CN110414657B - 7.5 inch II enhanced electronic tag - Google Patents

7.5 inch II enhanced electronic tag Download PDF

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Publication number
CN110414657B
CN110414657B CN201910596003.9A CN201910596003A CN110414657B CN 110414657 B CN110414657 B CN 110414657B CN 201910596003 A CN201910596003 A CN 201910596003A CN 110414657 B CN110414657 B CN 110414657B
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China
Prior art keywords
capacitor
resistor
wireless
circuit
zigbee wireless
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CN201910596003.9A
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Chinese (zh)
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CN110414657A (en
Inventor
陈天文
陈佳文
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Guangzhou Xibo Electronic Technology Co ltd
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Guangzhou Xibo Electronic Technology Co ltd
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Priority to CN201910596003.9A priority Critical patent/CN110414657B/en
Publication of CN110414657A publication Critical patent/CN110414657A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W84/00—Network topologies
    • H04W84/18—Self-organising networks, e.g. ad-hoc networks or sensor networks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/16—Gateway arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Selective Calling Equipment (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

The invention discloses a 7.5 inch II enhanced electronic tag, which comprises a 7.5 inch II enhanced electronic tag circuit arranged on a circuit board, wherein the 7.5 inch II enhanced electronic tag circuit comprises a wireless MCU circuit, a power management circuit, a ZigBee wireless RF wireless amplifying circuit, a ZigBee wireless RF transceiver control circuit, a ZigBee wireless RF adaptive circuit, a memory and a 7.5 inch II electronic paper screen driving circuit, the power management circuit and the ZigBee wireless RF wireless amplifying circuit are both connected with the wireless MCU circuit, and the 7.5 inch II enhanced electronic tag and an intelligent Internet of things form a star wireless network through a ZigBee wireless link. The invention can improve the comprehensive efficiency of wireless networking, power on ZigBee wireless automatic networking, plug and play, zigBee wireless off-network automatic searching and matching network access, does not need user intervention, adopts generalized design and has low power consumption.

Description

7.5 inch II enhanced electronic tag
Technical Field
The invention relates to the field of electronic tags, in particular to a 7.5 inch II enhanced electronic tag.
Background
Most 7.5 inch I-type electronic tags in the current market are limited by factors such as cost or professional field, and only have the product functions and the realization of networking control requirements, for example: the 7.5 inch I-type electronic tag on the market is applied to the super of an intelligent manufacturer, only the basic functions of updating display content, networking with an access gateway, setting parameters and the like are completed, the focus of circuit design is to meet the use requirement of the 7.5 inch I-type electronic tag in a specific application scene, and the 7.5 inch I-type electronic tag is basically not considered in the aspects of the use experience, networking efficiency, generalization and the like, so that the method is very unfavorable for large-scale popularization and popularization of the product, future development and application upgrading, and hardware interconnection among different manufacturers and among different product types is not needed, and even has a blocking effect.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the 7.5 inch II enhanced electronic tag which can improve the comprehensive efficiency of wireless networking, power on ZigBee wireless automatic networking, plug and play, zigBee wireless off-grid automatic search matching network access, does not need user intervention, adopts a generalized design and has low power consumption.
The technical scheme adopted for solving the technical problems is as follows: the 7.5 inch II enhanced electronic tag comprises a 7.5 inch II enhanced electronic tag circuit arranged on a circuit board, wherein the 7.5 inch II enhanced electronic tag circuit comprises a wireless MCU circuit, a power management circuit, a ZigBee wireless RF wireless amplifying circuit, a ZigBee wireless RF wireless receiving and transmitting control circuit, a ZigBee wireless RF adaptive circuit, a memory and a 7.5 inch II electronic paper screen driving circuit, the power management circuit is connected with the wireless MCU circuit and used for completing the functions of voltage reduction, voltage stabilization and charging, the ZigBee wireless RF wireless amplifying circuit is connected with the wireless MCU circuit and used for completing the function of amplifying ZigBee wireless RF signals, the ZigBee wireless RF receiving and transmitting control circuit is connected with the ZigBee wireless RF wireless amplifying circuit and used for completing the function of seamlessly switching signal receiving and transmitting channels of the ZigBee wireless RF wireless amplifying circuit, the ZigBee wireless RF adaptive circuit is connected with the ZigBee wireless RF wireless amplifying circuit and used for completing the function of radio frequency impedance matching, the memory is connected with the wireless MCU circuit and used for completing the function of data buffer or storage, and the 7.5 inch II electronic paper screen is connected with the 7.5 inch electronic paper screen driving circuit and forms an intelligent electronic tag through an intelligent electronic network.
In the 7.5 inch II enhanced electronic tag, the wireless MCU circuit is used for completing ZigBee air interface protocol conversion, receiving and processing instructions issued by an intelligent Internet of things gateway, transmitting display contents to a 7.5 inch II electronic paper screen for display according to actual needs, providing the capability of converting texts, two-dimensional codes, bar codes and pictures into a 7.5 inch II electronic paper screen display format by means of a word stock in a memory, automatically carrying out ZigBee wireless networking matching with the intelligent Internet of things gateway when ZigBee wireless network disconnection, and automatically searching the accessed intelligent Internet of things gateway for ZigBee wireless automatic networking matching.
