CN110414657A - 7.5 cun of II reinforced electric subtabs - Google Patents
7.5 cun of II reinforced electric subtabs Download PDFInfo
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- CN110414657A CN110414657A CN201910596003.9A CN201910596003A CN110414657A CN 110414657 A CN110414657 A CN 110414657A CN 201910596003 A CN201910596003 A CN 201910596003A CN 110414657 A CN110414657 A CN 110414657A
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- 230000006855 networking Effects 0.000 claims abstract description 18
- 239000000725 suspension Substances 0.000 claims abstract description 9
- 239000003990 capacitor Substances 0.000 claims description 423
- 230000005611 electricity Effects 0.000 claims description 21
- 238000001514 detection method Methods 0.000 claims description 19
- 230000006870 function Effects 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 9
- 230000006837 decompression Effects 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000009412 basement excavation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- -1 resistance Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W84/00—Network topologies
- H04W84/18—Self-organising networks, e.g. ad-hoc networks or sensor networks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/16—Gateway arrangements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Selective Calling Equipment (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
The invention discloses a kind of 7.5 cun of II reinforced electric subtabs, including 7.5 cun of II reinforced electric subtab circuits on circuit boards are arranged, 7.5 cun of II reinforced electric subtab circuit includes wireless MCU circuit, electric power management circuit, ZigBee wireless RF is wireless amplifying circuit, ZigBee wireless RF receives and dispatches control circuit, ZigBee wireless RF adapter circuit, memory and 7.5 cun of II type Electronic Paper screen driving circuits, electric power management circuit and the wireless amplifying circuit of ZigBee wireless RF with wireless MCU circuit connection, 7.5 cun of II reinforced electric subtabs form star-like wireless network by ZigBee Radio Link and intelligent things gateway.The present invention can be promoted wireless networking comprehensive effectiveness, power on the wireless automatic network-building of ZigBee, plug and play, ZigBee is wireless, and suspension searches for automatically that matching networks, without user intervention, using General design, low-power consumption.
Description
Technical field
The present invention relates to electronic tag field, in particular to a kind of 7.5 cun of II reinforced electric subtabs.
Background technique
Most of 7.5 cun of I type electronic tags are limited for the various aspects factor such as cost or professional domain currently on the market, all
Only have the realization of product function and networking control needs, such as: 7.5 cun of I type electronic tags of certain money are in intelligent quotient on the market
Super application is only the basic functions such as networking, the parameter setting of the update for completing display content and access gateway, circuit
The starting point of design is met as possible to the requirement of 7.5 cun of I type electronic tags under specific application scene, and for 7.5
It is not accounted for substantially in the excavation of very little I type electronic tag usage experience and networking efficiency, generalization etc., this is for such
Product is in the future between large-scale promotion and universal, future development and application upgrade and different manufacturers, without hard between product type
Part interconnection be it is very unfavorable, even with inhibition.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of can be promoted wirelessly
Networking comprehensive effectiveness, power on the wireless automatic network-building of ZigBee, plug and play, ZigBee is wireless, and suspension searches for automatically that matching networks,
Without user intervention, using General design, 7.5 cun of II reinforced electric subtabs of low-power consumption.
The technical solution adopted by the present invention to solve the technical problems is: a kind of 7.5 cun of II reinforced electric subtabs are constructed,
Including 7.5 cun of II reinforced electric subtab circuits on circuit boards, 7.5 cun of II reinforced electric subtab circuit packet is arranged
Include wireless MCU circuit, electric power management circuit, ZigBee wireless RF is wireless amplifying circuit, ZigBee wireless RF transmitting-receiving control circuit,
ZigBee wireless RF adapter circuit, memory and 7.5 cun of II type Electronic Paper screen driving circuits, the electric power management circuit with it is described
Wireless MCU circuit connection, for completing decompression, pressure stabilizing and charge function, the ZigBee wireless RF is wireless amplifying circuit and institute
State wireless MCU circuit connection, for completing ZigBee RF wireless signals enlarging function, the ZigBee wireless RF transmitting-receiving control electricity
Road connect with the wireless amplifying circuit of ZigBee wireless RF, the letter for completing the wireless amplifying circuit of ZigBee wireless RF
Number receive with sendaisle seamless handover function, the ZigBee wireless RF adapter circuit wirelessly puts with the ZigBee wireless RF
Big circuit connection, for completing RF impedance matching feature, the memory with the wireless MCU circuit connection, for completing
Data buffer storage or store function, 7.5 cun of II type Electronic Paper screen driving circuit and the wireless MCU circuit connection, described 7.5
Very little II reinforced electric subtab forms star-like wireless network by ZigBee Radio Link and intelligent things gateway.
In 7.5 cun of II reinforced electric subtab of the present invention, the wireless MCU circuit is for completing ZigBee sky
Mouth protocol conversion, receives and processes the instruction that intelligent things gateway issues, and sends display content to 7.5 cun according to actual needs
II type Electronic Paper screen is shown, by means of the character library in memory, is provided and is converted into text, two dimensional code, bar code and picture
The ability of 7.5 cun of II type Electronic Paper screen display formats opens electricity and puts row ZigBee wireless networking into Intelligent internet of things automatically and match,
When the wireless suspension of ZigBee, the Intelligent internet of things that can be accessed is searched for automatically and puts the wireless automatic network-building matching of row ZigBee into.
