Multiple conductions are provided on motherboard 12
Jack 14, every one second on connector 10 is conductively connected the grafting corresponding with each conductive jack 14 of head 230, to realize connector
10 are electrically connected with motherboard 12.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (20)
1. a kind of connector characterized by comprising
Integrated transformer, comprising:
At least one layer of substrate offers multiple annular accommodation grooves on each substrate；Each annular accommodation groove will be described
Substrate, which is divided into, encloses the central part set by the annular accommodation groove and around the outer part of the annular accommodation groove setting；It is each
Multiple inner via holes through the substrate are offered on the central part, and are offered and passed through on each outer part
Wear multiple turned on outside holes of the substrate；
Multiple magnetic cores are placed in the corresponding annular accommodation groove；
Transmission line layer, the opposite two sides of each substrate are respectively arranged with a transmission line layer；Each transmission line layer
It include multiple wire patterns along the circumferentially-spaced arrangement of the annular accommodation groove, each wire pattern is connected across correspondence
An inner via hole and a turned on outside hole between；With
Multiple conduct pieces are arranged in the inner via hole and the turned on outside hole, for being sequentially connected with each base
The wire pattern in two transmission line layers on plate, and then form the coil time that electric current can be transmitted around the magnetic core
Road；
Wherein, multiple central parts on each substrate, the corresponding outer part and multiple magnetic cores, Duo Gesuo
Conduct piece is stated, and constitutes the multiple changes arranged according to default arranging rule positioned at the transmission line layer of the substrate opposite sides
Depressor and/or multiple filters；
Joint assembly, including shell and the multiple first conductive connections heads being arranged on the shell, multiple described first are led
Electrical connector is electrically connected with the integrated transformer.
2. connector according to claim 1, which is characterized in that multiple transformers and multiple filters share
The same substrate.
3. connector according to claim 1, which is characterized in that at least one layer of substrate includes an at least first substrate
An at least the second substrate；Transformer is completely formed at least one first substrate；In at least one the second substrate all
Shaping filter.
4. connector according to claim 1, which is characterized in that each first conductive connection head includes connecting each other
The first conductive connection part and the second conductive connection part connect；Second conductive connection part is arranged in the shell, and with institute
State integrated transformer contact；Angle between first conductive connection part and second conductive connection part is less than 90 °.
5. connector according to claim 4, which is characterized in that plane where all second conductive connection parts with
Plane where the transmission line layer is parallel.
6. connector according to claim 5, which is characterized in that side table of the integrated transformer close to the shell
Multiple first pads are provided on face, multiple second conductive connection parts and multiple first pads are corresponded and welded.
7. connector according to claim 1, which is characterized in that each first conductive connection head includes sequentially connecting
The first conductive connection part, the second conductive connection part and the third conductive connection part connect, first conductive connection part and described
For angle between second conductive connection part less than 90 °, second conductive connection part is vertical with the third conductive connection part, and
Plane where all second conductive connection parts is parallel with the plane where the transmission line layer.
8. connector according to claim 7, which is characterized in that the integrated transformer is conductive close to multiple described first
The side of connector is provided with multiple the first conductive through holes for axially penetrating through the integrated transformer along the inner via hole,
Each first conductive through hole is electrically connected at least one transmission line layer；Each third conductive connection part insertion pair
It answers in first conductive through hole, and be electrically connected with first conductive through hole.
9. connector according to claim 7, which is characterized in that the integrated transformer it is vertical with the transmission line layer
One side on be provided with multiple the first conductive pins with preset length, multiple first conductive pins, which are spaced each other, to be set
It sets, and each first conductive pin is electrically connected at least one transmission line layer.
10. connector according to claim 9, which is characterized in that multiple third conductive connection parts with it is multiple described
First conductive pin is corresponded and is electrically connected.
11. connector according to claim 9, which is characterized in that the preset length is greater than the integrated transformer edge
The height of the inner via hole axial direction 1/5th and be less than or equal to the integrated transformer along the inner via hole
Axial height.
12. connector according to claim 1, which is characterized in that have the transmission line layer on the integrated transformer
Wherein side be additionally provided with the bonding layer for fixing and being electrically connected electronic component；The bonding layer is described with the side
The setting of transmission line layer same layer is not overlapped, and is electrically connected.
13. connector according to claim 1, which is characterized in that the integrated transformer further include:
Composite layer, is arranged at least one transmission line layer back to the side of the substrate, for electronic component to be arranged so that
The electronic component is electrically connected at least one transmission line layer.
14. connector according to claim 13, which is characterized in that the composite layer includes articulamentum and conductive layer, institute
Articulamentum is stated between the conductive layer and the corresponding transmission line layer；The electronic component is set to the conductive layer
On.
15. connector according to claim 14, which is characterized in that the connector further includes electronic component；It is described to lead
Electric layer is pad layer, and the electronic component is welded on the conductive layer.