In the 7.5 inch II enhanced electronic tag, the wireless MCU circuit comprises a capacitor C1, a capacitor C2, a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, a capacitor C15, a capacitor C16, a crystal oscillator Y1 and a ZigBee wireless MCU chip U1 which are arranged on the front surface of a circuit board, wherein the capacitor C2, the capacitor C14, the capacitor C15 and the capacitor C16 are all positioned on the right side of the ZigBee wireless MCU chip U1, the crystal oscillator Y1 is positioned on the right lower side of the ZigBee wireless MCU chip U1, the capacitor C1 is positioned on the right side of the capacitor C2, the capacitor C14, the capacitor C15 and the capacitor C16, the capacitor C13 is positioned on the right lower side of the crystal oscillator Y1, and the capacitor C12 is positioned on the lower side of the ZigBee wireless MCU chip U1.
The 7.5 inch II enhanced electronic tag according to claim 3, wherein the ZigBee wireless MCU chip U1 is a ZigBee wireless MCU special for JN5169 of NXP company.
In the 7.5 inch II enhanced electronic tag of the invention, the power management circuit comprises a battery, a battery holder J1, a wireless power receiving socket B1, an indicator light LED, a charging and working indicator light socket J7, a charging integrated chip U7, an LDO voltage reducing integrated chip U8, a wireless power receiving integrated chip U10, a resistor R26, a resistor R29, a resistor R30, a resistor R54, a resistor R55, a resistor R56, a resistor R57, a capacitor C48, a capacitor C49, a capacitor C50, a capacitor C51, a capacitor C52, a capacitor C53, a capacitor C54, a capacitor C55, a capacitor C56, a capacitor C57, a capacitor C58, a capacitor C59, a capacitor C70, a capacitor C71, a capacitor C75, a capacitor C60, a capacitor C61, a capacitor C63, a capacitor C64, a capacitor C65, a capacitor C66, a capacitor C67 and a capacitor C68 which are arranged on the left end of the circuit board, the indicator light LED is arranged on the right upper side of the battery holder J1, the charging and working indication lamp socket J7 is arranged at the upper end of the circuit board, the resistor R29, the capacitor C49, the resistor R30, the charging integrated chip U7, the capacitor C48 and the resistor R26 are all positioned below the charging and working indication lamp socket J7, the capacitor C51, the LDO voltage reduction integrated chip U8 and the capacitor C50 are all arranged at the lower end of the circuit board, the wireless power receiving coil socket B1 is arranged at the right end of the circuit board, the capacitor C53, the capacitor C54, the capacitor C55, the capacitor C56, the capacitor C57, the capacitor C52, the capacitor C75 and the capacitor C71 are all positioned above the wireless power receiving coil socket B1, the wireless power receiving integrated chip U10 is positioned at the left side of the wireless power receiving coil socket B1, the capacitor C63, the capacitor C64 and the capacitor C60 are all positioned above the wireless power receiving integrated chip U10, and the resistor R54, the resistor R55, the capacitor C57 and the wireless power receiving integrated chip U60 are all positioned above the wireless power receiving integrated chip U10 The capacitor C61, the capacitor C62, the resistor R56, the resistor R57 and the capacitor C65 are all located at the lower left of the wireless power receiving integrated chip U10, and the capacitor C66, the capacitor C67, the capacitor C68, the capacitor C59, the capacitor C70 and the capacitor C58 are all located at the lower side of the wireless power receiving integrated chip U10.
In the 7.5 inch II enhanced electronic tag of the present invention, the ZigBee wireless RF wireless amplifying circuit includes an RF transmitter U5, an RF LNA chip U6, an inductor L3, an inductor L4, an inductor L5, a capacitor C7, a capacitor C8, a capacitor C69 and a capacitor C72 mounted on the front surface of the circuit board, where the RF transmitter U5 is located above the ZigBee wireless MCU chip U1, the inductor L3, the capacitor C8 and the RF LNA chip U6 are all located above the RF transmitter U5, the capacitor C72 is located above the RF LNA chip U6 on the right, the capacitor C7 and the capacitor C69 are located on the left side of the RF transmitter U5, the inductor L4 is located on the left side of the inductor L3, and the inductor L5 is located below the RF transmitter U5.
In the 7.5 inch II enhanced electronic tag of the present invention, the ZigBee wireless RF transceiver control circuit includes an RF detection chip U9, a triode Q1, a triode Q2, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R19, a resistor R20, a resistor R21, a capacitor C18 and a capacitor C19 mounted on the front surface of the circuit board, the RF detection chip U9 is located at the upper right of the ZigBee wireless MCU chip U1, the resistor R4 is located at the lower left of the RF detection chip U9, the resistor R7 and the capacitor C19 are located at the lower of the RF detection chip U9, the capacitor C18 is located at the right of the RF detection chip U9, the resistor R5 and the resistor R6 are located at the lower of the capacitor C18, the resistor R21, the triode Q2 and the resistor R20 are located at the upper of the RF detection chip U9, the triode Q1 is located at the right of the resistor R20, and the resistor R8 and the resistor Q19 are located at the lower of the resistor Q1.
In the 7.5 inch II enhanced electronic tag of the present invention, the ZigBee wireless RF adapter circuit includes a resistor R1, a resistor R50, a resistor R51, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, an inductor L1, an inductor L2, an onboard antenna E1, and an external antenna socket J3, where the inductor L2 is located above the ZigBee wireless MCU chip U1, the capacitor C3 and the capacitor C4 are both located above the inductor L2, the inductor L1 and the capacitor C6 are both located above the capacitor C4, the capacitor C5 is located on the left side of the inductor L1, the external antenna socket J3 is located below the right of the charging and operating indicator socket, the resistor R50 and the resistor R51 are located on the right side of the external antenna socket J3, and the onboard antenna E1 is located above the external antenna socket J3.
In the 7.5 inch II enhanced electronic tag, the memory comprises a resistor R25, a capacitor C17, an SPI RAM integrated chip U2, a resistor R9, a resistor R12, a capacitor C74 and an SPI Flash integrated chip U3 which are arranged on the front surface of the circuit board, wherein the SPI RAM integrated chip U2 is positioned on the left side of the ZigBee wireless MCU chip U1, the capacitor C17 is positioned below the SPI RAM integrated chip U2, the resistor R25 and the capacitor C74 are positioned on the right upper side of the SPI RAM integrated chip U2, the SPI Flash integrated chip U3 is positioned above the SPI RAM integrated chip U2, and the resistor R9 and the resistor R12 are positioned above the SPI Flash integrated chip U3.
In the 7.5 inch type II enhanced electronic tag of the invention, the 7.5 inch type II electronic paper screen driving circuit comprises a resistor R15, a resistor R16, a resistor R17, a resistor R18, a resistor R31, a resistor R32, a resistor R33, a resistor R34, a resistor R58, a resistor R59, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C27, a capacitor C28, a capacitor C29, a capacitor C30, a capacitor C31, a capacitor C32, a capacitor C33, a capacitor C34, a capacitor C35, a capacitor C36, a capacitor C37, a capacitor C38, a capacitor C39, a capacitor C40, a capacitor C41, a capacitor C42, a capacitor C43, a capacitor C44, a capacitor C45, a capacitor C46, a capacitor C47, a diode D1, a diode D2, a diode D3, a diode D4, a diode D5, a diode D6, a capacitor L7, a MOS transistor Q4, a MOS transistor Q5, a 7.5 inch type II electronic paper screen socket and a 7.5 inch type II electronic paper screen socket, the 7.5 inch type II electronic paper screen socket J4, the capacitor C29, the capacitor C30, the capacitor C31, the capacitor C32, the capacitor C33, the resistor R16, the capacitor C34, the capacitor C35, the resistor R32, the resistor R31, the capacitor C27, the capacitor C28, the inductor L6, the resistor R15, the MOS tube Q4, the diode D1, the diode D2, the diode D3, the capacitor C24, the capacitor C25, the capacitor C26 and the resistor R58 are all positioned on the right side of the battery socket J1, the 7.5 inch type II electronic paper screen socket J5 is positioned above the indicator LED, the capacitor C47, the capacitor C46, the resistor R18, the capacitor C45, the capacitor C44, the capacitor C43, the capacitor C42, the capacitor C41, the capacitor C38, the capacitor C39, the capacitor C40, the resistor R34, the inductor L7 and the resistor R33 are all positioned above the 7.5 inch type II electronic paper screen J5, the diode D4, the diode D5, the diode D6, the capacitor C37 and the capacitor R37 are all positioned on the right side of the socket J5 inch type II electronic paper screen, the MOS tube Q5 is positioned on the right side of the 7.5 inch type II electronic paper screen socket J5, and the resistor R59 is positioned on the upper right side of the MOS tube Q5.
The 7.5 inch II enhanced electronic tag has the following beneficial effects: the 7.5 inch II enhanced electronic tag circuit is arranged on the circuit board, and comprises a wireless MCU circuit, a power management circuit, a ZigBee wireless RF wireless amplifying circuit, a ZigBee wireless RF transceiver control circuit, a ZigBee wireless RF adaptation circuit, a memory and a 7.5 inch II electronic paper screen driving circuit, wherein the 7.5 inch II enhanced electronic tag forms a star-shaped wireless network with an intelligent Internet of things through a ZigBee wireless link.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a 7.5 inch II enhanced electronic tag circuit according to one embodiment of the present invention;
FIG. 2 is a schematic diagram of a 7.5 inch II enhanced electronic tag network in the embodiment;
FIG. 3 is a diagram showing components on the front side of the circuit board according to the embodiment;
FIG. 4 is a pattern of pads and conductors on the front side of the circuit board in the illustrated embodiment;
FIG. 5 is a diagram showing components on the opposite side of the circuit board in the embodiment;
fig. 6 is a pattern of pads and conductors on the opposite side of the circuit board in the illustrated embodiment.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the 7.5 inch II enhanced electronic tag embodiment of the invention, the 7.5 inch II enhanced electronic tag comprises a 7.5 inch II enhanced electronic tag circuit arranged on a circuit board, and the 7.5 inch II enhanced electronic tag circuit is used as the core of the 7.5 inch II enhanced electronic tag and adopts a modularized and generalized design principle. The schematic structure of the 7.5 inch II enhanced electronic tag circuit is shown in figure 1. In fig. 1, the 7.5 inch II enhanced electronic tag circuit comprises a wireless MCU circuit 1, a power management circuit 2, a ZigBee wireless RF wireless amplifying circuit 3, a ZigBee wireless RF transceiver control circuit 4, a ZigBee wireless RF adapter circuit 5, a memory 6 and a 7.5 inch II electronic paper screen driving circuit 7, wherein the power management circuit 2 is connected with the wireless MCU circuit 1, is used for completing the functions of voltage reduction, voltage stabilization and charging, and is realized by selecting an LDO voltage reduction and charging integrated chip and combining with separated components (resistor, capacitor and the like).
The ZigBee wireless RF wireless amplifying circuit 3 is connected with the wireless MCU circuit 1 and is used for completing the ZigBee wireless RF signal amplifying function so as to provide ZigBee wireless networking with a larger space distance range, and the signal receiving and transmitting channels are independent. The method is realized by adopting an RF LNA chip, an RF switch chip, an RF transmitter element and a separated component (inductance, capacitance, resistance and the like).
The ZigBee wireless RF transceiver control circuit 4 is connected with the ZigBee wireless RF wireless amplifying circuit 3 and is used for completing the seamless switching function of the signal receiving and transmitting channels of the ZigBee wireless RF wireless amplifying circuit 3, and is realized by adopting an RF detection chip and separated components (inductance, capacitance, resistance and the like).
The ZigBee wireless RF adaptive circuit 5 is connected with the ZigBee wireless RF wireless amplifying circuit 3 and is used for completing the matching function of radio frequency impedance (50Ω), and is realized by adopting separated components (inductance, capacitance, resistance and the like).
The memory 6 is connected with the wireless MCU circuit 1 and is used for completing the data caching or storage function, and is realized by adopting an SPI Flash and RAM integrated chip and combining with separated components (resistor, capacitor and the like).
The 7.5 inch type II electronic paper screen driving circuit 7 is connected with the wireless MCU circuit 1. Based on the general design principle, the electronic paper screen is realized by adopting separated components (MOS (metal oxide semiconductor) tubes, resistors, capacitors, inductors and the like), and can be connected with 7.5 inch type II electronic paper screens of various manufacturers such as tin-free Weifeng, guangzhou Orthong and the like.
7.5 inch II enhanced electronic tag forms a star-shaped wireless network with the intelligent Internet of things through a ZigBee wireless link. Fig. 2 is a schematic diagram of a network structure of a 7.5 inch II enhanced electronic tag network in this embodiment. The user can operate and control the 7.5 inch II enhanced electronic tag through the intelligent Internet of things gateway. The intelligent Internet of things gateway (intelligent Internet of things gateway equipment) is different from a ZigBee Internet of things gateway on the market.
The 7.5 inch II enhanced electronic tag has the following characteristics: 1) The intelligent networking can be realized: the ZigBee wireless automatic networking is powered on without user operation, plug and play is realized, and the ZigBee wireless disconnection automatic searching and matching network access is realized; 2) Networking standard: IEEE802.15.4 supporting AES128 encryption; 3) Low power consumption: under the condition that the time interval of display content update is not less than 24 hours, the service life of the button cell is not less than 1 year; 4) Supply voltage: DC3.6V, lithium batteries can be used for power supply and repeated use; 5) And (3) displaying a screen: 7.5 inch II type electronic paper screen (three colors of red, black and white, resolution: 800 multiplied by 480), the display content can be kept and not lost without any power supply; 6) Wireless operating frequency band: 2.4GHz; 7) Wireless transmit power: 20dBm; 8) Wireless output impedance: 50 omega; 9) Radio reception sensitivity: -106dBm;10 Wireless data transmission rate): 250Kbps.
The wireless MCU circuit 1 is used for completing ZigBee air interface protocol conversion, receiving and processing instructions issued by an intelligent Internet of things gateway, transmitting display contents to the 7.5 inch II type electronic paper screen for display according to actual needs, providing the capability of converting text, two-dimensional codes, bar codes, pictures and other information into the 7.5 inch II type electronic paper screen display format by means of information such as word stock and the like in a memory, and combining the capability with an improved ZigBee wireless air interface data transmission protocol, so that the comprehensive efficiency of the traditional 7.5 inch II enhanced electronic tag ZigBee wireless networking can be improved by 10 times or more. The power-on is automatically matched with the intelligent Internet of things through ZigBee wireless networking, so that user intervention, plug and play are not needed, and the user experience is greatly improved. When ZigBee wireless network disconnection occurs, the intelligent Internet of things capable of being accessed is automatically searched for ZigBee wireless automatic networking matching, user intervention is not needed, and user experience is improved. The invention can promote the comprehensive efficiency of wireless networking, power on ZigBee wireless automatic networking, plug and play, zigBee wireless off-grid automatic searching and matching network access, does not need user intervention, and adopts generalized design.
Fig. 3 is a distribution diagram of components on the front side of a circuit board in the embodiment, in fig. 3, a wireless MCU circuit 1 includes a capacitor C1, a capacitor C2, a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, a capacitor C15, a capacitor C16, a crystal oscillator Y1 and a ZigBee wireless MCU chip U1 mounted on the front side of the circuit board, the capacitor C2, the capacitor C14, the capacitor C15 and the capacitor C16 are all located on the right side of the ZigBee wireless MCU chip U1, the crystal oscillator Y1 is located on the right lower side of the ZigBee wireless MCU chip U1, the capacitor C1 is located on the right side of the capacitor C2, the capacitor C14, the capacitor C15 and the capacitor C16, the capacitor C13 is located on the right lower side of the crystal oscillator Y1, and the capacitor C12 is located on the lower side of the ZigBee wireless MCU chip U1.
In this embodiment, the ZigBee wireless MCU chip U1 adopts a ZigBee wireless MCU dedicated for JN5169 of NXP corporation.
In this embodiment, the power management circuit 2 includes a battery, a battery holder J1, a wireless power receiving coil socket B1, an indicator LED, a charging and operating indicator socket J7, a charging integrated chip U7, an LDO voltage reducing integrated chip U8, a wireless power receiving integrated chip U10, a resistor R26, a resistor R29, a resistor R30, a resistor R54, a resistor R55, a resistor R56, a resistor R57, a capacitor C48, a capacitor C49, a capacitor C50, a capacitor C51, a capacitor C52, a capacitor C53, a capacitor C54, a capacitor C55, a capacitor C56, a capacitor C57, a capacitor C58, a capacitor C59, a capacitor C70, a capacitor C71, a capacitor C75, a capacitor C60, a capacitor C61, a capacitor C63, a capacitor C64, a capacitor C65, a capacitor C66, a capacitor C67, and a capacitor C68 mounted on the left end of the circuit board, the indicator LED is located on the right upper side of the battery holder J1, the charging and operating indicator socket J7 mounted on the upper end of the circuit board, the resistor R29, the capacitor C49, the resistor R30, the charging integrated chip U7, the capacitor C48 and the resistor R26 are all located below the charging and working indicator socket J7, the capacitor C51, the LDO voltage reduction integrated chip U8 and the capacitor C50 are all installed at the lower end of the circuit board, the wireless power receiving wire socket B1 is installed at the right end of the circuit board, the capacitor C53, the capacitor C54, the capacitor C55, the capacitor C56, the capacitor C57, the capacitor C52, the capacitor C75 and the capacitor C71 are all located above the wireless power receiving wire socket B1, the wireless power receiving integrated chip U10 is located at the left side of the wireless power receiving wire socket B1, the capacitor C63, the capacitor C64 and the capacitor C60 are all located above the wireless power receiving integrated chip U10, the resistor R54, the resistor R55, the capacitor C61, the capacitor C62, the resistor R56, the resistor R57 and the capacitor C65 are all located at the left lower part of the wireless power receiving integrated chip U10, the capacitor C66, the capacitor C67 and the capacitor C68, the capacitor C59, the capacitor C70 and the capacitor C58 are all located below the wireless power receiving integrated chip U10.
In this embodiment, the ZigBee wireless RF wireless amplifying circuit 3 includes an RF transmitter U5, an RF LNA chip U6, an inductor L3, an inductor L4, an inductor L5, a capacitor C7, a capacitor C8, a capacitor C69 and a capacitor C72, which are mounted on the front side of the circuit board, where the RF transmitter U5 is located above the ZigBee wireless MCU chip U1, the inductor L3, the capacitor C8 and the RF LNA chip U6 are all located above the RF transmitter U5, the capacitor C72 is located above the RF LNA chip U6, the capacitor C7 and the capacitor C69 are located on the left side of the RF transmitter U5, the inductor L4 is located on the left side of the inductor L3, and the inductor L5 is located below the RF transmitter U5.
In this embodiment, the ZigBee wireless RF transceiver control circuit 4 includes an RF detection chip U9, a transistor Q1, a transistor Q2, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R19, a resistor R20, a resistor R21, a capacitor C18, and a capacitor C19 mounted on the front surface of the circuit board, where the RF detection chip U9 is located at the upper right of the ZigBee wireless MCU chip U1, the resistor R4 is located at the lower left of the RF detection chip U9, the resistor R7 and the capacitor C19 are both located below the RF detection chip U9, the capacitor C18 is located at the right of the RF detection chip U9, the resistor R5 and the resistor R6 are both located below the capacitor C18, the resistor R21, the transistor Q2, and the resistor R20 are located above the RF detection chip U9, the transistor Q1 is located at the right of the resistor R20, and the resistor R8 and the resistor R19 are located below the transistor Q1.
In this embodiment, the ZigBee wireless RF adapter circuit 5 includes a resistor R1, a resistor R50, a resistor R51, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, an inductor L1, an inductor L2, an on-board antenna E1 and an external antenna socket J3 mounted on the front surface of the circuit board, the inductor L2 is located above the ZigBee wireless MCU chip U1, the capacitor C3 and the capacitor C4 are both located above the inductor L2, the inductor L1 and the capacitor C6 are both located above the capacitor C4, the capacitor C5 is located on the left side of the inductor L1, the external antenna socket J3 is located on the right lower side of the charging and working indicator socket, the resistor R50 and the resistor R51 are located on the right side of the external antenna socket J3, and the on-board antenna E1 is located above the external antenna socket J3.
In this embodiment, the memory 6 includes a resistor R25, a capacitor C17, an SPIRAM integrated chip U2, a resistor R9, a resistor R12, a capacitor C74 and an SPI Flash integrated chip U3 mounted on the front surface of the circuit board, where the SPI RAM integrated chip U2 is located on the left side of the ZigBee wireless MCU chip U1, the capacitor C17 is located below the SPI RAM integrated chip U2, the resistor R25 and the capacitor C74 are located on the upper right side of the SPI RAM integrated chip U2, the SPI Flash integrated chip U3 is located above the SPI RAM integrated chip U2, and the resistor R9 and the resistor R12 are located above the SPI Flash integrated chip U3.
In this embodiment, the 7.5 inch type II electronic paper screen driving circuit 7 includes a resistor R15, a resistor R16, a resistor R17, a resistor R18, a resistor R31, a resistor R32, a resistor R33, a resistor R34, a resistor R58, a resistor R59, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C27, a capacitor C28, a capacitor C29, a capacitor C30, a capacitor C31, a capacitor C32, a capacitor C33, a capacitor C34, a capacitor C35, a capacitor C36, a capacitor C37, a capacitor C38, a capacitor C39, a capacitor C40, a capacitor C41, a capacitor C42, a capacitor C43, a capacitor C44, a capacitor C45, a capacitor C46, a capacitor C47, a diode D1, a diode D2, a diode D3, a diode D4, a diode D5, a diode D6, an inductor L6, a capacitor L7, a MOS transistor Q4, a MOS transistor Q5, a 7.5 inch type II electronic paper screen socket J4 and a 7.5 type II electronic paper screen socket J5,7.5 inch type II electronic paper screen socket J4, capacitor C29, capacitor C30, capacitor C31, capacitor C32, capacitor C33, resistor R16, capacitor C34, capacitor C35, resistor R32, resistor R31, capacitor C27, capacitor C28, inductor L6, resistor R15, MOS tube Q4, diode D1, diode D2, diode D3, capacitor C24, capacitor C25, capacitor C26 and resistor R58 are all located on the right side of battery socket J1, 7.5 inch type II electronic paper screen socket J5 is located above indicator LED, capacitor C47, capacitor C46, resistor R18, capacitor C45, capacitor C44, capacitor C43, capacitor C42, capacitor C41, capacitor C38, capacitor C39, capacitor C40, resistor R34, inductor L7 and resistor R33 are all located on the top of 7.5 inch type II electronic paper screen socket J5, diode D4, diode D5, diode D6, capacitor C37, capacitor C36 are all located on the right side of 7.5 inch type II electronic paper screen socket J5, and the right side of 7.5 inch type II electronic paper screen socket J5 is located on the right side of the electronic paper screen socket J5, resistor R59 is located at the upper right side of MOS transistor Q5.
FIG. 4 is a diagram showing the patterns of pads and wires on the front surface of a circuit board in the present embodiment; FIG. 5 is a diagram showing the distribution of components on the opposite side of the circuit board in the present embodiment; fig. 6 is a diagram showing the patterns of pads and wires on the opposite side of the circuit board in this embodiment.
In summary, in this embodiment, by means of converting information such as text, two-dimensional code, bar code, and picture into a function of 7.5 inch II-type electronic paper screen display format, and an improved ZigBee wireless air interface data transmission protocol, the comprehensive efficacy of ZigBee wireless networking of the 7.5 inch II-type enhanced electronic tag is improved. The 7.5 inch II enhanced electronic tag has the functions of power-on ZigBee wireless automatic networking and plug-and-play. The ZigBee wireless network disconnection automatically searches for matching network access without user intervention. The 7.5 inch type II electronic paper screen driving circuit 7 adopts a generalized design, and can be connected with 7.5 inch type II electronic paper screens of various manufacturers such as tin-free Weifeng, guangzhou Oreg.
The ZigBee wireless RF amplification and receiving and transmitting switching control design of pure hardware can provide 10dBm for the signals sent by the ZigBee wireless RF adaptive circuit 5 and 10dBm for the signals received by the ZigBee wireless RF adaptive circuit without any change of software, the required current loss is only about 20mA, and the current loss is greatly lower than the current (about 350 mA) which is consumed by the RF signal gain achieved by adopting an RF power amplifier integrated chip (such as RFX2401C, AT 2401C) on the market, so that the ZigBee wireless RF adaptive circuit has very competitive advantage for electronic tag equipment requiring low power consumption.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.

Claims (2)

1. The 7.5 inch II enhanced electronic tag is characterized by comprising a 7.5 inch II enhanced electronic tag circuit arranged on a circuit board, wherein the 7.5 inch II enhanced electronic tag circuit comprises a wireless MCU circuit, a power management circuit, a ZigBee wireless RF wireless amplifying circuit, a ZigBee wireless RF receiving and transmitting control circuit, a ZigBee wireless RF adaptive circuit, a memory and a 7.5 inch II electronic paper screen driving circuit, the power management circuit is connected with the wireless MCU circuit and used for completing the functions of voltage reduction, voltage stabilization and charging, the ZigBee wireless RF wireless amplifying circuit is connected with the wireless MCU circuit and used for completing the function of ZigBee wireless RF signal amplification, the ZigBee wireless RF receiving and transmitting control circuit is connected with the ZigBee wireless RF wireless amplifying circuit and used for completing the function of seamless switching of signal receiving and transmitting channels of the ZigBee wireless RF wireless amplifying circuit, the wireless RF adaptive circuit is connected with the ZigBee wireless RF wireless amplifying circuit and used for completing the function of radio frequency impedance matching, the memory is connected with the wireless circuit and used for completing the function of data buffering or storage, and the 7.5 inch electronic paper screen is connected with the ZigBee wireless MCU wireless electronic paper screen driving circuit and forms an intelligent electronic tag with a Bluetooth wireless network II;
the wireless MCU circuit is used for completing ZigBee air interface protocol conversion, receiving and processing instructions issued by the intelligent Internet of things gateway, transmitting display contents to the 7.5 inch type II electronic paper screen for display according to actual needs, providing the capability of converting texts, two-dimensional codes, bar codes and pictures into a 7.5 inch type II electronic paper screen display format by means of a word stock in a memory, powering on to automatically perform ZigBee wireless networking matching with the intelligent Internet of things gateway, and automatically searching for the intelligent Internet of things gateway capable of being accessed to perform ZigBee wireless automatic networking matching when ZigBee wireless network disconnection;
the 7.5 inch II enhanced electronic tag has the following characteristics: 1) The intelligent networking can be realized: the ZigBee wireless automatic networking is powered on without user operation, plug and play is realized, and the ZigBee wireless disconnection automatic searching and matching network access is realized; 2) Networking standard: ieee802.15.4 supporting AES128 encryption; 3) Low power consumption: under the condition that the time interval of display content update is not less than 24 hours, the service life of the button cell is not less than 1 year; 4) Supply voltage: DC3.6V, the lithium battery is adopted for power supply and charging for repeated use; 5) And (3) displaying a screen: 7.5 cun II type electronic paper screen, three colors of red, black and white, resolution ratio: 800×480, without any power, the display content can be kept, not lost; 6) Wireless operating frequency band: 2.4GHz; 7) Wireless transmit power: 20dBm; 8) Wireless output impedance: 50 omega; 9) Radio reception sensitivity: -106dBm;10 Wireless data transmission rate): 250Kbps;
the wireless MCU circuit comprises a capacitor C1, a capacitor C2, a capacitor C11, a capacitor C12, a capacitor C13, a capacitor C14, a capacitor C15, a capacitor C16, a crystal oscillator Y1 and a ZigBee wireless MCU chip U1 which are arranged on the front surface of a circuit board, wherein the capacitor C2, the capacitor C14, the capacitor C15 and the capacitor C16 are all positioned on the right side of the ZigBee wireless MCU chip U1, the crystal oscillator Y1 is positioned on the right lower side of the ZigBee wireless MCU chip U1, the capacitor C1 is positioned on the right side of the capacitor C2, the capacitor C14, the capacitor C15 and the capacitor C16, the capacitor C13 is positioned on the right lower side of the crystal oscillator Y1, and the capacitor C12 is positioned on the lower side of the ZigBee wireless MCU chip U1;
the power management circuit comprises a battery, a battery seat J1, a wireless power receiving wire socket B1, an indicator light LED, a charging and working indicator light socket J7, a charging integrated chip U7, an LDO voltage reduction integrated chip U8, a wireless power receiving integrated chip U10, a resistor R26, a resistor R29, a resistor R30, a resistor R54, a resistor R55, a resistor R56, a resistor R57, a capacitor C48, a capacitor C49, a capacitor C50, a capacitor C51, a capacitor C52, a capacitor C53, a capacitor C54, a capacitor C55, a capacitor C56, a capacitor C57, a capacitor C58, a capacitor C59, a capacitor C70, a capacitor C71, a capacitor C75, a capacitor C60, a capacitor C61, a capacitor C62, a capacitor C63, a capacitor C64, a capacitor C65, a capacitor C66, a capacitor C67 and a capacitor C68, wherein the battery seat J1 is arranged at the left end of the circuit board, the indicator light LED is positioned at the right upper part of the battery seat J1, the charging and working indication lamp socket J7 is arranged at the upper end of the circuit board, the resistor R29, the capacitor C49, the resistor R30, the charging integrated chip U7, the capacitor C48 and the resistor R26 are all positioned below the charging and working indication lamp socket J7, the capacitor C51, the LDO voltage reduction integrated chip U8 and the capacitor C50 are all arranged at the lower end of the circuit board, the wireless power receiving coil socket B1 is arranged at the right end of the circuit board, the capacitor C53, the capacitor C54, the capacitor C55, the capacitor C56, the capacitor C57, the capacitor C52, the capacitor C75 and the capacitor C71 are all positioned above the wireless power receiving coil socket B1, the wireless power receiving integrated chip U10 is positioned at the left side of the wireless power receiving coil socket B1, the capacitor C63, the capacitor C64 and the capacitor C60 are all positioned above the wireless power receiving integrated chip U10, the resistor R54, the resistor R55, the capacitor C61, the capacitor C62 and the resistor R56 are all positioned above the wireless power receiving integrated chip U10 The resistor R57 and the capacitor C65 are all positioned at the left lower part of the wireless power receiving integrated chip U10, and the capacitor C66, the capacitor C67, the capacitor C68, the capacitor C59, the capacitor C70 and the capacitor C58 are all positioned at the lower part of the wireless power receiving integrated chip U10;