In 7.5 cun of II reinforced electric subtab of the present invention, the wireless MCU circuit includes being mounted on circuit board
Positive capacitor C1, capacitor C2, capacitor C11, capacitor C12, capacitor C13, capacitor C14, capacitor C15, capacitor C16, crystal oscillator Y1 and
ZigBee is wireless MCU chip U1, it is wireless that the capacitor C2, capacitor C14, capacitor C15 and capacitor C16 are respectively positioned on the ZigBee
The right side of MCU chip U1, the crystal oscillator Y1 are located at the lower right of the wireless MCU chip U1 of the ZigBee, and the capacitor C1 is located at
The right side of the capacitor C2, capacitor C14, capacitor C15 and capacitor C16, the capacitor C13 are located at the lower right of the crystal oscillator Y1,
The capacitor C12 is located at the lower section of the wireless MCU chip U1 of the ZigBee.
7.5 cun of II reinforced electric subtab according to claim 3, which is characterized in that the wireless MCU of ZigBee
Chip U1 is using the wireless MCU of the dedicated ZigBee of JN5169 for selecting NXP company.
In 7.5 cun of II reinforced electric subtab of the present invention, the electric power management circuit includes being mounted on circuit
The positive battery of plate, battery holder J1, wireless power receiving coil socket B1, indicator light LED, charging and work light socket J7, it fills
It is electrically integrated chip U7, LDO decompression integrated chip U8, wireless power source receives integrated chip U10, resistance R26, resistance R29, resistance
R30, resistance R54, resistance R55, resistance R56, resistance R57, capacitor C48, capacitor C49, capacitor C50, capacitor C51, capacitor C52,
Capacitor C53, capacitor C54, capacitor C55, capacitor C56, capacitor C57, capacitor C58, capacitor C59, capacitor C70, capacitor C71, capacitor
C75, capacitor C60, capacitor C61, capacitor C62, capacitor C63, capacitor C64, capacitor C65, capacitor C66, capacitor C67 and capacitor C68,
The battery holder J1 is mounted on the left end of the circuit board, and the indicator light LED is located at the upper right side of the battery holder J1, described
Charging and work light socket J7 are mounted on the upper end of the circuit board, the resistance R29, capacitor C49, resistance R30, charging
Integrated chip U7, capacitor C48 and resistance R26 are respectively positioned on the lower section of the charging and work light socket J7, the capacitor
C51, LDO decompression integrated chip U8 and capacitor C50 are installed in the lower end of the circuit board, the wireless power receiving coil socket B1
It is mounted on the right end of the circuit board, the capacitor C53, capacitor C54, capacitor C55, capacitor C56, capacitor C57, capacitor C52, electricity
Hold the top that C75 and capacitor C71 is respectively positioned on the wireless power receiving coil socket B1, the wireless power source receives integrated chip U10
Positioned at the left side of the wireless power receiving coil socket B1, the capacitor C63, capacitor C64 and capacitor C60 are respectively positioned on the radio
Source receive integrated chip U10 top, the resistance R54, resistance R55, capacitor C61, capacitor C62, resistance R56, resistance R57 and
Capacitor C65 is respectively positioned on the lower left that the wireless power source receives integrated chip U10, the capacitor C66, capacitor C67, capacitor C68,
Capacitor C59, capacitor C70 and capacitor C58 are respectively positioned on the lower section that the wireless power source receives integrated chip U10.
In 7.5 cun of II reinforced electric subtab of the present invention, the wireless amplifying circuit packet of ZigBee wireless RF
It includes and is mounted on the positive RF conveyer U5 of circuit board, RF LNA chip U6, inductance L3, inductance L4, inductance L5, capacitor C7, capacitor
C8, capacitor C69 and capacitor C72, the RF conveyer U5 are located at the top of the wireless MCU chip U1 of the ZigBee, the inductance
L3, capacitor C8 and RF LNA chip U6 are respectively positioned on the top of the RF conveyer U5, and the capacitor C72 is located at the RF LNA core
The upper right side of piece U6, the capacitor C7 and capacitor C69 are located at the left side of the RF conveyer U5, and the inductance L4 is located at the electricity
Feel the left side of L3, the inductance L5 is located at the lower section of the RF conveyer U5.
In 7.5 cun of II reinforced electric subtab of the present invention, the ZigBee wireless RF receives and dispatches control circuit packet
It includes and is mounted on the positive RF detection chip U9 of circuit board, triode Q1, triode Q2, resistance R4, resistance R5, resistance R6, resistance
R7, resistance R8, resistance R19, resistance R20, resistance R21, capacitor C18 and capacitor C19, the RF detection chip U9 are located at described
The upper right side of ZigBee is wireless MCU chip U1, the resistance R4 are located at the lower left of the RF detection chip U9, the resistance R7
The lower section of the RF detection chip U9 is respectively positioned on capacitor C19, the capacitor C18 is located at the right side of the RF detection chip U9,
The resistance R5 and resistance R6 is respectively positioned on the lower section of the capacitor C18, and the resistance R21, triode Q2 and resistance R20 are located at institute
State the top of RF detection chip U9, the triode Q1 is located at the right side of the resistance R20, the resistance R8 and resistance R19
In the lower section of institute triode Q1.
In 7.5 cun of II reinforced electric subtab of the present invention, the ZigBee wireless RF adapter circuit includes peace
Mounted in the positive resistance R1 of circuit board, resistance R50, resistance R51, capacitor C3, capacitor C4, capacitor C5, capacitor C6, inductance L1, electricity
Sense L2, onboard antenna E1 and external antenna seat J3, the inductance L2 are located at the top of the wireless MCU chip U1 of the ZigBee, institute
The upper right side that capacitor C3 and capacitor C4 is respectively positioned on the inductance L2 is stated, the inductance L1 and capacitor C6 is respectively positioned on the capacitor C4's
Top, the capacitor C5 are located at the left side of the inductance L1, and the external antenna seat J3 is located at the charging and work light
The lower right of socket, the resistance R50 and resistance R51 are located at the right side of the external antenna seat J3, and described onboard antenna E1
In the top of the external antenna seat J3.
In 7.5 cun of II reinforced electric subtab of the present invention, the memory includes being mounted on circuit board front
Resistance R25, capacitor C17, SPI RAM integrated chip U2, resistance R9, resistance R12, capacitor C74 and SPI Flash integrated chip
U3, the SPI RAM integrated chip U2 are located at the left side of the wireless MCU chip U1 of the ZigBee, and the capacitor C17 is located at described
The lower section of SPI RAM integrated chip U2, the resistance R25 and capacitor C74 are located at the upper right of the SPI RAM integrated chip U2
Side, the SPIFlash integrated chip U3 are located at the top of SPI RAM integrated chip U2, and the resistance R9 and resistance R12 are located at
The top of the SPI Flash integrated chip U3.
In 7.5 cun of II reinforced electric subtab of the present invention, 7.5 cun of II type Electronic Paper screen driving circuit packet
Include be mounted on the positive resistance R15 of circuit board, resistance R16, resistance R17, resistance R18, resistance R31, resistance R32, resistance R33,
Resistance R34, resistance R58, resistance R59, capacitor C24, capacitor C25, capacitor C26, capacitor C27, capacitor C28, capacitor C29, capacitor
C30, capacitor C31, capacitor C32, capacitor C33, capacitor C34, capacitor C35, capacitor C36, capacitor C37, capacitor C38, capacitor C39,
Capacitor C40, capacitor C41, capacitor C42, capacitor C43, capacitor C44, capacitor C45, capacitor C46, capacitor C47, diode D1, two poles
Pipe D2, diode D3, diode D4, diode D5, diode D6, inductance L6, inductance L7, metal-oxide-semiconductor Q4, metal-oxide-semiconductor Q5,7.5 cun
II type Electronic Paper screen socket J4 and 7.5 cun of II type Electronic Paper screen sockets J5,7.5 cun of II type Electronic Paper screen socket J4, capacitor
C29, capacitor C30, capacitor C31, capacitor C32, capacitor C33, resistance R16, capacitor C34, capacitor C35, resistance R32, resistance R31,
Capacitor C27, capacitor C28, inductance L6, resistance R15, metal-oxide-semiconductor Q4, diode D1, diode D2, diode D3, capacitor C24, electricity
Hold C25, capacitor C26 and resistance R58 are respectively positioned on the right side of the battery holder J1, described 7.5 cun of II type Electronic Paper screen socket J5
In the top of the indicator light LED, the capacitor C47, capacitor C46, resistance R18, capacitor C45, capacitor C44, capacitor C43, electricity
Hold C42, capacitor C41, capacitor C38, capacitor C39, capacitor C40, resistance R34, inductance L7 and resistance R33 and is respectively positioned on described 7.5 cun
The top of II type Electronic Paper screen socket J5, the diode D4, diode D5, diode D6, capacitor C37, capacitor C36 are respectively positioned on
The upper right side of 7.5 cun of II type Electronic Paper screen socket J5, the metal-oxide-semiconductor Q5 are located at 7.5 cun of II type Electronic Paper screen socket
The right side of J5, the resistance R59 are located at the upper right side of the metal-oxide-semiconductor Q5.
Implement 7.5 cun of II reinforced electric subtabs of the invention, has the advantages that due to including being arranged in circuit
7.5 cun of II reinforced electric subtab circuits on plate, 7.5 cun of II reinforced electric subtab circuits include wireless MCU circuit, power supply
Manage circuit, ZigBee wireless RF is wireless amplifying circuit, ZigBee wireless RF transmitting-receiving control circuit, ZigBee wireless RF adaptation electricity
Road, memory and 7.5 cun of II type Electronic Paper screen driving circuits, 7.5 cun of II reinforced electric subtabs pass through ZigBee radio chains
Road and intelligent things gateway form star-like wireless network, and the present invention can promote that wireless networking comprehensive effectiveness, to power on ZigBee wireless
Suspension that automatic network-building, plug and play, ZigBee are wireless search for automatically matching network, without user intervention, using General design,
Low-power consumption.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is 7.5 cun of II reinforced electric subtab circuits in 7.5 cun of II reinforced electric subtab one embodiment of the invention
Structural schematic diagram；
Fig. 2 is the schematic network structure of 7.5 cun of II reinforced electric subtab networkings in the embodiment；
Fig. 3 is the distribution map of the positive component of circuit board in the embodiment；
Fig. 4 is the distribution map of circuit board positive pad and conducting wire in the embodiment；
Fig. 5 is the distribution map of the component of circuit board reverse side in the embodiment；
Fig. 6 is the pad of circuit board reverse side and the distribution map of conducting wire in the embodiment.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In 7.5 cun of II reinforced electric subtab embodiments of the invention, which includes setting
7.5 cun of II reinforced electric subtab circuits on circuit boards, 7.5 cun of II reinforced electric subtab circuits are as 7.5 cun of II
The core of reinforced electric subtab, using modularization, unitized design principle.7.5 cun of II reinforced electric subtab circuits
Structural schematic diagram it is as shown in Figure 1.In Fig. 1, which includes wireless MCU circuit 1, power supply
It is suitable to manage circuit 2, ZigBee wireless RF is wireless amplifying circuit 3, ZigBee wireless RF transmitting-receiving control circuit 4, ZigBee wireless RF
With circuit 5, memory 6 and 7.5 cun II type Electronic Paper screen driving circuit 7, wherein electric power management circuit 2 and wireless MCU circuit 1
Connection is used to complete decompression, pressure stabilizing and charge function, and selection LDO decompression, charge integrated chip, in conjunction with separate type component (electricity
Resistance, capacitor etc.) Lai Shixian.