16. connector according to claim 1, which is characterized in that the integrated transformer is far from the joint assembly one
Side is additionally provided with multiple the second conductive through holes that the integrated transformer is axially penetrated through along the inner via hole, and each described
Second conductive through hole is electrically connected at least one transmission line layer.
17. connector according to claim 16, which is characterized in that the connector further comprises: multiple intervals are set
Second set is conductively connected head, and each described second is conductively connected in one second conductive through hole of the corresponding insertion in one end of head simultaneously
It is electrically connected with second conductive through hole, the other end is for the connector to be electrically connected with external circuit.
18. connector according to claim 16, which is characterized in that the shell further comprises: multiple location holes, often
One location hole is coaxially correspondingly arranged with each second conductive through hole；
The connector further comprises: multiple spaced second are conductively connected head, and each described second is conductively connected head
Each location hole is worn, one end of each second conductive connection head is plugged in second conductive through hole simultaneously
It is electrically connected with second conductive through hole, the other end is for the connector to be electrically connected with external circuit.
19. connector described in 7 or 18 according to claim 1, which is characterized in that described second is conductively connected head and described second
The inner wall of conductive through hole abuts against or described second is conductively connected head and second conductive through hole welding.
20. a kind of electronic device, which is characterized in that the electronic device includes: motherboard and such as any one of claim 1-19 institute
The connector stated, the connector are electrically connected with the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810405228.7A CN110415949A (en) | 2018-04-29 | 2018-04-29 | Connector and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810405228.7A CN110415949A (en) | 2018-04-29 | 2018-04-29 | Connector and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110415949A true CN110415949A (en) | 2019-11-05 |
Family
ID=68357576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810405228.7A Pending CN110415949A (en) | 2018-04-29 | 2018-04-29 | Connector and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110415949A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416773A (en) * | 2018-04-29 | 2019-11-05 | 深南电路股份有限公司 | A kind of connector and electronic device |
| CN115440463A (en) * | 2021-06-04 | 2022-12-06 | 深南电路股份有限公司 | Electronic device and connector thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673905A (en) * | 2008-09-10 | 2010-03-17 | 富士康(昆山)电脑接插件有限公司 | Electric connector system |
| US20100295646A1 (en) * | 2007-01-11 | 2010-11-25 | William Lee Harrison | Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors |
| CN106410462A (en) * | 2016-07-22 | 2017-02-15 | 昆山华信隆电子科技有限公司 | Manufacturing method for network connector |
| CN208141995U (en) * | 2018-04-29 | 2018-11-23 | 深南电路股份有限公司 | connector and electronic device |
-
2018
- 2018-04-29 CN CN201810405228.7A patent/CN110415949A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100295646A1 (en) * | 2007-01-11 | 2010-11-25 | William Lee Harrison | Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors |
| CN101673905A (en) * | 2008-09-10 | 2010-03-17 | 富士康(昆山)电脑接插件有限公司 | Electric connector system |
| CN106410462A (en) * | 2016-07-22 | 2017-02-15 | 昆山华信隆电子科技有限公司 | Manufacturing method for network connector |
| CN208141995U (en) * | 2018-04-29 | 2018-11-23 | 深南电路股份有限公司 | connector and electronic device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416773A (en) * | 2018-04-29 | 2019-11-05 | 深南电路股份有限公司 | A kind of connector and electronic device |
| CN115440463A (en) * | 2021-06-04 | 2022-12-06 | 深南电路股份有限公司 | Electronic device and connector thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI674590B (en) | Network transformer structure and methods of making the same | |
| CN208141988U (en) | transformer and electromagnetic device | |
| TW201351453A (en) | Flat coil planar transformer and methods | |
| CN208141995U (en) | connector and electronic device | |
| US20120315792A1 (en) | Magnetic device | |
| TWI394319B (en) | Electrical connector | |
| CN108417339A (en) | Chip electronic component and plate with the chip electronic component | |
| CN110415949A (en) | Connector and electronic device | |
| CN201708396U (en) | Module element | |
| CN208706926U (en) | A kind of connector and electronic device | |
| CN208141946U (en) | electromagnetic device and integrated transformer | |
| CN105453335B (en) | Antenna assembly and adapter for antenna assembly | |
| CN209232998U (en) | A kind of connector and electronic device | |
| CN215265795U (en) | Electronic device and connector thereof | |
| CN208637248U (en) | Electronic device, connector and its electromagnetic device | |
| WO2019210538A1 (en) | Transformer, electromagnetic device, and manufacturing method for transformer | |
| CN208141992U (en) | electromagnetic device and connector | |
| WO2019210541A1 (en) | Transformer and manufacturing method therefor, and electromagnetic device | |
| CN110416773A (en) | A kind of connector and electronic device | |
| CN110416772A (en) | A kind of connector and electronic device | |
| CN110676015A (en) | Electronic device, connector and electromagnetic device thereof | |
| CN208738007U (en) | Power transformer structure | |
| KR20190088771A (en) | Inductor and emi filter comprising the same | |
| CN207217847U (en) | A kind of caxial-line feeder and terminal | |
| CN109119230A (en) | Power transformer structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |