CN110408357A - A kind of epoxide-resin glue and its application method - Google Patents
A kind of epoxide-resin glue and its application method Download PDFInfo
- Publication number
- CN110408357A CN110408357A CN201910793603.4A CN201910793603A CN110408357A CN 110408357 A CN110408357 A CN 110408357A CN 201910793603 A CN201910793603 A CN 201910793603A CN 110408357 A CN110408357 A CN 110408357A
- Authority
- CN
- China
- Prior art keywords
- parts
- agent
- resin
- curing agent
- epoxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present patent application belongs to epoxy resin applied technical field, specifically disclosing a kind of epoxide-resin glue and its application method includes host agent and curing agent, and wherein host agent includes following components: 90-110 parts of E-44 epoxy resin, 10-20 parts of polyamide, 2-4 parts of DMP-30 promotor, 45-55 parts of diluent；Curing agent includes following components: 25-35 parts of 1,3- hexamethylene dimethylamine, 45-55 parts of benzyl alcohol, 15-25 parts of resin, 0.001-0.003 parts of defoaming agent；This programme can make product hardness high, and yellowing-resistant significant effect, self-defoaming ability is strong, good leveling property, and 80 DEG C of heatproof or more, can polish cutting, can be polishing to 7000 mesh.
Description
Technical field
The present patent application belongs to epoxy resin applied technical field, specifically discloses a kind of epoxide-resin glue and its user
Method.
Background technique
Epoxy resin is a kind of thermosetting resin, has excellent chemical stability, corrosion resistance, its adhesive property is good,
High mechanical strength, electrical insulating property is strong, is industrially widely used, especially in devices such as electronic device, transformers
Casting, encapsulation aspect, are even more widely used.
Existing method matches the epoxide-resin glue made, not heatproof, and quick-drying calorific value is big, not easy to operate, causes
Finished product hardness is low, and grinding effect (7000 mesh) is not achieved.
Summary of the invention
The purpose of the present invention is to provide a kind of epoxide-resin glue and its application methods, product hardness can be made high, yellowing-resistant
Significant effect, self-defoaming ability is strong, good leveling property, and 80 DEG C of heatproof or more, can polish cutting, can be polishing to 7000 mesh.
In order to achieve the above object, base case of the invention are as follows:
A kind of epoxide-resin glue, including host agent and curing agent, wherein host agent includes following components: E-44 epoxy resin 90-
110 parts, 10-20 parts of polyamide, 2-4 parts of DMP-30 promotor, 45-55 parts of diluent；Curing agent includes following components: 1,3- ring
25-35 parts of F-dimethylamine, 45-55 parts of benzyl alcohol, 15-25 parts of resin, 0.001-0.003 parts of defoaming agent.
Further, including host agent and curing agent, wherein host agent includes following components: 90 parts of E-44 epoxy resin, polyamide
10 parts, 2 parts of DMP-30 promotor, 45 parts of diluent；Curing agent includes following components: 25 parts of 1,3- hexamethylene dimethylamine, benzyl alcohol
45 parts, 15 parts of resin, 0.001 part of defoaming agent.
Further, host agent includes following components: 110 parts of E-44 epoxy resin, 20 parts of polyamide, 4 parts of DMP-30 promotor,
55 parts of diluent；Curing agent includes following components: 35 parts of 1,3- hexamethylene dimethylamine, 55 parts of benzyl alcohol, 25 parts of resin, defoaming agent
0.003 part.
Further, host agent includes following components: 100 parts of E-44 epoxy resin, 15 parts of polyamide, 3 parts of DMP-30 promotor,
50 parts of diluent；Curing agent includes following components: 30 parts of 1,3- hexamethylene dimethylamine, 50 parts of benzyl alcohol, 20 parts of resin, defoaming agent
0.002 part.
Further, host agent specific gravity is 1.15,25 DEG C: 2000-4000CPS of viscosity.
Further, curing agent specific gravity is 0.96, viscosity 25 DEG C: 100MAXCPS.
Above-mentioned epoxy resin presses formula reaction kettle high speed dispersion, stirs, and evacuates, and heats 80 degree.
