CN110408932A - Decoppering agent for circuit board clipping copper removal - Google Patents
Decoppering agent for circuit board clipping copper removal Download PDFInfo
- Publication number
- CN110408932A CN110408932A CN201810391072.1A CN201810391072A CN110408932A CN 110408932 A CN110408932 A CN 110408932A CN 201810391072 A CN201810391072 A CN 201810391072A CN 110408932 A CN110408932 A CN 110408932A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper
- nitric acid
- copper removal
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Abstract
A kind of decoppering agent for circuit board clipping copper removal, including smog removing agent, erosion copper promotor and nitric acid.The present invention carries out circuit board clipping copper removal using the decoppering agent that the components such as the nitric acid of low concentration and ammonium chloride are configured to, since corrosivity of the ammonium chloride to copper is bigger, copper on fixture can be effectively removed, improve the copper removal efficiency of circuit board clipping, using the nitric acid of low concentration, so that being not likely to produce nitric acid smog during circuit board clipping copper removal and setting off an explosion, reduce the loss of raw material, reduce the personal injury that nitric acid volatilizees to operator, improve workshop condition, the danger coefficient of decoppering agent is reduced, security risk is reduced, improves safety；At the same time it can also reduce the yield of the pernicious gases such as nitrogen dioxide during circuit board clipping copper removal, reduce tail gas yield, influence when reducing noxious gas emission to workshop condition and natural environment meets the demand for the environmentally protective production that country advocates.
Description
Technical field
The invention belongs to wiring board production technical fields, and in particular to a kind of decoppering agent for circuit board clipping copper removal.
Background technique
Plating be exactly using electrolysis make the surface of metal or other materials product attachment layer of metal film technique from
And playing prevents metal from aoxidizing, improve wearability, electric conductivity, corrosion resistance the effects of.Plating is normal in wiring board manufacturing process
The technique seen, wherein electro-coppering is with a kind of wider electroplating technology.Wiring board clamps the folder of wiring board during copper facing
For tool often also by copper facing, copper facing fixture will result in the pollution of other process reaction solution if not handling, influence wiring board quality.
Present most of factories are all the copper dissolved on fixture using concentrated nitric acid, but concentrated nitric acid is unstable, volatile
Nitric acid smog is formed, in addition, generating pernicious gas nitrogen dioxide when concentrated nitric acid removes the copper on fixture.Therefore wiring board production
Enterprise, when removing the copper on fixture using concentrated nitric acid, the mixing toxic smog of the concentrated nitric acid of the nitrogen dioxide and volatilization of generation, when
Operator can lead to operator's poisoning when sucking nitrogen dioxide and concentrated nitric acid mixture, influence the person peace of operator
Entirely, there are very big security risks；In addition, nitrogen dioxide and concentrated nitric acid mixture evaporate into air, toxic gas is caused to discharge,
Pollute environment.
Therefore, the copper metal film adhered on electroplating clamp how is removed, and removes copper metal film and does not generate nocuousness in the process
Smog improves workshop condition, reduces the generation of pernicious gas, and it is urgently to be resolved as electroplating enterprise to meet environmentally protective production requirement
The problem of.
Summary of the invention
In view of this, low dangerous and low exhaust emissions amount being used for wiring board the technical problem to be solved by the present invention is to a kind of
The decoppering agent of fixture copper removal can effectively remove the metallic copper on circuit board clipping, while reduce and remove circuit board clipping process
The generation of middle pernicious gas improves workshop condition, reduces security risk, improves safety, meets the demand of environmentally protective production.
In order to solve the above-mentioned technical problem, the present invention is realized using following scheme: a kind of for circuit board clipping copper removal
Decoppering agent, including smog removing agent, erosion copper promotor and nitric acid.
Preferably, the erosion copper promotor includes ammonium chloride, formic acid.
Preferably, the mass percent of each component of the decoppering agent is as follows:
Smog removing agent 1%~10%；
Ammonium chloride 1%~8%；
Formic acid 1%~8%；
Nitric acid 75%~97%.