ZigBee wireless RF is wireless, and amplifying circuit 3 is connect, for completing ZigBee RF wireless signals with wireless MCU circuit 1
Enlarging function, to provide the ZigBee wireless networking of greater room distance range, signal receives respectively independent with sendaisle.It adopts
It is real with RF LNA chip+RF switch chip+RF conveyor elements+separate type component (inductance, capacitor, resistance etc.) mode
It is existing.
ZigBee wireless RF transmitting-receiving control circuit 4 is connect, with the wireless amplifying circuit 3 of ZigBee wireless RF for completing
The signal of ZigBee wireless RF is wireless amplifying circuit 3 receive with sendaisle seamless handover function, using RF detection chip+separation
The mode of formula component (inductance, capacitor, resistance etc.) is realized.
ZigBee wireless RF adapter circuit 5 is connect, with the wireless amplifying circuit 3 of ZigBee wireless RF for completing RF impedance
(50 Ω) matching feature is realized using separate type component (inductance, capacitor, resistance etc.).
Memory 6 is connect, for completing data buffer storage or store function with wireless MCU circuit 1, using SPI Flash with
RAM integrated chip, in conjunction with separate type component (resistance, capacitor etc.) Lai Shixian.
7.5 cun of II type Electronic Paper screen driving circuits 7 are connect with wireless MCU circuit 1.Based on General design principle, use
Separate type component (metal-oxide-semiconductor, resistance, capacitor, inductance etc.) is realized, the 7.5 of the multiple commercial vendors such as Wuxi Wei Feng, Guangzhou Austria wing can be connect
Very little II type Electronic Paper screen.
7.5 cun of II reinforced electric subtabs form star-like wireless network by ZigBee Radio Link and intelligent things gateway
Network.Fig. 2 is the schematic network structure for originally applying 7.5 cun of II reinforced electric subtab networkings in example.User can pass through intelligent things
Gateway carries out operation control to 7.5 cun of II reinforced electric subtabs.The intelligent things gateway (intelligent things gateway equipment) is different
In ZigBee Internet of Things access gateway on the market.
7.5 cun of II reinforced electric subtabs have a characteristic that 1) energy intelligent networking: without user's operation, powering on
ZigBee is wireless automatic network-building, plug and play, suspension that ZigBee is wireless search for matching automatically and network；2) net-working standard: IEEE
802.15.4 supporting AES128 encryption；3) low-power consumption: in the case where showing that the time interval of content update is not less than for 24 hours, button
Battery is no less than 1 year；4) supply voltage: lithium battery power supply can be used in DC3.6V, charging is reused；5) it shows
Screen: (resolution ratio: red-black Bai Sanse 800 × 480), in the case where any power supply, is shown 7.5 cun of II type Electronic Paper screens
Content can keep, not lose；6) wireless working frequency range: 2.4GHz；7) radio transmitted power: 20dBm；8) wireless output resistance
It is anti-: 50 Ω；9) wireless receiving sensitivity: -106dBm；10) wireless data transmission rate: 250Kbps.
Wireless MCU circuit 1 receives and processes the finger that intelligent things gateway issues for completing the conversion of ZigBee air protocol
It enables, sends display content to 7.5 cun of II type Electronic Paper screens according to actual needs and show, by means of the character library in memory
Etc. information, the energy that the information such as text, two dimensional code, bar code and picture are converted into 7.5 cun of II type Electronic Paper screen display formats is provided
Power, the ability combine improved ZigBee radio open Data Transport Protocol, can promote traditional enhanced electronics mark of 7.5 cun of II
Sign 10 times of ZigBee wireless networking comprehensive effectiveness or more.It opens electricity and puts row ZigBee wireless networking into Intelligent internet of things automatically
Match, is not necessarily to user intervention, plug and play, greatly promotes user experience.When the wireless suspension of ZigBee, automatic search can be connect
The Intelligent internet of things entered puts the wireless automatic network-building matching of row ZigBee into, is not necessarily to user intervention, improves user experience.This hair
It is bright to promote wireless networking comprehensive effectiveness, power on that the wireless automatic network-building of ZigBee, plug and play, ZigBee is wireless, and suspension is searched automatically
Rope matching networks, is not necessarily to user intervention, using General design.
Fig. 3 is the distribution map of the positive component of circuit board in the present embodiment, and in Fig. 3, wireless MCU circuit 1 includes installation
The positive wireless MCU circuit of circuit board include be mounted on the positive capacitor C1 of circuit board, capacitor C2, capacitor C11, capacitor C12,
Capacitor C13, capacitor C14, capacitor C15, capacitor C16, crystal oscillator Y1 and ZigBee is wireless MCU chip U1, capacitor C2, capacitor C14, electricity
Hold the right side that C15 and capacitor C16 is respectively positioned on the wireless MCU chip U1 of ZigBee, crystal oscillator Y1 is located at the wireless MCU chip U1's of ZigBee
Lower right, capacitor C1 are located at the right side of capacitor C2, capacitor C14, capacitor C15 and capacitor C16, and capacitor C13 is located at the right side of crystal oscillator Y1
Lower section, capacitor C12 are located at the lower section of the wireless MCU chip U1 of ZigBee.
In the present embodiment, ZigBee is wireless, and MCU chip U1 is wireless using the dedicated ZigBee of JN5169 of selection NXP company
MCU。
In the present embodiment, electric power management circuit 2 includes being mounted on the positive battery of circuit board, battery holder J1, wirelessly by electricity
Coil receptacle B1, indicator light LED, charging and work light socket J7, charging integrated chip U7, LDO decompression integrated chip U8,
Wireless power source receives integrated chip U10, resistance R26, resistance R29, resistance R30, resistance R54, resistance R55, resistance R56, resistance
R57, capacitor C48, capacitor C49, capacitor C50, capacitor C51, capacitor C52, capacitor C53, capacitor C54, capacitor C55, capacitor C56,
Capacitor C57, capacitor C58, capacitor C59, capacitor C70, capacitor C71, capacitor C75, capacitor C60, capacitor C61, capacitor C62, capacitor
C63, capacitor C64, capacitor C65, capacitor C66, capacitor C67 and capacitor C68, battery holder J1 are mounted on the left end of circuit board, instruction
Lamp LED is located at the upper right side of battery holder J1, and charging and work light socket J7 are mounted on the upper end of circuit board, resistance R29, electricity
Hold C49, resistance R30, charging integrated chip U7, capacitor C48 and resistance R26 to be respectively positioned under charging and work light socket J7
Side, capacitor C51, LDO decompression integrated chip U8 and capacitor C50 are installed in the lower end of circuit board, wireless power receiving coil socket B1
Be mounted on the right end of circuit board, capacitor C53, capacitor C54, capacitor C55, capacitor C56, capacitor C57, capacitor C52, capacitor C75 and
Capacitor C71 is respectively positioned on the top of wireless power receiving coil socket B1, and wireless power source receives integrated chip U10 and is located at wireless power receiving coil
The left side of socket B1, capacitor C63, capacitor C64 and capacitor C60 are respectively positioned on the top that wireless power source receives integrated chip U10, resistance
R54, resistance R55, capacitor C61, capacitor C62, resistance R56, resistance R57 and capacitor C65 are respectively positioned on wireless power source and receive integrated core
The lower left of piece U10, capacitor C66, capacitor C67, capacitor C68, capacitor C59, capacitor C70 and capacitor C58 are respectively positioned on wireless power source
Receive the lower section of integrated chip U10.
In the present embodiment, ZigBee wireless RF is wireless amplifying circuit 3 include be mounted on the positive RF conveyer U5 of circuit board,
RF LNA chip U6, inductance L3, inductance L4, inductance L5, capacitor C7, capacitor C8, capacitor C69 and capacitor C72, RF conveyer U5
In the top of the wireless MCU chip U1 of ZigBee, inductance L3, capacitor C8 and RF LNA chip U6 are respectively positioned on the upper of RF conveyer U5
Side, capacitor C72 are located at the upper right side of RF LNA chip U6, and capacitor C7 and capacitor C69 are located at the left side of RF conveyer U5, inductance L4
Positioned at the left side of inductance L3, inductance L5 is located at the lower section of RF conveyer U5.
In the present embodiment, ZigBee wireless RF transmitting-receiving control circuit 4 includes being mounted on the positive RF detection chip of circuit board
U9, triode Q1, triode Q2, resistance R4, resistance R5, resistance R6, resistance R7, resistance R8, resistance R19, resistance R20, resistance
R21, capacitor C18 and capacitor C19, RF detection chip U9 are located at the upper right side of the wireless MCU chip U1 of ZigBee, and resistance R4 is located at RF
The lower left of detection chip U9, resistance R7 and capacitor C19 are respectively positioned on the lower section of RF detection chip U9, and capacitor C18 is located at RF detection
The right side of chip U9, resistance R5 and resistance R6 are respectively positioned on the lower section of capacitor C18, and resistance R21, triode Q2 and resistance R20 are located at
The top of RF detection chip U9, triode Q1 are located at the right side of resistance R20, and resistance R8 and resistance R19 are located at institute triode Q1's
Lower section.
In the present embodiment, ZigBee wireless RF adapter circuit 5 include be mounted on the positive resistance R1 of circuit board, resistance R50,
Resistance R51, capacitor C3, capacitor C4, capacitor C5, capacitor C6, inductance L1, inductance L2, onboard antenna E1 and external antenna seat J3, electricity
Sense L2 is located at the top of the wireless MCU chip U1 of ZigBee, and capacitor C3 and capacitor C4 are respectively positioned on the upper right side of inductance L2, inductance L1 with
Capacitor C6 is respectively positioned on the top of capacitor C4, and capacitor C5 is located at the left side of inductance L1, and external antenna seat J3 is located at charging and work refers to
Show the lower right of lamp socket, resistance R50 and resistance R51 are located at the right side of external antenna seat J3, and onboard antenna E1 is located at external day
The top of line seat J3.
In the present embodiment, memory 6 includes being mounted on the positive resistance R25 of circuit board, the integrated core of capacitor C17, SPIRAM
Piece U2, resistance R9, resistance R12, capacitor C74 and SPI Flash integrated chip U3, SPI RAM integrated chip U2 are located at ZigBee
The left side of wireless MCU chip U1, capacitor C17 are located at the lower section of SPI RAM integrated chip U2, and resistance R25 and capacitor C74 are located at
The upper right side of SPI RAM integrated chip U2, SPI Flash integrated chip U3 are located at the top of SPI RAM integrated chip U2, resistance
R9 and resistance R12 is located at the top of SPI Flash integrated chip U3.
In the present embodiment, 7.5 cun of II type Electronic Paper screen driving circuits 7 include being mounted on the positive resistance R15 of circuit board, electricity
Hinder R16, resistance R17, resistance R18, resistance R31, resistance R32, resistance R33, resistance R34, resistance R58, resistance R59, capacitor
C24, capacitor C25, capacitor C26, capacitor C27, capacitor C28, capacitor C29, capacitor C30, capacitor C31, capacitor C32, capacitor C33,
Capacitor C34, capacitor C35, capacitor C36, capacitor C37, capacitor C38, capacitor C39, capacitor C40, capacitor C41, capacitor C42, capacitor
C43, capacitor C44, capacitor C45, capacitor C46, capacitor C47, diode D1, diode D2, diode D3, diode D4, two poles
Pipe D5, diode D6, inductance L6, inductance L7, metal-oxide-semiconductor Q4, metal-oxide-semiconductor Q5,7.5 cun of II type Electronic Paper screen socket J4 and 7.5 cun of II
Type Electronic Paper screen socket J5,7.5 cun of II type Electronic Paper screen socket J4, capacitor C29, capacitor C30, capacitor C31, capacitor C32, capacitor
C33, resistance R16, capacitor C34, capacitor C35, resistance R32, resistance R31, capacitor C27, capacitor C28, inductance L6, resistance R15,
Metal-oxide-semiconductor Q4, diode D1, diode D2, diode D3, capacitor C24, capacitor C25, capacitor C26 and resistance R58 are respectively positioned on battery
The right side of seat J1,7.5 cun of II type Electronic Paper screen socket J5 are located at the top of indicator light LED, capacitor C47, capacitor C46, resistance
R18, capacitor C45, capacitor C44, capacitor C43, capacitor C42, capacitor C41, capacitor C38, capacitor C39, capacitor C40, resistance R34,
Inductance L7 and resistance R33 is respectively positioned on the top of 7.5 cun of II type Electronic Paper screen socket J5, diode D4, diode D5, diode
D6, capacitor C37, capacitor C36 are respectively positioned on the upper right side of 7.5 cun of II type Electronic Paper screen socket J5, and metal-oxide-semiconductor Q5 is located at 7.5 cun of II types
The right side of Electronic Paper screen socket J5, resistance R59 are located at the upper right side of metal-oxide-semiconductor Q5.
Fig. 4 is the distribution map of circuit board positive pad and conducting wire in the present embodiment；Fig. 5 is that circuit board is anti-in the present embodiment
The distribution map of the component in face；Fig. 6 is the pad of circuit board reverse side and the distribution map of conducting wire in the present embodiment.
In short, in the present embodiment, by the way that the information such as text, two dimensional code, bar code, picture are converted into 7.5 cun of II type electronics
The means such as the function of paper screen display format and improved ZigBee radio open Data Transport Protocol, so that 7.5 cun of II increase
The ZigBee wireless networking comprehensive effectiveness of strong type electronic tag is promoted.7.5 cun of II reinforced electric subtabs, which have, to be powered on
ZigBee is wireless automatic network-building, plug-and-play feature.Suspension that ZigBee is wireless searches for matching automatically and networks, without user intervention.
7.5 cun of II type Electronic Paper screen driving circuits 7 use General design, can connect the 7.5 of the multiple commercial vendors such as Wuxi Wei Feng, Guangzhou Austria wing
Very little II type Electronic Paper screen.
The ZigBee wireless RF amplification of pure hardware and transmitting-receiving switching control design, without any change of software, Ji Kewei
ZigBee wireless RF adapter circuit 5 sends signal offer 10dBm, reception signal also provides the gain of 10dBm, and required electric current damages
Consumption is only 20mA or so, is significantly less than and reaches suitable using RF power amplifier integrated chip (such as: RFX2401C, AT2401C) on the market
The electric current (350mA or so) that RF signal gain is lost, for the electronic tagging device for requiring low-power consumption, this advantage is for this
It is very competitive.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of 7.5 cun of II reinforced electric subtabs, which is characterized in that enhanced including the 7.5 cun of II of setting on circuit boards
Electronic tag circuit, 7.5 cun of II reinforced electric subtab circuit includes wireless MCU circuit, electric power management circuit, ZigBee
Wireless RF is wireless amplifying circuit, ZigBee wireless RF receive and dispatch control circuit, ZigBee wireless RF adapter circuit, memory and 7.5
Very little II type Electronic Paper screen driving circuit, the electric power management circuit and the wireless MCU circuit connection are depressured for completion, are steady
Pressure and charge function, the wireless amplifying circuit of ZigBee wireless RF and the wireless MCU circuit connection, for completing ZigBee
RF wireless signals enlarging function, the ZigBee wireless RF transmitting-receiving control circuit and the wireless amplifying circuit of ZigBee wireless RF
Connection, the signal for completing the wireless amplifying circuit of ZigBee wireless RF receive and sendaisle seamless handover function, institute
ZigBee wireless RF adapter circuit is stated to connect with the wireless amplifying circuit of ZigBee wireless RF, for completing RF impedance matching
Function, the memory and the wireless MCU circuit connection, for completing data buffer storage or store function, 7.5 cun of II types
Electronic Paper screen driving circuit and the wireless MCU circuit connection, 7.5 cun of II reinforced electric subtab are wireless by ZigBee
Link and intelligent things gateway form star-like wireless network.