The application method of this epoxy resin is as follows:
S1: seed selection cleaning plastic container, host agent and curing agent press formulation ratio, and precise is clockwise along container inner wall
3-5 minutes are stood after stirring；
S2: when not in use, host and curing agent are retained separately, need using when according to operating time and host agent and curing agent
Mass ratio 3:1 deploys glue amount, wherein host agent to be first preheated to the fusion tune for carrying out the two after 30 DEG C again when temperature is lower than 15 DEG C
Glue；
S3: when S2 step carries out, when relative humidity is greater than 85%, using heating cure；
S4: must seal bung after use, avoid causing scrap of the product because of the moisture absorption.
The working principle and beneficial effect of this base case are:
By means of the present invention, glue amount is deployed according to operable time and dosage, avoids waste when temperature is lower than 15 DEG C
When, please first host agent is preheated to after 30 DEG C and carries out impregnation again, it is easily operated (host agent meeting retrogradation when temperature is low)；It is required close after use
Bung is sealed, avoids causing scrap of the product because of the moisture absorption.
When relative humidity is greater than 85%, solidfied material surface is easy to absorb moisture content in air, forms one layer of white haze shape, therefore
When relative humidity is greater than 85%, is not suitable for doing normal temperature cure, solidification effect can be reinforced using heating cure.
This programme epoxide-resin glue yellowing-resistant, high hardness high transparency, good mobility, naturally defoaming, disposable perfusion
Amount is big, and greenhouse solidifies or is heating and curing；Artistic table is combined with resin suitable for river table, wood, resin tea table, craftwork,
Ornaments, log resin necklace, wood resin tea tray, marble resin table etc..
Specific embodiment
It is further described below by specific embodiment:
Embodiment 1
A kind of epoxide-resin glue, including host agent and curing agent, wherein host agent is made of following components: E-44 epoxy resin
100 parts, 15 parts of polyamide, 3 parts of DMP-30 promotor, 50 parts of diluent；Curing agent includes following components: 1,3- hexamethylene dimethylamine
30 parts, 50 parts of benzyl alcohol, 20 parts of resin, 0.002 part of defoaming agent.
The application method of this epoxide-resin glue is as follows:
S1: seed selection cleaning plastic container, host agent A6A and curing agent A6B are by weight proportion, precise, along container
Wall stands 3-5 minutes after stirring clockwise；
S2: when not in use, host and curing agent are retained separately, need using when according to operating time and host agent and curing agent
Mass ratio 3:1 deploys glue amount, wherein host agent to be first preheated to the fusion tune for carrying out the two after 30 DEG C again when temperature is lower than 15 DEG C
Glue；
S3: when S2 step carries out, when relative humidity is greater than 85%, using heating cure；
S4: must seal bung after use, avoid causing product report because of the moisture absorption.
Wherein host agent specific gravity is 1.15,25 DEG C: 2000-4000CPS of viscosity；Curing agent specific gravity be 0.96,25 DEG C of viscosity:
100MAXCPS。
The epoxide-resin glue as made from this formula may make product to reach hardness 85D, yellowing-resistant significant effect, self-defoaming
Ability is strong, good leveling property, and 80 DEG C of heatproof or more, can polish cutting, can be polishing to 7000 mesh.
Embodiment 2
Embodiment 2 the difference from embodiment 1 is that: 90 parts of E-44 epoxy resin, 10 parts of polyamide, DMP-30 promotor 2
Part, 45 parts of diluent；Curing agent includes following components: 25 parts of 1,3- hexamethylene dimethylamine, 45 parts of benzyl alcohol, 15 parts of resin, defoaming
0.001 part of agent.
Embodiment 3
Embodiment 3 the difference from embodiment 1 is that: 110 parts of E-44 epoxy resin, 20 parts of polyamide, DMP-30 promotor 4
Part, 55 parts of diluent；Curing agent includes following components: 35 parts of 1,3- hexamethylene dimethylamine, 55 parts of benzyl alcohol, 25 parts of resin, defoaming
0.003 part of agent.