Preferably, the mass percent of the smog removing agent is 2%~5%.
Preferably, the mass percent of the ammonium chloride is 3%~7%.
Preferably, the mass percent of the formic acid is 1%~5%.
Preferably, the smog removing agent is urea.
Preferably, the concentration of nitric acid is 30%~55%.
Compared with prior art, the present invention change traditional circuit board clipping except in process for copper using high concentration nitric acid into
The mode of row line board clamp copper removal carries out wiring board using the decoppering agent that the components such as the nitric acid of low concentration and ammonium chloride are configured to
Fixture copper removal can effectively remove copper on fixture, improve removing for circuit board clipping since corrosivity of the ammonium chloride to copper is bigger
Copper efficiency, so that being not likely to produce nitric acid smog during circuit board clipping copper removal and setting off an explosion, is subtracted using the nitric acid of low concentration
The loss of few raw material reduces the personal injury that nitric acid volatilizees to operator, improves workshop condition, reduces the danger of decoppering agent
Dangerous coefficient reduces security risk, improves safety；At the same time it can also reduce nitrogen dioxide etc. during circuit board clipping copper removal
The yield of pernicious gas, reduces tail gas yield, to workshop condition and natural environment when reducing noxious gas emission
It influences, meets the demand for the environmentally protective production that country advocates.
Specific embodiment
In order to allow those skilled in the art to more fully understand technical solution of the present invention, below with reference to embodiment to this hair
It is bright to be further elaborated.
A kind of decoppering agent for circuit board clipping copper removal, including smog removing agent, erosion copper promotor and nitric acid.It is described
Smog removing agent be urea；The erosion copper promotor includes ammonium chloride, formic acid；The nitric acid use concentration for 30%~
55% nitric acid.Wherein, the mass percent of the urea in decoppering agent, ammonium chloride, formic acid and nitric acid is as follows:
Smog removing agent 1%~10%；
Ammonium chloride 1%~8%；
Formic acid 1%~8%；
Nitric acid 75%~97%.
Embodiment 1
Configure 100Kg be used for circuit board clipping copper removal decoppering agent, the decoppering agent include smog removing agent, erosion copper promotor and
Nitric acid.The smog removing agent is urea；The erosion copper promotor includes ammonium chloride, formic acid；The nitric acid is using dense
The nitric acid that degree is 30%~55%.Wherein, urea 1Kg, ammonium chloride 1Kg, formic acid 1Kg, 30%~55% nitric acid is 97Kg.
Embodiment 2
Configure 100Kg be used for circuit board clipping copper removal decoppering agent, the decoppering agent include smog removing agent, erosion copper promotor and
Nitric acid.The smog removing agent is urea；The erosion copper promotor includes ammonium chloride, formic acid；The nitric acid is using dense
The nitric acid that degree is 30%~55%.Wherein, urea 10Kg, ammonium chloride 8Kg, formic acid 8Kg, 30%~55% nitric acid are
74Kg。
Embodiment 3
Configure 100Kg be used for circuit board clipping copper removal decoppering agent, the decoppering agent include smog removing agent, erosion copper promotor and
Nitric acid.The smog removing agent is urea；The erosion copper promotor includes ammonium chloride, formic acid；The nitric acid is using dense
The nitric acid that degree is 30%~55%.Wherein, urea 5Kg, ammonium chloride 4Kg, formic acid 5Kg, 30%~55% nitric acid is 86Kg.
Embodiment 4
Configure 100Kg be used for circuit board clipping copper removal decoppering agent, the decoppering agent include smog removing agent, erosion copper promotor and
Nitric acid.The smog removing agent is urea；The erosion copper promotor includes ammonium chloride, formic acid；The nitric acid is using dense
The nitric acid that degree is 30%~55%.Wherein, urea 1Kg, ammonium chloride 4Kg, formic acid 6Kg, 30%~55% nitric acid is 89Kg.