2. 7.5 cun of II reinforced electric subtab according to claim 1, which is characterized in that the wireless MCU circuit is used for
The conversion of ZigBee air protocol is completed, the instruction that intelligent things gateway issues is received and processed, it according to actual needs will be in display
Appearance sends 7.5 cun of II type Electronic Paper screens to and is shown, by means of the character library in memory, provides text, two dimensional code, bar code
It is converted into the ability of 7.5 cun of II type Electronic Paper screen display formats with picture, opens electricity and puts row ZigBee into Intelligent internet of things automatically
Wireless networking matching searches for the Intelligent internet of things that can be accessed automatically and puts row ZigBee into wirelessly certainly when the wireless suspension of ZigBee
Dynamic networking matching.
3. 7.5 cun of II reinforced electric subtab according to claim 1, which is characterized in that the wireless MCU circuit includes
It is mounted on the positive capacitor C1 of circuit board, capacitor C2, capacitor C11, capacitor C12, capacitor C13, capacitor C14, capacitor C15, capacitor
C16, crystal oscillator Y1 and ZigBee is wireless, and MCU chip U1, the capacitor C2, capacitor C14, capacitor C15 and capacitor C16 are respectively positioned on described
The right side of ZigBee is wireless MCU chip U1, the crystal oscillator Y1 is located at the lower right of the wireless MCU chip U1 of the ZigBee, described
Capacitor C1 is located at the right side of the capacitor C2, capacitor C14, capacitor C15 and capacitor C16, and the capacitor C13 is located at the crystal oscillator Y1
Lower right, the capacitor C12 is located at the lower section of the wireless MCU chip U1 of the ZigBee.
4. 7.5 cun of II reinforced electric subtab according to claim 3, which is characterized in that the wireless MCU core of ZigBee
Piece U1 is using the wireless MCU of the dedicated ZigBee of JN5169 for selecting NXP company.
5. 7.5 cun of II reinforced electric subtab according to claim 4, which is characterized in that the electric power management circuit packet
It includes and is mounted on the positive battery of circuit board, battery holder J1, wireless power receiving coil socket B1, indicator light LED, charging and work instruction
Lamp socket J7, charging integrated chip U7, LDO decompression integrated chip U8, wireless power source receive integrated chip U10, resistance R26, electricity
Hinder R29, resistance R30, resistance R54, resistance R55, resistance R56, resistance R57, capacitor C48, capacitor C49, capacitor C50, capacitor
C51, capacitor C52, capacitor C53, capacitor C54, capacitor C55, capacitor C56, capacitor C57, capacitor C58, capacitor C59, capacitor C70,
Capacitor C71, capacitor C75, capacitor C60, capacitor C61, capacitor C62, capacitor C63, capacitor C64, capacitor C65, capacitor C66, capacitor
C67 and capacitor C68, the battery holder J1 are mounted on the left end of the circuit board, and the indicator light LED is located at the battery holder J1
Upper right side, the charging and work light socket J7 are mounted on the upper end of the circuit board, the resistance R29, capacitor
C49, resistance R30, charging integrated chip U7, capacitor C48 and resistance R26 are respectively positioned on the charging and work light socket J7's
Lower section, capacitor C51, LDO decompression integrated chip U8 and capacitor C50 is installed in the lower end of the circuit board, described wireless
Power receiving coil socket B1 is mounted on the right end of the circuit board, the capacitor C53, capacitor C54, capacitor C55, capacitor C56, capacitor
C57, capacitor C52, capacitor C75 and capacitor C71 are respectively positioned on the top of the wireless power receiving coil socket B1, and the wireless power source connects
The left side that integrated chip U10 is located at the wireless power receiving coil socket B1 is received, the capacitor C63, capacitor C64 and capacitor C60 are equal
The top of integrated chip U10, the resistance R54, resistance R55, capacitor C61, capacitor C62, electricity are received positioned at the wireless power source
Resistance R56, resistance R57 and capacitor C65 are respectively positioned on the lower left that the wireless power source receives integrated chip U10, the capacitor C66,
Capacitor C67, capacitor C68, capacitor C59, capacitor C70 and capacitor C58 are respectively positioned on the wireless power source and receive under integrated chip U10
Side.
6. 7.5 cun of II reinforced electric subtab according to claim 5, which is characterized in that the ZigBee wireless RF without
Line amplifying circuit include be mounted on the positive RF conveyer U5 of circuit board, RF LNA chip U6, inductance L3, inductance L4, inductance L5,
Capacitor C7, capacitor C8, capacitor C69 and capacitor C72, the RF conveyer U5 are located at the upper of the wireless MCU chip U1 of the ZigBee
Side, the inductance L3, capacitor C8 and RF LNA chip U6 are respectively positioned on the top of the RF conveyer U5, and the capacitor C72 is located at
The upper right side of the RF LNA chip U6, the capacitor C7 and capacitor C69 are located at the left side of the RF conveyer U5, the inductance
L4 is located at the left side of the inductance L3, and the inductance L5 is located at the lower section of the RF conveyer U5.
7. 7.5 cun of II reinforced electric subtab according to claim 6, which is characterized in that the ZigBee wireless RF is received
Hair control circuit include be mounted on the positive RF detection chip U9 of circuit board, triode Q1, triode Q2, resistance R4, resistance R5,
Resistance R6, resistance R7, resistance R8, resistance R19, resistance R20, resistance R21, capacitor C18 and capacitor C19, the RF detection chip
U9 is located at the upper right side of the wireless MCU chip U1 of the ZigBee, and the resistance R4 is located at the lower left of the RF detection chip U9,
The resistance R7 and capacitor C19 is respectively positioned on the lower section of the RF detection chip U9, and the capacitor C18 is located at the RF detection chip
The right side of U9, the resistance R5 and resistance R6 are respectively positioned on the lower section of the capacitor C18, the resistance R21, triode Q2 and resistance
R20 is located at the top of the RF detection chip U9, and the triode Q1 is located at the right side of the resistance R20, the resistance R8 and
Resistance R19 is located at the lower section of institute triode Q1.