What has been described above is only an embodiment of the present invention, and the common sense such as well known specific structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these also should be considered as protection scope of the present invention, these all will not influence what the present invention was implemented
Effect and patent practicability.
Claims (8)
1. a kind of epoxide-resin glue, which is characterized in that including host agent and curing agent, wherein host agent includes following components: E-44 ring
90-110 parts of oxygen resin, 10-20 parts of polyamide, 2-4 parts of DMP-30 promotor, 45-55 parts of diluent；Curing agent includes with the following group
Point: 25-35 parts of 1,3- hexamethylene dimethylamine, 45-55 parts of benzyl alcohol, 15-25 parts of resin, 0.001-0.003 parts of defoaming agent.
2. a kind of epoxide-resin glue according to claim 1, it is characterised in that: including host agent and curing agent, wherein host agent
Including following components: 90 parts of E-44 epoxy resin, 10 parts of polyamide, 2 parts of DMP-30 promotor, 45 parts of diluent；Curing agent packet
Include following components: 25 parts of 1,3- hexamethylene dimethylamine, 45 parts of benzyl alcohol, 15 parts of resin, 0.001 part of defoaming agent.
3. a kind of epoxide-resin glue according to claim 1, it is characterised in that: including host agent and curing agent, wherein host agent
Including following components: 110 parts of E-44 epoxy resin, 20 parts of polyamide, 4 parts of DMP-30 promotor, 55 parts of diluent；Curing agent packet
Include following components: 35 parts of 1,3- hexamethylene dimethylamine, 55 parts of benzyl alcohol, 25 parts of resin, 0.003 part of defoaming agent.
4. a kind of epoxide-resin glue according to claim 1, it is characterised in that: including host agent and curing agent, wherein host agent
Including following components: 100 parts of E-44 epoxy resin, 15 parts of polyamide, 3 parts of DMP-30 promotor, 50 parts of diluent；Curing agent packet
Include following components: 30 parts of 1,3- hexamethylene dimethylamine, 50 parts of benzyl alcohol, 20 parts of resin, 0.002 part of defoaming agent.
5. a kind of epoxide-resin glue according to claim 1, it is characterised in that: the host agent specific gravity is 1.15, viscosity
25℃:2000—4000CPS。
6. a kind of epoxide-resin glue according to claim 1, it is characterised in that: the curing agent specific gravity is 0.96, is glued
Degree 25 DEG C: 100MAXCPS.
7. a kind of epoxide-resin glue according to claim 1, it is characterised in that: the diluent is 622 models.
8. a kind of application method of epoxide-resin glue according to claim 1, which is characterized in that further include following steps:
S1: seed selection cleaning plastic container, host agent and curing agent press formulation ratio, and precise is abundant clockwise along container inner wall
3-5 minutes are stood after mixing evenly, when not in use, the two is retained separately；
S2: when not in use, host and curing agent are retained separately, need using when according to operating time and host agent and curing agent quality
Glue amount is deployed than 3:1, wherein host agent to be first preheated to the fusion impregnation for carrying out the two after 30 DEG C again when temperature is lower than 15 DEG C；
S3: when S2 step carries out, when relative humidity is greater than 85%, using heating cure；
S4: must seal bung after use, avoid causing scrap of the product because of the moisture absorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910793603.4A CN110408357A (en) | 2019-08-27 | 2019-08-27 | A kind of epoxide-resin glue and its application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910793603.4A CN110408357A (en) | 2019-08-27 | 2019-08-27 | A kind of epoxide-resin glue and its application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110408357A true CN110408357A (en) | 2019-11-05 |
Family
ID=68369243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910793603.4A Pending CN110408357A (en) | 2019-08-27 | 2019-08-27 | A kind of epoxide-resin glue and its application method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110408357A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102093832A (en) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | High impact-resistant epoxy resin filling adhesive and preparation method thereof |