Embodiment 5
Configure 100Kg be used for circuit board clipping copper removal decoppering agent, the decoppering agent include smog removing agent, erosion copper promotor and
Nitric acid.The smog removing agent is urea；The erosion copper promotor includes ammonium chloride, formic acid；The nitric acid is using dense
The nitric acid that degree is 30%~55%.Wherein, urea 7Kg, ammonium chloride 6Kg, formic acid 3Kg, 30%~55% nitric acid is 84Kg.
Above-described embodiment is only wherein specific implementation of the invention, and the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these obvious alternative forms are equal
It belongs to the scope of protection of the present invention.
Claims (8)
1. a kind of decoppering agent for circuit board clipping copper removal, it is characterised in that: including smog removing agent, erosion copper promotor and
Nitric acid.
2. the decoppering agent according to claim 1 for circuit board clipping copper removal, it is characterised in that: the erosion it is copper-promoted into
Agent includes ammonium chloride, formic acid.
3. the decoppering agent according to claim 2 for circuit board clipping copper removal, it is characterised in that: the decoppering agent
The mass percent of each component is as follows:
Smog removing agent 1%~10%；
Ammonium chloride 1%~8%；
Formic acid 1%~8%；
Nitric acid 75%~97%.
4. the decoppering agent according to claim 3 for circuit board clipping copper removal, it is characterised in that: the smog removing
The mass percent of agent is 2%~5%.
5. the decoppering agent according to claim 3 for circuit board clipping copper removal, it is characterised in that: the ammonium chloride
Mass percent is 3%~7%.
6. the decoppering agent according to claim 3 for circuit board clipping copper removal, it is characterised in that: the matter of the formic acid
Measuring percentage is 1%~5%.
7. described in any item decoppering agents for circuit board clipping copper removal according to claim 1~6, it is characterised in that: described
Smog removing agent be urea.
8. the decoppering agent according to claim 7 for circuit board clipping copper removal, it is characterised in that: the concentration of nitric acid
It is 30%~55%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810391072.1A CN110408932A (en) | 2018-04-27 | 2018-04-27 | Decoppering agent for circuit board clipping copper removal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810391072.1A CN110408932A (en) | 2018-04-27 | 2018-04-27 | Decoppering agent for circuit board clipping copper removal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110408932A true CN110408932A (en) | 2019-11-05 |
Family
ID=68345859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810391072.1A Pending CN110408932A (en) | 2018-04-27 | 2018-04-27 | Decoppering agent for circuit board clipping copper removal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110408932A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1147025A (en) * | 1995-08-01 | 1997-04-09 | 美克株式会社 | Copper and copper alloy micro-etching agent |
| US20040046148A1 (en) * | 2000-12-20 | 2004-03-11 | Fan Zhang | Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| CN101476041A (en) * | 2008-12-12 | 2009-07-08 | 佛山市邦普镍钴技术有限公司 | Method for separating and recycling copper, nickel and regenerative plastic from waste electroplating plastic |
| CN102634801A (en) * | 2012-04-27 | 2012-08-15 | 东莞市广华化工有限公司 | Low-acidity acidic etching regenerant and acidic etching mother liquor thereof |
-
2018
- 2018-04-27 CN CN201810391072.1A patent/CN110408932A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1147025A (en) * | 1995-08-01 | 1997-04-09 | 美克株式会社 | Copper and copper alloy micro-etching agent |
| US20040046148A1 (en) * | 2000-12-20 | 2004-03-11 | Fan Zhang | Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| CN101476041A (en) * | 2008-12-12 | 2009-07-08 | 佛山市邦普镍钴技术有限公司 | Method for separating and recycling copper, nickel and regenerative plastic from waste electroplating plastic |
| CN102634801A (en) * | 2012-04-27 | 2012-08-15 | 东莞市广华化工有限公司 | Low-acidity acidic etching regenerant and acidic etching mother liquor thereof |
Non-Patent Citations (2)
| Title |
|---|
| 刘天齐: "《三废处理工程技术手册 废气卷 》", 31 May 1999 * |
| 荆晓: "《中学化学词典》", 30 April 1998 * |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191105 |
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| RJ01 | Rejection of invention patent application after publication |