8. 7.5 cun of II reinforced electric subtab according to claim 7, which is characterized in that the ZigBee wireless RF is suitable
It include being mounted on the positive resistance R1 of circuit board, resistance R50, resistance R51, capacitor C3, capacitor C4, capacitor C5, capacitor with circuit
C6, inductance L1, inductance L2, onboard antenna E1 and external antenna seat J3, the inductance L2 are located at the wireless MCU chip of the ZigBee
The top of U1, the capacitor C3 and capacitor C4 are respectively positioned on the upper right side of the inductance L2, and the inductance L1 and capacitor C6 are respectively positioned on
The top of the capacitor C4, the capacitor C5 are located at the left side of the inductance L1, and the external antenna seat J3 is located at the charging
With the lower right of work light socket, the resistance R50 and resistance R51 are located at the right side of the external antenna seat J3, described
Onboard antenna E1 is located at the top of the external antenna seat J3.
9. 7.5 cun of II reinforced electric subtab according to claim 8, which is characterized in that the memory includes installation
In the positive resistance R25 of circuit board, capacitor C17, SPIRAM integrated chip U2, resistance R9, resistance R12, capacitor C74 and SPI
Flash integrated chip U3, the SPI RAM integrated chip U2 are located at the left side of the wireless MCU chip U1 of the ZigBee, the electricity
Hold the lower section that C17 is located at the SPI RAM integrated chip U2, it is integrated that the resistance R25 and capacitor C74 are located at the SPI RAM
The upper right side of chip U2, the SPI Flash integrated chip U3 are located at the top of SPIRAM integrated chip U2, the resistance R9 and
Resistance R12 is located at the top of the SPI Flash integrated chip U3.
10. 7.5 cun of II reinforced electric subtab according to claim 9, which is characterized in that 7.5 cun of II type electronics
Paper screen driving circuit includes being mounted on the positive resistance R15 of circuit board, resistance R16, resistance R17, resistance R18, resistance R31, electricity
Hinder R32, resistance R33, resistance R34, resistance R58, resistance R59, capacitor C24, capacitor C25, capacitor C26, capacitor C27, capacitor
C28, capacitor C29, capacitor C30, capacitor C31, capacitor C32, capacitor C33, capacitor C34, capacitor C35, capacitor C36, capacitor C37,
Capacitor C38, capacitor C39, capacitor C40, capacitor C41, capacitor C42, capacitor C43, capacitor C44, capacitor C45, capacitor C46, capacitor
C47, diode D1, diode D2, diode D3, diode D4, diode D5, diode D6, inductance L6, inductance L7, metal-oxide-semiconductor
Q4, metal-oxide-semiconductor Q5,7.5 cun of II type Electronic Paper screen socket J4 and 7.5 cun of II type Electronic Paper screen socket J5,7.5 cun of II type electronics
Paper screen socket J4, capacitor C29, capacitor C30, capacitor C31, capacitor C32, capacitor C33, resistance R16, capacitor C34, capacitor C35, electricity
Hinder R32, resistance R31, capacitor C27, capacitor C28, inductance L6, resistance R15, metal-oxide-semiconductor Q4, diode D1, diode D2, diode
D3, capacitor C24, capacitor C25, capacitor C26 and resistance R58 are respectively positioned on the right side of the battery holder J1,7.5 cun of II type electronics
Paper screen socket J5 is located at the top of the indicator light LED, the capacitor C47, capacitor C46, resistance R18, capacitor C45, capacitor
C44, capacitor C43, capacitor C42, capacitor C41, capacitor C38, capacitor C39, capacitor C40, resistance R34, inductance L7 and resistance R33 are equal
Positioned at the top of 7.5 cun of II type Electronic Paper screen socket J5, the diode D4, diode D5, diode D6, capacitor C37,
Capacitor C36 is respectively positioned on the upper right side of 7.5 cun of II type Electronic Paper screen socket J5, and the metal-oxide-semiconductor Q5 is located at 7.5 cun of II types
The right side of Electronic Paper screen socket J5, the resistance R59 are located at the upper right side of the metal-oxide-semiconductor Q5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910596003.9A CN110414657B (en) | 2019-07-03 | 2019-07-03 | 7.5 inch II enhanced electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910596003.9A CN110414657B (en) | 2019-07-03 | 2019-07-03 | 7.5 inch II enhanced electronic tag |
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| CN110414657A true CN110414657A (en) | 2019-11-05 |
| CN110414657B CN110414657B (en) | 2024-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN206712845U (en) * | 2017-04-21 | 2017-12-05 | 深圳华制智能制造技术有限公司 | A kind of things-internet gateway equipment, internet of things equipment group network system |
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2019
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103324965A (en) * | 2013-06-05 | 2013-09-25 | 佛山市广华合志科技有限公司 | Electronic goods shelf label based on FPGA |
| CN107038829A (en) * | 2016-02-03 | 2017-08-11 | 深圳市睿祺智尚科技有限公司 | Intelligent door sensor and intelligent safety and defence system based on Internet of Things |
| CN206314008U (en) * | 2016-07-27 | 2017-07-07 | 山东大学 | A kind of gateway for merging plurality of wireless networks |
| CN206712845U (en) * | 2017-04-21 | 2017-12-05 | 深圳华制智能制造技术有限公司 | A kind of things-internet gateway equipment, internet of things equipment group network system |
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| CN110414657B (en) | 2024-01-12 |
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