| CN104592922A (en) * | 2014-12-31 | 2015-05-06 | 湖北绿色家园精细化工有限责任公司 | Transparent, high-hardness and yellowing-resistant epoxy ornament glue and preparation process thereof |
| CN106634756A (en) * | 2017-01-04 | 2017-05-10 | 濮阳惠成电子材料股份有限公司 | Two-component LED pouring sealant |
| CN109266277A (en) * | 2018-09-28 | 2019-01-25 | 湖北绿色家园材料技术股份有限公司 | A kind of transparent, high rigidity, color inhibition epoxy stone material surface glue and its preparation process |
| CN109705785A (en) * | 2018-12-03 | 2019-05-03 | 上海康达化工新材料股份有限公司 | A kind of room curing and high temperature resistant type epoxy glue and preparation method thereof |
-
2019
- 2019-08-27 CN CN201910793603.4A patent/CN110408357A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102093832A (en) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | High impact-resistant epoxy resin filling adhesive and preparation method thereof |
| CN104592922A (en) * | 2014-12-31 | 2015-05-06 | 湖北绿色家园精细化工有限责任公司 | Transparent, high-hardness and yellowing-resistant epoxy ornament glue and preparation process thereof |
| CN106634756A (en) * | 2017-01-04 | 2017-05-10 | 濮阳惠成电子材料股份有限公司 | Two-component LED pouring sealant |
| CN109266277A (en) * | 2018-09-28 | 2019-01-25 | 湖北绿色家园材料技术股份有限公司 | A kind of transparent, high rigidity, color inhibition epoxy stone material surface glue and its preparation process |
| CN109705785A (en) * | 2018-12-03 | 2019-05-03 | 上海康达化工新材料股份有限公司 | A kind of room curing and high temperature resistant type epoxy glue and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 《化工百科全书》编辑委员会: "《化工百科全书 第8卷 计算机控制系统-聚硅氧烷》", 30 September 1994, 化学工业出版社 * |
| 贺曼罗: "《环氧树脂胶粘剂》", 30 April 2004, 中国石化出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105038694B (en) | A kind of dual composition addition type organosilicon bonding casting glue and its application method | |
| CN105199643B (en) | A kind of cation type ultraviolet photo and hot dual deep cure adhesive and preparation method thereof | |
| CN101948667B (en) | Adhesive for compounding marble veneer with base material and preparation method thereof | |
| MY138890A (en) | Combinations of resin compositions and methods of use therof | |
| CN103540282A (en) | Urea-formaldehyde resin wood adhesive modifier and applications thereof | |
| CN106634714A (en) | Adhesive for plywood and preparation method thereof | |
| CN104962099A (en) | Inorganic binder refractory artificial board material and preparation method thereof | |
| CN101531799A (en) | PMMA/wood plastic composite rostone material and the preparing method thereof | |
| CN110204690A (en) | A kind of epoxy dry-hang glue curing agent and preparation method thereof | |
| WO2009005064A1 (en) | Thermoplastic resin composition, and molded article thereof | |
| CN105295740B (en) | The liquid adhesive and wood-based plate processing method of a kind of no aldehyde | |
| CN110408357A (en) | A kind of epoxide-resin glue and its application method | |
| CN104592922A (en) | Transparent, high-hardness and yellowing-resistant epoxy ornament glue and preparation process thereof | |
| CN105317197B (en) | A kind of manufacture craft of waste material composite floor board | |
| CN109735235A (en) | A kind of thermally conductive high refractive index LED transparent epoxy resin casting glue and preparation method thereof | |
| CN108147772A (en) | A kind of marmorean preparation method of cracking resistance transparent synthetic | |
| CN1033982C (en) | Production of transparent solf seal adhesive with epoxy double component | |
| CN103029490A (en) | Preparing method of environment-friendly pencil | |
| CN105839893A (en) | Wood-plastic floor using activated carbon to purity air | |
| CN116419954A (en) | Lignin-based binding resins | |
| CN104312516B (en) | A kind of high agglutinating value(of coal) ultraviolet photo-curing cementing agent and preparation method thereof | |
| CN102585749A (en) | Unsaturated polyester resin adhesive | |
| CN104087222A (en) | Preparation method of soybean oil-based two-component keel adhesive | |
| CN107267108A (en) | A kind of resistance to boiling solvent-free glue and preparation method thereof | |
| CN106634681A (en) | Environment-friendly wood board adhesive and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191105 |