the ZigBee wireless RF wireless amplifying circuit comprises an RF transmitter U5, an RFLNA chip U6, an inductor L3, an inductor L4, an inductor L5, a capacitor C7, a capacitor C8, a capacitor C69 and a capacitor C72 which are arranged on the front surface of a circuit board, wherein the RF transmitter U5 is arranged above the ZigBee wireless MCU chip U1, the inductor L3, the capacitor C8 and the RFLNA chip U6 are all arranged above the RF transmitter U5, the capacitor C72 is arranged above the right of the RFLNA chip U6, the capacitor C7 and the capacitor C69 are arranged on the left side of the RF transmitter U5, the inductor L4 is arranged on the left side of the inductor L3, and the inductor L5 is arranged below the RF transmitter U5;
the ZigBee wireless RF transceiver control circuit comprises an RF detection chip U9, a triode Q1, a triode Q2, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R19, a resistor R20, a resistor R21, a capacitor C18 and a capacitor C19 which are arranged on the front surface of a circuit board, wherein the RF detection chip U9 is positioned on the right upper side of the ZigBee wireless MCU chip U1, the resistor R4 is positioned on the left lower side of the RF detection chip U9, the resistor R7 and the capacitor C19 are positioned below the RF detection chip U9, the capacitor C18 is positioned on the right side of the RF detection chip U9, the resistor R5 and the resistor R6 are positioned below the capacitor C18, the resistor R21, the triode Q2 and the resistor R20 are positioned above the RF detection chip U9, the triode Q1 is positioned on the right side of the resistor R20, and the resistor R8 and the resistor R19 are positioned below the triode Q1;
the ZigBee wireless RF adapter circuit comprises a resistor R1, a resistor R50, a resistor R51, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, an inductor L1, an inductor L2, an on-board antenna E1 and an external antenna seat J3 which are arranged on the front surface of a circuit board, wherein the inductor L2 is positioned above the ZigBee wireless MCU chip U1, the capacitor C3 and the capacitor C4 are both positioned above the inductor L2, the inductor L1 and the capacitor C6 are both positioned above the capacitor C4, the capacitor C5 is positioned on the left side of the inductor L1, the external antenna seat J3 is positioned on the right lower side of the charging and working indicator lamp socket, the resistor R50 and the resistor R51 are positioned on the right side of the external antenna seat J3, and the on-board antenna E1 is positioned above the external antenna seat J3;
the memory comprises a resistor R25, a capacitor C17, a SPIRAM integrated chip U2, a resistor R9, a resistor R12, a capacitor C74 and a SPIFASH integrated chip U3 which are arranged on the front surface of a circuit board, wherein the SPIRAM integrated chip U2 is positioned on the left side of the ZigBee wireless MCU chip U1, the capacitor C17 is positioned below the SPIRAM integrated chip U2, the resistor R25 and the capacitor C74 are positioned on the upper right side of the SPIRAM integrated chip U2, the SPIFASH integrated chip U3 is positioned above the SPIRAM integrated chip U2, and the resistor R9 and the resistor R12 are positioned above the SPIFASH integrated chip U3;
the 7.5 inch type II electronic paper screen driving circuit comprises a resistor R15, a resistor R16, a resistor R17, a resistor R18, a resistor R31, a resistor R32, a resistor R33, a resistor R34, a resistor R58, a resistor R59, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C27, a capacitor C28, a capacitor C29, a capacitor C30, a capacitor C31, a capacitor C32, a capacitor C33, a capacitor C34, a capacitor C35, a capacitor C36, a capacitor C37, a capacitor C38, a capacitor C39, a capacitor C40, a capacitor C41, a capacitor C42, a capacitor C43, a capacitor C44, a capacitor C45, a capacitor C46, a capacitor C47, a diode D1, a diode D2, a diode D3, a diode D4, a diode D5, a diode D6, an inductor L7, a MOS tube Q4, a MOS tube Q5, a 7.5 inch type II electronic paper screen socket J4 and a 7.5 inch type II electronic paper screen socket J5, the 7.5 inch type II electronic paper screen socket J4, the capacitor C29, the capacitor C30, the capacitor C31, the capacitor C32, the capacitor C33, the resistor R16, the capacitor C34, the capacitor C35, the resistor R32, the resistor R31, the capacitor C27, the capacitor C28, the inductor L6, the resistor R15, the MOS tube Q4, the diode D1, the diode D2, the diode D3, the capacitor C24, the capacitor C25, the capacitor C26 and the resistor R58 are all positioned on the right side of the battery socket J1, the 7.5 inch type II electronic paper screen socket J5 is positioned on the upper side of the indicator LED, the capacitor C47, the capacitor C46, the resistor R18, the capacitor C45, the capacitor C44, the capacitor C43, the capacitor C42, the capacitor C41, the capacitor C38, the capacitor C39, the capacitor C40, the resistor R34, the inductor L7 and the resistor R33 are all positioned on the upper side of the 7.5 inch type II electronic paper screen J5, the diode D4, the diode D5, the diode D6 and the diode D37 are all positioned on the right side of the 7.5 inch type II electronic paper screen J5, and the resistor R59 is positioned at the upper right side of the MOS transistor Q5.
2. The 7.5 inch II enhanced electronic tag according to claim 1, wherein the ZigBee wireless MCU chip U1 is a ZigBee wireless MCU dedicated for JN5169 of NXP corporation.
CN201910596003.9A 2019-07-03 2019-07-03 7.5 inch II enhanced electronic tag Active CN110414657B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103324965A (en) * 2013-06-05 2013-09-25 佛山市广华合志科技有限公司 Electronic goods shelf label based on FPGA
CN107038829A (en) * 2016-02-03 2017-08-11 深圳市睿祺智尚科技有限公司 Intelligent door sensor and intelligent safety and defence system based on Internet of Things
CN206314008U (en) * 2016-07-27 2017-07-07 山东大学 A kind of gateway for merging plurality of wireless networks
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